OSRAM OPTO BPX 61 Instructions

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www.osram-os.com
Produktdatenblatt | Version 1.1
BPX 61
BPX 61
Metal Can® TO39
Silicon PIN Photodiode
— Industrial Automation (Machine Controls, Light
Barriers, Vision Controls)
Features:
— Package: hermetically sealed
— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
— Suitable up to 125 °C
— Especially suitable for applications from 400 nm to 1100 nm
— Short switching time (typ. 20 ns)
— Hermetically sealed metal package (similar to TO-5)
Ordering Information
Type Photocurrent Photocurrent Ordering Code
typ.
= 1000 lx; Std. Light A; VR = 5 V Ev = 1000 lx; Std. Light A; VR = 5 V
E
v
I
P
BPX 61 ≥ 50 µA 70 µA Q62705P0025
I
P
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BPX 61
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating Temperature T
Storage temperature T
Reverse voltage V
Total power dissipation P
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
op
stg
R
tot
V
ESD
min. max.
min. max.
max. 32 V
max. 250 mW
max. 2 kV
-40 °C
125 °C
-40 °C
125 °C
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Characteristics
TA = 25 °C
Parameter Symbol Values
Spectral sensitivity V
= 5 V
R
Wavelength of max sensitivity λ
Spectral range of sensitivity λ
S min.
typ.
S max
10%
typ. 850 nm
typ. 400 ... 1100
50 nA/lx 70 nA/lx
nm
Radiant sensitive area A typ. 7.02 mm²
Dimensions of active chip area L x W typ. 2.65 x 2.65
mm x mm
Half angle φ typ. 55 °
Dark current
= 10 V
V
R
Spectral sensitivity of the chip
I
R
typ. max.
S
λ
typ. 0.62 A / W
2 nA
30 nA
λ = 850 nm
Quantum yield of the chip
λ = 850 nm
Open-circuit voltage E
= 1000 lx; Std. Light A
v
Short-circuit current E
= 1000 lx; Std. Light A
v
Rise time V
= 5 V; RL = 50 Ω; λ = 850 nm; IP = 800 µA
R
Fall time V
= 5 V; RL = 50 Ω; λ = 850 nm; IP = 800 µA
R
Forward voltage I
= 100 mA; E = 0
F
Capacitance V
= 0 V; f = 1 MHz; E = 0
R
Temperature coe󰘲cient of voltage TC
Temperature coe󰘲cient of short-circuit current
η typ. 0.90 Electrons
/ Photon
V
I
SC
t
r
t
f
V
C
TC
O
min. typ.
typ. 70 µA
typ. 0.02 µs
typ. 0.02 µs
F
0
V
I
typ. 1.3 V
typ. 72 pF
typ. -2.6 mV / K
typ. 0.18 % / K
320 mV 375 mV
Std. Light A
Noise equivalent power V
= 10 V; λ = 850 nm
R
NEP typ. 0.041 pW /
1/2
Hz
Detection limit D* typ. 6.5e12 cm x
1/2
Hz
/ W
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Relative Spectral Sensitivity
S
= f (λ)
rel
S
rel
100
%
80
60
40
20
1), 2)
0
500 600 700 800 900 nm 1100
400
OHF00078
λ
Directional Characteristics
S
= f (φ)
rel
1), 2)
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BPX 61
Photocurrent/Open-Circuit Voltage
IP (VR = 5 V) / VO = f (Ev)
1), 2)
Dark Current
1), 2)
IR = f (VR); E = 0
4000
Ι
R
pA
3000
2000
1000
0
0 5 10 15 V 20
OHF00080
V
R
Capacitance
1), 2)
C = f (VR); f = 1 MHz; E = 0;
100
C
pF
80
70
60
50
40
30
20
10
0
10
-2
10
-1
10
0
10
OHF00081
1
V
R
2
10V
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BPX 61
Dark Current
IR = f (TA); E = 0; VR = 10 V
1)
Power Consumption
P
= f (TA)
tot
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Dimensional Drawing
3)
Approximate Weight:
Package marking:
855.0 mg
Cathode
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BPX 61
OHA04645
t
TTW Soldering
IEC-61760-1 TTW
300
˚C
T
250
200
150
100
50
10 s max., max. contact time 5 s per wave
235 ˚C - 260 ˚C
Second wave
Preheating
130 ˚C 120 ˚C
100 ˚C
First wave
T
∆
< 150 K
Continuous line: typical process Dotted line: process limits
Cooling
ca. 3.5 K/s typical
ca. 2 K/s
ca. 5 K/s
Typical
0
0
20 40 60 80 100 120 140 160 180 200 220 240
s
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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device speci󰘰ed in this
data sheet falls into the class exempt group (exposure time 10000 s) sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding e󰘯ect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita­tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal 󰘰lled materials including silver. Metal 󰘰lled materials can be a󰘯ected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
. Under real circumstances (for expo-
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Disclaimer
Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please 󰘰nd the latest version on the OSRAM OS webside.
Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales o󰘲ce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-speci󰘰c request between OSRAM OS and Buyer and/or Customer.
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Glossary
1)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only re󰘱ect statistical 󰘰gures.
These do not necessarily correspond to the actual parameters of each single product, which could dif­fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
2)
Testing temperature: TA = 25°C
3)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are speci󰘰ed with ±0.1 and
dimensions are speci󰘰ed in mm.
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Revision History
Version Date Change
1.4 2019-01-08 Package Outline
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Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.
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