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WARRANTY
Terms and Conditions applying to all PACE Technologies Products
1. LIMITED WARRANTY AND DISCLAIMER:
PACE Technologies Products are warranted for one year from the purchase date to be free from defects in
material and workmanship under correct use, normal operating conditions, and proper application. PACE
Technologies obligation under this warranty shall be limited to the repair or exchange, at PACE
Technologies option, of any PACE Technologies Product or part which proves to be defective as provided
herein. PACE Technologies reserves the right to either inspect the product at Buyer’s location or require it
to be returned to the factory for inspection. Buyer is responsible for freight to and from factory on all
warranty claims. The above warranty does not extend to goods damaged or subjected to accident, abuse or
misuse after release from PACE Technologies warehouse, nor goods altered or repaired by anyone other
than specifically authorized PACE Technologies representatives. PACE Technologies shall not in any way
be responsible for the consequences of any alteration, modification or misuse unless previously approved in
writing by an officer of PACE Technologies.
PACE TECHNOLOGIES MAKES NO EXPRESS WARRANTIES OTHER THAN THOSE WHICH ARE
SPECIFICALLY DESCRIBED HEREIN. Any description of the goods sold hereunder, including any
reference to Buyer’s specifications and any description in catalogs, circulars and other written material
published by PACE Technologies, is the sole purpose of identifying such goods and shall not create an
express warranty that the goods shall conform to such description.
THIS WARRANTY IS EXPRESSLY IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR
IMPLIED. THERE ARE NO IMPLIED WARRANTIES OF MERCHANT ABILITY OR FITNESS FOR
PARTICULAR PURPOSE. THIS WARRANTY STATES PACE TECHNOLOGIES ENTIRE AND
EXCLUSIVE LIABILITY AND BUYER’S EXCLUSIVE REMEDY FOR ANY CLAIM FOR DAMAGES
IN CONNECTIONS WITH PACE TECHNOLOGIES PRODUCTS. PACE TECHNOLOGIES WILL IN
NO EVENT BE LIABLE FOR INCIDENTAL OR CONSEQUENTIAL DAMAGES WHATSOEVER,
NOR FOR ANY SUM IN EXCESS OF THE PURCHASE PRICE.
2. LIABILITY CAP:
PACE Technologies maximum aggregate liability for loss and damage arising under, resulting from or in
connection with the supply or use of the Equipment and Consumables provided under this purchase, or from
the performance or breach of any obligation (s) imposed hereunder, whether such liability arises from any
one or more claims or actions for breach of contract, tort, (including negligence), delayed completion,
warranty, indemnity, strict liability or otherwise, unless otherwise limited by the terms hereof, shall be
limited to one hundred percent (100%) of the purchase price.
3. DELIVERY:
Customer assumes and shall bear the risk of all loss or damage to the Products from every cause whatsoever,
whether or not insured, and title to such Products shall pass to Customer upon PACE Technologies delivery
of the Products to the common carrier of Pace Technologies choice, or the carrier specified in writing by
Customer, for shipment to Customer. Any claims for breakage, loss, delay, or damage shall be made to the
carrier by the Customer and Pace Technologies will render customer reasonable assistance in prosecuting
such claims.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
4. ACCEPTANCE:
Customer shall inspect the Products promptly upon receipt of delivery. Unless customer objects in
writing within thirty (30) business days thereafter, customer shall be deemed to have accepted the
Products. All claims for damages, errors, or shortage in Products delivered shall be made by Customer
in writing within such five (5) business day period. Failure to make any claim timely shall constitute
acceptance of the Products.
5. PAYMENT:
Customer agrees to provide timely payment for the Products in accordance with the terms of payment
set forth on the reverse side hereof or in any proposal submitted herewith. If any payment is not paid
on or before its due date, Customer shall pay interest on such late payment from the due date until paid
at the lesser of 12% per annum or the maximum rate allowed by law.
6. DEFAULT:
If Buyer is in default (including, but not limited to, the failure by Buyer to pay all amounts due and
payable to Seller) under the work or purchase order or any other agreement between Buyer and Seller,
Buyer’s rights under the warranty shall be suspended during any period of such default and the original
warranty period will not be extended beyond its original expiration date despite such suspension of
warranty rights.
7. MISCELLANEOUS PROVISIONS:
This agreement has been made in and shall be governed by the laws of the State of Arizona. These
terms and conditions and the description of the Products on the reverse side hereof or in any proposal
submitted herewith constitute the entire agreement and understanding of the parties with respect to this
sale and supersede all prior and contemporaneous agreements or understandings, inducements or
representations, expressed or implied, written or oral, between the parties with respect hereto. Any
term or provision of this Agreement may be amended, and any observance of any term of this
Agreement may be waived, only by a writing signed by the party to be bounds. The waiver by a party
of any breach shall not be deemed to constitute a waiver of any other breach. Should suit be brought on
this Agreement, the prevailing party shall be entitled to recover its reasonable attorneys’ fees and other
costs of suit including costs and attorneys’ fees incurred on appeal or in collection of any judgment.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
1.0 Product Description
1.1 General Description
Pressure
Adjustment
Dispenser ON/OFF
Dispenser
controller
Head release
lever / switch
Specimen
Pressure pistons
Pressure Gauge
Variable speed
display
Manual Start/Stop
AUTO/MANUAL
mode buttons
Pistons
UP/DOWN
Water Supply
Dispenser feed
Emergency
Stop button
Speed display
Timer display
Auto start button
The FEMTO 1500 is a variable speed polishing head (0-200 rpm) for use with the NANO 1000T
or NANO 2000T grinding/ polishing machine for semi-automated metallographic specimen
preparation. The FEMTO 1500 can also run either automatically with the NANO polishing base
or in a manual mode independently control from the NANO polisher.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
1.3 Features and Benefits
The FEMTO 1500 is equipped with a 120 W
variable 0-200 rpm speed motor. The drive
mechanism is connected to the motor via a
maintenance-free anti-slip polychain.
The FEMTO 1500 also has a lubricant
dispenser in addition to a high flow water
valve for hands free wet grinding with
abrasive papers and lubrication for polishing.
In addition, the FEMTO 1500 can be operated
either automatically or independently with the
NANO polishing base.
Note: Installation of the FEMTO 1500 /
NANO polishing base should be on a flat
sturdy surface, with easy access to drain,
water and electrical connections.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
1.4 Single Force vs. Central Force Comparison
Single Force vs. Central Force Polishing Machines
Metallographic semi-automated polishing machines are available with
individual/ single specimen loading or with a fixed central holder. The
main advantage for using a central force holder is that the overall
specimen flatness is better. The primary advantages for individual
specimen holders are fewer required grinding/ polishing steps and
the ability to re-polish samples without the need to re-planarize the
Central Force: The individual pistons apply the
polishing force to the landing pads and pushes
down the holder through the spring loaded
central male coupler. For central polishing a
minimum of three samples locked into the holder
is required; however, flatness is then fixed over
all the mounted specimens
Note: With independent pistons, initial grinding can be done with finer abrasives, thus reducing the
number of grinding steps. For flatter specimen preparation a central force polishing system (FEMTO
1500 or FEMTO 2500) are recommended.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
Individual Force: Individual specimen force can
be applied using the Quick Release Chuck system
by screwing down the outside of the coupler so as
to lock the specimen mounting plate into a rigid
plane. This set-up allows for the individual holder
to be removed and cleaned. This holder also
eliminates the need to re-plane the samples if they
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
3.0 Installation
Install unit carefully! Improper installation voids warranty.
!
The FEMTO 1500 / NANO 1000T polishing base should be placed on a flat stable
surface.
Requires air, water supply, drain and electrical connections.
After mounting on NANO polishing base (water, drain, electrical) and connection to an
air and electrical supply, the system is ready for operation by activating the main power
switches on both the NANO polisher and FEMTO head for Automatic operation.
NANO interface
cable
Head release
lever
Post locking
collar
Head release
switch
FEMTO post
Lubricant
Dispenser
Dispenser
Interface
Cable
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
Installation (continued)
Post
3.1 Post Connection
Bottom side post
location on
NANO polisher
positioning
Plate Groove
Post slot
Post
connection:
Loosen and swing the Plat Groove for the post so that you can see the post
Remove plastic cover from the top of the NANO polisher and lower the FEMTO post
IMPT: Securing the post is very important and must be done by tightening the bolt/
Remove the plastic cover plate from underneath the NANO polisher.
alignment notch. The post notch must fit into the groove in the brass plate.
into the hole. (note it is recommended to tighten the FEMTO post locking lever first).
Work the post down as far as possible.
The post notch should extend below the NANO casting base. If the post does not
go down all the way align the post with the plate groove and insert bolt/flat washer
and locking washer and tighten so that the post is fully down.
Replace plate and NANO plastic cover.
washer/locker washer from underneath the NANO polisher
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
Installation (continued)
3.2 Quick Release Chuck Installation
The Quick Release Chuck is a system developed specifically for use in
the FEMTO 1500 polishing head. This systems purpose is to create a
fast and easy way of changing between our Central and Individual force
sample holders. With the Quick Release Chuck installed one polishing
head can be used to process and prepare samples with differing force
requirements. It is also possible to utilize both Individual and Central
force holders in the single procedure.
3.3 Installing a Central Force Sample Holder
To install the Central force sample holder simply
move the FEMTO head to the left of the NANO
bowl and lift the Quick Release Chuck sleeve
up. Now with your other hand push the “dogbone” male connector, on the sample holder, up
into the chuck until a click is heard. Push the
sleeve down then tighten the thump screw.
Tighten until a little bit of resistance is felt. The
Central force holder is ready to be used. Once
the procedure is completed, lift the sleeve back
up and pop off the sample holder to inspect the
samples. This system allows the sample holder
to be reinserted as many times as need
throughout the procedure.
Central Force Holder Part Number
1-inch / 25 mm central specimen holder (3-6 samples) QRC-SH100A-1500
1.25-inch / 30 mm central specimen holder (3-6 samples) QRC-SH125A-1500
1.5-inch / 40 mm central specimen holder (3-6 samples) QRC-SH150A-1500
2-inch / 50 mm central specimen holder (3 samples) QRC-SH200A-1500
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
Installation (continued)
3.5 Installing Individual Force Sample Holder
To install the Individual force holder move the FEMTO
head to the side of the NANO polisher. Lift the sleeve of
the Quick Release Chuck and push the sample holder
up into the chuck. Push the sleeve back down. Next,
turn the sleeve and thread the screw onto the holder.
This thread is reverse threaded. Therefore the normal
method of “lefty loose, righty tight” is not applicable here.
Instead it is “lefty tight, righty loose.” Once the sleeve is
secured around the threads turn the thumb screw on the
chuck. This greatly reduces the risk of the holder getting
loose during operation. Once finished with the Individual
force holder, simply unscrew the chuck from the sample
holder and then left the sleeve up again. The sample
holder is now able to be removed.
Specimen Holder FEMTO 1500
Single specimen holder mounting fixture for FEMTO 1100/1500, requires one set
of 3 plastic rings ranging from 1-inch up to 1.5-inch or 25mm up to 40 mm
(ordered separately)
1-in diameter rings SR-0100
1.25-in diameter rings SR-0125
1.5-in diameter rings SR-0150
25 mm diameter rings SR-25mm
30mm diameter rings SR-30mm
40 mm diameter rings SR-40mm
2-inch single specimen holder mounting fixture for FEMTO 1100/1500, requires
one set of 3, 2-inch or 50 mm plastic rings (ordered separately)
2-in diameter specimen rings SR-0200
50 mm diameter specimen rings SR-50mm
Individual specimen holder mounting fixture (for use with glass slide holders) SH-GHOLDER-1500
Glass slide holder for 27 x 47 mm and 1 x 3-inch slides (each) SR-G
SH-1150
SH-1250
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
Installation (continued)
.8 Height Adjustment for FEMTO Head /Specimen Holder (continued)
Specimen
holder height
adjustment:
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
Step 7. In the FEMTO manual mode, lower pistons with the down button.
Verify that the bottom of the piston is not rubbing against the abrasive
surface. (Note it is better to operate the specimen holder as close to the
working abrasive wheel as possible in order to get flatter specimens
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3.10 OPTIONAL Recirculating Filter System
Recirculating Filter System
The RC-1000 portable recirculating filter system allows for polishers to be mobile as well as to filter and
remove polishing swarf and abrasives generated from PACE Technologies NANO series polishers.
Utilizing a positive pressure pump, the recirculating filter system is able to provide clean water
containing <0.1 μm particles, thus eliminating waste flow to the building drainage system. The filtering
process begins with a coarse filter to eliminate coarse materials such as ripped polishing pads or torn
grinding papers. With a three chamber tank and counter current flow coarse abrasives can also settle
when the pump is not activated. As water is required, the pump will engage and pull the effluent
through a series of fine filters starting with a 0.5 μm filter, followed by a filter >0.1 μm and then to a sub
0.1 μm filter.
Pickup
screen
Coarse
Drain
Screen
Pump
Fine micron
exchangeable
filters
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
4.0 Safety Guidelines
4.1 Warning Sign
4.2 Safety Precautions
This sign points to special safety features on the machine.
!
Careful attention to this instruction manual and the recommended safety guidelines is
!
essential for the safe operation of the FEMTO 1500.
Proper operator training is required for operation of the FEMTO 1500. Any unauthorized
mechanical and electrical change, as well as improper operation, voids all warranty
!
claims. All service issues need to be reported to the manufacturer / supplier.
Operate unit as specified in this manual.
!
Disconnect power before opening unit.
!
Do not leave any specimen or other parts on the working wheel.
!
Ensure that the air slots on polishing head are not obstructed.
!
When unit is not in use turn off water and air.
!
Keep hands clear of the specimen holder when the machine is running. Do not place or
position hands under specimen holder when it is in the raised position or when lowering
!
the head.
4.3 Emergency Statement
The FEMTO 1500 power head has been designed for polishing metallographic specimens up
to 2-inch diameter. Always follow proper operational guidelines and avoid contact with moving
parts, lubricants and abrasives. Seek appropriate medical care for cutting injuries.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
4.4 Safety Test
The emergency stop switch on the NANO polisher controls the operation of the FEMTO 1500
power head when operated in the AUTO mode. Test the emergency stop switch by running
!
the FEMTO 1500 head in the AUTO mode through the NANO polisher. The following safety
check is considered important:
Emergency stop switch
Test:
Proper
Response:
Malfunction:
Corrective
measure:
Activate main power switch.
Start NANO 1000T/ FEMTO 1500
machine in AUTO mode.
Depress emergency stop switch.
NANO 1000T and FEMTO 1500 head
stops.
NANO 1000T or FEMTO 1500 polisher
does not lose power.
If system does not power down,
disconnect power supply cord and call
service technician.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
5.4 AUTO Polishing Mode
1. Install working wheel and attach grinding papers /
polishing cloths.
Position the specimen holder so that the sample
tracks over the entire diameter of the grinding
papers in order to break the grinding papers
uniformly. Note positioning is not as significant
for polishing pads.
2. Power on the FEMTO and NANO machines
using the power switch located on the back of the
units.
Find and press the AUTO button on the FEMTO,
a light will illuminate when selected
Set an approximate pressure and head speed on
the FEMTO head.
Adjust
polishing
force
Adjust
head
speed
Set to
Auto mode
3. Set the base speed, time and direction on the
NANO controller (see next page for instructions)
4. Rotate water spout over working wheel. During
sample preparation adjust water flow by turning
water control knob as required. Note: Initial
operation of water valve may contain air in the
lines. Turn water on slowly to purge air from
system.
4. Depress AUTO mode button on the NANO,
ensure red light is illuminated. To start operation
press RUN/STOP button.
5. Adjust speed of the polishing head and the
applied pressure
Set to Auto
mode
Starts Auto
polishing
mode
TIP: It is recommended that the FEMTO head speed match or
exceed the NANO base speed and run in the same direction. This
provides flatter specimen samples, especially for coarse grinding.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
5.4.1 Programmable Mode
1. The programming mode can be used to pre-set the
polishing speed, direction and time for automated
polishing. It can also be used to change the Preset
speed buttons.
2. To change the speed of the wheel:
Press the PRG button and use the Up and Down
buttons to find SP1 and press ENTER. Use the up and
down < key to change the speed. Press ENTER to
save.
3. To program a grinding/ polishing time:
Press the PRG button and use the Up and Down
buttons to find t1 and press ENTER. Use the up and
down < key to change the time (enter in seconds displayed min-sec)
Preset speed buttons
4. To operate the pre-programmed conditions:
PRESS the AUTO button and then start the program
with the RUN/STOP button. The pre-programmed
conditions will be executed.
To change the speed setting for
the Preset speed buttons use
the following procedure:
Press the PRG button and use
the Up and Down buttons to SL
(slow speed) and press ENTER.
Use the up and down < key to
change the speed. Use Sn for
changing the medium speed
and SH for the fast speed.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
5.5 MANUAL NANO-FEMTO Polishing Mode
1. Install working wheel and attach grinding
papers / polishing cloths.
2. Power on the FEMTO and NANO machines
using the power switch located on the back of
the units.
Find and press the MANUAL button on the
FEMTO, a light will illuminate when selected
Set an approximate pressure and head speed on
the FEMTO head.
Load samples and lower the Pistons to the
DOWN position.
Press green Start button to start the FEMTO
head (NANO polisher will not start automatically
in this mode, it must be started separately).
Adjust the FEMTO speed and force.
Adjust
polishing
force
Press to
lower
pistons
Adjust
head
speed
Start/Stop
FEMTO head
Set to
Manual
3. Start the NANO head by using preset speeds
(SPL, SPM, SPH) and pressing RUN/STOP
button. Note speed can be adjusted with up and
down arrow keys.
4. Rotate water spout over working wheel. During
sample preparation adjust water flow by turning
water control knob as required. Note: Initial
operation of water valve may contain air in the
lines. Turn water on slowly to purge air from
system.
5. Both the NANO and FEMTO heads need to be
stopped by pressing the red STOP button on the
FEMTO head and also the RUN/STOP button on
the NANO controller.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
5.6 SEMI-AUTO NANO-FEMTO Polishing Mode
1. Install working wheel and attach grinding papers /
polishing cloths.
2. Power on the FEMTO and NANO machines
using the power switch located on the back of the
units.
Find and press the AUTO button on the FEMTO
control panel
Set an approximate pressure and head speed on
the FEMTO head.
Load samples.
3. Start the NANO head by using preset speeds
(SPL, SPM, SPH) and pressing RUN/STOP
button. Note speed can be adjusted with up and
down arrow keys.
Adjust the FEMTO speed and force.
The FEMTO head and NANO polisher will start
automatically in this mode, however, it will run
until the RUN/STOP button is pressed.
Adjust
polishing
force
Adjust
head
speed
Set to
Auto
mode
4. Position flexible water spout over working wheel.
During sample preparation adjust water flow by
turning water control knob as required. Note:
Initial operation of water valve may contain air in
the lines. Turn water on slowly to purge air from
system.
5. Press the RUN/STOP button on the NANO
controller to stop the polishing operation.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
457 MANUAL Hand Polishing Mode (NANO ONLY)
To use the NANO polishing without the FEMTO head, turn off the power to the FEMTO head
using the main power switch on the back of the FEMTO head.
Swing the FEMTO head out of the way.
5.7.1 Grinding / polishing by hand
1. Install working wheel and attach grinding papers / polishing cloths.
2. Power on the machine in the back and set the mode, speed, and time (if required).
3. Rotate water spout over working wheel. During sample preparation adjust water flow by
turning water control knob as required. Note: Initial operation of water valve may contain
air in the lines. Turn water on slowly to purge air from system.
4. Press RUN/STOP start and stop the machine in the manual mode.
5.7.2 Direction and speed controller (manual)
1.To change direction of the wheel:
-Press FWD (clockwise) or REV (counter clockwise),
LED will light
2. To change the speed of the wheel:
Select one of the low, medium or high preset speed
buttons and use the Up and Down arrows to fine tune
speed if required
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
5.8 Manual Mode - Programming changes
1. The programming mode can be used to pre-set
the polishing speed, direction and time for
automated polishing. It can also be used to
change the Preset speed buttons.
2. To change the speed of the wheel:
Press the PRG button and use the Up and Down
buttons to find SP1 then press ENTER. Use the
Up and Down buttons to change the speed, press
ENTER to finalize the change.
3. To program a grinding/ polishing time:
Press the PRG button and use the Up and Down
buttons to find ST1 and press ENTER. Use the
Up and Down buttons to change the time
(seconds), press ENTER to finalize the change.
4. To operate the pre-programmed conditions:
Press the AUTO button and then start the
program with the RUN/STOP button. The preprogrammed conditions will be executed.
Preset
Speeds
To change the speed setting for
the Preset speed buttons use
the following procedure:
Press the PRG button and use
the Up and Down keys to find
SL (slow speed) then press
ENTER. Use the Up and Down
button to change the speed.
Use SN for changing the
medium speed and SH for the
fast speed presets.
Start/Stop
NANO
manually
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599email: pace@metallographic.comWeb: http://www.metallographic.com
5.9 Positioning and Loading FEMTO holder
1. For grinding with abrasive papers, the specimen holder
for the FEMTO head should be positioned so that the
specimen tracks over the entire radius of the grinding
paper.
Since grinding papers break down relatively fast, it is
recommended that the hardest part of the mount
(typically the specimen) track over the entire radius in
order to uniformly break down the grinding papers. If
the specimen does not break down the grinding papers
uniformly then the softer outside part of the mount will
grind more. The result is after polishing there will be a
portion of the mount which is not fully polished. This
portion of the mount will appear as a crescent shaped
moon and can cause issues when examining the edge
of the specimen.
TIP: If you have small samples, mount them toward
the outside edge of the mount for better tracking
Position holder so that the
specimen in the mount tracks over
then entire radius of the grinding
paper.
2. Individual specimen holders do not hold the specimen
in the holder. When the head is lifted, the specimens
will remain on the working wheel. In such a case they
will need to be reloaded after changing the abrasive.
TIP: By placing a rubber O-ring around the top of the
mount it can be lifted when the head is raised and held
in place. Note you most likely will not be able to do this
if you use the splash guards.
You can use O-rings to hold
specimens in place when
head is lifted
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
5.10 Metallographic Specimen Preparation Basics
TIP: To optimize individual polishing
Rubber molds produce
square mounts
machines, the specimen mounts need
to be square. It is recommended that
the specimen be mounted in either a
compression mounting press or with a
rubber mold for castable mounting.
DO NOT USE TAPERED 2-PIECE
MOLDING CUPS for Individual
Specimen Polishing machines.
2-piece molds produce
tapered mounts
USE A BELT GRINDER OR CENTRAL POLISHING FORCE
FIXTURE FOR COARSE GRINDING!!!
Square grinding
attachment
TIP: Individual polishing machines
DO NOT require coarse planar
grinding. In fact, extremely coarse
grinding with 60 grit down to 180 grit
is not recommended.
If coarse grinding is required, it is
recommended that the PENTA 7500
belt grinder, with its square grinding
attachment be used. The FEMTO
1500 with the central sample fixture
can also be used (see Section 1.5)
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5.10.1 Rough / Planar Grinding
Rough or planar grinding, is required to produce flat specimens and to reduce the damage created by
sectioning. The planar grinding step is accomplished by decreasing the abrasive grit particle size
sequentially to obtain surface finishes that are ready for polishing. Care must be taken to avoid being
too abrasive in this step, and actually creating greater specimen damage than produced during cutting.
This is especially true for very brittle materials such as ceramics and silicon.
The machine parameters which affect the preparation of metallographic specimens include: grinding /
polishing pressure, grinding direction, and the relative velocity distribution between the specimen and
the polishing wheel.
Grinding Speed
For automated polishing the relative speed between the polishing head and the polishing wheel has a
significant effect on the flatness of the mount, especially for grinding with coarse abrasives. As an
example, the following two conditions show the effect of running with the head and base speed in the
contra direction as well as running the head and base speeds in the same direction at the same speed.
High relative velocity difference (contra)
between the polishing head and polishing base
Low relative velocity difference
(complementary) between the polishing head
and polishing base
Based on the relative velocity distributions for grinding / polishing the best condition for maintaining a
uniform velocity across the specimen as it rotates around the polishing wheel is to run them in the
same direction at the same speed. In addition, changing the offset as well as the combination speed
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can control the aggressiveness of the
grinding/ polishing operation.
It is also very important for polishing
machines which use individual force
pistons for applying the polishing force to
run the power head and base at closely
matching speeds and in the
complementary direction. If these
machines are run with significantly different
speeds or direction the mount will have a
tendency to grind with a wedge and
therefore it will not be square.
Grinding Pressure
Grinding / polishing pressure is dependent upon the applied force (pounds or Newton's) and the area
of the specimen and mounting material. Pressure is defined as the Force/Area (psi, N/m2 or Pa). For
specimens significantly harder than the mounting compound, pressure is better defined as the force
divided by the specimen surface area. Thus, for larger hard specimens, higher grinding / polishing
pressures increase stock removal rates. However, higher pressure also increases the amount of
surface and subsurface damage produced in the specimen.
Note regarding SiC grinding papers: as the abrasive grains dull and cut rates decrease, increasing
grinding pressures can extend the life of the SiC paper.
Higher grinding / polishing pressures can also generate additional frictional heat which may be
beneficial for the chemical mechanical polishing (CMP) of ceramics, minerals and composites.
Likewise for extremely friable specimens (such as nodular cast iron), higher pressures and lower
relative velocity distributions can aid in retaining inclusions and secondary phases.
Grinding Direction
The orientation of the specimen can have a significant impact on the preparation results, especially for
specimens with coatings. In general, when grinding and polishing materials with coatings, the brittle
component should be kept in compression. In other words, for brittle coatings, the direction of the
abrasive should be through the coating and into the substrate. Conversely, for brittle substrates with
ductile coatings, the direction of the abrasive should be through the brittle substrate and into the
ductile coating.
Manual Preparation
In order to ensure that the previous rough grinding damage is removed when grinding by hand, the
specimen should be rotated 90 degrees and continually ground until all of the scratches from the
previous grinding direction are removed. When necessary, the abrasive paper should be replaced with
a newer paper to maintain cutting rates.
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5.10.2 Rough Polishing
The purpose of the rough polishing step is to remove the damage produced during cutting and planar
grinding. Proper rough polishing will maintain specimen flatness and retain all inclusions or
secondary phases. By eliminating the previous damage and maintaining the microstructural integrity
of the specimen at this step, a minimal amount of time is required to remove the cosmetic damage at
the final polishing step.
Rough polishing is accomplished primarily with diamond abrasives ranging from 9 micron to 1
micron. Polycrystalline diamond -- because of its multiple and small cutting edges -- produces high
cut rates with minimal surface damage. Therefore, polycrystalline diamond abrasives are
recommended for metallographic rough polishing on low-napped polishing cloths.
Microelectronic specimens Diamond-lapping films are recommended.
Plastics and polymers 800 and 1200 grit SiC abrasive paper are recommended.
Plasma spray materials
Rough polishing typically requires two polishing steps, e.g., a 6micron diamond followed by a 1-micron diamond on low-napped
polishing cloths.
Low-nap polishing pads using polycrystalline diamond, alternating
with colloidal silica. This provides a chemical mechanical
polishing (CMP) effect which results in a damage-free surface
Diamond-lapping films are recommended.
Low-napped polishing pads with polycrystalline diamond,
alternating with colloidal silica. Alternatively, diamond-lapping
films may work well.
Diamond-lapping films or low-napped polishing pads with
alternating diamond and colloidal silica abrasives.
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5.10.3 Final Polishing
The purpose of final polishing is to remove only the cosmetic surface damage. It should not be used
to remove any damage remaining from cutting and planar grinding. If the damage from these steps is
not completely removed, the rough polishing step should be repeated or continued.
Final Polishing Guidelines
Material Recommendation
Metals (ferrous, nonferrous, tool steels, super
alloys, etc.)
Ceramics and ceramic
matrix composites (CMC)
Polymer matrix composites
(PMC)
Biomaterials
Microelectronic specimens
Plastics and polymers Light polish with alumina on a high-napped polishing pad.
Plasma spray materials
High-napped polishing pads with a nanometer alumina polishing
abrasive. The polishing times should nominally be less than 30
seconds.
Low-napped polishing pads using 1-um polycrystalline diamond,
alternating with colloidal silica or colloidal silica alone.
Fine abrasive diamond-lapping films, followed by a very light polish
on a high-napped polishing pad.
Low-napped polishing pads with polycrystalline diamond, alternating
with colloidal silica.
Diamond-lapping films followed by a very light polish on a
high-napped polishing pad.
Diamond-lapping films followed by a very light and short alumina or
colloidal silica polish on a high-napped polishing pad.
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5.11 Selected Polishing Procedures
Metallographic specimen preparation requires knowledge of the specimen properties, the most
important characteristics are the hardness and ductility of the metallographic specimen. Based
on these material properties, the proper metallographic consumables and equipment parameters can be determined. The following chart shows the hardness and ductility for most metallographic material classes that are analyzed by metallographic techniques. Specimen procedures
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CLASS 1 Polishing Procedures
5.11.1 Aluminum and Aluminum Alloys
Aluminum and aluminum alloys are difficult to prepare because
they are soft and contain oxide particles which can become
dislodged and scratch the surface. The key to polishing aluminum
is to use very fine polishing abrasives (fine aggregates).
Abrasive/surface Lubricant
P120 grit ALO paper*
P220 grit ALO paper*
P220 grit ALO paper
P500 grit ALO paper
P1200 grit ALO paper
1 um DIAMAT diamond on
ATLANTIS pad
0.05 um Nanometer alumina on
NAPPAD pad
Water
Water
DIALUBE Purple
Extender
60-75 1 minute 100 rpm / 100 rpm
FEMTO pressure
setting (psi)
60-75 200 rpm / 200 rpm
60-75
60-75 2 minutes 200 rpm / 200 rpm
200 rpm / 200 rpm
* Recommended for Central Force holders (this step not required for Individual Force holders)
Time Head / Wheel speed
Until plane
1 minute
Until plane
1 minute
1 minute
Aluminum-Silicon Alloy, B.F. 200X
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CLASS 2 Polishing Procedures
5.11.2 Rhenium and Refractory Alloys
Refractory metals such as Rhenium, Niobium, Tungsten and Molybdenum are
a very soft, and any loose or fracture abrasive particles can easily embed. This
makes specimen preparation very difficult because it gums up diamond
grinding disks or becomes embedded with fractured SiC particles when ground
with SiC papers. The key to preparation of this material is to use the tougher
alumina abrasive and to chemically etch the specimen between each grinding
step. The purpose of etching is to remove the embedded particles and not carry
them over as contamination.
Abrasive/surface Lubricant
P120 grit ALO paper*
P220 grit ALO paper*
P220 grit ALO paper
P500 grit ALO paper
P1200 grit ALO paper
1 um DIAMAT diamond on
ATLANTIS pad
Water
Water
DIALUBE Purple
Extender
FEMTO pressure
setting (psi)
60-75
60-75
60-75 2 minutes
100/100 rpm
100/100 rpm
100/100 rpm
Polishing with
10% Diluted
0.05 um acidic Nanometer
acid alumina on a
BLACKCHEM 2 pad
etchant below:
5-10 lbs 1 minute 100/100 rpm
Rhenium - 30 ml
lactic acid, 30 ml
HNO3, 1 ml HF
* Recommended for Central Force holders (this step not required for Individual Force holders)
Time Head / Wheel speed
Until plane
1 minute
Until plane
1 minute
1 minute
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CLASS 3 Polishing Procedures
5.11.3 Cast Irons
Cast irons are difficult materials to prepare properly because the
graphite nodules (or graphite flakes) are easily pulled out during
preparation. By minimizing the sectioning damage and by
starting with a modest-grit-size SiC paper, retaining these difficult
particles can be accomplished.
Abrasive/surface Lubricant
120 grit SiC paper*
240 grit SiC paper*
360 grit SiC paper
600 grit SiC paper
800 grit SiC paper
1200 grit SiC paper
1 um DIAMAT diamond on
GOLDPAD pad
0.05 um Nanometer alumina
on TRICOTE pad
* Recommended for Central Force holders (this step not required for Individual Force holders)
Water 5-10 lbs 200/200 rpm
Water 5-10 lbs 200/200 rpm
DIALUBE
Purple Extender
5-10 lbs 100/100 rpm 1 minute
FEMTO pressure
setting (psi)
5-10 lbs 200/200 rpm 2 minutes
Head / Wheel speed Time
Until plane
1 minute 1 minute
1 minute
1 minute
1 minute
1 minute
Nodular Cast Iron microstructure, Etchant 2%
Nital, Mag. 100X
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Graphite Cast Iron microstructure, Etchant 2%
Nital, Mag. 500X
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CLASS 4 Polishing Procedures
5.11.4 Microelectronics
The microstructural preparation of electronic packages presents some very
difficult challenges, such as abrasives embedding in very soft solder joints,
edge rounding, polishing relief between very hard (ceramic) or brittle
(silicon) materials and the very soft plastic and metal solders. The use of
alumina lapping films are very useful for maintaining flatness and for
minimizing fractured abrasive embedding for non-ceramic substrates. For
specimens with ceramic substrates, diamond lapping films are recommended.
Abrasive/surface Lubricant
30 micron alumina lapping
film*
15 micron alumina lapping
film*
9 micron alumina lapping
film
6 micron alumina lapping
film
3 micron alumina lapping
film
1 um DIAMAT diamond on
ATLANTIS polishing pad
SIAMAT colloidal silica on a
MICROPAD polishing pad
* Recommended for Central Force holders (this step not required for Individual Force holders)
POLYLUBE
Extender
POLYLUBE
Extender
POLYLUBE
Extender
POLYLUBE
Extender
POLYLUBE
Extender
DIALUBE
Purple Extender
5-10 lbs 100/100 rpm 1 minute
FEMTO pressure
setting (psi)
5-10 lbs 100/100 rpm Until plane
5-10 lbs 100/100 rpm 1-2 minutes
5-10 lbs 100/100 rpm 1-2 minutes
5-10 lbs 100/100 rpm 1-2 minutes
5-10 lbs 100/100 rpm 1-2 minutes
5-10 lbs 100/100 rpm 1-2 minutes
Head / Wheel speed Time
Electronic die cross section
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CLASS 5 Polishing Procedures
5.11.5 Stainless Steels
Stainless steels have high concentrations of chromium (>12%) and are
generally relatively soft as compared to heat treated steels. This makes
stainless steel more susceptible to smearing. Preparation is relatively
straight forward.
Abrasive/surface Lubricant
120 grit SiC paper*
240 grit SiC paper*
360 grit SiC paper
600 grit SiC paper
800 grit SiC paper
1200 grit SiC paper
1 um DIAMAT diamond on
GOLDPAD polishing pad
0.05 um Nanometer alumina
on TRICOTE polishing pad
* Recommended for Central Force holders (this step not required for Individual Force holders)
Water 5-10 lbs 200/200 rpm
Water 5-10 lbs 200/200 rpm
DIALUBE
Purple Extender
5-10 lbs 100/100 rpm 1 minute
FEMTO pressure
setting (psi)
5-10 lbs 200/200 rpm 2 minutes
Head / Wheel speed Time
Until plane
1 minute
1 minute
1 minute
1 minute
1 minute
431 Stainless Steel, mag. 400X, etched with Modified
Murakami's
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300 Series Cast Stainless Steel, 200X (BF), Etchant
Oxalic Acid.
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CLASS 6 Polishing Procedures
5.11.6 Super Alloys
Superalloys are high-performance alloys which exhibits excellent
mechanical strength and creep resistance at high temperatures,
good surface stability, and corrosion and oxidation resistance. The
base element in Superalloys are nickel, cobalt, nickel-iron.
Abrasive/surface Lubricant
120 grit SiC paper*
240 grit SiC paper*
360 grit SiC paper
600 grit SiC paper
9 um DIAMAT diamond on
POLYPAD polishing pad
6 um DIAMAT diamond on
TEXPAN polishing pad
1 um DIAMAT diamond on
GOLDPAD polishing pad
0.05 um Nanometer alumina
on TRICOTE polishing pad
* Recommended for Central Force holders (this step not required for Individual Force holders)
Water 5-10 lbs 200/200 rpm
Water 5-10 lbs 200/200 rpm
DIALUBE
Purple Extender
DIALUBE
Purple Extender
DIALUBE
Purple Extender
5-10 lbs 200/200 rpm 1 minute
FEMTO pressure
setting (psi)
5-10 lbs 200/200 rpm 2 minutes
5-10 lbs 200/200 rpm 2 minutes
5-10 lbs 200/200 rpm 2 minutes
Head / Wheel speed Time
Until plane
1 minute
1 minute
1 minute
Fe-Ni-Co-Al Alloy, 400X (Polarized Light)
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CLASS 7 Polishing Procedures
5.11.7 Thermal Spray Coatings
The metallographic specimen preparation of thermal spray coatings is
affected by the specimen composition and deposition conditions.
Microstructural features of interest include: porosity, flow, thickness and
inclusions. Proper metallurgical preparation takes into account that the
microstructure may be porous and perhaps somewhat brittle because of
inadequate processing.
Abrasive/surface Lubricant
180 grit SiC paper*
240 grit SiC paper*
320 grit SiC paper
400 grit SiC paper
600 grit SiC paper
800 grit SiC paper
1200 grit SiC paper
3 um DIAMAT diamond on
GOLDPAD polishing pad
1 um DIAMAT diamond on
ATLANTIS polishing pad
Final Polish on Vibratory Polisher using CMP polishing suspension and a MICROPAD polishing pad
* Recommended for Central Force holders (these steps are not required for Individual Force holders)
Water 5-10 lbs 200/200 rpm
Water 5 lbs 200/200 rpm
DIALUBE
Purple Extender
SIAMAT
Colloidal Silica
FEMTO pressure
setting (psi)
5 lbs 200/200 rpm 2 minutes
10 lbs 200/200 rpm 2 minutes
Head / Wheel speed Time
Until plane
1 minute
1 minute
1 minute
1 minute
1 minute
Nickel Chrome Coating, Mag 1000x (B.F.)
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CLASS 9 Polishing Procedures
5.11.9 Metal Matrix Composites
Hard particles in a metal matrix can be difficult to prepare
because of particle pull-out as well as excessive relief between
the particles and the matrix. The key to preparation of metal
matrix composites (MMC) is to minimize damage at each
preparation stage. This includes sectioning with the appropriate
diamond wafering blade and using the finest practical abrasive
for initial grinding. Polishing with SIAMAT colloidal silica provides
a chemical mechanical polishing (CMP) action which is the most
effective means for eliminating both surface and subsurface damage. The combination of SIAMAT
colloidal silica with DIAMAT polycrystalline diamond also produces the required surfaces finishes in a
minimal amount of time.
Abrasive/surface Lubricant
30 um DIAMAT diamond
suspension on CERMESH Metal
Mesh cloth
9 um DIAMAT diamond on
POLYPAD polishing pad
3 um DIAMAT diamond on
TEXPAN polishing pad
0.05 micron NANOMETER
alumina on TRICOTE polishing
pad
5-10 lbs 200/200 rpmUntil plane
5-10 lbs 200/200 rpm3 minutes
SIAMAT
colloidal silica
5-10 lbs 100/100 rpm 1 minute
FEMTO pressure
setting (psi)
5-10 lbs 200/200 rpm 3 minutes
Head / Wheel speed Time
SiC particles in an Aluminum Matrix, 400X (DIC)
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Zirconium Diboride particles in a Titanium Matrix
Etched, 1000X (DIC)
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CLASS 10 Polishing Procedures
5.11.10 Engineered Ceramics
Engineered ceramics have found increasing applications for high
temperature, corrosion resistance, low wearability and a number of
other applications. An example of a Class 10 specimen preparation
technique is for aluminum oxynitride (AlON) which is a ceramic
composed of aluminum, oxygen and nitrogen. It is a transparent
ceramic that is harder than glass.
Abrasive/surface Lubricant
30 um DIAMAT diamond
suspension on CERMESH Metal
Mesh cloth
9 um DIAMAT diamond on
POLYPAD polishing pad
3 um DIAMAT diamond on
TEXPAN polishing pad
0.05 micron NANOMETER
alumina on TRICOTE polishing
pad
5-10 lbs 200/200 rpmUntil plane
5-10 lbs 200/200 rpm3 minutes
SIAMAT
colloidal silica
5-10 lbs 100/100 rpm 1 minute
FEMTO pressure
setting (psi)
5-10 lbs 200/200 rpm 3 minutes
Head / Wheel speed Time
AlON ceramic, B.F. 1000X (as polished)
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CLASS 11 Polishing Procedures
5.11.11 Glass and Minerals
Glasses and minerals are generally fairly hard and have a tendency
to fracture. Proper specimen preparation requires that the damage
during specimen preparation be minimized, even as early as the
sectioning or cutting operation.
Abrasive/surface Lubricant
30 um DIAMAT diamond
suspension on CERMESH Metal
Mesh cloth
9 um DIAMAT diamond on
POLYPAD polishing pad
3 um DIAMAT diamond on
TEXPAN polishing pad
0.05 micron NANOMETER
alumina on TRICOTE polishing
pad
5-10 lbs 200/200 rpmUntil plane
5-10 lbs 200/200 rpm3 minutes
SIAMAT
colloidal silica
5-10 lbs 100/100 rpm 1 minute
FEMTO pressure
setting (psi)
5-10 lbs 200/200 rpm 3 minutes
Head / Wheel speed Time
Alumino-silicate glass ceramic, 400X (Polarized
light) as polished
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Slag, 100X (Polarized light), as polished condition
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8.2 Diamond Grinding Disks
Diamond grinding is the most useful for removing material from ceramics and ceramic matrix composites. It is
also useful for hard non-ferrous metals such as titanium and zirconium. Diamond Grinding Disks are available in
9, 15, 30, 45, 70, 125 and 250 micron grit sizes.
In general, for grinding other ferrous, steel and softer non-ferrous metals, diamond is typically not the best
choice from both a performance and cost perspective.
9 micron Diamond
Disk
75 micron
Diamond Disk
Fixed Diamond Grinding Disks with Close-up
15 micron Diamond
Disk
250 micron
Diamond Disk
125 micron
Diamond Disk
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8.3 Composite Grinding Plates
Composite grinding disks are an alternative to intermediate grinding and polishing. PACE
Technologies composite disk vary slightly from other competitive products in that they are pre-charged
with diamond. This allows the disks to cut faster and longer. Two disks types are available, the ORION
composite polishing disk is pre-charged with 3 micron diamond, whereas the SIRIUS composite disk is
pre-charged with 9 micron diamond.
The SIRIUS composites grinding disks offer an alternative to grinding with 320-600 grit SiC
papers, and the ORION composite disk offer an excellent alternative to rough polishing with 3-6
micron diamond.
Composite grinding disks using diamond suspensions.
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8.5 Polycrystalline Diamond Abrasives
Polycrystalline diamond is a synthetic diamond which
provides better surface finishes and higher removal rates
than monocrystalline diamond. The following are the
advantages of a polycrystalline diamond over a
monocrystalline diamond:
Higher removal rates (self-sharpening abrasive)
Very uniform surface finish
More uniform particle size distribution
Harder / tougher particles
Blocky - shaped particles
Hexagonal (equally hard in all directions)
microcrystallites
Extremely rough surface (more cutting points)
Surface area is 300% greater than with a
monocrystalline diamond
No abrasion-resistant
directionality (abrasion
Diamond Size (um) Color code
0.10
0.25
0.50
1.0
3.0
6.0
9.0
15
30
45
Charcoal
Gray
White
Blue
Green
Yellow
Red
Brown
Orange
Purple
Monocrystalline blocky - diamond
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8.6 Final Polishing Abrasives
Final polishing abrasives include fine diamond, alumina
and colloidal silica. For successful microstructural preparation, the polishing abrasive / cloth
combination must be appropriately matched to the specimen hardness, fracture toughness and
corrosion properties of the specimen.
Colloidal Silica
Colloidal silica is a relatively soft abrasive with high chemical activity. It is an ideal chemical
mechanical polishing (CMP) abrasive. The chemical activity of colloidal silica results from the
electrochemical balance (zeta potential) required to keep very fine particles from aggregating. This
chemical balance also produces a surface phenomenon which makes the specimen surface more
chemically active. This produces a surface layer which can be mechanically removed by the colloidal
silica particles themselves, or by the mechanical scrubbing of the surface with the polishing pad.
For ceramics, the combination of fine polycrystalline diamond and colloidal silica improves surface
finishes and increases polishing rates.
Nanometer Alumina
Nanometer alumina is a polycrystalline colloidal alumina processed by a proprietary seeded gell
process. Polycrystalline alumina offers two significant improvements over conventional alumina
calcining processes:
1. Tighter, more controlled particle size distributions
2. Harder alpha alumina particles
The tighter, more controlled particle size distribution is a result of less particle aggregation which
produces significantly less scratching in soft metals, such as aluminum, tin, lead, copper and soft
steels.
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