Page 1
This product complies with the RoHS Directive (EU 2002/95/EC).
Transistors
2SC4691G
Silicon NPN epitaxial planar type
For high-speed switching
■ Features
• Low collector-emitter saturation voltage V
• SS-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing
CE(sat)
■ Package
• Code
SSMini3-F3
• Marking Symbol: 2Y
• Pin Name
1. Base
■ Absolute Maximum Ratings Ta = 25°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) V
Collector-emitter voltage (E-B short) V
Emitter-base voltage (Collector open) V
Collector current I
Peak collector current I
Collector power dissipation P
Junction temperature T
Storage temperature T
CBO
CES
EBO
C
CP
C
j
−55 to +125 °C
stg
40 V
40 V
5V
100 mA
300 mA
125 mW
125 °C
2. Emitter
3. Collector
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter Symbol Conditions Min Typ Max Unit
Collector-base cutoff current (Emitter open)
Emitter-base cutoff current (Collector open)
Forward current transfer ratio
*
Collector-emitter saturation voltage V
Base-emitter saturation voltage V
Transition frequency f
Collector output capacitance C
(Common base, input open circuited)
Turn-on time t
Turn-off time t
Storage time t
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2.*: Rank classification
Rank Q R No-rank
h
FE
60 to 120 90 to 200 60 to 200
Product of no-rank is not classified and have no indication for rank.
I
CBO
I
EBO
h
FE
CE(sat)IC
BE(sat)IC
T
ob
on
off
stg
VCB = 40 V, IE = 0 0.1 µA
VEB = 4 V, IC = 0 0.1 µA
VCE = 1 V, IC = 10 mA 60 200
= 10 mA, IB = 1 mA 0.17 0.25 V
= 10 mA, IB = 1 mA 1.0 V
VCB = 10 V, IE = −10 mA, f = 200 MHz 450 MHz
VCB = 10 V, IE = 0, f = 1 MHz 2 6 pF
Refer to the measurement circuit 17 ns
17 ns
10 ns
Publication date: May 2007 SJC00394AED
1
Page 2
2SC4691G
Measurement circuit
ton , t
test circuit t
off
220 Ω
3.3 kΩ
V
= 10 V
IN
50 Ω
3.3 kΩ
VBB = −3 V
This product complies with the RoHS Directive (EU 2002/95/EC).
0.1 µF
50 Ω
V
CC
= 3 V
test circuit
stg
V
OUT
V
= 10 V
IN
50 Ω
0.1 µF
A
500 Ω
500 Ω
V
BB
910 Ω
= 2 V
0.1 µF
90 Ω
V
CC
1 kΩ
= 10 V
V
OUT
V
IN
10%
V
OUT
90%
t
on
PC T
150
)
125
mW
(
C
100
75
50
25
Collector power dissipation P
0
0 15012510025 7550
Ambient temperature Ta (°C
10%
a
90%
t
V
IN
V
OUT
off
10%
10%
t
stg
(Waveform at A)
IC V
250
200
)
A
(m
C
150
100
Collector current I
50
0
)
0654132
Collector-emitter voltage VCE (V
CE
Ta = 25°C
IB = 8 mA
7 mA
6 mA
5 mA
4 mA
3 mA
2 mA
1 mA
1
)
V
(
CE(sat)
0.1
Collector-emitter saturation voltage V
0.01
0.1 1 10 100 1 000
)
V
I
CE(sat)
25°C
T
a
C
IC / IB = 10
= 75°C
−25°C
Collector current IC (mA
)
V
I
BE(sat)
−25°C
25°C
)
V
(
BE(sat)
10
1
Base-emitter saturation voltage V
0.1
0.1 1 10 100
Collector current IC (mA
2
C
IC / IB = 10
T
= 75°C
a
hFE I
= 75°C
a
25°C
−25°C
C
V
= 1 V
CE
100
(pF)
ob
C
10
1
Collector output capacitance
(Common base, input open circuited)
0.1
0 5 15 20 25 3010 35
)
160
140
FE
120
100
80
60
40
Forward current transfer ratio h
20
0
0.1 1 10 100 1 000
)
T
Collector current IC (mA
Cob V
CB
f = 1 MHz
= 25°C
T
a
Collector-base voltage VCB (V
)
SJC00394AED
Page 3
This product complies with the RoHS Directive (EU 2002/95/EC).
SSMini3-F3 Unit: mm
+0.05
1.60
−0.03
+0.05
0.26
−0.02
3
12
(0.50) (0.50)
1.00 ±0.05
(5°)
−0.03
+0.05
0.85
+0.05
0 to 0.10
1.60 ±0.05
−0.03
0.70
0.375 ±0.05
(5°)
+0.05
0.13
−0.02
(0.45)
Page 4
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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