Abfallzeit Ausgang (90% → 10%)
Fall time output (90% → 10%)
1)
Gemessen von 50% Punkt der ansteigenden Flanke Eingangspuls bis zu 1,3 V Punkt der ansteigenden Flanke
Ausgangspuls (
Flanke Ausgangspuls (
1)
Measured from 50% of the rising edge of the input pulse to 1.3 V of the rising edge of the output pulse (t
50% of the descending edge input pulse to 1.3 V of the descending output pulse edge (
t
), bzw. von 50% Punkt der abfallenden Flanke Eingangspuls bis zu 1,3 V Punkt der abfallenden
PLH
t
).
PHL
Symbol
Symbol
t
r
t
f
Funktionsbereich
Functional Characteristics
Bezeichnung
Parameter
Betriebs- und Lagertemperatur
Symbol
Symbol
T
Operating and storage temperature range
Versorgungsspannung
V
Supply voltage
2
Wert
Value
Einheit
Unit
typ.Limit
30–ns
10–ns
) or from
t
), respectively.
PHL
Wert
Value
; T
op
stg
CC
– 40 … + 85°C
4.5 … 15V
PLH
Einheit
Unit
Shield
AmplifierTrigger
Schmitt
Figure 1Block Diagram
2004-06-094
OHF00358
V
CC
OUT
GND
SFH 5400
Output Voltage
V
= f (VCC, IC)
O
15
V
V
O
10
5
0
Output Characteristics
V
= f (Ioh), VCC = 5 V
oh
3.60
V
V
oh
3.55
3.50
3.45
3.40
3.35
3.30
3.25
3.20
51015
0
0.01
0.10110
I
=mA0
ch
2.6 mAI =
ch
OHF00351
V
V
CC
OHF00354
mA
I
oh
Rel. Threshold
E
e/Ee(VCC
1.02
E
e
Ee(VCC= 5 V)
1.01
1.00
0.99
0.98
0.97
0.96
= 5 V)
0
OHF00352
51015V
Switching Threshold
1.8
2
mW/cm
1.6
1.4
1.2
Threshold
1.0
0.8
0.6
0.4
0.2
0
V
CC
400 500600700mm900
_
<
LH
OHF00353
_
<
H
L
λ
2004-06-095
Maßzeichnung
Package Outlines
SFH 5400
Chip position
1.1
1.2
0...0.1
GND
1.1
0.9
Photosensitive area
0.5 x 0.5
Maße in mm, wenn nicht anders angegeben / Dimensions in mm, unless otherwise specified.
LötbedingungenVorbehandlung nach JEDEC Level 2
Soldering ConditionsPreconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil für bleifreies Löten(nach J-STD-020B)
IR Reflow Soldering Profile for lead free soldering(acc. to J-STD-020B)
260 ˚C
245 ˚C
235 ˚C
OHLA0687
+0 ˚C
-5 ˚C
±5 ˚C
+5 ˚C
-0 ˚C
300
˚C
T
240 ˚C
255 ˚C
250
217 ˚C
200
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
10 s min
30 s max
100 s max
Ramp Down
6 K/s (max)
150
120 s max
100
Ramp Up
3 K/s (max)
50
min. condition for IR Reflow Soldering:
solder point temperature ≥ 235 °C for at least 10 sec.
25 ˚C
0
0
50100150200250300
s
t
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
1
, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2004-06-097
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