Panasonic 2SK2571 Datasheet

Power F-MOS FETs

2SK2571

Silicon N-Channel Power F-MOS FET

■ Features

●Avalanche energy capacity guaranteed

●High-speed switching

●Low ON-resistance

●No secondary breakdown

■ Applications

●Contactless relay

●Diving circuit for a solenoid

●Driving circuit for a motor

●Control equipment

●Switching power supply

■ Absolute Maximum Ratings (T

Parameter

Drain to Source breakdown voltage
Gate to Source voltage

Drain current

DC

Pulse
Avalanche energy capacity
Allowable power
dissipation

TC = 25°C

Ta = 25°C
Channel temperature
Storage temperature

*

L = 2.4mH, IL = 13A, 1 pulse

Symbol

V
V
I

D

I

DP

EAS

P

D

T

ch

T

stg

DSS

GSS

*

= 25°C)

C

Ratings

−55 to +150

450
±30
±13
±26
200
100

3

150

Unit

V
V
A
A

mJ

W

°C
°C

4.5

4.0

2.0±0.2

1.1±0.1

5.45±0.3

0.7±0.1

3.3±0.3

15.5±0.5

5˚

123

φ3.2±0.1

2.0 2.0 1.2 10.0

5.45±0.3

2.0

26.5±0.5

18.6±0.5

5.5±0.3

unit: mm

3.0±0.3

5˚ 5˚

23.4

5˚

5˚

5˚

0.7±0.1

1: Gate
2: Drain
3: Source

TOP-3E Package

22.0±0.5

■ Electrical Characteristics (T

Parameter

Drain to Source cut-off current
Gate to Source leakage current
Drain to Source breakdown voltage
Gate threshold voltage
Drain to Source ON-resistance
Forward transfer admittance
Diode forward voltage
Input capacitance (Common Source)
Output capacitance (Common Source)
Reverse transfer capacitance (Common Source)
Turn-on time
Fall time
Turn-off time (delay time)
Thermal resistance between channel and case
Thermal resistance between channel and atmosphere

C

Symbol

I

DSS

I

GSS

V

DSS

V

th

R

DS(on)

| Yfs |
V

DSF

C

iss

C

oss

C

rss

t

on

t

f

t

d(off)

R

th(ch-c)

R

th(ch-a)

= 25°C)

Conditions

VDS = 360V, VGS = 0
VGS = ±30V, VDS = 0
ID = 1mA, VGS = 0
VDS = 25V, ID = 1mA
VGS = 10V, ID = 7A
VDS = 25V, ID = 7A
IDR = 13A, VGS = 0

VDS = 20V, VGS = 0, f = 1MHz

VDD = 150V, ID = 7A
VGS = 10V, RL = 21.4Ω

min

450

2

5

typ

0.34
8

1700

300
120
110

90

220

max

100

±1

5

0.45

−2

1.25

41.67

Unit

µA
µA

V
V

Ω

S

V
pF
pF
pF

ns
ns

ns
°C/W
°C/W

1

Power F-MOS FETs 2SK2571

Area of safe operation (ASO) PD  Ta IAS  L-load

2

10

I

DP

)

I

D

A

(

10

D

1

Drain current I

–1

10

–1

10

Non repetitive pulse

=25˚C

T

C

DC

100ms

10ms

11010210

Drain to source voltage VDS (V

I

 V

D

30

VDS=25V
T

=25˚C

C

25

)

A

(

20

D

15

GS

t=1ms

120

)
W

(

100

D

80

60

40

20

Allowable power dissipation P

3

)

0

0 16040 12080 14020 10060

Ambient temperature Ta (˚C

6

)

5

V

(

th

4

3

(1) TC=Ta
(2) Without heat sink

P

=3.0W

D

(1)

(2)

Vth  T

C

VDS=25V
I

=1mA

D

)

2

10

)
A

(

10

1

Avalanche current IAS

–1

10

–1

10

11010

L-load (mH

R

 I

DS(on)

1.2

)

Ω

(

1.0

DS(on)

0.8

0.6

TC=25˚C

E=200mJ

)

D

TC=25˚C

2

10

Drain current I

5

0

0108264

Gate to source voltage VGS (V

VDS  V

35

)

30

V

(

DS

25

20

15

10

5

Drain to source voltage V

3.25A

0

030252051510

Gate to source voltage VGS (V

GS

TC=25˚C

I

=26A

D

13A

6.5A

2

1

Gate threshold voltage V

0

0 15012510025 7550

)

Case temperature TC (˚C

20

)
S

(
|

fs

15

10

5

Forward transfer admittance |Y

0

0252051510

)

| Yfs |  I

D

VDS=25V
T

C

Drain current ID (A

=25˚C

)

)

,

)

Common source

(

, Output capacitance

)

Common source

(

Input capacitance

=10V

0.4

0.2

Drain to source ON-resistance R

0

0252051510

V

GS

15V

Drain current ID (A

C

, C

, C

oss

rss

 V

f=1MHz
T

=25˚C

C

iss

10000

)

pF

(

rss

3000

,C

oss

,C

1000

iss

C

)

300

Common source

(

100

30

Reverse transfer capacitance

10

0 25020050 150100

Drain to source voltage VDS (V

DS

)

C

iss

C

oss

C

rss

)

2