OSRAM SFH 3100 Technical data

NPN-Silizium-Fototransistor mit Tageslichtsperrfilter Silicon NPN Phototransistor with Daylight-Cutoff Filter
Lead (Pb) Free Product - RoHS Compliant
SFH 3100 F
Wesentliche Merkmale
Speziell geeignet für Anwendungen im Bereich von 840 nm bis 1080 nm
Geringe Außenabmessungen
Gleiche Bauform wie IRED SFH 4110
Hoher Koppelfaktor in Lichtschranken mit SFH 4110
IR-Filter
Leichte Unterscheidbarkeit zwischen SFH 3100 F (schwarzes Gehäuse) und SFH 4110 (klares Gehäuse)
Anwendungen
Empfänger in Lichtschranken
Bandende-Erkennung (z.B. Videorecorder)
Datenübertragung
Positionsüberwachung
Barcode-Leser
„Messen/Steuern/Regeln“
Münzzähler
Features
Especially suitable for applications from 840 nm to 1080 nm
Narrow half angle
Small outline dimensions
Same package as IRED SFH 4110
High coupling factor in light barriers with SFH 4110
IR filter
Easy identification of SFH 3100 F (black package) and SFH 4110 (clear package)
Applications
Detector in photointerrupters
Tape end detection
Data transmission
Position sensing
Barcode reader
For control and drive circuits
Coin counters
Typ Type
SFH 3100 F SFH 3100 F-2/3/4
2005-02-17 1
Bestellnummer Ordering Code
Q62702P5073 Q62702P5475
I
(mA)
PCE
(λ = 950 nm, >0.4
0.63 ... 3.2
E
= 0.5 mW/cm2, VCE = 5 V)
e
Grenzwerte Maximum Ratings
SFH 3100 F
Bezeichnung Parameter
Betriebs- und Lagertemperatur Operating and storage temperature range
Kollektor-Emitterspannung Collector-emitter voltage
Kollektorstrom Collector current
Kollektorspitzenstrom,
t < 10 µs
Collector surge current Emitter-Kollektorspannung
Emitter-collector voltage Verlustleistung,
T
= 25 °C
A
Total power dissipation Wärmewiderstand Sperrschicht - Umgebung
Thermal resistance junction - ambient
Symbol Symbol
T
; T
op
stg
V
CE
V
(t <2min)3070
CE
I
C
I
CS
V
EC
P
tot
R
thJA
Wert Value
Einheit Unit
– 40 + 85 °C
V
50 mA
100 mA
7V
150 mW
280 K/W
2005-02-17 2
Kennwerte (TA = 25 °C, λ = 950 nm) Characteristics
SFH 3100 F
Bezeichnung Parameter
Wellenlänge der max. Fotoempfindlichkeit Wavelength of max. sensitivity
Spektraler Bereich der Fotoempfindlichkeit
S = 10% von S
max
Spectral range of sensitivity
S = 10% of S
max
Abmessungen der Chip-Fläche Dimension of chip area
Bestrahlungsempfindliche Fläche Radiant sensitive area
Halbwinkel Half angle
Kapazität Capacitance
V
= 0 V, f = 1 MHz, E =0
CE
V
= 5 V, f = 1 MHz, E =0
CE
Dunkelstrom,
V
CE
= 20 V
Dark current
Symbol Symbol
λ
Smax
Wert Value
Einheit Unit
920 nm
λ 840 1080 nm
L × B
× W
L
0.55 × 0.55 mm × mm
A 0.11 mm
ϕ± 14 Grad
deg.
C
I
CEO
CE
6.5
pF
3.0 2 (50) nA
2
Fotostrom Photocurrent
E
= 0.5 mW/cm2,VCE = 5 V
e
I
PCE
>0.4 mA
2005-02-17 3
SFH 3100 F
Bezeichnung Parameter
Fotostrom, λ = 950 nm Photocurrent
E
= 0.5 mW/cm2, VCE = 5 V
e
Anstiegszeit/Abfallzeit Rise and fall time
I
= 1 mA, VCC = 5 V, RL = 1 k
C
Kollektor-Emitter-Sättigungsspannung Collector-emitter saturation voltage
=
I
I
C
E
= 0.5 mW/cm2, λ = 950 nm
e
1)
I
PCEmin
1)
I
PCEmin
1)
PCEmin
× 0.3,
ist der minimale Fotostrom der jeweiligen Gruppe. is the min. photocurrent of the specified group.
Symbol Symbol
I
PCE
t
,
r
t
f
V
CEsat
Wert
Value
Einheit Unit
-2 -3 -4
0.63 … 1.25 1 … 2 1.6 … 3.2 mA
7
µs
9
110 (400) mV
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SFH 3100 F
Relative Spectral Sensitivity
S
= f (λ)
rel
100
%
S
rel
90 80 70 60 50 40 30 20 10
0
700
800 900 1000 1100nm
I
Photocurrent
V
= 5 V, normalized to 25 °C
CE
1.6
Ι
PCE
Ι
PCE
25
1.4
1.2
PCE
= f (TA),
OHF00377
λ
OHF01524
Photocurrent
I
= f (Ee), VCE = 5 V
PCE
1
10 mA
Ι
PCE
0
10
-1
10
-2
10
-3
10
-3
10
-2
10
Dark Current
I
= f (TA), VCE = 20 V, E = 0
CEO
3
10
Ι
CEO
2
10
10
-1
mW/cm
OHF00378
2
10
E
e
OHF00380
Collector-Emitter Capacitance
C
= f (VCE), f = 1 MHz, E = 0
CE
7
pF
CE
6
5
4
3
2
1
0
0
-2
10C10-1100101102V
OHF00379
V
CE
Total Power Dissipation
P
= f (TA)
tot
160 mW
P
tot
140
120
OHF00381
1.0
0.8
0.6
0.4
0.2
0
-25
0 25 50 75 100
Photocurrent SFH 3100 F
I
= f (VCE)
PCE
2.0 mA
Ι
PCE
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2 0
10 20 30 40V
0
1.0 mW/cm
0.5 mW/cm
0.25 mW/cm
0.1 mW/cm
C
T
A
OHF00386
2 2
2
2
V
CE
1
10
0
10
-1
10
0nA20 40 60 80 100˚C
Dark Current
I
= f (VCE), E = 0
CEO
1
10
nA
Ι
CEO
0
10
-1
10
-2
10
0
T
A
OHF00383
10 20 30V
V
100
80
60
40
20
0
20 40 60 80 100
0
CE
˚C
T
A
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Maßzeichnung Package Outlines
SFH 3100 F
Emitter/ Cathode
2.54 (0.100)
1.42 (0.056)
1.22 (0.048)
0.6 (0.024)
0.5 (0.020)
16.5 (0.650)
16.0 (0.630)
1.04 (0.041)
0.84 (0.033)
17.77 (0.700)
0.4 (0.016)
17.27 (0.680)
0.3 (0.012)
0.9 (0.035)
60˚
0.7 (0.028)
R 0.7 (0.028)
R 0.9 (0.035)
4.1 (0.161)
3.9 (0.154)
1.3 (0.051)
1.1 (0.043)
2.9 (0.114)
3.1 (0.122)
0.5 (0.020) x 45˚
1.04 (0.041)
0.84 (0.033)
1.6 (0.063)
1.4 (0.055)
0.84 (0.033)
2.2 (0.087)
2.0 (0.079)
3.0 (0.118)
2.8 (0.110)
0.64 (0.025)
GEOY6976
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2005-02-17 6
Empfohlenes Lötpaddesign Wellenlöten (TTW) Recommended Solder Pad
TTW Soldering
4.8 (0.189)
4 (0.157)
SFH 3100 F
OHLPY985
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Lötbedingungen Soldering Conditions Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802)
SFH 3100 F
300
C
250
T
235 C
200
150
CC... 130100
100
50
0
0
C... 260
1. Welle
1. wave
ca 200 K/s
50 100 150 200 250
10 s
2 K/s
2. Welle
2. wave
5 K/s
Zwangskühlung forced cooling
Normalkurve standard curve
Grenzkurven limit curves
2 K/s
t
OHLY0598
s
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured chara cteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
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Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components
1
A critical component is a component used in a life-support device or sys tem whose failure can reasonably be expected
1
, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
to cause the failure of that life-support device or system, or to affec t its safety or e ffectiveness of that dev ice or system.
2
Life support devices or systems are intended (a) to be implanted in the human body , or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2005-02-17 8
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