EXAMINED BY :
APPROVED BY
:
C
USTOMER
FILE NO
. CAS-0006502
EMERGING DISPLAY
ISSUE
: OCT.31, 2007
TECHNOLOGIES CORPORATION
TOTAL PAGE
VERSION
: 2
: 26
A
CCEPTANCE
S
PECIFICATIONS
MODEL NO. :
E T 0 2 4 0 0 6 D M U
FOR MESSRS :
(R oH S )
CUSTOMER'S APPROVAL
:
DATE
_____________________________
:
BY
_____________________________
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
R E C O R D S OF R E V I S I O N
D A T E
OCT.31, 2007 5 DELETE 5.2 PARALLEL INTERFACE CHARACTISTICS(6800-SERIES MPU)
11 8. BLOCK DIMENSION
REVISING THE ENTIRE PAGE
13,14 10. INTERFACE SIGNALS
REVISING THE ENTIRE PAGE
REVISED
PAGE
NO.
MODEL NO.
E T 0 2 4 0 0 6 D M U
DOC . FIRST ISSUE
S U M M A R Y
VERSION PAGE
2 0-1
OCT.23, 2007
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO.
E T 0 2 4 0 0 6 D M U
VERSION PAGE
2 0-2
T A B L E O F C O N T E N T S
NO. I T E M PAGE
===============================================================
1.
2. MECHANICAL SPECIFICATIONS
3.
4.
5. TIMING CHARACTERISTICS
6.
7.
8.
9. DETAIL DRAWING OF DOT MATRIX
10. INTERFACE SIGNAL
11. POWER SUPPLY
12. INSPECTION CRITERION
GENERAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
OPTICAL CHARACTERISTICS
OUTLINE DIMENSIONS
BLOCK DIMENSIONS
----------------------------------------------------
--------------------------------------------
---------------------------------------------
-------------------------------------------------
-------------------------------------------------------
------------------------------------------------
---------------------------------------
-------------------------------------
-------------------------------------
-------------------------------------
---------------------------------------
---------------------------------
1
1
2
3
4 ~ 6
7
8 , 9
10
11
12 , 13
14
15 ~ 26
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO.
E T 0 2 4 0 0 6 D M U
1. GENERAL SPECIFICATIONS
1 . 1 APPLICATION NOTES FOR CONTROLLER/DRIVER
PLEASE REFER TO :
H I M A X H X 8 3 4 7 - A
1 . 2 MATERIAL SAFETY DESCRIPTION
ASSEMBLIES SHALL COMPLY WITH EUROPEAN ROHS REQUIREMENTS,
INCLUDING PROHIBITED MATERIALS/COMPONENTS CONTAINING
LEAD,MERCURY, CADMIUM, HEXAVALENT CHROMIUM,
POLYBROMINATED BIPHENYLS (PBB) AND POLYBROMINATED
DIPHENYL ETHERS (PBDE)
2 . MECHANICAL SPECIFICATIONS
( 1 ) DISPLAY SIZE (inch)
( 2 ) NUMBER OF DOTS
( 3 ) MODULE SIZE
--------------------------------
---------------------------
--------------------------
2.4”
240W * (RGB) * 320H DOTS
42.72W * 60.26H * 3D mm
(WITHOUT FPC SIZE)
VERSION PAGE
2 1
( 4 ) ACTIVE AREA
( 5 ) DOT SIZE
( 6 ) PIXEL SIZE
( 7 ) LCD TYPE
( 8 ) COLOR
( 9 ) VIEWING DIRECTION
( 10 ) BACK LIGHT
---------------------------------
--------------------------------------
-------------------------------------
-----------------------------------
--------------------------------------
----------------------------------
-----------------------
36.72W * 48.96H mm (LCD)
0.051W * 0.153H mm
0.153W * 0.153H mm
TFT , TRANSMISSIVE
262K (18BIT)
12 O’CLOCK
LED , COLOR : WHITE
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO.
E T 0 2 4 0 0 6 D M U
VERSION PAGE
2 2
3 . ABSOLUTE MAXIMUM RATINGS
3 . 1 ELECTRICAL ABSOLUTE MAXIMUM RATINGS .
PARAMETER SYMBOL MIN. MAX. UNIT REMARK
INPUT POWER SUPPLY IOVCC/VCI -0.3 4.6 V
INPUT VOLTAGE V
STATIC ELECTRICITY
LED BACKLIGHT POWER
DISSIPATION
LED BACKLIGHT
FORWARD CURRENT
LED BACKLIGHT
REVERBE VOLTAGE
NOTE( 1 ) : LCM SHOULD BE GROUNDED DURING HANDING LCM.
- 0.3 VCI+0.3 V
I
⎯
PD
IF
VR
⎯
⎯
⎯
⎯
⎯
324 mW
90 mA
5 V
V NOTE ( 1 )
3 . 2 ENVIRONMENTAL ABSOLUTE MAXIMUM RATINGS .
OPERATING STORAGE
AMBIENT TEMPERATURE
HUMIDITY NOTE ( 4 ) NOTE ( 4 )
VIBRATION
SHOCK
CORROSIVE GAS NOT ACCEPTABLE NOT ACCEPTABLE
I T E M
MIN. MAX. MIN. MAX.
- 2 0 °C 7 0
⎯
⎯
C - 3 0 °C 8 0
°
( 3G)
2
2
⎯
⎯
2.45m/S
( 0.25G)
29.4 m/S
C
°
11.76m/S
( 1.2 G )
490m/S
( 50 G )
2
2
REMARK
NOTE ( 2 ), ( 3 )
WITHOUT
CONDENSATION
5~20Hz , 1HR
20~500Hz(20Hz) , 1HR
20~500Hz(500Hz) , 1HR
X,Y,Z,TOTAL 3HRS
10 m SECONDS
XYZ
DIRECTIONS
1 TIME EACH
NOTE ( 2 ) : Ta AT -30°C : 48HRS MAX .
80°C : 168HRS MAX .
NOTE ( 3 ) : BACKGROUND COLOR CHANGES SLIGHTLY DEPENDING ON AMBIENT
TEMPERATURE THIS PHENOMENON IS REVERSIBLE .
NOTE ( 4 ) : Ta ≤ 60°C : 90%RH (96HRS MAX .)
Ta > 60°C : ABSOLUTE HUMIDITY MUST BE LOWER THAN THE HUMIDITY OF
90%RH AT 60°C.(96 HRS MAX.)
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
4 . ELECTRICAL CHARACTERISTICS
PARAMETER SYMBOL CONDITION MIN. TYP. MAX. UNIT REMARK
POWER SUPPLY FOR
ANALOG
POWER SUPPLY FOR
INTERFACE SIGNAL
V
INPUT VOLTAGE
NOTE ( 1 )
V
OUTPUT VOLTAGE
NOTE ( 1 )
OUTPUT CURRENT
NOTE (2)
VOLTAGE OF B/L VF IF = 60mA 3.0 3.3 3.6 V NOTE(3)
NOTE ( 1 ) : APPLIED TO TERMINALS , NRESET, D0~D17 , SDO ,SDI , RD_E , NWR_RNW ,
DNC_SCL ,TE.
NOTE ( 2 ) : IC : I
NOTE ( 3 ) : INTERNAL CIRCUIT DIAGRAM
VCI
+ I
IOVCC
VCI
I
OVCC
H LEVEL 0.8I
IH
VIL L LEVEL -0.3
H LEVEL 0.8I
OH
VOL L LEVEL
IC
MODEL NO.
⎯
⎯
⎯
E T 0 2 4 0 0 6 D M U
2.3 2.8 3.3 V
1.65 2.8 3.3 V
OVCC
OVCC
⎯
⎯
⎯
⎯
⎯
⎯
5 10 mA NOTE(2)
I
0.2 I
0.2 I
OVCC
OVCC
⎯
OVCC
VERSION PAGE
V
V
V
2 3
V
Ta = 25 °C
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
5 . TIMING CHARACTERISTICS
MODEL NO.
E T 0 2 4 0 0 6 D M U
VERSION PAGE
2 4
5.1 PARALLEL INTERFACE CHARACTISTICS (8080-SERIES MPU)
SIGNAL
DNC_SCL
NCS
NWR_RNW
NDR_E
D17 TO D0
SYMBOL
t
AST
t
AHT
t
CHW
t
CS
t
RCSFM
t
CSF
t
CSH
t
WC
t
WRH
t
WRL
t
DRCFM
t
RDHFM
t
RDLFM
t
DST
t
DHT
t
RATFM
t
ODH
PARAMETER
ADDRESS SETUP TIME
ADDRESS HOLD TIME (WRITE/READ)
CHIP SELECT “H” PULSE WIDTH
CHIP SELECT SETUP TIME(WRITE)
CHIP SELECT SETUP TIME
SHIP SELECT WAIT TIME(WRITE/READ)
CHIP SELECT HOLD TIME
WRITE CYCLE
CONTROL PULSE “H” DURATION
CONTROL PULSE “L“ DURATION
READ CYCLE
CONTROL PULSE “H“ DURATION
CONTROL PULSE ”L“ DURATION
DATA SETUP TIME
DATA HOLD TIME
READ ACCESS TIME
OUTPUT DISABLE TIME
MIN.
10
10
0
35
180
10
10
100
15
20
250
15
180
10
10
⎯
20
MAX.
TYP.
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
180
80
ns
ns
ns
ns
ns
DESCRIPTION
WHEN READ FROM
GRAM
FOR MAXIMUM
C
L = 30pF
FOR MINIMUM
L = 8pF
C
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO.
E T 0 2 4 0 0 6 D M U
VERSION PAGE
2 5
5.2 SERIAL INTERFACE CHARACTISTICS
SERIAL CLOCK CYCLE(WRITE)
DNC_SCL “H” PULSE WIDTH(WRITE)
DNC_SCL ”L” PULSE WIDTH ( WRITE)
DATA SETUP TIME(WRITE)
DATA HOLD TIME(WRITE)
SERIAL CLOCK CYCLE (READ)
DNC_SCL “H“ PULSE WIDTH (READ)
DNC_SCL ”L” PULSE WIDTH (READ)
ACCESS TIME
OUTPUT DISABLE TIME
DNC_SCL TO CHIP SELECT
NCS “H” PULSE WIDTH
CHIP SELECT SETUP TIME
CHIP SELECT HOLD TIME
PARAMETER
SYMBOL
t
SCYCW
t
SHW
t
SHW
t
SDS
t
SDH
t
SCYCR
t
SHR
t
SLR
t
ACC
tOH
t
SCC
t
CHW
t
CSS
t
CSH
CONDITIONS
DNC_SCL
SDI
DNC_SCL
SDO FOR MAXIMUM CL=30pF
FOR MINIMUM C
SDO FOR MAXIMUM CL=30pF
FOR MINIMUM C
DNC_SCL , NCS 50
NCS 45
NCS
L = 8pF
L = 8pF
MIN.
100
35
35
30
30
150
60
100
10
15
60
80
MAX.
TYP.
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯ ⎯
⎯ ⎯
⎯
⎯
UNIT
⎯
ns
⎯
⎯
⎯
ns
⎯
⎯
ns
⎯
⎯
100 ns
100 ns
ns
ns
⎯
ns
⎯
02101300-01-02
1
⎯
⎯
⎯
⎯
⎯
5
120
⎯
WHEN RESET
APPLIED DURING
STB MODE
WHEN RESET
APPLIED DURING
STB MODE
RESET GOES HIGH
LEVEL AFTER
POWER ON
VERSION PAGE
2 6
µ
⎯
UNIT
s
ms
ms
ms
⎯
⎯
MODEL NO.
E T 0 2 4 0 0 6 D M U
⎯
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
5.3 RESET INPUT TIMING
SYMBOL PARAMETER RELATED PINS MIN. TYP. MAX. NOTE
tRESW
tREST
tPRES
RESET LOW PULSE
WIDTH
RESET COMPLETE
RESET GOES HIGH
LEVEL AFTER
POWER ON TIME
TIME
(2)
(1)
NRESET 10
NRESET&
IOVCC
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
6 . OPTICAL CHARACTERISTICS NOTE ( 1 )
VIEWING
ANGLE
CONTRAST RATIO CR
t r ( rise )
RESPONSE TIME
THE BRIGHTNESS
OF MODULE
X
X
COLOR OF
CIE
X
COORDINATE
X
THE BRIGHTNESS OF
UNIFORMITY
NOTE (1) : TEST EQUIPMENT SETUP :
AFTER STABILIZING AND LEAVING THE PANEL ALONE AT A GIVEN TEMPERATURE FOR
30 MINUTES, THE MEASUREMENT SHOULD BE EXECUTED. MEASUREMENT SHOULD BE
EXECUTED IN A STABLE, WINDLESS , AND DARK ROOM. OPTICAL SPECIFICATIONS ARE
MEASURED BY TOPCON BM-7(FAST) WITH A VIEWING ANGLE OF 2° AT A DISTANCE OF
50cm AND NORMAL DIRECTION.
I T E M SYMBOL CONDITION MIN. TYP. MAX. UNIT REMARK
x+
HOR.
VER.
RED
GREEN
BLUE
WHITE
θ
x-
θ
y+
θ
y-
θ
t f ( fall )
B
0.587 0.617 0.647
R
YR 0.312 0.342 0.372
0.293 0.323 0.352
G
YG 0.571 0.601 0.631
0.112 0.142 0.172
B
YB 0.047 0.077 0.107
0.250 0.300 0.350
W
Y
W
⎯
MODEL NO
E T 0 2 4 0 0 6 D M U
y=0
CENTER
CR≥10
θ
θ
θ
IF = 60mA
θ
VIEWING
NORMAL ANGLE
θ
NTSC = 60%
θ
x=0
θ
x = θy = 0
x = θy = 0°
x = θy = 0°
x = θy = 0°
x = θy = 0°
⎯
.
60 65
°
35 40
60 65
°
25 30
200 250
°
⎯
⎯
250 300
0.270 0.320 0.370
70 75
10 20
20 30
VERSION PAGE
⎯
⎯
⎯
⎯
⎯
⎯
⎯
2 7
deg . NOTE(2)
NOTE(2)
ms NOTE(2)
2
cd/m
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Ta = 2 5 °C
NOTE(3)
NOTE(3)
NOTE(4)
7)
NOTE (2) : PLEASE REFER TO 12.3 DEFINITION OF OPTICAL CHARACTERISTICS.
NOTE (3) : THE BRIGHTNESS TEST METHOD (BRIGHTNESS MEASURED WHEN LCD IS AT “ WHITE
STATE” )
○
ADD POWER TO LED, A、K PIN TEST POINT ARE
NOTE (4) : TNE BRIGHTNESS VNIFORMITY CALCULATE METHOD
⎡
−
1: UNIFORMITY ×
⎢
⎣
BRIGHTESS AVERAGE
BRIGHTESS MINIMUN - BRIGHTESS MAXIMUN
○
~
1
9
⎤
⎥
⎦
%100
02101300-01-02
E M E R G I N G D I S P L A Y
N
TECHNOLOGIES CORPORATION
7 . OUTLINE DIMENSIONS
MODEL NO.
E T 0 2 4 0 0 6 D M U
VERSION PAGE
2 8
UNIT : mm
SCALE : NTS
OT SPECIFIED TOLERANCE IS ± 0.3
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO.
E T 0 2 4 0 0 6 D M U
VERSION PAGE
2 9
DETAIL A
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
8 . BLOCK DIMENSION
MODEL NO.
E T 0 2 4 0 0 6 D M U
VERSION PAGE
2 10
02101300-01-02
N
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
9 . DETAIL DRAWING OF DOT MATRIX
MODEL NO
E T 0 2 4 0 0 6 D M U
36.72
0.153
0.051
R
G
B
0.153
R
G
B
.
VERSION PAGE
2 11
48.96
240(RGB)*320 DOTS
UNIT : mm
SCALE : NTS
OT SPECIFIED TOLERANCE IS ± 0.1
DOTS MATRIX TOLERANCE IS ± 0.01
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
10 . INTERFACE SIGNALS
MODEL NO
E T 0 2 4 0 0 6 D M U
.
PIN NO SYMBOL FUNCTION
1 VLED POWER SUPPLY FOR LED ( + )
2 VLSS POWER SUPPLY FOR LED ( - )
MAKER’S IDENTIFICATION(MAY ESTABLISH “H”, ”L” OR ”NC”)
IF THE CUSTOMER HAS MORE THAN TWO MAKERS WHO APPLIED
3 MAKER_ID
4 BS0
5 BS1
6 BS2
7 NRESET RESET
8 D17
9 D16
10 D15
11 D14
12 D13
13 D12
14 D11
15 D10
16 D9
17 D8
18 D7
19 D6
20 D5
21 D4
22 D3
23 D2
24 D1
25 D0
26 SDO
27 SDI
28 RD
29 WR
DIFFERENT S/W, CAN USE THIS PIN TO DETECT THE CODE BY THE MPU
AND DECIDE THE MAKER’S ID. MOST IMPORTANTLY, THE CUSTOMER
MUST DESIGN THIS PIN ON THE MAIN BOARD AS WELL AND LEAVE IT
OPEN AS NOT USED. NOTE：EDT MODULE’S SETTING IS “H”.
BS2 BS1 BS0 INTERFACE MODE
0 0 0 16-BIT BUS INTERFACE, 80-SYSTEM, 65K-COLOR
0 0 1
0 1 0
0 1 1 8-BIT BUS INTERFACE, 80-SYSTEM, 262K-COLOR
1 0 0
DATA BUS
8-BIT BUS：USE D7-D0 AND D17-D8 UNUSED
16-BIT BUS：USE D15-D0 AND D17-D16 UNUSED
18-BIT BUS：USE D17-D0
CONNECTED UNUSED PINS TO THE GND LEVEL
SERIAL INSTRUCTION DATA OUTPUT
IF NOT USE, LET IT TO OPEN
SERIAL INSTRUCTION DATA INPUT
IF NOT USE, LET IT CONNECTED TO IOVCC OR GND
READ SIGNAL AND READ DATA AT THE LOW LEVEL FIX IT TO IOVCC
OR GND WHEN USING SERIAL BUS INTERFACE
WRITE SIGNAL AND WRITES DATA AT RISING EDGE
FIX IT TO IOVCC OR GND WHEN USING SERIAL BUS INTERFACE
16-BIT BUS INTERFACE, 80-SYSTEM, 262KCOLOR
18-BIT BUS INTERFACE, 80-SYSTEM, 262KCOLOR
16-BIT BUS INTERFACE, 80-SYSTEM, 262KCOLOR
18-BIT BUS INTERFACE, 80-SYSTEM, 262K-
VERSION PAGE
2 12
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO
E T 0 2 4 0 0 6 D M U
.
PIN NO SYMBOL FUNCTION
THE SIGNAL FOR COMMAND OR PARAMETER SELSECT NUDER PARALLEL
MOED(i.e. NOT SERIAL INTERFACE)：
30 DNC_SCL
LOW：COMMAND
HIGH：PARAMETER
WHEN UNDER SERIAL INTERFACE, IT SERVERS AS SCL
31 NCS
32 TE
33 GND
34 IOVCC
35 VCI
36 NC
37 NC
38 NC
39 NC
40 NC
CHIP SELECT SIGNAL
TEARING EFFECT OUTPUT, IF NOT USED LET IT OPEN
GROUND
POWER SUPPLY FOR INTERFACE SIGAL
POWER SUPPLY FOR ANALOG
NOT CONNECTION
NOT CONNECTION
NOT CONNECTION
NOT CONNECTION
NOT CONNECTION
VERSION PAGE
2 13
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
1 1 . POWER SUPPLY
1 1 .1 POWER SUPPLY FOR LCM
VCI
MODEL NO.
E T 0 2 4 0 0 6 D M U
VERSION PAGE
2 14
IOVCC
GND
VLED
VLSS
LCD MODULE
NOTE : IOVCC ≤ VCI
2.8V
2.8V
IF=60mA
VF=3.3V
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO
.
E T 0 2 4 0 0 6 D M U
VERSION PAGE
2 15
12 . INSPECTION CRITERION
12.1 APPLICATION
THIS INSPECTION STANDARD IS TO BE APPLIED TO THE LCD MODULE
DELIVERED FROM EMERGING DISPLAY TECHNOLOGIES CORP.( E.D.T ) TO
CUSTOMERS
12.2 INSPECTION CONDITIONS
12.2.1
(2)VIEW ANGLE :
(1)OBSERVATION DISTANCE : 35CM±5CM
NON-OPERATION CONDITION：±5°
(PERPENDICULAR TO LCD PANEL SURFACE)
OPERATION CONDITION：±45°
(PERPENDICULAR TO LCD PANEL SURFACE)
12.2.2 ENVIRONMENT CONDITIONS :
ILLUMINATION
AMBIENT TEMPERATURE
AMBIENT HUMIDITY
AMBIENT
COSMETIC INSPECTION More than 600Lux
FUNCTIONAL INSPECTION 300~500 Lux
20°C~25°C
65±20%RH
12.2.3 INSPECTION LOT
QUANTITY PER DELIVERY LOT FOR EACH MODEL
12.2.4 INSPECTION METHOD
A SAMPLING INSPECTION SHALL BE MADE ACCORDING TO THE
FOLLOWING PROVISIONS TO JUDGE THE ACCEPTABILITY
(a)APPLICABLE STANDARD：MIL-STD-105E
NORMAL INSPECTION, SINGLE
SAMPLING LEVEL Ⅱ
(b)AQL：MAJOR DEFECT：AQL 0.65
MINOR DEFECT：AQL 2.5
TOTAL DEFFCTS：AQL 2.5
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO
E T 0 2 4 0 0 6 D M U
.
12.3 DEFINITION OF OPTICAL CHARACTERISTICS
12.3.1
DEFINITION OF VIEWING ANGLE θx AND θy
VERSION PAGE
2 16
12.3.2 DEFINITION OF CONTRAST RATIO
"STATEWHITE"ATISLCDWHENMEASUREDBRIGHTNESS
)CR(RATIOCONTRAST =
"STATEBLACK"ATISLCDWHENMEASUREDBRIGHTNESS
12.3.3 DEFINITION OF RESPONSE TIME : (TR AND TF)
THE FIGURE BVELOW IS THE OUTPUT SIGNAL OF THE PHOTO
DETECTOR.
MEASURED AT THE CENTER AREA OF THE PANEL WHEN ALL THE INPUT
TERMINALS OF LCD PANEL ARE ELECTRICALLY OPENED.
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO
E T 0 2 4 0 0 6 D M U
.
VERSION PAGE
2 17
12.4 INSPECTION STANDARDS
12.4.1 VISUAL DEFECTS CLASSIFICATION
TYPE OF DEFECT INSPECTION ITEM DEFECT FEATURE AQL
• DEFECT TO MISS SPECIFIED
DISPLAY FUNCTION , FOR ALL
1.DISPLAY ON
AND SPECIFIED DOTS
EX : DISCONNECTION , SHORT
CIRCUIT ETC
MAJOR DEFECT
2.BACKLIGHT
• NO LIGHT
• FLICKERING AND OTHER
0.65
ABNORMAL ILLUMINATION
3.DIMENSIONS
• SUBJECT TO INDIVIDUAL
ACCEPTANCE SPECIFICATIONS
• BLACK/WHITE SPOT
• BUBBLES ON POLARIZER
1.DISPLAY ZONE
• BLACK/WHITE LINE
• SCRATCH
• CONTAMINATION
• LEVER COLOR SPREED
2.BEZEL ZONE
• STAINS
• SCRATCHES
• FOREIGN MATTER
MINOR DEFECT
3.PCB
• CRACKS
• SCRATCHES
2.5
• STAINS
• INSUFFICIENT SOLDER
• SOLDERED IN INCORRECT
4.SOLDERING
POSITION
• CONVEX SOLDERING SPOT
• SOLDER BALLS
• SOLDER SCRAPS
5.DISPLAY ON
• LIGHT LINE
(ALL ON)
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO
.
E T 0 2 4 0 0 6 D M U
VERSION PAGE
2 18
12.4.2 MODULE DEFECTS CLASSIFICATION
NO. ITEM CRITERIA
DISPLAY ON
1.
INSPECTION
(1)INCORRECT PATTERN
(2)MISSING SEGMENT
(3)DIM SEGMENT
(4)OPERATING VOLTAGE BEYOND SPEC
OVERALL
2.
DIMENSIONS
(1)OVERALL DIMENSION BEYOND SPEC
(1)INSPECTION PATTERN : FULL WHITE,FULL
BLACK,RED,GREEN AND BLUE SCREENS.
(2)
BLACK SPOT Ⅰ
3.
WHITE SPOT Ⅰ
ON-DISPLAY
DOT
DEFECT
BRIGHT DOT
DARK DOT
TOTAL DOT
MINIMUM DISTANCE
BETWEEN BRIGHT DOTS
MINIMUM DISTANCE
BETWEEN BRIGHT DOTS AND
DARK DOTS
MINIMUM DISTANCE
BETWEEN DARK DOTS
N≤3
N≤3
N≤3
L≥5mm
L≥5mm
L≥5mm
NOTE : THE DEFINITION OF DOT DEFECT:THE DOT
DEFECT WAS JUDGED AFTER REPAIR AND THE SIZE
OF A DEFECTIVE DOT OVER 1/2 OF WHOLE DOT IS
REGARDED AS ONE DEFECTIVE DOT.
(1)THE FOLLOWING BLACK LINE , WHITE LINE ARE
WITHIN THE VIEWING AREA .
LENGTH : L WIDTH : W PERMISSIBLE NO.
4.
WHITE LINE
ON-DISPLAY
3 < L
BLACK LINE
WIDTH : Wmm , LENGH : Lmm
L ≤ 0.5 W ≤ 0.1
0.5 < L ≤ 3 0.1 < W ≤ 0.5
0.5 ≤ W
IGNORE
3
NONE
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E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
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NO. ITEM CRITERIA
BUBBLE
ON THE
POLARIZER
SURFACE STATUS
LINE SHAPE
L:LENGTH(mm)
DOT SHAPE
D:AVERAGE
DIAMETER(mm)
BUBBLES OF
POLARIZER
5.
/SURFACE STAINS
/DIRT/CF FAIL
/SPOT
CF FAIL / SPOT
NOTE : (1)POLARIZER BUBBLE IS DEFINED AS THE BUBBLE
APPEARS ON ACTIVE DISPLAY AREA. THE DEFECT OF
POLARIZER BUBBLE SHALL BE IGNORED IF THE
POLARIZER BUBBLE APPEARS ON THE OUTSIDE OF
ACTIVE DISPLAY AREA.
(2)THE EXTRANEOUS SUBSTANCE IS DEFINED AS IT CAN
BE OBSERVED WHEN THE MODULE IS POWER ON.
(3)THE DEFINITION OF AVERAGE DIAMETER ,D IS DEFINED
AS FOLLOWING.
AVERAGE DIAMETER(D)=(X+Y)/2 , WHERE
L ≤ 0.5, W ≤ 0.1
0.25 < D ≤ 0.5 N ≤ 5
0.1 < D ≤ 0.3mm N ≤ 3
0.1 < D ≤ 0.3mm N ≤ 3
X
0.5 < L ≤ 3
0.1< W ≤ 0.5
D ≤ 0.25
0.5 < D
D < 0.1 mm
D < 0.1 mm
NOTE
LGNORE
N ≤ 2
LGNORE
IGNORE
IGNORE
Y
SCRATCHES AND
6.
DENT ON GLASS
POLARIZER
UNEVEN COLOR
7.
SPREAD ,
COLORATION
BEZEL
8.
APPEARANCE
(1) PLS REFER TO THE ABOVE NO.3 AND 4 TO
DETERMINE SCRATCHES AND DENT ON POLARIZER
OR GLASS
(1)TO BE DETERMINED BASED UPON THE STANDARD
SAMPLE .
(1)BEZEL MAY NOT HAVE RUST ,BE DEFORMED OR HAVE
FINGER PRINTS STAINS OF OTHER CONTAMINATION .
(2)BEZEL MUST COMPLY WITH JOB SPECIFICATIONS .
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
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NO. ITEM CRITERIA
(1)NO SOLDERING FOUND ON THE SPECIFIED PLACE
(2)INSUFFICENT SOLDER
(a)LSI , IC
A POOR WETTING OF SOLDER IS BETWEEN LOWER
BEND OR “HEEL” OF LEAD AND PAD
SOLDER FILLET
(b)CHIP COMPONENT
．SOLDER IS LESS THAN 50% OF SIDES AND FRONT
FACE WETTING
SOLDER FILLET
9. SOLDERING
1/2
• SOLDER WETS 3 SIDES OF TERMINAL , BUT LESS
THAN 25% OF SIDES AND FRONT SURFACE AREA ARE
COVERED
SOLDER
02101300-01-02
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TECHNOLOGIES CORPORATION
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NO. ITEM CRITERIA
(3)PARTS ALIGMENT
(a)LSI , IC
LEAD WIDTH IS MORE THAN 50% BEYOND PAD
OUTLINE
9. SOLDERING
(b)CHIP COMPONENT
COMPONENT IS OFF CENTER , AND MORE THAN
50% OF THE LEADS IS OFF THE PAD OUTLINE
10. BACKLIGHT
(4)NO UNMELTED SOLDER PASTE MAY BE PRESENT
ON THE PCB.
(5)NO COLD SOLDER JOINTS , MISSING SOLDER
CONNECTIONS, OXIDATION OR ICICLE.
(6)NO RESIDUE OR SOLDER BALLS ON PCB.
(7)NO SHORT CIRCUITS IN COMPONENTS ON PCB.
(1)NO LIGHT
(2)FLICKERING AND OTHER ABNORMAL ILLUMINATION
(3)SPOTS OR SCRATCHES THAT APPEAR WHEN LIT
MUST BE JUDGED USING LCD SPOT , LINES AND
CONTAMINATION STANDARDS.
(4)BACKLIGHT DOESN’T LIGHT OR COLOR IS WRONG.
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
NO. ITEM CRITERIA
11. PCB , COB
GENERAL
12.
APPEARANCE
(1)COB SEAL MAY NOT HAVE PINHOLES LARGER THAN
0.2mm OR CONTAMINATION.
(2)COB SEAL SURFACE MAY NOT HAVE PINHOLES
THROUGH TO THE IC.
(3)THE HEIGHT OF THE COB SHOULD NOT EXCEED THE
HEIGHT INDICATED IN THE ASSEMBLY DIAGRAM.
(4)THERE MAY NOT BE MORE THAN 2mm OF SEALANT
OUTSIDE THE SEAL AREA ON THE PCB,AND THERE
SHOULD BE NO MORE THAN THREE PLACES.
(5)NO OXIDATION OR CONTAMINATION PCB TERMINALS
(6)PARTS ON PCB MUST BE THE SAME AS ON THE
PRODUCTION CHARACTERISTIC CHART.
THERE SHOULD BE NO WRONG PARTS , MISSING
PARTS OR EXCESS PARTS .
(7)THE JUMPER ON THE PCB SHOULD CONFORM TO THE
PRODUCT CHARACTERISTIC CHART.
(8)IF SOLDER GETS ON BEZEL TAB PADS,LED PAD,
ZEBRA PAD OR SCREW HOLD PAD,MAKE SURE IT IS
SMOOTHED DOWN .
(1)NO OXIDATION,CONTAMINATION,CURVES OR,BENDS
ON INTERFACE PIN (OLB) OF TCP.
(2)NO CRACKS ON INTERFACE PIN (OLB) OF TCP.
(3)NO CONTAMINATION, SOLDER RESIDUE OR SOLDER
BALLS ON PRODUCT.
(4)THE IC ON THE TCP MAY NOT BE DAMAGED, CIRCUITS.
(5)THE UPPERMOST EDGE OF THE PROTECTIVE STRIP ON
THE INTERFACE PIN MUST BE PRESENT OR LOOK AS
IF IT CAUSE THE INTERFACE PIN TO SEVER.
(6)THE RESIDUAL ROSIN OR TIN OIL OF SOLDERING
(COMPONENT OR CHIP COMPONENT) IS NOT BURNED
INTO BROWN OR BLACK COLOR.
(7)SEALANT ON TOP OF THE ITO CIRCUIT HAS NOT
HARDENED.
(8)PIN TYPE MUST MATCH TYPE IN SPECIFICATION
SHEET.
(9)LCD PIN LOOSE OR MISSING PINS.
(10)PRODUCT PACKAGING MUST THE SAME AS
SPECIFIED ON PACKAGING SPECIFICATION SHEET.
(11)PRODUCT DIMENSION AND STRUCTURE MUST
CONFORM TO PRODUCT SPECIFICATION SHEET.
(12)THE APPEARANCE OF HEAT SEAL SHOULD NOT
ADMIT ANY DIRT AND BREAK.
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b
b
b
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E M E R G I N G D I S P L A Y
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NO. ITEM CRITERIA
THE LCD WITH EXTENSIVE CRACK IS NOT ACCEPTABLE
a b c
*W=DISTANCE BETWEEN
General glass chip :
a
c
≤ t/2 < VIEWING AREA ≤ 1/8X
t/2 > , ≤ 2t ≤ W/3 ≤ 1/8X
SEALANT AREA AND LCD
PANEL EDGE
w
c
X = LCD SIDE LENGTH
t = GLASS THICKNESS
a
c
a
a b c
13. CRACKED GLASS
Corner part :
c
b
≤ t/2 < VIEWING AREA ≤ 1/8X
> t/2 , ≤ 2t ≤ W/3 ≤ 1/8X
*W=DISTANCE BETWEEN
a
SEALANT AREA AND LCD
PANEL EDGE
X=LCD SIDE LENGTH
Y=GLASS THICKNESS
CHIP ON ELECTRODE PAD
a
c
a b c
≤ t ≤ 0.5mm ≤ 1/8X
* X=LCD SIDE WIDTH
t =GLASS THICKNESS
a b c
≤ t ≤ 1/8X ≤ L
*X=LCD SIDE WIDTH
t = GLASS THICKNESS
c
a
L=ELECTRODE PAD LENGTH
cIF GLASS CHIPPING THE ITO
TERMINAL , OVER 2/3 OF THE ITO
MUST REMAIN AND BE ,
INSPECTED ACCORDING TO
ELECTRODE TERMINAL
SPECIFICATIONS
dIF THE PRODUCT WILL BE HEAT
SEALED BY THE CUSTOMER , THE
ALIGNMENT MARK MUST NOT BE
DEMAGED
02101300-01-02
E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
MODEL NO
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12.5 RELIABILITY TEST
12.5.1 STANDARD SPECIFICATIONS FOR RELIABILITY OF LCD MODULE
NO ITEM DESCRIPTION
HIGH TEMPERATURE
1
2
3
4
5
6
7
8
OPERATION
LOW TEMPERATURE
OPERATION
HIGH TEMPERATURE
STORAGE
LOW TEMPERATURE
STORAGE
HIGH TEMPERATURE /
HUMIDITY TEST
HIGH TEMPERATURE /
HIGH HUMIDITY
STORAGE
THERMAL SHOCK
( NOT OPERATED )
ESD
( ELECTROSTATIC
DISCHARGE )
THE SAMPLE SHOULD BE ALLOWED TO STAND AT +70°C FOR 240 hrs
THE SAMPLE SHOULD BE ALLOWED TO STAND AT -20°C FOR 240 hrs
THE SAMPLE SHOULD BE ALLOWED TO STAND AT +80°c FOR 240 hrs
THE SAMPLE SHOULD BE ALLOWED TO STAND AT -30°C FOR 240 hrs
THE SAMPLE SHOULD BE ALLOWED TO STAND AT 40°C, 90% RH
240 hrs
THE SAMPLE SHOULD BE ALLOWED TO STAND AT 40°C, 90% RH
240 hrs
THE SAMPLE SHOULD BE ALLOWED TO STAND THE FOLLOWING 10
CYCLES OF OPERATION :
-30°C FOR 30 MINUTES
+80°C FOR 30 MINUTES
AIR DISCHARGE ± 15KV
CONTACT DISCHARGE ± 8KV
VERSION PAGE
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E M E R G I N G D I S P L A Y
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12.5.2 TESTING CONDITIONS AND INSPECTION CRITERIA
FOR THE FINAL TEST THE TESTING SAMPLE MUST BE STORED AT ROOM
TEMPERATURE FOR 24 HOURS, AFTER THE TESTS LISTED IN TABLE 6.2 ,
STANDARD SPECIFICATIONS FOR RELIABILITY HAVE BEEN EXECUTED IN
ORDER TO ENSURE STABILITY .
NO ITEM TEST MODEL INSPECTION CRITERIA
CURRENT
1
CONSUMPTION REFER TO SPECIFICATION
2 CONTRAST REFER TO SPECIFICATION
3 APPEARANCE VISUAL INSPECTION
12.5.3 LIFE TIME
FUNCTIONS , PERFORMANCE , APPEARANCE , ETC . SHALL BE FREE
FROM REMARKABLE DETERIORATION WITHIN 50,000 HOURS
UNDER ORDINARY OPERATING AND STORAGE CONDITIONS ROOM
LIFE TIME
NOTE : FROM OUR EXPERIENCE THE LIFE TIME OF HIGH HUMIDITY OPERATION AND HIGH
TEMPERATURE OPERATION AS ABOVE MENTIONED COULD BE ACHIEVED.
TEMPERATURE (25±10°C) , NORMAL HUMIDITY ( 45±20% RH ) , AND
IN AREA NOT EXPOSED TO DIRECT SUN LIGHT.
( LIFE TIME OF BACKLIGHT , PLEASE REFER TO DATA ABOUT
BACKLIGHT . )
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THE CURRENT CONSUMPTION
SHOULD CONFORM TO THE PRODUCT
SPECIFICATION.
AFTER THE TESTS HAVE BEEN
EXECUTED , THE CONTRAST MUST BE
LARGER THAN HALF OF ITS INITIAL
VALUE PRIOR TO THE TESTS.
DEFECT FREE
VERSION PAGE
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E M E R G I N G D I S P L A Y
TECHNOLOGIES CORPORATION
12.6 OPERATION
12.6.1 Do not connect or disconnect modules to or from the main system while
power is being supplied .
12.6.2 Use the module within specified temperature ; lower temperature causes the
retardation of blinking speed of the display ; higher temperature makes
overall display discolor . When the temperature returns to normality , the
display will operate normally .
12.6.3 Adjust the LC driving voltage to obtain the optimum contrast .
12.6.4 Power On Sequence input signals should not be supplied to LCD module
before power supply voltage is applied and reaches the specified value ( 5
±0.25v ) .
If above sequence is not followed , CMOS LSIs of LCD modules may be
damaged due to latch - up problem .
12.7 NOTICE
12.7.1 Use a grounded soldering iron when soldering connector I/O terminals . For
soldering or repairing , take precaution against the temperature of the soldering
iron and the soldering time to prevent peeling off the through-hole-pad .
12.7.2 Do not disassemble . EDT shall not be held responsible if the module is
disassembled and upon the reassembly the module failed .
12.7.3 Do not charge static electricity , as the circuit of this module
contains CMOS LSIs. A workman's body should always be static-protected by
use of an ESD STRAP . Working clothes for such personnel should be of
static-protected material .
12.7.4 Always ground the electrically-powered driver before using it to install the
LCD module . While cleaning the work station by vacuum cleaner , do not
bring the sucking mouth near the module ; static electricity of the electricallypowered driver or the vacuum cleaner may destroy the module .
12.7.5 Don’t give external shock.
12.7.6 Don’t apply excessive force on the surface.
12.7.7 Liquid in LCD is hazardous substance .Must not lick and swallow.
When the liquid is attach to your,skin,cloth etc.wash it out thoroughly and
immediately.
12.7.8 Don’t operate it above the absolute maximum rating.
12.7.9 Storage in a clean environment , free from dust,active gas,and
solvent.
12.7.10 Store without any physical load.
12.7.11 Rewiring : no more than 3 times .
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02101300-01-02
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