OSRAM ORBEOS Components User Manual

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APRIL

Application guide.

ORBEOS

2011

CONTENTS

1. OLED integration 4

1.1. General handling instructions 4

1.2. Contact ledges and their polarity 5

1.3. Interconnection 6

1.4. Contacting of OLED tiles via conductive glue 6

1.5. Contacting of OLED tiles via elastomeric connectors 7

1.6. Contacting via Flex-PCB 8

2. Binning 10

2.1. Color binning 10

2.2. Luminance binning 12

3. Driving 13

4. Reliability 13

4.1. Maximum ratings 13

4.2. Degradation 14

4.2.1. Absolute value of initial luminance 14

4.2.2. Ambient temperature 14

4.3. Lifetime 14

4.4. Robustness 15

4.4.1. Mechanical pressure,

shock and vibration 15

4.4.2. ESD sensitivity 15

4.4.3. Low air pressure 15

4.4.4. Shelf life 15

4.4.5. Photo degradation (UV resistance) 15

Appendix 16

OLED INTEGRATION

1. OLED integration

1.1. General handling instructions

Remember when handling OLED devices: First and fore-

most, OLEDs are made of glass and glass is fragile.

• Avoid mechanical stress such as shock and pressure on the

glass during handling, especially at the center of the active area and the back of the device (to avoid glass cracking,

delamination and damage of the internal structure).

• For tiled OLED designs without a frame to protect the edges

and corners of the tile, exercise caution in order to avoid glass

chipping and breakage.

• Finger cots and/or gloves are recommended when handling

OLEDs to avoid corrosion of contacting material.

• In case of a ﬂ ex connector or any other type of connector, do

not pull, press, or peel off the connector from glass contact

area, as this will cause module malfunctions.

• Do not submerge the module into any kind of solvent or

any other chemicals such as (but not limited to) acids,

bases or salts.

• Wipe off water drops. Contact with water over a long period

of time may cause damage to the scattering ﬁ lm on the active

side of the OLED, and an active OLED tile with water conden-

sation on its surface will result in corrosion of metal traces.

• Handle the OLED’s surface (glass or ﬁ lm) with care. Avoid

hard or sharp objects coming into contact with the tile sur-

face. Do not rub hard on the OLED surface.

• Avoid touching exposed contact pads with bare ﬁ ngers, as

this will leave moisture on metal traces and cause corrosion.

• In case of OLED breakage, please avoid direct contact and

handle like broken glass: Use protective gloves to avoid injury.

Use a dust pan and hand brush to dispose of the splinters.

• Keep chips and materials out of reach of children.

• The light-emitting side of the OLED device can be cleaned

by softly wiping the surface with a moist cleaning cloth.

Small amounts of glass cleaner may be used.

1.2. Contact ledges and their polarity

OLED devices without Flex-PCB (for Flex-PCB, please see

below) are electrically connected via the metallized areas

at the contact ledges (see ﬁ g. 1). Usually, symbols at the

metallization indicate the polarity of the contacts. For round

ORBEOS

contacts can be identiﬁ ed when looking at the emissive side

of the device: Cathode contacts exhibit a comb structure at

the edge of the active area (see ﬁ g. 2). Often, devices have

more than two contact ledges, i.e. there might be more than

one contact ledge for each polarity (see device in ﬁ g. 2).

(CDW-031, CMW-031) devices, the cathode

OLED INTEGRATION

The rectangular ORBEOS

ledges, two cathode pads and one anode pad (see ﬁ g. 2c).

All contact ledges must be electrically connected in order to

ensure optimum current supply from all sides necessary for

best brightness homogeneity over the active area. Other

conﬁ gurations will usually lead to a signiﬁ cant reduction of

brightness homogeneity.

RMW-046 exhibits three contact

Fig. 1. Rear side of an OLED device. The device is electrically connected at the contact ledges. Symbols usually indicate the polarity of the contacts.

–

ab c

+ +

–

Fig. 2. a) Polarity of a round ORBEOS® CDW-031, CMW-031. b) The cathode contacts exhibit a comb structure. c) The rectangular ORBEOS® RMW-046 has three contact ledges.

OLED INTEGRATION

1.3. Interconnection

On the following pages, several techniques for interconnec-

ting OLEDs are described. To interconnect OLED devices,

their contact surfaces have to be free of dust and grease.

If necessary, use isopropyl alcohol (IPA) to carefully wipe the

contact ledges clean.

1.4. Contacting of OLED tiles via conductive glue

The conductive epoxy used in this application example can

be obtained through R+S Components (conductive epoxy

CW2400, Stock No.: 496-265).

Mix equal amounts of part A and part B thoroughly for at least

2 minutes. The mixed components have to be applied within

a short period. The pot life is only 10 minutes at 24 °C. After-

wards, apply the epoxy to the contact surface and attach

In general, the interconnection should be applied without heat

introduction into the active area of the device. Furthermore,

avoid mechanical stress. Exercise caution in order to avoid

glass chipping and breakage when applying the interconnec-

tion at the substrate edges.

the wire. For better adhesion, fan out the strands of the wire

slightly before attaching it. The wire should have a cross-

sectional area of 0.25 – 0.5 mm². The curing time of the epoxy

is 4 hours at room temperature (24 °C). However, to achieve

maximum conductivity and adhesion, you may expose the ep-

oxy to a temperature of 66 °C – 80 °C for 10 minutes and sub-

sequently allow it to cool. Please note that the heat should be

applied to the contact ledges only.

Fig. 3. Rear side of an OLED device. Two wires are attached to the contact ledges with conductive epoxy.

1.5. Contacting of OLED tiles via elastomeric connectors

In this example, elastomeric connectors are used for inter-

connecting OLEDs. Similar low-resistance connectors can

be used accordingly. The product can be acquired from

Nucletron Technologies GmbH, Munich.

OLED INTEGRATION

The connectors should cover the contact ledges completely to

minimize contact resistance. They have to be compressed by

5 – 25 % of their height to ensure optimal conductivity and

vibration resistance. The carrier of the OLED has to provide a

sufﬁ cient holding force and also has to ﬁ x the connectors late-

rally. To calculate the force needed, consult the datasheet of

the connectors. Keep in mind that the active area of the OLEDs

should not be exposed to mechanical stress.

Fig. 4. Front side of an ORBEOS® CMW-031. The elastomeric connectors (light blue) have to be compressed to ensure sufﬁ cient electrical connection.

OLED INTEGRATION

abc

Fig. 5. Free-standing Flex-PCB with four ﬂ aps (a) attached to an ORBEOS® CMW-031 (b). The eight golden soldering pads of the Flex-PCB are visible. Each one provides a positive and negative pole as well as a through contact “0”. ORBEOS

RMW-046 (c) can be equipped with a ﬂ ex connector with two soldering pads on both sides (front side and back side).

1.6. Contacting via Flex-PCB

The application of Flex-PCBs (ﬂ exible printed circuit boards)

allows the connection of an OLED device with wires by stan-

dard selective solder process (heat tip). Devices with more

than two contact ledges can be connected by only two wires

without any branches. Furthermore, depending on the de-

sign, Flex-PCBs are bendable due to their low thickness in

the range of 300 µm.

As an example, ﬁ gure 5 shows a Flex-PCB (left) attached to

an ORBEOS

CMW-031 (right). The Flex-PCB has four con-

tacts to the OLED and 8 areas for external wiring. Figure 5.

c) illustrates the Flex-PCB of an ORBEOS

RMW-046. Several

different wiring modes are possible using the ﬂ ex connector as

shown in ﬁ gure 6.

Fig. 6. a) Single devices (CDW-031, CMW-031)

Fig. 6. Various wiring options. These can be realized with the help of the Flex-PCB shown in ﬁ gure 5.

Fig. 6. b) Series connection (CDW-031, CMW-031)

Fig. 6. c) Series connection with back wiring (CDW-031, CMW-031)

Fig 6. d) Single device and series connection (RMW-046)

OLED INTEGRATION

Flex-PCBs are applied by a special conductive polymer mate-

rial in a thermo-compression process called ACF bonding

(anisotropic conductive ﬁ lm bonding), which is well known

from the display industry: First, a two-component material is

dispensed at the contact pad of the OLED. Then, the Flex-PCB

is adjusted to the contact pad. Afterwards, heat and pressure

is applied on the connection by a heated stamp (bonding

tool, ﬁ gure 7).

ORBEOS

devices are available with PCB. In case an indivi-

dual PCB design is desired, and for more details on the

material and process conditions, the following links regarding

ACF may be helpful:

http://www.hitachi-chem.co.jp/english/products/do/001.html

http://www.sonycid.jp/en/products/dd1/

For more details on ACF/heatseal bonding equipment, please

refer to, e.g.:

http://www.miyachieurope.com/products/hot-bar/

Thermal management:

Heat sinks as known from LED technology are not obligatory, since

OLEDs are cooled passively by heat convection and radiation from

both of their surfaces. A device, which is driven at typical operation

conditions (1000 cd/m

luminance), heats up by between 5 K and

15 K above ambient temperature. In general, the design of the OLED

application should enable sufﬁ cient heat transport from the surfaces.

Please also see the section: 4.2.2. Ambient temperature.

Fig. 7. Application of Flex-PCB on the OLED contacts via ACF bonding.

BINNING

2. Binning

Solid-state lighting products are usually classiﬁ ed into color and

brightness bins in order to meet customer demands and deliver

as narrow selections as possible. For ORBEOS

binning schemes are explained in the following sections.

2.1. Color binning

products, the

A widely-used standard for the classiﬁ cation of chromaticity

in SSL application is “ANSI_NEMA_ANSLG C78.377-2008”

(http://www.nema.org/stds/ANSI-ANSLG-C78-377.cfm).

In this document, standard color temperatures are deﬁ ned

and described as boxes along the Planck curve (as shown

Fig. 8. ANSI-NEMA classiﬁ cation of SSL color temperature boxes.

in ﬁ gure 8).

The corner and center points of these boxes are addressed as follows:

2,700 K 3,000 K 3,500 K 4,000 K 4,500 K 5,000 K 5,700 K 6,500 K

xyxyxyxyxyxyx yxy

Center

point

Tolerance

quadrangle

0.4578 0.4101 0.4338 0.4030 0.4073 0.3917 0.3818 0.3797 0.3611 0.3658 0.3447 0.3553 0.3287 0.3417 0.3123 0.3282

0.4813 0.4319 0.4562 0.4260 0.4299 0.4165 0.4006 0.4044 0.3736 0.3874 0.3551 0.3760 0.3376 0.3616 0.3205 0.3481

0.4562 0.4260 0.4299 0.4165 0.3996 0.4015 0.3736 0.3874 0.3548 0.3736 0.3376 0.3616 0.3207 0.3462 0.3028 0.3304

0.4373 0.3893 0.4147 0.3814 0.3889 0.3690 0.3670 0.3578 0.3512 0.3465 0.3366 0.3369 0.3222 0.3243 0.3068 0.3113

0.4593 0.3944 0.4373 0.3893 0.4147 0.3814 0.3839 0.3716 0.3670 0.3578 0.3515 0.3487 0.3366 0.3369 0.3221 0.3261

Table 1: CIE x/y coordinates of corners and centers of the ANSI-NEMA boxes.

OSRAM has established a ﬁ ner resolution classiﬁ cation and

has divided the ANSI-NEMA color boxes into smaller sub-bins

(so called “ﬁ ne-bins”). In order to cover the full production

output, a row of sub-bins of similar size have been introduced

above and below the ANSI-NEMA boxes. The scheme is

shown in ﬁ gure 9.

BINNING

In this binning scheme, the size of one ﬁ ne-bin box roughly

corresponds to a three-step MacAdam ellipse. According

to MacAdam, a one-step ellipse in the CIE 1931 diagram

represents an area where a homogeneous color impression

is perceived (MacAdam, D. L., Visual sensitivities to color dif-

ferences in daylight, J. Opt. Soc. Am., 32, 247 (1942)) and

where color differences are just noticeable to human observers.

The nomenclature of the ﬁ ne-bins is set up as follows. The

resulting grid pattern is created by rows – enumerated from

4 to 8 (and 9, respectively) towards the top – and by columns

assigned from left to right with characters ranging from C to

X. The ﬁ ne-bin is addressed via a combination of row num-

ber and column character. The example in ﬁ gure 9 highlights

the bin 7H. The chromaticity coordinates of the ﬁ ne-bins are

given in the appendix.

Since it is impossible to produce only one selected bin, an order

has to combine several ﬁ ne-bins. The more parts are needed,

the more ﬁ ne-bins have to be selected in order to ensure se-

curity of supply. Individual selections can be agreed upon in

close cooperation with each customer.

Fig. 9. OSRAM Opto Semiconductors’ ﬁ ne binning scheme of white color.

BINNING

2.2. Luminance binning

Brightness binning of OLEDs is slightly different than for LED

products. While inorganic LEDs rely on luminous intensity or

a ﬁ ner classiﬁ cation. Detailed values of upper and lower bin

limits are shown in table 2.

luminous ﬂ ux binning, the most reasonable quantity for OLED

products is the luminance. For ORBEOS

products, the binning

scheme is characterized by a double-digit system. The ﬁ rst digit

denotes the rough luminance class. The second digit delivers

ORBEOS

deﬁ ned by the constant drive current. For example, the

ORBEOS

Luminance class 1st digit: Luminance class Luminance range 2nd digit: Fine-bin Binning code

250 cd/m

500 cd/m

1,000 cd/m

2,000 cd/m

4,000 cd/m

Upper limit

cd/m

1 200 230 1

1 230 265 2

1 265 305 3

1 305 350 4

1 350 400 5

2 400 460 1

2 460 530 2

2 530 610 3

2 610 700 4

2 700 800 5

3 800 920 1

3 920 1,060 2

3 1,060 1,220 3

3 1,220 1,400 4

3 1,400 1,600 5

4 1,600 1,840 1

4 1,840 2,120 2

4 2,120 2,440 3

4 2,440 2,800 4

4 2,800 3,200 5

5 3,200 3,680 1

5 3,680 4,240 2

5 4,240 4,880 3

5 4,880 5,600 4

5 5,600 6,400 5

Lower limit

cd/m

products are usually set to a nominal luminance

CDW-031 is a typical 1000 cd/m² product.

Table 2: Limit values of luminance bins.

3. Driving

DRIVING/RELIABILITY

In general, OLEDs are driven in constant current mode. If

dimming is required, it is recommended to use PWM (pulse

width modulation). Besides, it is also possible to adjust the

driving current. Please note that current modulation may in-

ﬂ uence the color coordinates of the emitted light.

If several OLEDs are supposed to light up simultaneously, a

series connection has to be used. Parallel connection may

result in different luminance values or even cause damage of

the devices. OLEDs are designed for driving under forward

voltage only. Please avoid any kind of reverse voltage applied

to the OLED.

4. Reliability

4.1. Maximum ratings

The core materials of an OLED device are organic semicon-

ductor compounds which currently cannot be used under

extreme conditions. OSRAM deﬁ ned some generic maximum

ratings for the operation of ORBEOS

in table 3.

products as described

If a constant-current source design for LEDs is used, make

sure that the power supply doesn’t generate current and/or

voltage overshoots while switching it on or off.

Parameter Value

Relative humidity 40 °C/93 %

Operating temperature range -20 … +40 °C

These ratings can also be found on the datasheets. Stresses

beyond the conditions listed in this table or the dedicated

datasheet may cause permanent damage to the device.

Stresses at maximum rating conditions for extended periods

may affect the device reliability. This may include optical arti-

facts and sudden failure modes such as shorts as well as

faster luminance degradation.

Storage temperature range -40 … +60 °C

Operating and storage pressure 0.8 … 1.2 bar

Table 3: OLED maximum ratings.

RELIABILITY

1.00

0.75

0.50

0.25

Relative luminance [L/L0]

0 2,500 5,000 7,500 10,000 12,500 15,000 17,500

Fig. 10. Luminance degradation characteristics of an OLED with two different initial luminance values (normalized luminance values). The lower curve shows a drop to 50 % of the initial value after approximately 5,000 hours. By reducing the initial luminance by a factor of 2, the time to reach the half value nearly triples to 14,000 hours (upper curve).

Operating time [h]

Initial luminance = 50 % of standard Standard initial luminance

4.2. Degradation

The major type of degradation during operation which can be

observed quite easily is the decay of luminance. Driven under

constant current conditions, the luminance of an OLED typi-

cally degrades according to a stretched exponential behavior,

meaning that the initial degradation rate is higher than the

degradation rate in the mid or later state of operation. The

luminance degradation effect is dependent on several side

parameters:

4.2.1. Absolute value of initial luminance

The higher the luminance of the OLED, the more charge car-

riers are transported through the device which can initiate

degradation mechanisms. Additionally, the internal OLED

temperature increases due to higher energy input resulting in

an accelerated degradation. Depending on the stack archi-

tecture, the effect can be more or less pronounced. As a rule

of thumb, it can be estimated that the lifetime can be tripled

when the initial luminance is decreased by 50 %. This is indi-

cated in ﬁ gure 10 (above).

In parallel to the luminance decay, the driving voltage will in-

crease during operation in constant current mode. ORBEOS®

OLEDs currently show a voltage increase of less than 1.0 V

after reaching 50 % of the initial luminance.

4.2.2. Ambient temperature

The luminance degradation is a process which requires acti-

vation energy. This means that for higher ambient temperature,

the decay rate is also higher. As another rule of thumb, it can

be estimated that a temperature increase of about 20 K cur-

rently leads to reduction of lifetime by approximately 50 %.

Since the OLED is sensitive to higher temperatures, a heat man-

agement system is recommended in order to keep operating

temperature low and the lifetime of the OLED high. Depending

on the individual integration level, e.g. in a well-insulated envi-

ronment, accumulation of heat needs to be avoided.

4.3. Lifetime

The luminance degradation is the most important parameter

for the deﬁ nition of lifetime and reliability. For a single OLED

device, the lifetime is usually deﬁ ned as the time interval in

which the luminance has dropped to a certain percentage of

its initial value. The operating conditions (constant current

driving, ambient temperature etc.) remain unchanged during

this period of time.

Most common in use are L50 and L70 values, representing

the time intervals after which 50 % and 70 % of the initial

luminance values have been reached. In contrast to other

light sources the luminance is taken as reference quantity

and not luminous intensity or luminous ﬂ ux, because for a

large area emitter the luminance can be determined easier

and quicker.

4.4. Robustness

RELIABILITY

In the following paragraphs, some indications are given on

the ruggedness of OLEDs and their stability against some

environmental conditions.

4.4.1. Mechanical pressure, shock and vibration

OLEDs are made of glass, meaning that mechanical forces

may cause glass breaks. One special case is local pressure

on the back side of a cavity-glass-encapsulated OLED. Even

with quite low forces (just by using a ﬁ nger) the cap glass

may be bended and touches the cathode of the OLED caus-

ing damage to the device. Such handling must be avoided

during assembly of the OLED. For a thin-ﬁ lm-encapsulated

device, this issue is irrelevant. OSRAM has tested various

OLEDs and their resistance against shock and vibration. The

table below shows the tested conditions. There is no concern

to use OLEDs under these conditions.

4.4.2. ESD sensitivity

OLEDs represent a big capacitance. However, they are not

designed for reverse operation. The organic layer structure

is very thin, meaning that high electrical ﬁ elds can occur in

case of electrostatic discharge. According to the human body

model (HBM), OLEDs can withstand 1 kV. Proper grounding

should be assured when handling OLEDs during luminaire

assembly. In order to ensure maximum ESD stability, all

ORBEOS

equipped with an ESD protection diode.

panels with ﬂ ex connectors from OSRAM are

4.4.3. Low air pressure

The maximum ratings on the datasheet state 800 mbar as

minimum pressure. Actually, the OLEDs can withstand lower

air pressures, e.g. while transporting them on a plane. The

limit must be mentioned in case of glass-cavity-encapsulated

OLEDs. The glass cavity is ﬁ lled with an inert gas at standard

ambient pressure. By decreasing the outer pressure, the dif-

ference between inner and outer pressure may cause a lift-

off of the cap glass from the substrate. However, the exact

values for the limit pressures change with the size of the

OLED. In case of a thin-ﬁ lm-encapsulated OLED, this issue

is irrelevant.

4.4.4. Shelf life

Shelf life denotes the length of time a product may be stored

without becoming unsuitable for use. Under ambient condi-

tions (room temperature, 50 % RH, no direct exposure to

sunlight etc.) it is typically 10 years. Increased temperature

may reduce shelf life.

4.4.5. Photo degradation (UV resistance)

OLEDs are currently designed for indoor applications.

Test Condition Duration

Mechanical vibration Displacement: 0.35 mm

10 sweeps per X, Y, Z direction

Acceleration: 5 g

Frequency: 10 – 500 Hz

Mechanical shock 11 ms half sine

6 shocks per X, Y, Z direction

100 g peak

APPENDIX

Appendix

Corner values (CIE coordinates) of all 4C9X ﬁ ne-bins

Bin cx cy Bin cx cy Bin cx cy Bin cx cy

8C 0.3028 0.3304 8J 0.3548 0.3736 9Q 0.4198 0.4115 9W 0.4688 0.429

0.3015 0.3368 0.356 0.3826 0.4232 0.4201 0.4739 0.4382

0.3076 0.343 0.3659 0.3899 0.4337 0.4253 0.4803 0.4398

0.3087 0.3363 0.3642 0.3805 0.4299 0.4165 0.475 0.4304

7C 0.3041 0.324 7J 0.3536 0.3646 8Q 0.4164 0.4029 8W 0.4636 0.4197

0.3028 0.3304 0.3548 0.3736 0.4198 0.4115 0.4688 0.429

0.3087 0.3363 0.3642 0.3805 0.4299 0.4165 0.475 0.4304

0.3098 0.3296 0.3625 0.3711 0.4261 0.4077 0.4697 0.4211

6C 0.3055 0.3177 6J 0.3524 0.3555 7Q 0.4129 0.3944 7W 0.4585 0.4104

0.3041 0.324 0.3536 0.3646 0.4164 0.4029 0.4636 0.4197

0.3098 0.3296 0.3625 0.3711 0.4261 0.4077 0.4697 0.4211

0.3108 0.3229 0.3608 0.3616 0.4223 0.3989 0.4644 0.4118

5C 0.3068 0.3113 5J 0.3512 0.3465 6Q 0.4095 0.3858 6W 0.4534 0.4011

0.3055 0.3177 0.3524 0.3555 0.4129 0.3944 0.4585 0.4104

0.3108 0.3229 0.3608 0.3616 0.4223 0.3989 0.4644 0.4118

0.3119 0.3162 0.3591 0.3522 0.4185 0.3902 0.4591 0.4024

4C 0.3081 0.3049 4J 0.35 0.3375 5Q 0.4061 0.3773 5W 0.4483 0.3918

0.3068 0.3113 0.3512 0.3465 0.4095 0.3858 0.4534 0.4011

0.3119 0.3162 0.3591 0.3522 0.4185 0.3902 0.4591 0.4024

0.313 0.3095 0.3574 0.3427 0.4147 0.3814 0.4538 0.3931

8D 0.3087 0.3363 8K 0.3642 0.3805 4Q 0.4027 0.3687 4W 0.4432 0.3826

0.3076 0.343 0.3659 0.3899 0.4061 0.3773 0.4483 0.3918

0.3138 0.3492 0.3758 0.3973 0.4147 0.3814 0.4538 0.3931

0.3146 0.3422 0.3736 0.3874 0.4109 0.3726 0.4485 0.3838

7D 0.3098 0.3296 7K 0.3625 0.3711 9R 0.4299 0.4165 9X 0.475 0.4304

0.3087 0.3363 0.3642 0.3805 0.4337 0.4253 0.4803 0.4398

0.3146 0.3422 0.3736 0.3874 0.4428 0.4286 0.4868 0.4413

0.3154 0.3352 0.3714 0.3775 0.4387 0.4197 0.4813 0.4319

6D 0.3108 0.3229 6K 0.3608 0.3616 8R 0.4261 0.4077 8X 0.4697 0.4211

0.3098 0.3296 0.3625 0.3711 0.4299 0.4165 0.475 0.4304

0.3154 0.3352 0.3714 0.3775 0.4387 0.4197 0.4813 0.4319

0.3162 0.3282 0.3692 0.3677 0.4346 0.4108 0.4758 0.4225

5D 0.3119 0.3162 5K 0.3591 0.3522 7R 0.4223 0.3989 7X 0.4644 0.4118

0.3108 0.3229 0.3608 0.3616 0.4261 0.4077 0.4697 0.4211

0.3162 0.3282 0.3692 0.3677 0.4346 0.4108 0.4758 0.4225

0.317 0.3212 0.367 0.3578 0.4304 0.4018 0.4703 0.4132

4D 0.313 0.3095 4K 0.3574 0.3427 6R 0.4185 0.3902 6X 0.4591 0.4024

0.3119 0.3162 0.3591 0.3522 0.4223 0.3989 0.4644 0.4118

0.317 0.3212 0.367 0.3578 0.4304 0.4018 0.4703 0.4132

0.3178 0.3142 0.3648 0.3479 0.4263 0.3929 0.4648 0.4038

8E 0.3146 0.3422 8L 0.3736 0.3874 5R 0.4147 0.3814 5X 0.4538 0.3931

0.3138 0.3492 0.3758 0.3973 0.4185 0.3902 0.4591 0.4024

0.32 0.3554 0.3853 0.4033 0.4263 0.3929 0.4648 0.4038

0.3205 0.3481 0.3826 0.3931 0.4222 0.384 0.4593 0.3944

APPENDIX

Corner values (CIE coordinates) of all 4C9X ﬁ ne-bins

Bin cx cy Bin cx cy Bin cx cy Bin cx cy

7E 0.3154 0.3352 7L 0.3714 0.3775 4R 0.4109 0.3726 4X 0.4485 0.3838

0.3146 0.3422 0.3736 0.3874 0.4147 0.3814 0.4538 0.3931

0.3205 0.3481 0.3826 0.3931 0.4222 0.384 0.4593 0.3944

0.321 0.3408 0.3799 0.3828 0.4181 0.3751 0.4538 0.385

6E 0.3162 0.3282 6L 0.3692 0.3677 9S 0.4387 0.4197

0.3154 0.3352 0.3714 0.3775 0.4428 0.4286

0.321 0.3408 0.3799 0.3828 0.4518 0.4319

0.3216 0.3334 0.3773 0.3726 0.4474 0.4228

5E 0.317 0.3212 5L 0.367 0.3578 8S 0.4346 0.4108

0.3162 0.3282 0.3692 0.3677 0.4387 0.4197

0.3216 0.3334 0.3773 0.3726 0.4474 0.4228

0.3221 0.3261 0.3746 0.3624 0.443 0.4138

4E 0.3178 0.3142 4L 0.3648 0.3479 7S 0.4304 0.4018

0.317 0.3212 0.367 0.3578 0.4346 0.4108

0.3221 0.3261 0.3746 0.3624 0.443 0.4138

0.3226 0.3188 0.3719 0.3522 0.4386 0.4047

8F 0.3207 0.3462 8M 0.3826 0.3931 6S 0.4263 0.3929

0.3202 0.3535 0.3853 0.4033 0.4304 0.4018

0.3291 0.3617 0.3947 0.4093 0.4386 0.4047

0.3291 0.3539 0.3916 0.3987 0.4342 0.3957

7F 0.3212 0.3389 7M 0.3799 0.3828 5S 0.4222 0.384

0.3207 0.3462 0.3826 0.3931 0.4263 0.3929

0.3291 0.3539 0.3916 0.3987 0.4342 0.3957

0.3292 0.3461 0.3885 0.3882 0.4298 0.3867

6F 0.3217 0.3316 6M 0.3773 0.3726 4S 0.4181 0.3751

0.3212 0.3389 0.3799 0.3828 0.4222 0.384

0.3292 0.3461 0.3885 0.3882 0.4298 0.3867

0.3293 0.3384 0.3853 0.3776 0.4253 0.3776

5F 0.3222 0.3243 5M 0.3746 0.3624 9T 0.4474 0.4228

0.3217 0.3316 0.3773 0.3726 0.4518 0.4319

0.3293 0.3384 0.3853 0.3776 0.4609 0.4352

0.3294 0.3306 0.3822 0.367 0.4562 0.426

4F 0.3227 0.317 4M 0.3719 0.3522 8T 0.443 0.4138

0.3222 0.3243 0.3746 0.3624 0.4474 0.4228

0.3294 0.3306 0.3822 0.367 0.4562 0.426

0.3295 0.3228 0.3791 0.3564 0.4515 0.4168

8G 0.3291 0.3539 8N 0.3916 0.3987 7T 0.4386 0.4047

0.3291 0.3617 0.3947 0.4093 0.443 0.4138

0.3379 0.3698 0.4042 0.4153 0.4515 0.4168

0.3376 0.3616 0.4006 0.4044 0.4467 0.4076

7G 0.3292 0.3461 7N 0.3885 0.3882 6T 0.4342 0.3957

0.3291 0.3539 0.3916 0.3987 0.4386 0.4047

0.3376 0.3616 0.4006 0.4044 0.4467 0.4076

0.3373 0.3534 0.397 0.3935 0.442 0.3985

APPENDIX

Corner values (CIE coordinates) of all 4C9X ﬁ ne-bins

Bin cx cy Bin cx cy Bin cx cy Bin cx cy

6G 0.3293 0.3384 6N 0.3853 0.3776 5T 0.4298 0.3867

0.3292 0.3461 0.3885 0.3882 0.4342 0.3957

0.3373 0.3534 0.397 0.3935 0.442 0.3985

0.3369 0.3451 0.3934 0.3825 0.4373 0.3893

5G 0.3294 0.3306 5N 0.3822 0.367 4T 0.4253 0.3776

0.3293 0.3384 0.3853 0.3776 0.4298 0.3867

0.3369 0.3451 0.3934 0.3825 0.4373 0.3893

0.3366 0.3369 0.3898 0.3716 0.4326 0.3801

4G 0.3295 0.3228 4N 0.3791 0.3564 9U 0.4562 0.426

0.3294 0.3306 0.3822 0.367 0.4609 0.4352

0.3366 0.3369 0.3898 0.3716 0.4674 0.4367

0.3363 0.3287 0.3862 0.3607 0.4625 0.4275

8H 0.3376 0.3616 9O 0.3996 0.4015 8U 0.4515 0.4168

0.3379 0.3698 0.4023 0.4096 0.4562 0.426

0.3471 0.3775 0.4128 0.4148 0.4625 0.4275

0.3464 0.3688 0.4097 0.4065 0.4576 0.4182

7H 0.3373 0.3534 8O 0.3969 0.3934 7U 0.4467 0.4076

0.3376 0.3616 0.3996 0.4015 0.4515 0.4168

0.3464 0.3688 0.4097 0.4065 0.4576 0.4182

0.3456 0.3601 0.4067 0.3982 0.4526 0.409

6H 0.3369 0.3451 7O 0.3943 0.3852 6U 0.442 0.3985

0.3373 0.3534 0.3969 0.3934 0.4467 0.4076

0.3456 0.3601 0.4067 0.3982 0.4526 0.409

0.3448 0.3515 0.4036 0.3898 0.4477 0.3998

5H 0.3366 0.3369 6O 0.3916 0.3771 5U 0.4373 0.3893

0.3369 0.3451 0.3943 0.3852 0.442 0.3985

0.3448 0.3515 0.4036 0.3898 0.4477 0.3998

0.344 0.3428 0.4006 0.3815 0.4428 0.3906

4H 0.3363 0.3287 5O 0.3889 0.369 4U 0.4326 0.3801

0.3366 0.3369 0.3916 0.3771 0.4373 0.3893

0.344 0.3428 0.4006 0.3815 0.4428 0.3906

0.3433 0.3341 0.3975 0.3731 0.4379 0.3813

8I 0.3464 0.3688 4O 0.3862 0.3609 9V 0.4625 0.4275

0.3471 0.3775 0.3889 0.369 0.4674 0.4367

0.3563 0.3851 0.3975 0.3731 0.4739 0.4382

0.3551 0.376 0.3945 0.3648 0.4688 0.429

7I 0.3456 0.3601 9P 0.4097 0.4065 8V 0.4576 0.4182

0.3464 0.3688 0.4128 0.4148 0.4625 0.4275

0.3551 0.376 0.4232 0.4201 0.4688 0.429

0.3539 0.3669 0.4198 0.4115 0.4636 0.4197

6I 0.3448 0.3515 8P 0.4067 0.3982 7V 0.4526 0.409

0.3456 0.3601 0.4097 0.4065 0.4576 0.4182

0.3539 0.3669 0.4198 0.4115 0.4636 0.4197

0.3527 0.3578 0.4164 0.4029 0.4585 0.4104

APPENDIX

Corner values (CIE coordinates) of all 4C9X ﬁ ne-bins

Bin cx cy Bin cx cy Bin cx cy Bin cx cy

5I 0.344 0.3428 7P 0.4036 0.3898 6V 0.4477 0.3998

0.3448 0.3515 0.4067 0.3982 0.4526 0.409

0.3527 0.3578 0.4164 0.4029 0.4585 0.4104

0.3515 0.3487 0.4129 0.3944 0.4534 0.4011

4I 0.3433 0.3341 6P 0.4006 0.3815 5V 0.4428 0.3906

0.344 0.3428 0.4036 0.3898 0.4477 0.3998

0.3515 0.3487 0.4129 0.3944 0.4534 0.4011

0.3503 0.3396 0.4095 0.3858 0.4483 0.3918

5P 0.3975 0.3731 4V 0.4379 0.3813

0.4006 0.3815 0.4428 0.3906

0.4095 0.3858 0.4483 0.3918

0.4061 0.3773 0.4432 0.3826

4P 0.3945 0.3648

0.3975 0.3731

0.4061 0.3773

0.4027 0.3687

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