— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
— Suitable up to 125 °C
— Especially suitable for applications from 400 nm to 1100 nm
— Short switching time (typ. 20 ns)
— Hermetically sealed metal package (similar to TO-5)
Ordering Information
TypePhotocurrent Photocurrent Ordering Code
typ.
= 1000 lx; Std. Light A; VR = 5 VEv = 1000 lx; Std. Light A; VR = 5 V
E
v
I
P
BPX 61≥ 50 µA70 µAQ62705P0025
I
P
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BPX 61
Maximum Ratings
TA = 25 °C
ParameterSymbolValues
Operating TemperatureT
Storage temperatureT
Reverse voltageV
Total power dissipationP
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
op
stg
R
tot
V
ESD
min.
max.
min.
max.
max.32 V
max.250 mW
max.2 kV
-40 °C
125 °C
-40 °C
125 °C
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BPX 61
Characteristics
TA = 25 °C
ParameterSymbolValues
Spectral sensitivity
V
= 5 V
R
Wavelength of max sensitivityλ
Spectral range of sensitivityλ
Smin.
typ.
S max
10%
typ.850 nm
typ.400 ... 1100
50 nA/lx
70 nA/lx
nm
Radiant sensitive areaAtyp.7.02 mm²
Dimensions of active chip areaL x Wtyp.2.65 x 2.65
mm x mm
Half angleφtyp.55 °
Dark current
= 10 V
V
R
Spectral sensitivity of the chip
I
R
typ.
max.
S
λ
typ.0.62 A / W
2 nA
30 nA
λ = 850 nm
Quantum yield of the chip
λ = 850 nm
Open-circuit voltage
E
= 1000 lx; Std. Light A
v
Short-circuit current
E
= 1000 lx; Std. Light A
v
Rise time
V
= 5 V; RL = 50 Ω; λ = 850 nm; IP = 800 µA
R
Fall time
V
= 5 V; RL = 50 Ω; λ = 850 nm; IP = 800 µA
R
Forward voltage
I
= 100 mA; E = 0
F
Capacitance
V
= 0 V; f = 1 MHz; E = 0
R
Temperature coecient of voltageTC
Temperature coecient of short-circuit current
ηtyp.0.90 Electrons
/ Photon
V
I
SC
t
r
t
f
V
C
TC
O
min.
typ.
typ.70 µA
typ.0.02 µs
typ.0.02 µs
F
0
V
I
typ.1.3 V
typ.72 pF
typ.-2.6 mV / K
typ.0.18 % / K
320 mV
375 mV
Std. Light A
Noise equivalent power
V
= 10 V; λ = 850 nm
R
NEPtyp.0.041 pW /
1/2
Hz
Detection limitD*typ.6.5e12 cm x
1/2
Hz
/ W
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BPX 61
Relative Spectral Sensitivity
S
= f (λ)
rel
S
rel
100
%
80
60
40
20
1), 2)
0
500600700800900nm 1100
400
OHF00078
λ
Directional Characteristics
S
= f (φ)
rel
1), 2)
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BPX 61
Photocurrent/Open-Circuit Voltage
IP (VR = 5 V) / VO = f (Ev)
1), 2)
Dark Current
1), 2)
IR = f (VR); E = 0
4000
Ι
R
pA
3000
2000
1000
0
051015V20
OHF00080
V
R
Capacitance
1), 2)
C = f (VR); f = 1 MHz; E = 0;
100
C
pF
80
70
60
50
40
30
20
10
0
10
-2
10
-1
10
0
10
OHF00081
1
V
R
2
10V
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BPX 61
Dark Current
IR = f (TA); E = 0; VR = 10 V
1)
Power Consumption
P
= f (TA)
tot
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BPX 61
Dimensional Drawing
3)
Approximate Weight:
Package marking:
855.0 mg
Cathode
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BPX 61
OHA04645
t
TTW Soldering
IEC-61760-1 TTW
300
˚C
T
250
200
150
100
50
10 s max., max. contact time 5 s per wave
235 ˚C - 260 ˚C
Second wave
Preheating
130 ˚C
120 ˚C
100 ˚C
First wave
T
∆
< 150 K
Continuous line: typical process
Dotted line: process limits
Cooling
ca. 3.5 K/s typical
ca. 2 K/s
ca. 5 K/s
Typical
0
0
20406080100120140160180200220240
s
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BPX 61
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specied in this
data sheet falls into the class exempt group (exposure time 10000 s)
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding eect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal lled materials including silver.
Metal lled materials can be aected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
. Under real circumstances (for expo-
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BPX 61
Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please nd the latest version on the OSRAM OS webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales oce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-specic request between OSRAM OS and Buyer and/or Customer.
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BPX 61
Glossary
1)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reect statistical gures.
These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
2)
Testing temperature: TA = 25°C
3)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specied with ±0.1 and