IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (850 nm)
Lead (Pb) Free Product - RoHS Compliant
SFH 4235
Vorläufige Daten / Preliminary Data
Wesentliche Merkmale
• IR-Lichtquelle mit hohem Wirkungsgrad
• Chipgröße (emittierende Fläche) 1 x 1 mm2
• max. Gleichstrom 1 A
• niedriger Wärmewiderstand (9 K/W)
• Schwerpunktswellenlänge 850 nm
• ESD-sicher bis 2 kV nach JESD22-A114-E
• Erweiterte Korrosionsfestigkeit
(s.a. Abschnitt Maßzeichnung)
Anwendungen
• Infrarotbeleuchtung für Kameras
• Überwachungssysteme
• Fahrer-Assistenz Systeme
• Beleuchtung für Bilderkennungssysteme
Sicherheitshinweise
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Features
• IR lightsource with high efficiency
• die-size (emitting area) 1 x 1 mm2
• max. DC-current 1 A
• Low thermal resistance (9 K/W)
• Center of spectral emission at 850 nm
• ESD safe up to 2 kV acc. to JESD22-A114-E
• Superior Corrosion Robustness
(see chapter package outlines)
Applications
• Infrared Illumination for cameras
• Surveillance systems
• Driver assistance systems
• Machine vision systems
Safety Advices
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
Typ
Type
SFH 4235 Q65110A8900 ≥ 630 (typ. 950)
1)
gemessen mit Ulbrichtkugel / measured with integrating sphere
2010-05-18 1
Bestellnummer
Ordering Code
Gesamtstrahlungsfluss1) (IF = 1A, tp = 10 ms)
Total Radiant Flux
Φe (mW)
1)
Grenzwerte (TA = 25 °C) Maximum Ratings
SFH 4235
Bezeichnung
Parameter
Betriebs- und Lagertemperatur
Operating and storage temperature range
Sperrschichttemperatur
Junction temperature
Sperrspannung
Reverse voltage
Vorwärtsgleichstrom
Forward current
Stoßstrom, tp = 200 µs, D = 0
Surge current
Leistungsaufnahme
Power consumption
Wärmewiderstand Sperrschicht - Lötstelle
Thermal resistance junction - soldering point
Kennwerte (TA = 25 °C) Characteristics
Symbol
Symbol
Top , T
T
V
I
I
P
R
stg
J
R
F
FSM
tot
thJS
Wert
Value
Einheit
Unit
– 40 … + 125 °C
+ 145 °C
1 V
1 A
5 A
3.4 W
9 K/W
Bezeichnung
Parameter
Wellenlänge der Strahlung
Wavelength at peak emission
I
= 1 A, tp = 10 ms
F
Centroid-Wellenlänge der Strahlung
Centroid wavelength
I
= 1 A, tp = 10 ms
F
Spektrale Bandbreite bei 50% von I
Spectral bandwidth at 50% of I
IF = 1 A, t
Abstrahlwinkel
= 10 ms
p
max
max
Half angle
Aktive Chipfläche
Active chip area
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
Symbol
Symbol
λ
peak
λ
centroid
Wert
Value
Einheit
Unit
860 nm
850 nm
Δλ 30 nm
ϕ ± 60 Grad
deg.
A
L × B
1 mm
1 × 1 mm²
2
L × W
2010-05-18 2
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
SFH 4235
Bezeichnung
Parameter
Schaltzeiten, Ie von 10% auf 90% und von 90%
I
auf 10%,
= 5 A, RL = 50 Ω
F
Switching times, Ιe from 10% to 90% and from
I
90% to 10%,
= 5 A, RL = 50 Ω
F
Durchlassspannung
Forward voltage
I
= 1 A, tp = 100 µs
F
I
= 5 A, tp = 100 µs
F
Strahlstärke
Radiant intensity
I
= 1 A, tp = 100 μs
F
Temperaturkoeffizient von Ie bzw. Φ
Temperature coefficient of Ie or Φ
I
= 1 A, tp = 10 ms
F
Temperaturkoeffizient von V
Temperature coefficient of V
I
= 1 A, tp = 10 ms
F
F
F
e
e
Temperaturkoeffizient von λ
Temperature coefficient of λ
I
= 1 A, tp = 10 ms
F
Symbol
Symbol
t
/ t
r
f
V
F
V
F
I
e typ
TC
I
TC
V
TC
λ,centroid
Wert
Value
Einheit
Unit
7 / 14 ns
3.0 (< 3.4)
3.5 (< 4.5)
V
V
320 mW/sr
– 0.3 %/K
– 2 mV/K
+ 0.3 nm/K
2010-05-18 3
SFH 4235
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚
OHL01660
50˚
60˚
70˚
80˚
90˚
100˚
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Gesamtstrahlungsfluss1) Φ
Total Radiant Flux1) Φ
Bezeichnung
e
e
Symbol Werte
Parameter
Gesamtstrahlungsfluss
Total Radiant Flux
I
= 1 A, tp = 10 ms
F
1)
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 1.6:1) /
Only one group in one packing unit (variation lower 1.6:1)
Φ
Φ
e min
e max
Abstrahlcharakteristik
Radiation Characteristics I
= f (ϕ)
rel
Values
-EA -EB
630
1000
800
1250
Einheit
Unit
mW
mW
2010-05-18 4
SFH 4235
700
0
nm
%
OHF04132
20
40
60
80
100
950750 800 850
I
rel
λ
0
0
F
I
T
S
OHF04190
1.1
0.1
0.2
0.4
0.3
0.5
0.7
0.6
0.8
0.9
A
13010060 80 ˚C20 40
OHF04188
F
I
V
A
2
F
V
10
-1
5
10
0
5
10
1
10
-2
2.5 3 3.5 4
-5
F
I
A
t
p
s
OHF04189
-410-310-210-1100101102
1010
P
t
=
D
T
T
t
P
I
F
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.5
0.5
0.2
0.33
0.1
0.02
0.05
D
=
0.01
0.005
1
OHF04187
I
F
A
10-1510
0
510
1
1
10
-2
10
-3
10
5
10
10
5
-1
5
0
e
Φ
(1 A)
Φ
e
10
-2
Relative spektrale Emission
Relative Spectral Emission
I
= f (λ)
rel
Max. zulässiger Durchlassstrom
Max. Permissible Forward Current
I
= f (TA), R
F
thJS
= 9 K/W
Durchlassstrom
Forward Current
I
= f (VF)
F
Single pulse, tp = 100 μs
Zulässige Impulsbelastbarkeit
Permissible Pulse Handling
Capability
I
= f (tp), TS = 85 °C,
F
Duty cycle D = parameter
Relativer Gesamtstrahlungsfluss
Relative Total Radiant Flux
Φe/Φe(1A) = f (IF)
Single pulse, tp = 100 μs
2010-05-18 5
Maßzeichnung1)
GPLY7072
6.2 (0.244)
5.8 (0.228)
1.9 (0.075)
1.7 (0.067)
Cathode
(R0.85 (0.033))
11.2 (0.441)
10.8 (0.425)
1.2 (0.047)
0.8 (0.031)
0...0.1 (0.004)
0.29 (0.011)
0.24 (0.009)
6.8 (0.268)
7.2 (0.283)
1.1 (0.043)
0.9 (0.035)
1.6 (0.063)
2.0 (0.079)
(ø4.2 (0.165))
ø0.81 (0.031)
4.25 (0.167)
5.35 (0.210)
5.25 (0.206)
ø0.73 (0.028)
4.15 (0.163)
0.65 (0.026)
0.45 (0.018)
OHAY0508
1.55 (0.061)
2 (0.079)
4 (0.157)
6.35 (0.250)
8 (0.315)
1.75 (0.069)
11.5 (0.453)
12.4 (0.488)
24 (0.945)
0.3 (0.012)
0.3 (0.012)
1.9 (0.075)
7.35 (0.289)
Cathode/Collector Side
Package Outlines
Korrosionsfestigkeit besser als EN 60068-2-60 (method 4):
mit erweitertem Korrosionstest: 40°C / 90%rh / 15ppm H2S / 336h
Corrosion robustness better than EN 60068-2-60 (method 4):
with enhanced corrosion test: 40°C / 90%rh / 15ppm H2S / 336h
SFH 4235
Kathodenkennung: Markierung
Cathode mark: mark
Gewicht / Approx. weight: 0.2 g
Gurtung / Polarität und Lage Verpackungseinheit 800/Rolle, ø180 mm Method of Taping / Polarity and Orientation Packing unit 800/reel, ø180 mm
1)
Maße in mm (inch) / Dimensions in mm (inch)
2010-05-18 6
Empfohlenes Lötpaddesign
Solder resist
Freies Kupfer
Bare Copper
Lötpasten Schablone
Solder paste stencil
Lötstopplack
OHAY0681
0.3 (0.012)
Kupfer
Copper
1.6 (0.063)
11.6 (0.457)
12.0 (0.472)
2.3 (0.091)
2.3 (0.091)
10 (0.394)
1.6 (0.063)
11.6 (0.457)
3 Lötstellen
3 solder points
Thermal enhanced PCB
Thermisch optimiertes PCB
ø4.0 (0.157)
Heatsink attach
ø4.0 (0.157)
ø2.5 (0.098)
Achtung:
Anode und Heatsink sind elektrisch verbunden
Attention:
Anode and Heatsink are electrically connected
Footprint
Recommended Solder Pad Design
SFH 4235
2010-05-18 7
SFH 4235
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C
+0 ˚C
-5 ˚C
245 ˚C
±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C
-0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
1
, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2010-05-18 8
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