Page 1
Transistor
Maintenance/
Discontinued
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2SC5378
Silicon NPN epitaxial planer type
For low-voltage low-noise high-frequency oscillation
Features
■
●
Low noise figure NF.
●
High gain.
●
High transition frequency fT.
●
S-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing and the magazine
packing.
Absolute Maximum Ratings (Ta=25˚C)
■
Parameter
Collector to base voltage
Collector to emitter voltage
Emitter to base voltage
Collector current
Collector power dissipation
Junction temperature
Storage temperature
Symbol
V
CBO
V
CEO
V
EBO
I
C
P
C
T
j
T
stg
Ratings
15
8
2
80
150
150
–55 ~ +150
Unit
V
V
V
mA
mW
˚C
˚C
2.1±0.1
1.25±0.1 0.4250.425
1
1.3±0.10.9±0.1
2.0±0.2
0.650.2 0.65
2
0.7±0.1
0.2±0.1
0 to 0.1
1:Base
2:Emitter EIAJ:SC–70
3:Collector S–Mini Type Package
Marking symbol : HT
3
Unit: mm
–0
+0.1
0.3
–0.05
+0.1
0.15
Electrical Characteristics (Ta=25˚C)
■
Parameter
Collector cutoff current
Emitter cutoff current
Forward current transfer ratio
Collector output capacitance
Transition frequency
Noise figure
Foward transfer gain
*1
hFE Rank classification
Rank Q R S
h
FE
80 ~ 115 95 ~ 155 135 ~ 200
Symbol
I
CBO
I
EBO
*1
h
FE
C
ob
f
T
NF
| S
21e
Conditions
VCB = 10V, IE = 0
VEB = 1V, IC = 0
VCE = 5V, IC = 10mA
VCB = 5V, IE = 0, f = 1MHz
VCE = 5V, IC = 10mA, f = 2GHz
VCE = 5V, IC = 3mA, f = 1GHz
2
|
VCE = 5V, IC = 10mA, f = 1GHz
min
80
8.5
typ
0.6
1.6
11
max
200
7
Unit
1
µA
1
µA
1
2
pF
GHz
dB
dB
1
Page 2
Transistor
Maintenance/
Discontinued
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2SC5378
PC — Ta IC — V
200
)
mW
(
160
C
120
80
40
Collector power dissipation P
0
0 16040 12080 14020 10060
Ambient temperature Ta (˚C
CE
120
100
)
mA
(
80
C
60
40
Collector current I
20
0
0108264
)
Collector to emitter voltage VCE (V
Ta=25˚C
IB=600µA
500µA
400µA
300µA
200µA
100µA
180
FE
150
120
90
60
30
Forward current transfer ratio h
0
1 10 100 10003 30 300
)
hFE — I
C
VCE=5V
Ta=75˚C
25˚C
–25˚C
Collector current IC (mA
)
2
Page 3
Request for your special attention and precautions in using the technical information and
Maintenance/
Discontinued
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semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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