Panasonic 2SK2124 Datasheet

Power F-MOS FETs

2SK2124

Silicon N-Channel Power F-MOS FET

■ Features

●Avalanche energy capacity guaranteed: EAS > 130mJ

●V

= ±30V guaranteed

GSS

●High-speed switching: t

●No secondary breakdown

■ Applications

●Contactless relay

●Diving circuit for a solenoid

●Driving circuit for a motor

●Control equipment

●Switching power supply

■ Absolute Maximum Ratings (T

Parameter

Drain to Source breakdown voltage
Gate to Source voltage

Drain current

Avalanche energy capacity
Allowable power
dissipation
Channel temperature
Storage temperature

*

L = 4.1mH, IL = 8A, VDD = 50V, 1 pulse

= 60ns

f

DC
Pulse

TC = 25°C
Ta = 25°C

Symbol

V

DSS

V

GSS

I

D

I

DP

*

EAS

P

D

T

ch

T

stg

= 25°C)

C

Ratings

−55 to +150

450
±30

±8
±16
130

50

2

150

Unit

V
V
A
A

mJ

W

°C
°C

φ3.2±0.1

15.0±0.313.7

–0.2

+0.5

8.0±0.2

4.1±0.2

Solder Dip

7

9.9±0.3

231

3.0±0.2

1.2±0.15

1.45±0.15

0.75±0.1

2.54±0.2

5.08±0.4

unit: mm

4.6±0.2

2.9±0.2

2.6±0.1

0.7±0.1

1: Gate
2: Drain
3: Source

TO-220E Package

■ Electrical Characteristics (T

Parameter

Drain to Source cut-off current
Gate to Source leakage current
Drain to Source breakdown voltage
Gate threshold voltage
Drain to Source ON-resistance
Forward transfer admittance
Diode forward voltage
Input capacitance (Common Source)
Output capacitance (Common Source)
Reverse transfer capacitance (Common Source)
Turn-on time (delay time)
Rise time
Fall time
Turn-off time (delay time)
Thermal resistance between channel and case

C

Symbol

I

DSS

I

GSS

V

DSS

V

th

R

DS(on)

| Yfs |
V

DSF

C

iss

C

oss

C

rss

t

d(on)

t

r

t

f

t

d(off)

R

th(ch-c)

= 25°C)

Conditions

VDS = 360V, VGS = 0
VGS = ±30V, VDS = 0
ID = 1mA, VGS = 0
VDS = 25V, ID = 1mA
VGS = 10V, ID = 4A
VDS = 25V, ID = 4A
IDR = 8A, VGS = 0

VDS = 20V, VGS = 0, f = 1MHz

VGS = 10V, ID = 4A
VDD = 150V, RL = 37.5Ω

min

450

2

3

typ

0.56
5

1300

160

70
25
45
50

150

max

0.1
±1

5

0.75

−1.7

2.5

Unit

mA

µA

V
V

Ω

S

V
pF
pF
pF

ns
ns
ns
ns

°C/W

1

Power F-MOS FETs 2SK2124

Area of safe operation (ASO) PD  Ta EAS  T

100

30

I

DP

I

10

D

)
A

(

D

3

1

0.3

Drain current I

0.1

0.03

0.01
1 10 1003 30 300 1000

Non repetitive pulse
T

1ms
10ms

=25˚C

C

DC

Drain to source voltage VDS (V

ID  V

DS

16

VGS=15V

14

10V

12

)
A

(

10

D

8

6

Drain current I

4

2

0

0 102030405060

7V

6V

Drain to source voltage VDS (V

t=100µs

T

=25˚C

C

5.5V

5V
50W

)

)

60

)
W

(

50

D

40

30

20

10

Allowable power dissipation P

0

020

(1) TC=Ta
(2) Without heat sink

=2W)

(P

D

(1)

(2)

40 60 80 100 120 140 160

Ambient temperature Ta (˚C

ID  V

GS

10

8

)
A

(

D

6

4

100˚C25˚C

TC=0˚C 150˚C

Drain current I

2

0

012108264

Gate to source voltage VGS (V

VDS=25V

240

)
mJ

(

200

160

120

80

40

Avalanche energy capacity EAS

0

25 50

)

)

Junction temperature Tj (˚C

6

)

5

V

(

th

4

3

2

1

Gate threshold voltage V

0

0 25 50 75 100 125 150

Case temperature TC (˚C

j

VDD=50V
I

=8A

D

75 100 125 150 175

)

Vth  T

C

VDS=25V

=1mA

I

D

)

R

 I

DS(on)

2.4

)

Ω

(

2.0

DS(on)

1.6

1.2

0.8

0.4

Drain to source ON-resistance R

0

0108264

Drain current ID (A

2

D

VGS=10V

T

=150˚C

C

100˚C

25˚C

0˚C

)

R

 I

DS(on)

2.4

)

Ω

(

2.0

DS(on)

1.6

1.2

0.8

0.4

Drain to source ON-resistance R

0

0108264

D

TC=25˚C

V

GS

Drain current ID (A

=10V

15V

)

| Yfs |  I

12

)
S

(

10

|

fs

8

6

4

2

D

VDS=25V
T

=25˚C

C

Forward transfer admittance |Y

0

0246810

Drain current ID (A

)