OSRAM VALUE Flex Advanced User Manual

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LINEARlight

Value Flex Advanced – VF06A

Value Flex Power – VF06P

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Ensure that the mounting surface is clean and smooth. This guarantees that the allowed operating temperatures are not exceeded.
Module mounted to a thermally conductive surface: Before soldering, tin-plate the cable and solder pads fi rst and solder for max.
3s at 350°C; before every further soldering step, allow the solder point to completely cool down; prevent peeling or shearing
forces. The module is mounted using the double-sided adhesion tape on the reverse. Ensure the surfaces are clean and free of
grease, oil, silicone and dirt particles. Please observe the information from 3M about the recommended primers for various sur­faces. The attachment materials themselves must be fi rm. Ensure the protective tape is completely removed. If mounted to metal­lic surfaces, apply insulation between the mounting surface and the module to prevent short-circuits at the solder contact points.
Protect against mechanical and electrostatic loads when mounted.

确保安装表面清洁平滑，这可以确保工作温度不超出限制值。在焊接带锡电缆线及焊盘时，焊接温度350℃最长不
可超过3秒钟，待焊点完全冷却后再进行下一步操作；注意剥离或剪切力度，之后将模块安装在导热面上。模块安
装使用背面双面胶。确保安装表面清洁，无油脂、硅晶或其他不洁净颗粒物。可与3M联系获取有关各种表面使用
信息。所有附带材料本身需要是固定的。确保保护胶条完整移除。如果安装在金属表面，需在安装面与产品之间
进行绝缘隔离处理，以防焊接点间短路。安装时避免机械及静电负载。

OSRAM GmbH

86167 Augsburg, Germany

Steinerne Furt 62

www.osram.com

G10447913

C10238698

VF06A

VF06P

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Care must be taken to provide a clean and
even mounting surface, which assures,
that the allowed operating temperatures
(~300°C/≤4s) are not exceeded.

焊接需在干净平坦的操作面上进行，并且确保
不会超过所允许的操作温度(~300°C/≤4s)。

3b3a

Soldering of wires with the module mounted
on a thermally conducted surface:

• Pretin solderpads and wires
and solder for max 3s at 350°C.

• Allow solderpoints to completely
cool down before the next soldering.

• Prevent shear- or peel forces.

焊接模块连接线时需在导热较好的表面上进行

• 连线和焊盘上需做预上锡处理，焊接过程中在
350°C焊接温度下最多停留3秒钟。

• 需待焊点完全冷却后再进行后续焊接

• 注意剪切或剥离力度，以免造成模块损伤

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mounting surface, free of oils or silicone coatings as
well as dirt particle. The mounting substrate must have
suffi cient structural integrity. Take care to completely
remove the protective backing.

通过模组背面的双面胶将有助于产品安装。注意安装面需清
洁、干燥、无油脂或树脂涂层以及不净颗粒物。安装基底必
须要有足够的结构完整性。请小心完整地移除保护胶条。

The mounting of the module is facilitated
by means of the double-sided adhesive
on the back-surface of the module. Care
must be taken to provide a clean and dry

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When mounting on metallic or otherwise
conductive surfaces, there needs to be an
electrical isolation at soldering points be­tween module and the mounting surface.

当安装在金属或其他导电表面时，在焊点及安
装面之间需要做电子绝缘处理。

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