OSRAM SFH 320, SFH 320 FA Technical data

NPN-Silizium-Fototransistor im SMT TOPLED Silicon NPN Phototransistor in SMT TOPLED

Lead (Pb) Free Product - RoHS Compliant

SFH 320 SFH 320 FA

®

-Gehäuse

®

-Package

Wesentliche Merkmale

• Speziell geeignet für Anwendungen im Bereich von 380 880

• Hohe Linearität

• P-LCC-2 Gehäuse

• Gruppiert lieferbar

• Für alle Lötverfahren geeignet.

Anwendungen

• Miniaturlichtschranken für Gleich- und Wechsellichtbetrieb

• Industrieelektronik

• „Messen/Steuern/Regeln“

Typ Type

SFH 320 Q65110A2471 SFH 320 FA Q65110A2472 SFH 320-3 Q65110A2469 SFH 320 FA-3 Q65110A2470

nm bis 1150 nm (SFH 320) und bei

nm (SFH 320 FA)

Bestellnummer Ordering Code

Features

• Especially suitable for applications from nm to 1150 nm (SFH 320) and of 880 nm

380

320 FA)

(SFH

• High linearity

• P-LCC-2 package

• Available in groups

• Suitable for all soldering methods.

Applications

• Miniature photointerrupters

• Industrial electronics

• For control and drive circuits

Typ Type

Bestellnummer Ordering Code

SFH 320-3/-4 Q65110A1781 SFH 320 FA-3/-4 Q65110A2475 SFH 320-4 Q65110A2510 SFH 320 FA-4 Q65110A1836

2005-05-12 1

Grenzwerte Maximum Ratings

SFH 320, SFH 320 FA

Bezeichnung Parameter

Betriebs- und Lagertemperatur Operating and storage temperature range

Kollektor-Emitterspannung Collector-emitter voltage

Kollektorstrom Collector current

Kollektorspitzenstrom, τ < 10 µs Collector surge current

Verlustleistung, TA = 25 ° C Total power dissipation

Wärmewiderstand für Montage auf PC-Board Thermal resistance for mounting on pcb

Symbol Symbol

T

; T

op

stg

V

CE

I

C

I

CS

P

tot

R

thJA

Wert Value

Einheit Unit

– 40 … + 100 ° C

35 V

15 mA

75 mA

165 mW

450 K/W

2005-05-12 2

Kennwerte (TA = 25 ° C, λ = 950 nm) Characteristics

SFH 320, SFH 320 FA

Bezeichnung Parameter

Wellenlänge der max. Fotoempfindlichkeit Wavelength of max. sensitivity

Spektraler Bereich der Fotoempfindlichkeit

S = 10% von S

max

Spectral range of sensitivity

S = 10% of S

Bestrahlungsempfindliche Fläche

max

(∅

220 µm)

Radiant sensitive area Abmessung der Chipfläche

Dimensions of chip area Halbwinkel

Half angle Kapazität, VCE = 0 V, f = 1 MHz, E = 0

Capacitance Dunkelstrom

Dark current

V

= 20 V, E = 0

CE

Symbol Symbol

Wert

Value

SFH 320 SFH 320 FA

λ

S max

980 980 nm

λ 450 … 1150 750 … 1120 nm

A

L × B

0.038 0.038 mm

0.45 × 0.45 0.45 × 0.45 mm × m

L × W

ϕ ± 60 ± 60 Grad

C

I

CEO

CE

5.0 5.0 pF

1 (≤ 50) 1 (≤ 50) nA

Einheit Unit

2

m

deg.

2005-05-12 3

SFH 320, SFH 320 FA

Die Fototransistoren werden nach ihrer Fotoempfindlichkeit gruppiert und mit arabischen Ziffern gekennzeichnet. The phototransistors are grouped according to their spectral sensitivity and distinguished by arabian figures.

Bezeichnung Parameter

Fotostrom, λ = 950 nm Photocurrent

E

= 0.1 mW/cm2, VCE = 5 V

e

SFH 320:

E

= 1000 Ix, Normlicht/standard

v

A, VCE = 5 V

light Anstiegszeit/Abfallzeit

Rise and fall time

I

= 1 mA, VCC = 5 V, RL = 1 kΩ

C

Kollektor-Emitter-Sättigungsspannung Collector-emitter saturation voltage

I

= I

C

E

= 0.1 mW/cm

e

1)

I

PCEmin

1)

I

PCEmin

1)

PCEmin

× 0.3,

2

ist der minimale Fotostrom der jeweiligen Gruppe. is the min. photocurrent of the specified group.

Symbol Symbol

I

PCE

I

PCE

t

, t

r

f

V

CEsat

SFH 320

Wert

Value

-2 -3 -4

Einheit Unit

/FA

≥ 16

–

16 … 32

420

25 … 50

650

40 … 80

1000

µA

7 6 7 8 µs

150 150 150 150 mV

Directional Characteristics S

40 30 20 10

50

60

70

80

90

100

2005-05-12 4

ϕ

= f (ϕ)

rel

0

1.0

0.8

0.6

0.4

0.2

0

20 40 60 80 100 1200.40.60.81.0

OHF01402

SFH 320, SFH 320 FA

Relative Spectral Sensitivity, SFH

320 S

100

%

S

rel

80 70 60 50 40 30 20 10

= f (λ)

rel

0

400

500 600 700 800 900 1100

OHF00207

nm

λ

Total Power Dissipation

P

= f (TA)

tot

200 mW

P

tot

160

120

80

OHF00871

Relative Spectral Sensitivity, SFH

320 FA S

100

S

rel

%

80

60

40

20

0

400

= f (λ)

rel

OHF00468

nm500 600 700 800 900 1100

λ

Photocurrent

I

= f (VCE), Ee = Parameter

PCE

0

10

mA

Ι

PCE

-1

10

0.5

0.25

0.1

mW

1

cm mW

cm

mW cm

OHF01529

2

mW

2

cm

2

Photocurrent

I

= f (Ee), VCE = 5 V

PCE

3

10

µ

A

Ι

PCE

2

10

1

10

0

10

-1

10

-3

10

Dark Current

I

= f (VCE), E = 0

CEO

1

10 nA

Ι

CEO

0

10

-1

10

OHF01924

4 3 2

mW/cm

2

E

OHF01527

0

10

e

-2

10

40

0

20 40 60 80 ˚C 100

0

Dark Current

I

= f (TA), V

CEO

3

10

Ι

CEO

2

10

1

10

0

10

-1

10

-25nA0 25 50 75 100

= 5 V, E = 0

CE

T

A

OHF01530

˚C

T

A

-2

10

0

5 10 15 20 25 30 35

Capacitance

C

= f (VCE), f = 1 MHz, E = 0

CE

5.0

C

pF

CE

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5 0

-2

10

10-110010110

V

CE

OHF01528

V

CE

-2

10

-3

10

0 5 10 15 20 25 30 35V

V

CE

Photocurrent

PCE

1.6

25

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

o

= f (TA), V

-25

0 25 50 75 100

CE

= 5 V

OHF01524

C

T

A

I

PCE/IPCE25

Ι

PCE

2

2005-05-12 5

Maßzeichnung Package Outlines

SFH 320, SFH 320 FA

3.0 (0.118)

2.6 (0.102)

2.3 (0.091)

2.1 (0.083)

0.1 (0.004) (typ.)

2.1 (0.083)

1.7 (0.067)

0.9 (0.035)

0.7 (0.028)

4˚±1

3.3 (0.130)

3.0 (0.118)

3.4 (0.134)

Collector marking

(2.4) (0.095)

3.7 (0.146)

1.1 (0.043)

0.18 (0.007)

0.12 (0.005)

0.5 (0.020)

0.6 (0.024)

0.4 (0.016)

GPLY6030

Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).

Empfohlenes Lötpaddesign Recommended Solderpad Design

2.6 (0.102)

1.5 (0.059)

Padgeometrie für verbesserte Wärmeableitung

Paddesign for improved heat dissipation

4.5 (0.177)

Lötstopplack Solder resist

Cu-Fläche > 16 mm Cu-area > 16 mm

4.5 (0.177)

1.5 (0.059)

2

OHLPY970

Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).

2005-05-12 6

SFH 320, SFH 320 FA

Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil für bleifreies Löten (nach J-STD-020B) IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-020B)

300

˚C

250

T

255 ˚C 240 ˚C

Maximum Solder Profile

Recommended Solder Profile

Minimum Solder Profile

217 ˚C

200

30 s max

150

120 s max

100 s max

100

Ramp Up

50

3 K/s (max)

25 ˚C

0

50 100 150 200 250 300

Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802)

260 ˚C 245 ˚C 235 ˚C

10 s min

Ramp Down 6 K/s (max)

t

OHLA0687

+0 ˚C

-5 ˚C ±5 ˚C

+5 ˚C

-0 ˚C

s

300

C

250

T

200

150

100

235 C

CC... 130100

50

0

C... 260

1. Welle

1. wave

ca 200 K/s

50 100 150 200 250

2 K/s

10 s

5 K/s

Zwangskühlung forced cooling

2005-05-12 7

2. Welle

2. wave

OHLY0598

Normalkurve standard curve

Grenzkurven limit curves

2 K/s

s

t

SFH 320, SFH 320 FA

Published by OSRAM Opto Semiconductors GmbH

Wernerwerkstrasse 2, D-93049 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as assured chara cteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or wh ich we are not obliged to accept, we shall hav e to invoice you for any costs incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components

1

A critical component is a component used in a life-support device or sys tem whose failure can reasonably be expected

to cause the failure of that life-support device or system, or to affec t its safety or e ffectiveness of that dev ice or system.

2

Life support devices or systems are intended (a) to be implanted in the h uman body, or (b) to support and/or maintain

and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

1

, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.

2005-05-12 8

OSRAM SFH 320, SFH 320 FA Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

Wesentliche Merkmale

Anwendungen

Features

Applications

Grenzwerte Maximum Ratings

Die Fototransistoren werden nach ihrer Fotoempfindlichkeit gruppiert und mit arabischen Ziffern gekennzeichnet. The phototransistors are grouped according to their spectral sensitivity and distinguished by arabian figures.

Maßzeichnung Package Outlines

Empfohlenes Lötpaddesign Recommended Solderpad Design

Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil für bleifreies Löten (nach J-STD-020B) IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-020B)