Panasonic 2SC5895 Datasheet
Power Transistors
2SC5895
Silicon NPN epitaxial planar type
Power supply for Audio & Visual equipments
such as TVs and VCRs
Industrial equipments such as DC-DC converters
■ Features
• High-speed switching (t
• Low collector-emitter saturation voltage V
• Superior forward current transfer ratio hFE linearity
• TO-220D built-in: Excellent package with withstand voltage 5 kV
guaranteed
■ Absolute Maximum Ratings TC = 25°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) V
Collector-emitter voltage (Base open) V
Emitter-base voltage (Collector open) V
Collector current I
Peak collector current I
Collector power
dissipation
Junction temperature T
Storage temperature T
: storage time/tf: fall time is short)
stg
CE(sat)
CBO
CEO
EBO
C
CP
TC = 25°CP
C
60 V
60 V
6V
2A
4A
15 W
Ta = 25°C2
j
stg
150 °C
−55 to +150 °C
9.9
±0.3
±0.5
3.0
φ 3.2
0.8
2.54
5.08
1.4
1.6
±0.1
±0.2
±0.2
±0.30
±0.50
±0.1
TO-220D-A1 Package
±0.5
15.0
±0.2
13.7
±0.2
4.2
Solder Dip
123
Marking Symbol: C5895
Internal Connection
B
C
E
Unit: mm
4.6
±0.2
0.55
1: Base
2: Collector
3: Emitter
2.9
2.6
±0.2
±0.1
±0.15
■ Electrical Characteristics TC = 25°C ± 3°C
Parameter Symbol Conditions Min Typ Max Unit
Collector-emitter voltage (Base open) V
Collector-base cutoff current (Emitter open)
Collector-emitter cutoff current (Base open)
Forward current transfer ratio h
Collector-emitter saturation voltage V
CEOIC
I
CBO
I
CEO
FE1
h
FE2
h
FE3
CE(sat)IC
Transition frequency f
Turn-on time t
Storage time t
on
stg
Fall time t
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: December 2002 SJD00299AED
= 10 mA, IB = 060V
VCB = 60 V, IE = 0 100 µA
VCE = 60 V, IB = 0 100 µA
VCE = 4 V, IC = 0.2 A 60
VCE = 4 V, IC = 1 A 80 250
VCE = 4 V, IC = 2 A 30
= 2 A, IB = 0.25 A 0.5 V
VCE = 10 V, IC = 0.1 A, f = 10 MHz 100 MHz
T
IC = 1 A, Resistance loaded 0.2 µs
IB1 = 0.1 A, IB2 = − 0.1 A 0.7 µs
VCC = 50 V 0.15 µs
f
1
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteris-
tics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL
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