Oracle StorageTek SL3000 System Assurance Manual

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StorageTek SL3000

Systems Assurance Guide

E20876-11

September 2014

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StorageTek SL3000 Systems Assurance Guide

E20876-11

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Preface ............................................................................................................................................................... xiii

Documentation Accessibility................................................................................................................... xiii

1 Introduction

Library Features ........................................................................................................................................ 1-1

Software Options...................................................................................................................................... 1-2

Supported Tape Drives and Media....................................................................................................... 1-2

2 Library Modules and Hardware

Library Modules....................................................................................................................................... 2-1

Base Module........................................................................................................................................ 2-2

Configuration Options ............................................................................................................... 2-2

Components................................................................................................................................. 2-2

Drive Expansion Module .................................................................................................................. 2-3

Configuration Options ............................................................................................................... 2-3

Components................................................................................................................................. 2-3

Cartridge Expansion Module ........................................................................................................... 2-4

Configuration Options ............................................................................................................... 2-4

Parking Expansion Module .............................................................................................................. 2-4

Configuration Options ............................................................................................................... 2-4

Access Expansion Module ................................................................................................................ 2-5

Configuration Options ............................................................................................................... 2-5

Hardware Components ........................................................................................................................... 2-5

Electronics Control Module.............................................................................................................. 2-5

Command Line Interface ........................................................................................................... 2-6

Redundant Electronics ............................................................................................................... 2-6

Robotics ............................................................................................................................................... 2-6

Redundant Robotics ................................................................................................................... 2-6

Cartridge Access Ports - Rotational................................................................................................. 2-6

Cartridge Access Ports - Bulk Load................................................................................................. 2-7

3 Software and Connectivity

Host Connectivity..................................................................................................................................... 3-1

FC-SCSI Connection........................................................................................................................... 3-1

Supported Topologies ................................................................................................................ 3-1

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TCP/IP Connection ........................................................................................................................... 3-2

Port Bonding ....................................................................................................................................... 3-2

Media Validation...................................................................................................................................... 3-2

Library Monitoring .................................................................................................................................. 3-2

StorageTek Library Console ............................................................................................................. 3-2

Simple Network Management Protocol ......................................................................................... 3-3

Log SnapShot Feature........................................................................................................................ 3-3

Library Management Software.............................................................................................................. 3-3

Automated Cartridge System Library Software (ACSLS) ........................................................... 3-3

Enterprise Library Software ............................................................................................................. 3-4

Host Software Component (HSC) and Storage Management Component (SMC) ........... 3-4

Virtual Tape Control System (VTCS)....................................................................................... 3-4

Concurrent Disaster Recovery Test (CDRT) ........................................................................... 3-4

Independent Software Vendors (ISVs)............................................................................................ 3-4

Other Storage System Solutions............................................................................................................ 3-4

Client System Component (CSC)..................................................................................................... 3-5

Expert Performance Reporter........................................................................................................... 3-5

Extended High Performance Data Mover...................................................................................... 3-5

Library Content Manager (LCM)..................................................................................................... 3-5

Linear Tape File System (LTFS) ....................................................................................................... 3-5

StorageTek Tape Analytics ............................................................................................................... 3-5

Virtual Storage Manager (VSM)....................................................................................................... 3-6

Virtual Library Extension (VLE)............................................................................................... 3-6

4 Capacity

Physical Capacity...................................................................................................................................... 4-1

Calculation Example 1: Base, DEM, CEMs, PEMs ........................................................................ 4-2

Calculation Example 2: Base and CEM........................................................................................... 4-2

Calculation Example 3: Base, DEM, CEMs, AEM ......................................................................... 4-2

Active Capacity ......................................................................................................................................... 4-3

RealTime Growth ............................................................................................................................... 4-3

Capacity on Demand ......................................................................................................................... 4-3

5 Power and Cooling

Power Configurations.............................................................................................................................. 5-1

AC Power Source Options ................................................................................................................ 5-1

Power Redundancy Options ............................................................................................................ 5-1

N+1 power configuration (standard) ...................................................................................... 5-1

2N power configuration............................................................................................................. 5-2

2N+1 power configuration ........................................................................................................ 5-2

DC Power Supplies.................................................................................................................................. 5-2

Electronic Control Module Power Supplies................................................................................... 5-3

Robotics Unit Power Supplies.......................................................................................................... 5-3

Tape Drive Power Supplies .............................................................................................................. 5-4

Calculating Tape Drive Power Supply Quantities............................................................................ 5-4

Watt Consumption Per Drive........................................................................................................... 5-4

Power Supplies Required for 120 VAC PDUs ............................................................................... 5-4

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Power Supplies Required for 240 VAC PDUs ............................................................................... 5-5

Example: Calculating Required Number of Drive DC Power Supplies .................................... 5-5

AC Power Cables...................................................................................................................................... 5-6

Power Consumption ................................................................................................................................ 5-7

Calculating Total Watts, CO

Power Consumption Example 1 ............................................................................................... 5-7

Power Consumption Example 2 ............................................................................................... 5-8

Cooling ....................................................................................................................................................... 5-8

Library Electronics Control Module................................................................................................ 5-8

Tape Drives ......................................................................................................................................... 5-9

DC Power Supplies ............................................................................................................................ 5-9

Emissions, and Btu/hr .................................................................. 5-7

6 Systems Assurance

System Assurance Planning................................................................................................................... 6-1

Engagement Methodology...................................................................................................................... 6-1

Actions for Sales Personnel............................................................................................................... 6-1

7 Site Planning

Networking................................................................................................................................................ 7-1

Physical Dimensions and Weights ....................................................................................................... 7-2

Base Module........................................................................................................................................ 7-3

Drive Expansion Module .................................................................................................................. 7-4

Cartridge and Parking Expansion Modules................................................................................... 7-4

Access Expansion Module ................................................................................................................ 7-4

Covers, Doors, and Service Clearances........................................................................................... 7-5

Floor Requirements.................................................................................................................................. 7-5

Weight.................................................................................................................................................. 7-5

Floor Slope .......................................................................................................................................... 7-5

Fire Suppression Planning ..................................................................................................................... 7-6

Cable Routing ........................................................................................................................................... 7-6

AC Power Configurations and Cables............................................................................................ 7-6

Library Network and Tape Drive Cables ....................................................................................... 7-7

Environmental Requirements................................................................................................................ 7-7

Power Consumption.......................................................................................................................... 7-7

Seismic or Earthquake Ratings......................................................................................................... 7-7

Airborne Contaminants .................................................................................................................... 7-8

8 Installation Planning

Physical Space........................................................................................................................................... 8-1

Time and Personnel ................................................................................................................................. 8-1

Shipping Weights and Measures .......................................................................................................... 8-2

Pallet Double Stacking............................................................................................................................ 8-3

Installation Tools...................................................................................................................................... 8-3

Drive Tray Power-on Tool ................................................................................................................ 8-4

Installation Kits................................................................................................................................... 8-4

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9 Ordering

Ordering Process ...................................................................................................................................... 9-1

Hardware Activation Files................................................................................................................ 9-1

Physical Configuration............................................................................................................................ 9-2

Base Module (required)..................................................................................................................... 9-2

Drive Expansion Module (DEM) ..................................................................................................... 9-2

Cartridge Expansion Module (CEM) .............................................................................................. 9-3

Dual Robotics Support ...................................................................................................................... 9-3

Parking Expansion Module (PEM)........................................................................................... 9-3

Access Expansion Module (AEM)............................................................................................ 9-4

Dual TallBots ............................................................................................................................... 9-4

Module Add-on Options......................................................................................................................... 9-4

Tape Drive Arrays.............................................................................................................................. 9-4

Cartridge Access Port ........................................................................................................................ 9-5

Rotational CAP............................................................................................................................ 9-5

Window Cartridge Array.................................................................................................................. 9-5

Operations Panel ................................................................................................................................ 9-5

Redundant Electronics ...................................................................................................................... 9-6

Activating Capacity.................................................................................................................................. 9-6

Active Capacity Permits.................................................................................................................... 9-6

Tape Drives................................................................................................................................................ 9-6

T-Series Drives.................................................................................................................................... 9-7

LTO Drives.......................................................................................................................................... 9-7

Conversion Kits .................................................................................................................................. 9-7

Encryption Switches and Cabling.................................................................................................... 9-7

Port Conversions Kits........................................................................................................................ 9-8

Cartridges and Labels.............................................................................................................................. 9-8

Power Options .......................................................................................................................................... 9-9

DC Power Supplies ............................................................................................................................ 9-9

AC Power Distribution Units (PDU)............................................................................................... 9-9

AC Power Cords................................................................................................................................. 9-9

Software Options...................................................................................................................................... 9-9

Cables ...................................................................................................................................................... 9-10

Fiber Optic Cables........................................................................................................................... 9-10

Ethernet Cables................................................................................................................................ 9-11

Support.................................................................................................................................................... 9-11

Service Delivery Platform .............................................................................................................. 9-11

Oracle Premier Support for Systems............................................................................................ 9-11

Contacting Support......................................................................................................................... 9-12

A Tape Drives and Media

Supported Tape Drives .......................................................................................................................... A-1

T9840 ................................................................................................................................................... A-1

T10000 ................................................................................................................................................. A-2

LTO Ultrium ...................................................................................................................................... A-2

Encryption.......................................................................................................................................... A-2

Tape Drive and Media Comparisons .................................................................................................. A-2

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B Controlling Contaminants

Environmental Contaminants............................................................................................................... B-1

Required Air Quality Levels................................................................................................................. B-2

Contaminant Properties and Sources .................................................................................................. B-2

Operator Activity .............................................................................................................................. B-3

Hardware Movement ....................................................................................................................... B-3

Outside Air......................................................................................................................................... B-3

Stored Items ....................................................................................................................................... B-3

Outside Influences ............................................................................................................................ B-3

Cleaning Activity .............................................................................................................................. B-4

Contaminant Effects ............................................................................................................................... B-4

Physical Interference......................................................................................................................... B-4

Corrosive Failure............................................................................................................................... B-4

Shorts .................................................................................................................................................. B-4

Thermal Failure ................................................................................................................................. B-5

Room Conditions..................................................................................................................................... B-5

Exposure Points ....................................................................................................................................... B-6

Filtration.................................................................................................................................................... B-6

Positive Pressurization and Ventilation ............................................................................................. B-7

Cleaning Procedures and Equipment.................................................................................................. B-8

Daily Tasks......................................................................................................................................... B-8

Weekly Tasks ..................................................................................................................................... B-8

Quarterly Tasks ................................................................................................................................. B-9

Biennial Tasks .................................................................................................................................... B-9

Activity and Processes.......................................................................................................................... B-10

C Standards of Conformance

Glossary

Index

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List of Figures

2–1 SL3000 Library Configuration Example .................................................................................. 2-1

2–2 Base Module Rear View............................................................................................................. 2-2

2–3 DEM Rear View........................................................................................................................... 2-3

2–4 Parking Expansion Module ....................................................................................................... 2-4

2–5 Electronics Control Module....................................................................................................... 2-5

2–6 Library CAPs ............................................................................................................................... 2-7

5–1 Power Supply Locations - Base and DEM (Rear View)......................................................... 5-3

7–1 Service Clearances and Dimensions (Top View).................................................................... 7-2

7–2 Service Clearances and Dimensions (Side View)................................................................... 7-3

7–3 Door Cable Routing Cutouts..................................................................................................... 7-6

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List of Tables

4–1 Physical Slot Capacity Per Module ......................................................................................... 4-1

5–1 Watts Per Drive .......................................................................................................................... 5-4

5–2 DC Power Supplies for Base (120 VAC PDU)....................................................................... 5-4

5–3 DC Power Supplies for DEM (120 VAC PDU) ..................................................................... 5-5

5–4 DC Power Supplies for Base (240 VAC PDU)....................................................................... 5-5

5–5 DC Power Supplies for DEM (240 VAC PDU) ..................................................................... 5-5

5–6 Base Module Tape Drive Watts Consumption Example...................................................... 5-5

5–7 DEM Tape Drive Watts Consumption Example ................................................................... 5-6

5–8 DC Supplies Required for Base Example ............................................................................... 5-6

5–9 DC Supplies Required for Drive Expansion Module - Example ........................................ 5-6

5–10 Power Cable Descriptions......................................................................................................... 5-7

5–11 Power Consumption Values..................................................................................................... 5-7

5–12 Power Consumption Example ................................................................................................. 5-8

5–13 Power Consumption Example ................................................................................................. 5-8

7–1 Base Module Measurements .................................................................................................... 7-3

7–2 Drive Expansion Module Measurements............................................................................... 7-4

7–3 Cartridge and Parking Expansion Module Measurements................................................. 7-4

7–4 Access Expansion Module Measurements............................................................................. 7-4

7–5 Covers, Doors, and Service Clearance Measurements ......................................................... 7-5

7–6 Environmental Specifications................................................................................................... 7-7

7–7 Gas Limit Recommendations ................................................................................................... 7-8

8–1 Installation Time Estimates ...................................................................................................... 8-2

8–2 Module and Tape Drive Shipping Information..................................................................... 8-2

8–3 Standard Installation Tools....................................................................................................... 8-3

8–4 Special Installation Tools .......................................................................................................... 8-3

9–1 Base Module Part Number ....................................................................................................... 9-2

9–2 Drive Expansion Module Part Numbers................................................................................ 9-2

9–3 Cartridge Expansion Module Part Numbers......................................................................... 9-3

9–4 Parking Expansion Module Part Numbers............................................................................ 9-3

9–5 Access Expansion Module Part Numbers.............................................................................. 9-4

9–6 Dual TallBots Part Numbers .................................................................................................... 9-4

9–7 Tape Drive Array Part Numbers ............................................................................................. 9-5

9–8 Rotational Cartridge Access Ports - Part Numbers............................................................... 9-5

9–9 Window Array Part Numbers.................................................................................................. 9-5

9–10 Operations Panel Part Numbers.............................................................................................. 9-6

9–11 Redundant Electronics Part Numbers .................................................................................... 9-6

9–12 Activate Capacity Permit Part Numbers................................................................................ 9-6

9–13 T-series Tape Drive Part Numbers.......................................................................................... 9-7

9–14 LTO Tape Drive Part Numbers................................................................................................ 9-7

9–15 Tape Drive Conversion Kits ..................................................................................................... 9-7

9–16 Drive E-Switch Harness Part Numbers .................................................................................. 9-8

9–17 T-Series Port Conversion Kit Part Numbers.......................................................................... 9-8

9–18 LTO Dual-Port Conversion Kit Part Numbers ..................................................................... 9-8

9–19 DC Power Supply Part Numbers ............................................................................................ 9-9

9–20 AC Power Distribution Unit Part Numbers........................................................................... 9-9

9–21 AC Power Cord Part Numbers ................................................................................................ 9-9

9–22 Software Options Part Numbers........................................................................................... 9-10

9–23 LC-to-LC, 50/125 Micron, Multimode Cable Part Numbers............................................ 9-10

9–24 LC-to-LC, 9/125 Micron, Single Mode Cable Part Numbers ........................................... 9-10

9–25 LC-to-SC, 9/125 Micron Cable Part Numbers.................................................................... 9-10

9–26 ESCON Cable Part Numbers................................................................................................. 9-11

9–27 Ethernet Cable Part Numbers ............................................................................................... 9-11

A–1 Tape Drive and Media Comparisons..................................................................................... A-2

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C–1 Standards of Conformance - Country.................................................................................... C-1

C–2 Standards of Conformance - Emissions................................................................................. C-1

C–3 Standards of Conformance - Directives................................................................................. C-1

C–4 Standards of Conformance...................................................................................................... C-1

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This guide is an introductory and planning resource for Oracle's StorageTek SL3000 modular library system. For additional product information, refer to the SL3000 product documentation library on the Oracle Technical Network (OTN):

http://www.oracle.com/technetwork/documentation/tape-storage-curr-187744.h tml

The system assurance process is the exchange of information between Oracle team members and the customer to ensure that no aspects of the sale, order, or installation of the SL3000 library are overlooked. This process promotes an error-free installation and contributes to overall customer satisfaction.

Documentation Accessibility

For information about Oracle's commitment to accessibility, visit the Oracle Accessibility Program website at

http://www.oracle.com/pls/topic/lookup?ctx=acc&id=docacc

Access to Oracle Support

Oracle customers have access to electronic support through My Oracle Support. For information, visit visit

http://www.oracle.com/pls/topic/lookup?ctx=acc&id=trs

impaired.

http://www.oracle.com/pls/topic/lookup?ctx=acc&id=info

Preface

if you are hearing

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Oracle's StorageTek SL3000 modular library system is a midrange storage solution that offers flexibility, scalability, and high availability. The SL3000 library uses a modular design to meet the demands of rapidly growing and constantly changing environments.

This guide is intended as an introductory and planning resource for the SL3000 library. For additional information about this product or other Oracle tape storage products, refer to the product documentation library on the Oracle Technical Network (OTN):

http://www.oracle.com/technetwork/documentation/tape-storage-curr-187744.h tml

Library Features

Modular Design

■ Consists of five module types: base module, drive expansion module, cartridge

Introduction

expansion module, parking expansion module, and access expansion module

■ Provides storage capacity for 200 to 5,925 cartridge slots and 1 to 56 tape drives

■ Provides cartridge loading for up to 260 cartridges using rotational cartridge

assess ports, and bulk cartridge loading capabilities from 234 to 468 cartridges using access expansion modules

Capacity on Demand

■ Provides the ability to expand non-disruptively in real time by activating

previously installed physical capacity

■ Allows customer to purchase hardware in advance, but only pay for currently

required capacity

Any Cartridge, Any Slot

■ Supports multiple drive types (T9840, T10000, LTO)

■ Allows any cartridge type to be placed anywhere in the library

Centerline Technology

■ Allows modules to be added to either side of the Base module

■ Supports optional redundant robots for improved performance

■ Balances work load, improving efficiency and performance

Multiple Software and Connectivity Options

■ Supports both open systems and mainframe library management software options

Introduction 1-1

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Software Options

■ Allows for multiple host connectivity and partitioning options

■ Allows for dual control paths using either TCP/IP or Fibre Channel

Redundancy and Failover Protection

■ Supports optional redundant electronics for failover protection

■ Provides multiple power redundancy options

■ Supports optional redundant robotics to increase library efficiency

Software Options

The main options for library management software include:

■ Enterprise Library Software (ELS)/Host Software Component (HSC) for

mainframe

■ Automated Cartridge System Library Software (ACSLS) for open systems

Additional software and storage system solutions include:

■ Linear Tape File System (LTFS)

■ Virtual Storage Manager (VSM)

■ Library Content Manager (LCM) and Expert Library Reporter (ExPR)

■ StorageTek Tape Analytics (STA)

■ Independent Software Vendors (ISVs) and other 3rd party backup and archive

applications

Supported Tape Drives and Media

■ StorageTek T-Series (T9840C/D and T10000 series)

■ Linear Tape-Open (LTO) generations 3, 4, 5, and 6

1-2 StorageTek SL3000 Systems Assurance Guide

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This chapter describes each of the SL3000 library modules and their major hardware components. For dimensions and weights, see Chapter 7, "Site Planning".

Library Modules

■ Base Module (Base) — one required per library.

■ Drive Expansion Module (DEM) — maximum of one on the left side of a Base

■ Cartridge Expansion Module (CEM) — maximum of eight with four to left of

■ Parking Expansion Module (PEM) — must install as a pair with one on each end

■ Access Expansion Module (AEM) — maximum of two with one on each end of

Library Modules and Hardware

module only.

centerline and four to right of centerline.

of the library for the redundant robotics feature. A PEM is a converted CEM.

the library. An AEM cannot be installed directly to the left of the Base module.

Figure 2–1 SL3000 Library Configuration Example

Figure Legend:

1. Perforated window

2. Operator panel

3. Service door

Library Modules and Hardware 2-1

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Library Modules

Base Module

CAP (open)

One Base module is required for every library installation. A standalone Base module is the smallest possible configuration of an SL3000 library.

Configuration Options

The physical capacity varies from 205 to 431 cartridge slots (see Chapter 4, "Capacity"). Configuration options include:

■ 8 (standard), 16, or 24 drive slots

■ Perforated window (standard), window storage array, or operator panel

■ CAP (standard)

Components

The front of the Base module contains a single CAP, service door, front panel with LEDs, and a perforated window, optional operator panel, or window storage array. The rear of the Base module contains the electronics module, power distribution units (PDUs), DC power supplies, tape drives, and two 1-unit rack spaces.

Figure 2–2 Base Module Rear View

Figure Legend:

1. Tape d rive s

2. Electronics module

3. Drive DC power supplies

4. Ethernet switches (optional)

2-2 StorageTek SL3000 Systems Assurance Guide

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Power distribution units

Drive Expansion Module

The DEM is attached to the left side of the Base module (when viewed from the front of the library). The DEM expands the number of tape drives and provides additional cartridge storage. There can be only one DEM per library.

Configuration Options

The physical capacity varies from 153 to 522 cartridge slots (see Chapter 4, "Capacity"). Configuration options include:

■ 8 (standard), 16, 24, or 32 drive slots

■ Perforated window (standard), window storage array, or operator panel

■ CAP (optional)

Components

The front of the DEM contains a service door, optional CAP, and a perforated window or optional operator panel (if not already in the Base module) or window storage array. The rear of the DEM contains tape drives, PDUs, DC power supplies, and two 1-unit rack spaces.

Library Modules

Figure 2–3 DEM Rear View

Figure Legend:

1. Tape d rive s

2. Drive DC power supplies

3. Ethernet switches (optional)

Library Modules and Hardware 2-3

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Library Modules

Power distribution unit

Cartridge Expansion Module

The CEM provides additional cartridge storage. There are no tape drives present within this module. CEMs on the end of the library can be converted to PEMs (see

"Parking Expansion Module" on page 2-4). A maximum of eight CEMs are supported

in a single library. The initial CEM should be installed to the right of a Base module, then a second to the left of the DEM/Base module, a third to the right, and the fourth one to the left, and so on. This alternating method maximizes library performance.

Configuration Options

The physical capacity varies from 438 to 620 cartridge slots (see Chapter 4, "Capacity"). Configuration options include:

■ CAP (optional)

■ Placement to the left or right of a Base module and DEM

■ A maximum of four CEMs on each side of centerline (eight total)

Parking Expansion Module

The PEM is a converted CEM used in a redundant robotics configuration. The library uses the PEM to "park" a defective robot without blocking access for the operational robot. Performing maintenance on a disabled robot in a PEM is disruptive to library operations. The parking space causes six columns of cartridge arrays in the PEM to become inaccessible (three on the front wall and three on the rear wall). You do not need to remove the inaccessible arrays. The module can be restored to a CEM at anytime.

Configuration Options

The physical capacity varies from 230 to 312 cartridge slots depending on the configuration (see Chapter 4, "Capacity"). One PEM must be installed on each end of the library. Only the left PEM can have an optional CAP.

Figure 2–4 Parking Expansion Module

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Figure Legend:

1. Inaccessible CAP area

2. Robot parking area (inaccessible cartridge slots)

Access Expansion Module

An AEM has a large cartridge access door used for bulk loading and unloading of cartridges. Additionally, two AEMs may be used to support the redundant robotics feature. A sliding safety door sections off a defective robot, allowing a service representative to access the disabled robot while the library remains online.

Configuration Options

Each AEM supports bulk loading and unloading of up to 234 cartridges (see

"Cartridge Access Ports - Bulk Load" on page 2-7). AEMs can only be placed on the

ends of the library. An AEM cannot be installed directly to the left of the Base module; there must be a module in between. AEMs and PEMs cannot be installed in the same library. Configuration options include:

■ Single AEM for bulk load capabilities only. You should install a single AEM on the

left for an additional 104 storage slots (see Chapter 4, "Capacity").

Hardware Components

■ Dual AEMs for bulk load and redundant robotics support.

Hardware Components

■ "Electronics Control Module" on page 2-5

■ "Robotics" on page 2-6

■ "Cartridge Access Ports - Rotational" on page 2-6

■ "Cartridge Access Ports - Bulk Load" on page 2-7

Electronics Control Module

The electronics control module (ECM) is responsible for electronics control, robot and drive control, and host connectivity. The ECM is located in the rear of the Base module, its main controller cards are the HBCR (library controller) and HBT (drive controller).

Figure 2–5 Electronics Control Module

Figure Legend:

1. Serial port (reserved)

2. Serial port (CSE port for CLI)

3. Primary Ethernet port

Library Modules and Hardware 2-5

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Hardware Components

Dual TCP/IP Ethernet port

5. Ethernet port (reserved)

Note: The ECM ships with an optional MPU2 card (2Gb) or PUA2

card (8 Gb) for Fibre Channel interface connections. This card is not shown in the figure but is installed below the HBCR card.

Command Line Interface

The command line interface (CLI) is used exclusively by Oracle support to configure and diagnose the library. Service representatives can access the CLI through the electronic control module using either of the following:

■ Serial Port Connection on the HBCR card (RS-232) and a HyperTerminal

connection to enter the commands

■ Ethernet Port Connection (ports 1A, 2A, or 2B) on the HBCR card and a secure

shell (PuTTY) to enter the commands

Redundant Electronics

The optional redundant electronics (RE) feature is available for failover protection for the HBCR controller card. With the RE feature, each library has two HBCR controller cards. If the active library controller experiences errors, operations switch automatically to the stand-by library controller, with minimal disruption to library and host operations.

RE is not available for libraries that use the direct FC-SCSI connection to hosts (refer to the SL3000 Host Connectivity Guide and the SL3000 User’s Guide).

Robotics

The robot in the SL3000 library is called a TallBot. Each library can have either one (standard) or two TallBots (redundant robotics option). TallBots retrieve and insert cartridges into CAPs or slots and mount or dismount cartridges from tape drives.

TallBots move along two rails on the rear wall of the library. One rail is at the top of the library and one rail attaches to the floor. Two copper strips in the top rail provide power and a signal path between the TallBot and library controller (HBCR) card. Power is supplied from +48 VDC 1200 W load sharing supplies (see Chapter 5, "Power

and Cooling").

TallBots contain a bar-code scanner that reads the configuration blocks in each module during library initialization and identifies volume serial numbers (VOLSERs) of cartridges during CAP entries and audits.

Redundant Robotics

The optional redundant robotics feature increases the speed for robotic operations and allows library operations to continue if one robot fails. Redundant robotics requires 240 VAC, 2N power, and two PEMs or two AEMs.

Cartridge Access Ports - Rotational

The cartridge access port (CAP) is a vertically-mounted, rotating cylinder with two removable 13-slot magazines.

■ The Base module comes standard with a CAP.

2-6 StorageTek SL3000 Systems Assurance Guide

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Hardware Components

■ The DEM and CEMs can have one optional CAP per module. Only the left PEM

can contain a CAP.

■ There can be a maximum of 10 rotational CAPs per library.

■ Each CAP has a keypad with an unlock indicator and a button to open the CAP.

Figure 2–6 Library CAPs

Figure Legend:

1. CAP (closed)

2. No CAP installed

3. CAP (open)

4. Keypad

Cartridge Access Ports - Bulk Load

AEMs allow the customer to add cartridges in bulk, up to 234 cartridges on each side, without disrupting library operations. Only one AEM is required in a library to support the bulk loading feature (see "Access Expansion Module" on page 2-5).

Library Modules and Hardware 2-7

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Hardware Components

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This chapter provides information on library connectivity and software options:

■ Host Connectivity

■ Media Validation

■ Library Monitoring

■ Library Management Software

■ Other Storage System Solutions

Host Connectivity

The SL3000 library supports two types of host connections:

■ Small computer system interface over a physical Fibre Channel interface (FC-SCSI)

■ Ethernet using 10/100 Base-T and CAT-5 cable (TCP/IP)

In a non-partitioned configuration, the library can use only one interface type, either FC-SCSI or TCP/IP. In a partitioned configuration, the library can have one interface type per partition.

Software and Connectivity

FC-SCSI Connection

A PUA2 Fibre Channel (FC) card must be purchased to provide a FC-SCSI connection to the library. The card provides a single or optional dual port feature, with an 8 Gb connection.

The SL3000 Interface Reference Manual contains information about the SCSI command set, FC operations, command implementations, topologies, cables, and connectors.

Supported Topologies

■ Switched Fabric — Oracle recommends this topology. It provides dynamic

inter-connections between nodes and multiple, simultaneous FC connections. If the library is connected to a FC switch or fabric-capable host, it configures itself as a switched topology and can support up to 16 million ports logged into the fabric.

■ Arbitrated Loop — While the library supports the arbitrated loop topology, Oracle

does not recommend it. This topology provides multiple connections for devices that share a single loop and allows only point-to-point connections between an initiator and target during communications. An arbitrated loop can connect only up to 126 ports.

Software and Connectivity 3-1

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Media Validation

TCP/IP Connection

The TCP/IP connection provides the host library interface (HLI) used to communicate with library management applications, such as:

■ Open system platforms with ACSLS

■ Enterprise-level mainframes with ELS /HSC

The library controller card is responsible for coordinating all component operations within the library and providing the interface connection with the host. There are two separate Ethernet connections for host to library communications—Ports 2A and 2B.

■ Port 2B provides the primary host connection (standard).

■ Port 2A provides the dual TCP/IP connection (optional) or can be connected to

The dual TCP/IP feature uses both ports to provide two connections between the library and ACSLS or ELS/HSC host(s), eliminating a single point of failure. For more information, refer to the SL3000 Host Connectivity Guide.

Port Bonding

Port bonding combines multiple ports to create redundancy. The SL3000 library uses an active-backup mode. In active-backup mode, there is one bond with two slave Ethernet interfaces. If the active interface fails, the backup interface becomes active. With minimum library firmware FRS_4.30 and a second Ethernet switch installed in the library, port bonding is automatically enabled—no command or activation file is required.

StorageTek Library Console (SLConsole).

Media Validation

Media validation allows you to verify all T10000 tape cartridge types using SLConsole or minimum version 2.0 of StorageTek Tape Analytics (STA). The following validation methods are available: Basic Verify, Standard Verify, and Complete Verify. Media validation provides a "pass" or "suspect" result for each tape cartridge tested.

Media validation requires a designated pool of T10000C or T10000D tape drives. Up to ten drives can be placed in the media validation pool using SLConsole. The drives in the pool are not available to hosts. The pool is not considered a partition and does not contain cartridges.

The media validation feature requires minimum firmware SL3000 FRS_4.30 and SLConsole FRS_6.50. For more information about media validation using SLConsole, refer to the SL3000 User's Guide on OTN. For more information about media validation using STA, refer to the STA documentation on OTN.

Library Monitoring

The library can be monitored using SLConsole or Simple Network Management Protocol (SNMP). Additionally, service representatives can use the Log SnapShot feature to collect logs from the controller cards.

StorageTek Library Console

SLConsole is a software application used to manage and monitor an SL3000 library. SLConsole can be accessed from the local operator panel, a standalone version on a

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workstation, or through the web-based SLConsole. For installation requirements and additional information, refer to the SL3000 User’s Guide.

Simple Network Management Protocol

SNMP is an application layer protocol that performs network management operations over an Ethernet connection. SNMP allows libraries to inform the system administrator of potential problems and system administrators to query the library for configuration, operation, and statistical information using SNMP traps. The SL3000 library supports SNMP v2c and SNMP v3 (preferred).

This functionality requires the use of a Management Information Base (MIB) on the controller card. The MIB contains information that specifically describe the library, components, and configuration. For more information, refer to the SL3000 SNMP Reference Guide.

Log SnapShot Feature

The Log SnapShot feature is a utility that gathers, compresses, and encrypts logs from a given controller card or from an entire library such as the SL3000 library. A log snapshot can be generated using the CLI or SLConsole. Only authorized Oracle engineers or service representatives have access to the data obtained from the Log SnapShot utility.

Library Management Software

Library management software controls the library hardware and manages the library database. When the library is operating in automated mode, cartridge mount and dismount operations occur without manual intervention. Using audit data uploaded from the library, the software:

■ Tracks volume identifiers (vol-ids), attributes, and locations of cartridges

■ Allocates drives and requests library operations, such as entering, mounting,

dismounting, and ejecting cartridges

Automated Cartridge System Library Software (ACSLS)

ACSLS is a centralized, multi-platform library management software product for an open-systems environment. ACSLS manages all library operations and shares library resources with any ACSLS-enabled application. A single instance of ACSLS can manage multiple libraries. The key benefits of ACSLS include:

■ Centralized library control across multiple StorageTek libraries, including legacy

technology

■ Optimized library performance by load-balancing hardware and executing

parallel commands

■ Reduced downtime through dynamic configuration capabilities and queuing

commands during short-term library outages

■ Enriched reporting and management capabilities for ease of use

ACSLS version 7.3 or greater is required for interfacing with the SL3000 library. ACSLS

7.3 requires PUT 0801 for AEM support.

Software and Connectivity 3-3

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Physical Capacity

Physical storage capacity can range from 205 to 5,925 data cartridge slots depending on the library configuration. The capacity of a module depends on its position relative to other modules and the add-on features selected. Review the configuration options in Chapter 2, "Library Modules and Hardware".

Capacity

Use the table below to calculate the physical capacity of a library. Start with the standard configuration slot count, then either add or subtract slots from the standard slot count to reflect the module position and add-on options. Finally, add the slot counts of each module together to get the total slot count for the library.

Table 4–1 Physical Slot Capacity Per Module

Physical Configuration

Standard 0 308 516 410 320 620 312 0

2nd Drive Array

3rd Drive Array

4th Drive Array

Adjacent Module to Left -- -- +104 +88 +88 0 0 0

Adjacent Module to Right0000+130----

CAP -- -78 -78 -77 Std. -78 -- --

Window Storage Array -- -- -- +23 +23 -- -- --

For additional drive arrays, the first number listed is the change in capacity when there is no module to the left, and the second number is the change in capacity when there is a module to the left.

Left

AEM

Left

PEM

-- -- -- -55/-66 -55/-66 -- -- --

-- -- -- -60/-72 -60/-72 -- -- --

-- -- -- -65/-78 -- -- -- --

Left

CEM DEM Base

Right

CEM

Right

PEM

Right

AEM

Capacity 4-1

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Physical Capacity

Calculation Example 1: Base, DEM, CEMs, PEMs

The example library has a Base module, a DEM, two CEMs (one on each side of centerline), and two PEMs (one on each end of the library).

Base module

Contains an op panel and three drive arrays. There are modules to the right and left.

320 (standard) + 0 (op panel) + 13 (right module) + 88 (left module) – 66 (2nd drive array) – 72 (3rd drive array) = 283

DEM

Contains a window array, a CAP, and four drive arrays. There is a module to the left.

410 (standard) + 88 (left module) + 23 (window array) – 77 (CAP) – 66 (2nd drive array) – 72 (3rd drive array) – 78 (4th drive array) = 228

Left CEM

The module is installed left of centerline. There is a module to the left.

516 (standard) + 104 (left module) = 620

Right CEM

Contains a CAP. The module is installed right of centerline with a module to the right.

620 (standard) – 78 (CAP) = 542

PEMs

There are two PEMs, one on each end of the library. The left PEM contains a CAP.

313 (standard right PEM) + 308 (standard left PEM) - 78 (CAP) = 542

Library Total

283 (Base) + 228 (DEM) + 620 (left CEM) + 542 (right CEM) + 542 (PEMs) = 2,215

Calculation Example 2: Base and CEM

The example library has a Base module and a CEM to the right of centerline.

Base module

Contains a window array and three drive arrays. There is a module to the right.

320 (standard) + 13 (right module) + 23 (window array) – 55 (2nd drive array) – 60 (3rd drive array) = 241

Right CEM

Contains a CAP. The module is installed right of centerline with a module to the left.

516 (standard) + 104 (left module) – 78 (CAP) = 542

Library Total

241 (Base) + 542 (right CEM) = 783

Calculation Example 3: Base, DEM, CEMs, AEM

The example library has a Base module, DEM, two CEMs (one on each side of centerline), and a single AEM on the right for bulk loading. Oracle does not recommend installing a single AEM on the right. If the AEM was installed on the left end of the library, 104 additional cartridge slots would be accessible in the far left CEM.

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Active Capacity

Base module

Contains window array and two drive arrays. There are modules to the right and left.

320 (standard) + 23 (window array) + 13 (right module) + 88 (left module) – 66 (2nd drive array) = 378

DEM

Contains an op panel and three drive arrays. There is a module to the left.

410 (standard) + 88 (left module) + 0 (op panel) – 66 (2nd drive array) – 72 (3rd drive array) = 360

Left CEM

Module is installed left of centerline with no module to the left.

516 (standard) = 516

Right CEM

Module is installed right of centerline with modules to the right and left.

516 (standard) + 104 (left module) = 620

AEM

Module is installed right of centerline (not recommended for single AEM).

0 (standard) = 0

Library Total

378 (Base) + 360 (DEM) + 516 (left CEM) + 620 (right CEM) + 0 (AEM) = 1,874

Active Capacity

The SL3000 library uses Capacity on Demand and RealTime Growth to allow customers to instantly increase and activate capacity without disruption.

RealTime Growth

RealTime Growth allows physical capacity to be pre-installed and then activated as needed. Additional library modules are installed during the initial installation. Then, through Capacity on Demand, the customer pays to activate slots when additional capacity is necessary. No additional physical library components are required.

Capacity on Demand

Capacity on Demand is non-disruptive, allowing you to increase capacity within the library by activating previously-installed, yet inactive slots. You can upgrade capacity in 25, 100, 200, 500, and 1000 slot increments. To activate a capacity upgrade, a hardware activation file is required (see "Hardware Activation Files" on page 9-1).

Changes to active capacity result in minimal disruptions to library operations. The specific library behavior depends on the type of host connection, HLI or FC-SCSI (refer to SL3000 User's Guide). It is recommended that you make the library unavailable to other user requests before committing the active storage region changes.

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Active Capacity

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All power supplies and power distribution units (PDUs) reside in the Base module and DEM. When selecting a power configuration, consider any power redundancy requirements along with the features and number of drives that will be supported in the library.

■ Power Configurations

■ DC Power Supplies

■ Calculating Tape Drive Power Supply Quantities

■ AC Power Cables

■ Power Consumption

■ Cooling

Power Configurations

The power configuration depends on the power source and the power redundancy.

Power and Cooling

AC Power Source Options

Each PDU installed in the library requires a separate AC power source. There can be a maximum of four PDUs in the library depending on the configuration selected (two in the Base module and two in the DEM). There are two AC power source options. Both are single phase:

■ 120 VAC, 50/60 Hz, at 20 amps (range: 100–127 VAC, 47–63 Hz, 16 amps)

– Limited support for T9840 and T10000 drives; no redundant robotics support

■ 240 VAC, 50/60 Hz, at 30 amps (range: 200–240 VAC, 47–63 Hz, 24 amps)

– Supports all drive types and redundant robotics

Power Redundancy Options

There are three power configurations that offer various levels of power redundancy.

N+1 power configuration (standard)

■ Offers DC power redundancy only

■ Consists of one PDU (per Base module or DEM), with one extra drive DC supply

and one extra robotics DC supply

■ Provides N+1 DC power supply redundancy

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DC Power Supplies

■ Limited support for T9840 and T10000 drives and no redundant TallBot support

2N power configuration

■ Offers both AC and DC power redundancy

■ Consists of two PDUs (per Base module or DEM) for AC redundancy, with a set of

DC power supplies for each PDU

■ Provides N DC power supplies per PDU

■ Requires two separate AC input sources per Base module or DEM

■ Required for redundant TallBot and redundant electronics support

2N+1 power configuration

■ Offers both AC and DC power redundancy with additional DC redundancy

■ Consists of two PDUs (per Base module or DEM) for AC redundancy, with

additional DC power supplies for each PDU

■ Provides N+1 DC power redundancy for each PDU (except the second PDU only

has N DC power supply redundancy for the TallBot)

■ Requires two separate AC input sources per Base module or DEM

■ Supports redundant TallBot and redundant electronics

DC Power Supplies

There are two types of DC power supplies:

■ Load sharing 1200W DC — used for the robotics unit and tape drives

■ 200W cPCI — used for the electronics control module

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Figure 5–1 Power Supply Locations - Base and DEM (Rear View)

DC Power Supplies

Figure Legend:

1. Robotics DC power supplies (1200W DC)

2. Electronics module DC power supplies (200W cPCI)

3. Tape drive DC power supplies (1200W DC)

4. Power distribution unit (120 VAC or 240 VAC)

Electronic Control Module Power Supplies

The electronics control module (ECM) uses 200 W cPCI power supplies. These power supplies are located below the HBT card in the Base module (there are no ECM power supplies in the DEM) — see Figure 5–1. The power supply for the electronics control module is different from the power supplies used for the robotics unit and the tape drives.

Each Base module ships standard with two ECM power supplies used for N+1 and 2N configurations. Order two additional ECM supplies for the 2N+1 configuration (see

"DC Power Supplies" on page 9-9).

Robotics Unit Power Supplies

The robotics unit uses load sharing 1200 W DC power supplies located at the top of the Base module (the DEM does not contain robotics DC supplies) — see Figure 5–1. The 1200 W DC power supply used for the robotics unit is the same power supply used for the tape drives.

Each Base module ships standard with two robotics DC power supplies used for N+1 and 2N configurations. Order a third DC power supply for the 2N+1 configuration (see "DC Power Supplies" on page 9-9).

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Calculating Tape Drive Power Supply Quantities

Tape Drive Power Supplies

The tape drives use load sharing 1200 W DC power supplies. Up to four tape drive power supplies are located to the left of each PDU in both the Base module and the DEM — see Figure 5–1.

The library ships with two tape drive DC power supplies per Base module and two tape drive DC power supplies per DEM. The number of tape drive DC power supplies required depends on the power configuration selected and the number and type of tape drives in the library. To calculate the number of power supplies to order, see

"Calculating Tape Drive Power Supply Quantities" below.

Calculating Tape Drive Power Supply Quantities

The number of supplies required, depends on:

■ Power configuration (120 VAC or 240 VAC with N+1, 2N, or 2N+1)

■ Number and type of tape drive (T10000, T9840, or LTO)

To determine the number of power supplies required for a library configuration:

1. Determine the total number of each drive type.

2. Multiply by the watts-per-drive for each drive type, see Table 5–1, " Watts Per

Drive".

3. Add together the watts used by each drive type to calculate the total watts

consumed.

4. Use Table 5–2 through Tab le 5 –5 to determine the number of DC power supplies

needed.

For ordering part numbers, see "DC Power Supplies" on page 9-9.

Watt Consumption Per Drive

Table 5–1 Watts Per Drive

Maximum Watts

Drive Type

T9840D 100

T10000A/B/C 93

T10000D 127

LTO 46

Used by Each Drive

Power Supplies Required for 120 VAC PDUs

To use 120 VAC PDUs, the total watts used by the drives must be less than 843 W in the Base module and less than 1,481 W in the DEM. If the total watts exceeds 843 W in the Base module or 1,481 W in the DEM, 240 VAC PDUs are required. You cannot mix 120 VAC with 240 VAC PDUs within the library. All PDUs must be the same type.

Table 5–2 DC Power Supplies for Base (120 VAC PDU)

Total Watts Used by All Drives

1 - 563 2 2 4

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Power Supplies Required for N+1

Power Supplies Required for 2N

Power Supplies Required for 2N+1

Page 39

Table 5–2 (Cont.) DC Power Supplies for Base (120 VAC PDU)

Total Watts Used by All Drives

564-843 3 4 6

Table 5–3 DC Power Supplies for DEM (120 VAC PDU)

Total Watts Used by All Drives

1 - 700 2 2 4

701 - 1,400 3 4 6

1,401-1,481 4 6 8

Power Supplies Required for N+1

Power Supplies Required for 240 VAC PDUs

If the total watts used by the drives exceeds 843 W in the Base module or 1,481 W in the DEM, 240 VAC PDUs are required. You cannot mix 120 VAC with 240 VAC PDUs within the library. All PDUs must be the same type.

Table 5–4 DC Power Supplies for Base (240 VAC PDU)

Total Watts Used by All Drives

1 - 1,063 2 2 4

1,064 - 2,263 3 4 6

Power Supplies Required for N+1

Calculating Tape Drive Power Supply Quantities

Power Supplies Required for 2N

Power Supplies Required for 2N+1

2,264 - 3,463 4 6 8

3,464 - 3,805 5 8 8

Table 5–5 DC Power Supplies for DEM (240 VAC PDU)

Total Watts Used by All Drives

1 - 1,200 2 2 4

1,201 - 2,400 3 4 6

2,401 - 3,600 4 6 8

3,601 - 4,443 5 8 8

Power Supplies Required for N+1

Power Supplies Required for 2N

Power Supplies Required for 2N+1

Example: Calculating Required Number of Drive DC Power Supplies

The sample library has a Base module and a DEM with all three drive types (T10000, T9840, LTO). Tab le 5 –6 and Tab le 5 –7 show how to calculate the total watts used by the tape drives in the Base module and DEM:

Table 5–6 Base Module Tape Drive Watts Consumption Example

Drive Type Quantity of Drives

T10000D 6 127 762

T9840D 6 100 600

LTO4 4 46 184

Multiply by Watts Per Drive

Total Watts Per Drive Type

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AC Power Cables

The drives in the Base module use 1,546 W. In Tab le 5 –2 , 1,546 W exceeds the maximum 843 W supported by a 120 VAC PDU. Therefore, the Base module requires a 240 VAC PDU to support the drive configuration, so refer to Tab le 5 –4 .

Table 5–7 DEM Tape Drive Watts Consumption Example

Multiply by Watts

Drive Type Quantity of Drives

T10000C 4 93 372

T9840D 2 100 200

LTO5 4 46 184

Per Drive

Total Watts Per Drive Type

The drives in the DEM use 756 W. In Table 5–3 and Tab le 5 –5 , either a 120 VAC or 240 VAC PDU can support 756 W. However, you cannot mix 120 VAC with 240 VAC PDUs within the library. Therefore, the example library requires 240 VAC PDUs.

Two tape drive DC power supplies ship standard with the Base module and two power supplies ship standard with the DEM. Therefore, subtract two from the DC supplies required. Use Tab le 5 –4 and Table 5–5 to determine what to order.

The tables below list the power supplies required for the example library.

Table 5–8 DC Supplies Required for Base Example

Configuration Option

N+1 (240 VAC PDU) 3 1

2N (240 VAC PDU) 4 2

2N+1 (240 VAC PDU) 6 4

Table 5–9 DC Supplies Required for Drive Expansion Module - Example

Configuration Option

N+1 (240VAC PDU) 2 0

2N (240VAC PDU) 2 0

2N+1 (240VAC PDU) 4 2

DC Supplies Required

DC Supplies to Order (= Required - 2)

The number of drive DC supplies that must be ordered depends on the power configuration selected. For instance, if the example library had a 2N+1 configuration, it would require an order of six additional drive DC power supplies (four supplies for the Base module and two supplies for the DEM). The 2N+1 also requires an additional DC supply for the robotics and an additional ECM 200W cPCI power supply. The ECM power supply is different than the tape drive and robot power supplies listed in this example. For ordering information, see "DC Power Supplies" on page 9-9.

AC Power Cables

The following table lists the cables required for each power configuration. You must order one power cord per PDU installed:

■ For N+1 order one power cord for the Base module and an additional power cord

for the DEM (if installed)

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■ 2N or 2N+1: Two power cords for the Base module and two additional power

cords for the DEM (if installed)

Table 5–10 Power Cable Descriptions

Power Source Description

120 VAC/20A US/Japan 20A L5-20P L5-20R 3.7 m (12 ft) 12 AWG

240 VAC/30A US 30A L6-30P L6-30R 3.7 m (12 ft) 12 AWG

240 VAC/30A International 30A 330P6W L6-30R 4 m (13 ft) HAR

Power Consumption

For environmental or economical reasons, you may want to determine the total power consumption (watts), CO SL3000 library and tape drives. The table below provides power consumption in watts.

Table 5–11 Power Consumption Values

Components Quantity Idle Watts Max Watts

Base Library (required)

Includes: 1 ECM, 1 robot, and 1 CAP

Redundant Electronics (optional) 1 100 100

Power Consumption

Circuit Breaker

emission values, and British Thermal Units (Btu/hr) for the

Wall Connector

1 156 197

Library Connector

Powe r Cord

Length/Type

Redundant Robotics (optional) 1 28 55

Operator Panel (optional) 1 29 37

Additional CAPs (optional) Each 10 14

Access Expansion Module (optional) Each 8 30

T9840 Each 79 100

T10000A/B/C Each 61 93

T10000D Each 64 127

LTO Eac h 3 0 46

Calculating Total Watts, CO2 Emissions, and Btu/hr

To calculate the total power consumption in Watts for the library, add up all the applicable wattage values for the library configuration from Table 5–11.

To calculate kilograms of CO constant. Use the constant that is applicable for your country (0.02497 for US).

To convert electrical values to Btu/hr, multiply the number of watts by 3.412 (1 W =3.412 Btu/hr). Many manufacturers publish kW, kVA, and Btus for their equipment. Use the information provided by the manufacturer. Otherwise, use the formula below.

■ 3.41214 x Watts =Btu/hr

emissions per day, multiply watts by the CO2 emissions

Power Consumption Example 1

Using the maximum continuous values for the following components:

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Cooling

Table 5–12 Power Consumption Example

Quantity Component Description Watts

1 SL3000 Base (including one ECM, one robot, one CAP) 197

16 LTO4 Tape Drives 736

-- Total 933

■ Emissions: 933W x 0.02497 = 23.3 Kg of CO

■ Power consumption: 933W x 3.412 = 3,183 Btu/hr

Power Consumption Example 2

Using the maximum continuous values for the following components:

Table 5–13 Power Consumption Example

Quantity Component Description Watts

1 SL3000 Base (including one ECM, one robot, one CAP) 197

8 T9840D Tape Drives 800

1 Drive Expansion Module --

8 T10000C Tape Drives 744

1 Cartridge Expansion Module --

3 CAPs (3 at 10 Watts each) 30

-- Total 1,771

■ Emissions: 1,771W x 0.02497 = 44.2 Kg of CO

■ Power consumption: 1,771W x 3.412 = 6,043 Btu/hr

Cooling

Cooling within the SL3000 library is divided into three areas:

■ Electronics control module

■ Tape d rive s

■ DC power supplies

Library Electronics Control Module

Two fans, located to the right of the electronics control module, provide cooling for the electronics in the library. Air is drawn from the sides of the library and flows through the fans to the rear of the library.

■ The library controller card (HBCR) monitors these fans for proper operation.

■ An amber Fault indicator is on the fan assembly to indicate a failure.

While there are two dedicated fans, one fan is sufficient to provide adequate cooling for the library and the electronics. The fans can be replaced without interfering with library operations. Therefore, replace a defective fan when it is detected.

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Tape Drives

Each tape drive tray contains a fan for drive cooling. The tape drive's power converter card supplies power for the fans. Air is drawn from the front of the drive and flows through the fan to the rear of the drive/library.

DC Power Supplies

Each 1200 Watt DC power supply contains a fan that pulls air from the library, through the rear of the supply, and out the rear of the library.

Cooling

Power and Cooling 5-9

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Cooling

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The system assurance process is the exchange of information between the customer and Oracle representatives to ensure that no aspects of the sale, order, installation and implementation for the SL3000 library are overlooked. This process promotes an error-free installation and contributes to overall satisfaction.

■ System Assurance Planning

■ Engagement Methodology

System Assurance Planning

The purpose of the system assurance planning is to:

■ Introduce you to the SL3000 library.

■ Explain the system assurance process and establish the team.

■ Identify and define requirements and configurations.

■ Complete the order.

Systems Assurance

■ Prepare for the installation and implementation.

Engagement Methodology

Oracle has standardized and implemented a delivery methodology that provides continuity and quality assurance. Sales personnel can provide a series of templates and checklists to ensure that the proposed solution can be delivered and supported. Following this methodology allows Oracle marketing, sales, and engagement personnel to provide consistent documentation for each engagement and to ensure both customer satisfaction and overall sales success.

Actions for Sales Personnel

■ Introduce the team members and exchange contact information.

■ Describe the SL3000 modular library, options, and features.

■ Identify and define the customer's requirements and expectations.

■ Identify any additional items the customer might need:

– Library management software and additional hardware activation files,

media, tape drives, drive tray conversions, encryption, network components and cables, and service delivery platform (SDP)

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Engagement Methodology

■ Make sure the site is ready to receive the SL3000 library. Review the information in

■ Review and complete the site survey, found at:

■ Place an order, see Chapter 9, "Ordering".

■ Install and implement that solution by providing qualified service and support.

Chapter 7, "Site Planning" and Chapter 8, "Installation Planning".

http://my.oracle.com/site/pd/sss/products/tape/index.html

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Networking

Site Planning

This chapter provides planning information and requirements to consider before installing the SL3000 library. Key planning considerations include:

■ Networking

■ Physical Dimensions and Weights

■ Floor Requirements

■ Fire Suppression Planning

■ Cable Routing

■ Environmental Requirements

If possible, use a dedicated and secure private network for communication between the library and host management software. A secure private network connection using an Ethernet hub or switch is required for maximum throughput and minimum resource contention.

If a shared network must be used:

■ Place the library on its own subnet.

■ Directly connect the library to a switch and use a managed switch that can:

– Set priorities on ports to give the host and library higher priority.

– Provide dedicated bandwidth and create a VLAN between the host and the

library.

■ Use a virtual private network (VPN) to insulate host and library traffic.

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Physical Dimensions and Weights

Figure 7–1 Service Clearances and Dimensions (Top View)

Figure Legend:

1. Side cooling area

2. Side cover

3. Nozzle cutout for fire suppression system

4. Base and DEM service clearance (light gray areas)

5. AEM service clearance (dark gray areas)

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Figure 7–2 Service Clearances and Dimensions (Side View)

Physical Dimensions and Weights

Base Module

Figure Legend:

1. Base and DEM rear service clearance

2. Base and DEM front service clearance

3. AEM service clearance

4. Jack pad adjustment range

Table 7–1 Base Module Measurements

Dimension Type Measurement

Height 196.7 cm (77.45 in.) on casters for transport

197.5 cm (77.75 in.) to 201.68 cm (79.4 in.) on jack pads for permanent install

Width 76.8 cm (30.22 in.) when placed between modules

81.3 cm (32 in.) transport width (no side covers)

91.5 cm (36 in.) standalone with side covers on both sides

Depth 121.9 cm (48 in.)

Service Area Front: 45.7 cm (18.0 in.)

Rear: 81.3 cm (32.0 in.)

Side Cooling Area: 5 cm (2 in.)

Side Install Area: 45.7 cm (18.0 in.)

Weight Frame only: 361 kg (796 lb), Shipping weight: 411 kg (905 lb)

8 drives and media: 623 kg (1372 lb)

16 drives and media: 661 kg (1457 lb)

24 drives and media: 687 kg (1514 lb)

Side Covers: 18.5 kg (41 lb) per side

Minimum transportation clearance. There are alignment tabs on each side of the module, which add 4.5 cm to the 76.8 cm width of the module. Therefore, 81.3 cm is the minimum transportation width.

One side cover adds 7.4 cm (2.9 in.) to the module width. Only the ends of the library require side covers.

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Physical Dimensions and Weights

Drive Expansion Module

Table 7–2 Drive Expansion Module Measurements

Dimension Measurement

Height 196.7 cm (77.45 in.) on casters for transport:

Width (module only) 76.8 cm (30.22 in.) when placed between modules

Depth (doors closed) 121.9 cm (48 in.)

Service Area Front: 45.7 cm (18.0 in.)

Weight Frame only, no CAP: 265 kg (584 lb)

Minimum transportation clearance. There are alignment tabs on each side of the module, which add 4.5 cm to the 76.8 cm width of the module. Therefore, 81.3 cm is the minimum transportation width.

197.5 cm (77.75 in.) to 201.68 cm (79.4 in.) on jack pads for permanent install

81.3 cm (32 in.) transport width (no side covers)

83.8 cm (33 in.) with one side cover

Rear: 81.3 cm (32.0 in.)

Side Cooling Area: 5 cm (2 in.)

Side Install Area: 45.7 cm (18.0 in.)

Shipping (frame only): 314 kg (693 lb), 321 kg (708 lb) with CAP

8 drives and media: 540 kg (1190 lb), 582 kg (1284 lb) with CAP

16 drives and media: 596 kg (1314 lb), 621 kg (1369 lb) with CAP

24 drives and media: 647 kg (1426 lb), 660 kg (1456 lb) with CAP

32 drives and media: 709 kg (1564 lb), 723 kg (1594 lb) with CAP

Cartridge and Parking Expansion Modules

Table 7–3 Cartridge and Parking Expansion Module Measurements

Dimension Measurements

Height 196.7 cm (77.45 in.) on casters for transport

197.5 cm (77.75 in.) to 201.68 cm (79.4 in.) on jack pads for permanent install

Width (module only) 76.8 cm (30.22 in.) when placed between modules/side cover

81.3 cm (32 in.) transport width (no side covers)

83.8 cm (33 in.) with one side cover

Depth 77.5 cm (30.5 in.)

Weight (CEM) Frame only: 175 kg (385 lb)

Shipping: 213 kg (469 lb)

Installed, with media: 340 kg (749 lb)

Weight (PEM) Frame only: 122.5 kg (270 lb)

Shipping: 213 kg (469 lb)

Minimum transportation clearance. There are alignment tabs on each side of the module, which add 4.5 cm to the 76.8 cm width of the module. Therefore, 81.3 cm is the minimum transportation width.

Access Expansion Module

Table 7–4 Access Expansion Module Measurements

Dimension Measurement

Height 196.7 cm (77.45 in.) on casters for transport

197.5 cm (77.75 in.) to 201.68 cm (79.4 in.) on jack pads for permanent install

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Table 7–4 (Cont.) Access Expansion Module Measurements

Dimension Measurement

Width 91.4 cm (36.0 in.) when placed between module and side cover

96 cm (37.8 in) transport width (no side covers)

99.1 cm (39 in.) with one side cover

Depth 77.5 cm (30.5 in.)

Service Area Front: 59.7 cm (23.5 in.)

Weight Frame only: 204.2 kg (450 lb)

Shipping: 260 kg (570 lb)

Minimum transportation clearance. There are alignment tabs on each side of the module, which add 4.5 cm to the 91.5 cm width of the module. Therefore, 96 cm is the minimum transportation width.

Covers, Doors, and Service Clearances

Table 7–5 Covers, Doors, and Service Clearance Measurements

Dimension Measurement

Height 190.3 cm (74.9 in.) frame only

Door thickness Front: 1.9 cm (0.75 in.)

Rear: 4.5 cm (1.75 in.)

Door latches 2.53 cm (0.9 in.)

Service clearance Front: 45.7 cm (18 in.) for Base and DEM only, 59.7 cm (23.5 in.) for AEM

Rear: 81 cm (32 in.) for Base and DEM only

Side: 5 cm (2 in.) for cooling, 45.7 cm (18.0 in.) for install

Side cover 7.4 cm (2.9 in.) width

18.5 kg (41 lb) each

Floor Requirements

The SL3000 library can be installed on a raised, solid, or carpeted floor with a smooth surface. There must be adequate airflow and the floor must meet environmental specifications and weight requirements. If the floor is raised, there should not be ventilation panels directly below the library. If the floor is solid, route cables from the ceiling to avoid creating a tripping hazard. If the floor is carpeted, make sure the carpet is approved for computer-room equipment and provides protection from electrostatic discharge (ESD).

Weight

Ensure the site floor can support the weight of the library. It must support 454 kg (1,000 lb) per weight distribution pad, which measure 4 by 8 inches. There are four distribution pads per module.

If the equipment must be transported on elevators, the elevator cars must be capable of safely handling the weight. Depending on the library configuration the weight of the library can vary (see "Physical Dimensions and Weights" on page 7-2).

Floor Slope

TallBots must travel along a level plane throughout the library. Any excessive out-of-plane conditions could cause binding, premature wear, and damage to the TallBots. Use the jack pads to adjust the library on a sloped floor.

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Fire Suppression Planning

The library does not ship with a fire suppression system, but each module has a 5 cm (2 inch) diameter nozzle opening (see Figure 7–1). Plates, 7 cm (2.75 inch) square and

1.2 mm (0.048 inch) thick, cover the openings and can be drilled to custom fit nozzles. Nozzles must be clear of robotic operations and cannot protrude more than 1.9 cm (0.75 inches) into the library. Professional Services can assist with fire suppression planning (contact your Oracle sales representative).

Cable Routing

The SL3000 library has rear door cut-outs on both the top and bottom of the door to allow for cable routing. The cut-out is a 2.5 cm (1 inches) opening that runs 73 cm (29 inches) along the length of the door with cable routing hardware and reliefs available.

Note: The Base module and DEM have two square cut-outs on the

rear door. These are only for PDU power source cables, not for general cable routing.

When routing cables, make sure to include locations for power, drive interface, library control, and Ethernet cables. As a best practice, route power cables through one cut-out and signal cables through another cut-out.

Figure 7–3 Door Cable Routing Cutouts

Figure Legend:

1. Cable routing area

2. Top/bottom view of rear door

AC Power Configurations and Cables

SL3000 libraries require that the customer select one of the following single phase AC power options for the Base module and DEM:

■ 110 VAC, 50/60 Hz, at 20 Amps (range: 100–127 VAC, 50–60 Hz, 16 Amps)

■ 240 VAC, 50/60 Hz, at 30 Amps (range: 200–240 VAC, 50–60 Hz, 24 Amps)

Make sure to plan for the locations of power cables and list the locations for their associated circuit breakers. Cables must be ordered for the appropriate power configuration. Order one power cord per PDU installed:

■ N+1: One power cord for the Base module and an additional power cord for the

DEM (if installed).

■ 2N or 2N+1: Two power cords for the Base module and two additional power

cords for the DEM (if installed).

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Library Network and Tape Drive Cables

The library can be used in a 62.5-micron-cable Storage Area Network (SAN). However, the cable that connects the library to the network must be a 50-micron cable. The maximum distances supported on a Fibre Channel link is determined by the link speed, the type of fiber (50 or 62.5 micron), and the device to which the library is attached. Refer to your switch vendor to determine what is supported in your storage area network.

The typical support distances for the cables are:

■ 4 Gbps = up to 70 m (230 ft) for 62.5-micron, 150 m (492 ft) for 50-micron

■ 2 Gbps = up to 150 m (492 ft) for 62.5-micron, 300 m (984 ft) for 50-micron

■ 1 Gbps = up to 175 m (574 ft) for 62.5-micron, 500 m (1640 ft) for 50-micron

If your library attaches to a host bus adapter (HBA), refer to the documentation for the HBA for the supported cable distances. For a list of cables, see "Cables" on page 9-10.

If your library will support encryption, see "Encryption Switches and Cabling" on page 9-7.

Environmental Requirements

For optimal reliability, maintain the environment between the recommended ranges. Although this equipment is designed to operate in environmental conditions of 20% to 80% humidity, a recommended industry best practice is to maintain a relative humidity of 40% to 50%.

Environmental Requirements

Table 7–6 Environmental Specifications

Description Temperature

Operating 15 to 32°C (60 to 90°F)

dry bulb

Storage 10 to 40°C (50 to

104°F)

Shipping -40 to 60°C (-40 to

140°F)

Power Consumption

For power requirements, heat output, and power consumption, see Chapter 5, "Power

and Cooling".

Seismic or Earthquake Ratings

The requirements for seismic compatibility vary dramatically throughout the world. Therefore, Oracle does not offer a standard "seismic" feature for the SL3000 library. It is recommended that any customer who has seismic concerns work with local experts who are familiar with the local code and requirements. Professional Services can also be engaged to help coordinate this activity.

Caution: Bodily injury and equipment damage: A qualified seismic

engineer must be consulted to verify seismic zone exposures and adequate site preparation.

Relative Humidity (non-condensing) Wet Bulb Maximum Maximum Altitude

20% to 80% 29.2°C (84.5°F) 3.05 km (10,000 ft)

10% to 95% 35.0°C (95.0°F) 3.05 km (10,000 ft)

10% to 95% 35.0°C (95.0°F) 15.24 km (50,000 ft)

Site Planning 7-7

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Environmental Requirements

For sites in areas of seismic activity, the customer may want to permanently fix the library position for added stability. The SL3000 library provides mounting holes in the floor of each module where half-inch carriage bolts (mounting studs) can be used to permanently fix the library's position.

Airborne Contaminants

Control over contaminant levels in a computer room is an extremely important consideration when evaluating an environment. Automated tape library components and electronics, tape drives, and media are subject to damage from airborne particulates. The operating environment must adhere to the requirements of: ISO 14644-1 Class 8 environment. For more information, see Appendix B, "Controlling

Contaminants".

Gasses that are particularly dangerous to electronic components include chlorine compounds, ammonia and its derivatives, oxides of sulfur and petrol hydrocarbons. In the absence of appropriate hardware exposure limits, health exposure limits must be used.

Humidification with chlorinated water is a common source of damaging airborne chlorine. Appropriately designed carbon filters must be used to ensure safe levels of airborne chlorine when chlorinated water is used for humidification.

Table 7–7 Gas Limit Recommendations

Chemical Name Formula ASHRAE OSHA (PEL) ACGIH NIOSH

Acetic Acid CH

Ammonia NH

Chlorine Cl

Hydrogen Chloride HCl Not defined 5 ppm (c) Not defined Not defined

Hydrogen Sulfide H

Ozone O

Petrol-hydrocarbons C

Sulfur Dioxide SO

Sulfuric Acid H

COOH Not defined 10 ppm Not defined Not defined

350 ppm 25 ppm Not defined

31 ppm (c) Not defined 0.5 ppm (c)

320 ppm (c) 10 ppm 10 ppm

30.1 ppm Not defined Not defined

35 ppm 2 ppm 0.5 ppm (c)

nHn

2SO4

3500 µg/m

2100 µg/m

50 µg/m

235 µg/m

Not defined 500 ppm 75 ppm 300 ppm

80 µg/m

Not defined 1 ppm Not defined 1 ppm (c)

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This chapter outlines requirements and planning considerations for an SL3000 library installation.

■ Physical Space

■ Time and Personnel

■ Shipping Weights and Measures

■ Pallet Double Stacking

■ Installation Tools

Physical Space

A successful installation of the SL3000 library requires an adequate physical space. For dimensions of the library modules, see "Physical Dimensions and Weights" on page 7-2. If modules will be added in the future, ensure there is enough room to expand the library.

Installation Planning

Floor

Ensure that the weight and coplanar requirements are satisfied (see "Floor

Requirements" on page 7-5).

Transportation

If the equipment must be transported on elevators, the elevator cars must be capable of safely handling the weight. Additionally, ensure that the components can pass through doorways and fit in elevators. For more information, see "Shipping Weights

and Measures" on page 8-2.

Construction Area

The minimum working area (not including the space required for the pallets) is approximately 19 m

Waste Disposal

Sales and service personnel should plan with customers on the disposal of all packing material. Determine if waste bins or recycling containers will be provided on site or whether an independent company will handle the disposal at additional cost.

Time and Personnel

The table below shows the estimated times for the installation of modules and components. At least two qualified service representatives should install the library. The times listed below do not include library initialization, testing, audits, and feature

(200 ft2).

Installation Planning 8-1

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Shipping Weights and Measures

upgrades. Installation services are required with the purchase of the SL3000 library. Contact an Oracle sales representative for more information.

Table 8–1 Installation Time Estimates

Module/Component

Base with 8 drives (standard) 3 2 6

Base and DEM 5 2 10

Base and CEM 4 2 8

Each additional CEM 2 2 4

Two PEMs 224

AEMs (each) 224

CAPs 122

Tape drive (each drive) 0.5 1 0.5

Operator panel or window 0.75 1 0.75

Firmware 0.2 1 0.2

Integration (cables, hubs, switches, connections) 8 1 8

Media install (each) 0.02 1 variable

Time Estimate (hours)

Personnel Required

Total P e rson Hours

Shipping Weights and Measures

The SL3000 library modules and other components are shipped on pallets. The table below lists each module and its shipping specifications. If equipment on a pallet must be transported on elevators, the elevator cars must be capable of safely handling the weight.

Table 8–2 Module and Tape Drive Shipping Information

Type Height Width Depth Weight

Base 216 cm (85 in.) 97 cm (38.3 in.) 134 cm (53 in.) 410 kg (905 lb)

DEM 216 cm (85 in.) 97 cm (38.3 in.) 134 cm (53 in.) 321 kg (708 lb)

CEM 216 cm (85 in.) 97 cm (38.3 in.) 96 cm (38 in.) 213 kg (469 lb)

PEM 216 cm (85 in.) 97 cm (38.3 in.) 96 cm (38 in.) 213 kg (469 lb)

AEM 216 cm (85 in.) 97 cm (38.3 in.) 148 cm (58 in.) 260 kg (570 lb)

LTO 32 cm (12.6 in.) 31 cm (12.2 in.) 66 cm (26 in.) 9.5 kg (20.9 lbs)

T10000 34 cm (13.4 in.) 31 cm (12.2 in.) 66 cm (26 in.) 10.5 kg (23.1 lbs)

Either a split-pallet or pallet-ramp design is used to ship and provide safe removal of the module at the customer site. SL3000 library modules are shipped with wheels (casters) already attached to allow for easy positioning within the data center. Once positioned, the modules must be raised from their wheel-base to rest upon load plates for stability and leveling purposes.

The suggested library adjustment height is 200 cm (77.6 in.). Therefore, ensure that the top of the library does not interfere with ceiling fixtures at the installation site.

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Pallet Double Stacking

WARNING: Possible Physical Injury. Only use a forklift operated

by a qualified operator to remove a stacked second pallet. Do not attempt to tilt or slide the pallet off by hand.

In the event that a forklift is unavailable to safely remove the module, notify the installation coordinator. Inform them that the library may need to be picked up from the site by the delivery company, taken off the second pallet, and re-delivered. Delivery personnel are not authorized to remove the modules from the second pallet without the proper equipment.

Installation Tools

The tables below lists the installation tools required for the SL3000 library. Obtain the standard tools locally or from the SL8500 installation kit if available.

Table 8–3 Standard Installation Tools

Standard Tools Use

Torx screwdriver with T8, T10, T15, T25 bits T8: Removal and replacement of the PUK card.

3/8-in. drive ratchet wrench

5/16-in. hex Allen on 3/8-in. drive

9/16-in. socket on 3/8-in.-drive

Adjustable wrench (must accept 7/8-in. nut)

Phillips and flat blade screwdrivers General assembly

Power drill (optional) General assembly. Adjust the torque settings to 2.8 Nm (25

Wire side cutters Cutting shipping straps

Multimeter Electrical testing

Flashlight, step stool General assembly

Pallet jack Moving equipment

Can be obtained from the SL8500 tool kit.

Installation Tools

T10: PUO, PUW, PUN, PUF, PUZ cards. Track stops.

T15: Operator panel, window, blank plate, arrays

T25: Shipping brace, rails, and CAP screws.

Module height adjustment, joining modules

Module removal from pallet

Lock weight distribution pads

in.-lb) for T-25 screws and 0.6 Nm (5 in.-lb) for T-10 screws.

Table 8–4 Special Installation Tools

Special Tools Part Number Use

Copper rail connector extraction tool

Rail separator/joiner 4199410xx Release or join extrusions (obtain from Base installation kit)

Serial cable for laptop 24100134 CLI access to library (obtain from iProcurement/Zones)

Crossover cable for laptop 24100163 Ethernet access to library (obtain from iProcurement/Zones)

Drive tray power-on tool 314831204 See "D r i v e Tr a y P o w e r- on Tool" on page 8-4 below (obtain

313921001 Track terminator removal (obtain from Base installation kit)

from iProcurement/Zones)

Installation Planning 8-3

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Installation Tools

Driv e Tray Power-o n Tool

A tool is available to assist in removing a stuck tape within a library tape drive. This tool turns on a drive outside the library for the primary function of removing a cartridge stuck within a library drive.

The drive tray toolkit part number is 314831204, which contains the instructions (document 102084) and a drive power cable (part 419632401).

An AC power cord is required to use this tool. You must obtain a cord that is appropriate for your region. The Drive Tray Power-on Tool is available from iProcurement under the Zones online tool crib.

Installation Kits

Installation kits are supplied with each module. These contain the hardware required to install each module. Kit part numbers are:

■ 419838301—Base module

■ 419844301—DEM and CEM

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This chapter provides information for ordering an SL3000 modular library, additional components, tape drives, media, and external cables. Contact Sales Assistance at +1.888.672.2534 for more information.

The tables throughout this chapter provide the part numbers for library components and upgrade options. The ATO number is for initial orders and PTO is for orders after the initial purchase of an SL3000 library.

Ordering Process

1. Physical Configuration — choose library modules. You should plan for future

growth.

2. Module Add-on Options — select module specific add-ons (drive arrays, CAPs,

and so on).

3. Activating Capacity — determine the active capacity required. Quantity options

include: +25, +100, +200, +500, +700, +1000.

Ordering

4. Tap e D ri ve s — order tape drives (T9840, T10000, and LTO).

5. Cartridges and Labels — order tape cartridges and labels.

6. Power Options — select a power redundancy option: N+1, 2N, or 2N+1. Order the

required number of power supplies, AC power cords, and PDUs (to calculate requirements, see Chapter 5, "Power and Cooling").

7. Software Options — select software options: dual TCP/IP, dual fibre channel,

partitioning, redundant electronics, library management software, and network connectivity.

8. Cables — select required cables.

9. Support — select maintenance options and professional service options.

Hardware Activation Files

Hardware activation files are required to enable:

■ Active capacity

■ Partitioning

■ Dual TCP/IP Port or dual Fibre Channel (FC)

■ Redundant Electronics

Ordering 9-1

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Physical Configuration

Hardware activation files are a digitally signed Java Archive (.jar) typically delivered through Oracle's Software Delivery Cloud. These activation files can be added and removed from the library using the SLConsole. To download a purchased hardware activation file:

1. Go to Oracle's Software Delivery Cloud at:

2. Choose a language, and enter your information.

3. Read and agree to terms and conditions.

4. Under select a product pack, choose Oracle StorageTek Products. Under platform

select Generic Platform.

5. Select the StorageTek SL3000 Modular Library System.

6. Download the purchased features. Refer to the SL3000 User’s Guide for installation

instructions.

Physical Configuration

Before selecting a physical configuration, read the options and requirements for each module carefully and review Chapter 2, "Library Modules and Hardware".

Base Module (required)

A Base module is required with every initial order. A standalone Base module is the smallest library configuration.

Table 9–1 Base Module Part Number

Description ATO

Base module, no active slots, one drive array (eight drive slots), CAP SL3000-BASE-Z

Base module for non-European Union countries, no active slots, one drive array (eight drive slots), CAP

https://edelivery.oracle.com/

7105811

Options:

■ 8 (standard), 16, or 24 drive slots. To order additional drive arrays, see "Tape Drive

Arrays" on page 9-4.

■ Perforated window (standard), window storage array, or operator panel. To order,

see "Module Add-on Options" on page 9-4.

Requirements:

■ A minimum of 200 activated slots must be purchased, see "Activating Capacity" on

page 9-6.

Drive Expansion Module (DEM)

Order a DEM for additional drive capacity.

Table 9–2 Drive Expansion Module Part Numbers

Description ATO PTO

DEM, 200 active slots, one drive array (eight drive slots) SL3000K-DEM200-Z XSL3000-DEM200-F

Options:

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■ 8 (standard), 16, 24, or 32 drive slots. To order additional drive arrays, see "Tape

Drive Arrays" on page 9-4.

■ Perforated window (standard), window storage array, operator panel, or CAP. To

order, see "Module Add-on Options" on page 9-4.

Requirements:

■ One DEM maximum per library.

■ Activation file for 200 slots included. However, additional activation permits may

be purchased to activate storage capacity in this module, see "Activating Capacity" on page 9-6.

Cartridge Expansion Module (CEM)

Order up to eight cartridge expansion modules for additional tape cartridge storage capacity.

Table 9–3 Cartridge Expansion Module Part Numbers

Description ATO PTO

CEM, no active slots (438 to 620 cartridge slots) SL3000-1CEM-Z XSL3000-CEM-Z-N

Physical Configuration

Options:

■ One CAP per module. To order, see "Cartridge Access Port" on page 9-5.

■ Two CEMs may be converted to PEMs at any time, if the dual robotics option is

selected. There is a loss of capacity when converting a CEM to a PEM. Ensure that the library has the required capacity.

Requirements:

■ Maximum of eight CEMs per library.

■ Activation permits may be purchased to activate storage capacity in this module,

see "Activating Capacity" on page 9-6.

Dual Robotics Support

Dual robotics require either two PEMs or two AEMs and a minimum 2N power with 240 VAC.

Parking Expansion Module (PEM)

A PEM provides dual robotics support. A PEM is a converted CEM.

Table 9–4 Parking Expansion Module Part Numbers

Description ATO PTO

PEM, no active slots (230 to 312 cartridge slots) SL3000-1CEM-Z XSL3000-CEM-Z-N

Options:

■ PEM on left side may have a CAP, but a CAP on the right PEM is not supported.

To order, see "Cartridge Access Port" on page 9-5.

Requirements:

■ If AEMs are not installed, two PEMs (one on each end of the library) are required

to support dual robotics.

Ordering 9-3

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Module Add-on Options

■ The library requires a minimum 2N power with 240 VAC to support dual robotics.

■ The library must have two TallBots. To order an additional TallBot, see "Dual

Tal lB ot s" on page 9-4.

Access Expansion Module (AEM)

AEMs can provide bulk loading and dual robotics support. AEMs can only be placed at the ends of the library. An AEM cannot be placed directly to the left of the Base module; there must be a module in between.

Table 9–5 Access Expansion Module Part Numbers

Description ATO PTO

AEM for Left Side, 234 bulk loading CAP SL3000-LEFTAEM-Z XSL3000-AEM-LFT-N

AEM for Right Side, 234 bulk loading CAP SL3000-RIGHTAEM-Z XSL3000-AEM-RT-Z-N

Options:

■ One AEM supports bulk loading capability only, dual robotics is not supported. It

is recommended to install a single AEM on the left for maximum storage slot capacity.

■ Two AEMs support bulk loading and dual robotics.

Requirements for Dual Robotics:

■ If two PEMs are not installed, two AEMs are required to support dual robotics.

■ The library requires a minimum 2N power with 240 VAC to support dual robotics.

■ The library must have two TallBots for dual robotics. To order an additional

Tall B ot, s ee "Dual TallBots" on page 9-4.

Dual TallBots

Dual TallBots increase efficiency and provide redundancy if a robot becomes inactive.

Table 9–6 Dual TallBots Part Numbers

Description ATO PTO

Dual TallBot SL3000-DUALBOT-Z XSL3000K-DUALBOT-N

Requirements:

■ Two AEMs or two PEMs are required to support dual robotics.

■ The library requires a minimum 2N power with 240 VAC to support dual robotics.

Module Add-on Options

Module add-on options include tape drive arrays, CAPs, window arrays, and an operator panel which can be added to a module. Some options are only compatible with a specific module. Therefore, read the options and requirements carefully.

Tape Drive Arrays

Tape drive arrays may be ordered for the Base module or DEM.

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Table 9–7 Tape Drive Array Part Numbers

Description ATO PTO

Tape Drive Array (eight drive slots) SL3000-DRVARRAY-Z XSL3000-DRVARY-Z-N

Options:

■ The Base module holds a maximum of three drive arrays. One array comes

standard with the module. Order up to two additional arrays.

■ The DEM holds a maximum of four drive arrays. One array comes standard with

the module. Order up to three additional arrays.

Cartridge Access Port

Order cartridge access ports (CAPs) to increase the import and export capacity of the library. Bulk cartridge loading is available with an AEM (see "Access Expansion

Module (AEM)" on page 9-4).

Rotational CAP

The cartridge access port (CAP) is a vertically-mounted, rotating cylinder with two removable 13-slot magazines.

Module Add-on Options

Table 9–8 Rotational Cartridge Access Ports - Part Numbers

Description ATO PTO

Cartridge Access Port (26 slots) SL3000-1CAP-Z XSL3000-CAP-Z-N

Spare CAP Magazine (13 slots) SL3000-CAPMAG-Z XSL3000-CAP-MAG-N

Options:

■ Spare CAP magazines can be ordered.

■ There can only be one CAP per CEM or DEM module.

Requirements:

■ The Base module comes standard with one CAP. A maximum of nine additional

CAPs can be ordered for a maximum-sized library.

Window Cartridge Array

The window array increases cartridge capacity in the Base module and DEM. The window array replaces the perforated window with 23 storage slots.

Table 9–9 Window Array Part Numbers

Description ATO PTO

Cartridge Window Array (+23 slots) SL3000-WARRAY-Z XSL3000-W-ARRAY-N

Requirements:

■ Only for Base module and DEM. Replaces perforated window.

Operations Panel

The operations panel provides a local touch screen panel for SLConsole.

Ordering 9-5

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Activating Capacity

Table 9–10 Operations Panel Part Numbers

Description ATO PTO

Operations Panel SL3000-OPPANL-Z XSL3000-OP-PANL-N

Requirements:

■ Only for Base module or DEM, one per library. Replaces the perforated window.

Redundant Electronics

Redundant electronics provide failover protection if a library controller card fails.

Table 9–11 Redundant Electronics Part Numbers

Description ATO PTO

Redundant Electronics SL3000-REDELCT-Z XSL3000-REDELCT-Z

Activating Capacity

Activate physical capacity in the library to allow access by the host. Capacity upgrades can be purchased at any time. For more information, see Chapter 4, "Capacity".

Active Capacity Permits

Capacity can be activated in quantities of: +25, +100, +200, +500, +700, +1000. However, the 700 slot upgrade is only available for an initial purchase. Order larger quantities first and add smaller quantities to get the total desired active capacity.

Table 9–12 Activate Capacity Permit Part Numbers

Description ATO PTO

1000 Cartridge Slot Upgrade SL3000K-1000SLOT XSL3000-1000SLOT-F

700 Cartridge Slot Upgrade SL3000K-700-SLOT Not available

500 Cartridge Slot Upgrade SL3000K-500-SLOT XSL3000-500-SLOT-F

200 Cartridge Slot Upgrade SL3000K-200-SLOT XSL3000-200-SLOT-F

100 Cartridge Slot Upgrade SL3000K-100-SLOT XSL3000-100-SLOT-F

25 Cartridge Slot Upgrade SL3000K-25SLOT XSL3000-25-SLOT-F

Tape Dr ive s

Refer to the tape media area on the corporate website for additional information:

http://www.oracle.com/us/products/servers-storage/storage/tape-storage/ove rview/index.html

For more detailed ordering information about T-series tape drives, refer to the drive specific Systems Assurance Guide on the OTN. Additionally, encryption is available for some drives, refer to the Oracle Key Management System, Systems Assurance Guide for more information about encryption-capable tape drives.

Some tape drives used in other StorageTek modular libraries can be converted to operate in an SL3000 library (see "Conversion Kits" on page 9-7). To order tape drive arrays for a module, see "Tape Drive Arrays" on page 9-4.

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T-Series Drives

LTO Dri ves

Tape Drives

The SL3000 library is compatible with T9840(C,D) and T10000(A,B,C,D). However, not all models are currently sold. Check the Oracle website for the most current sales information.

Table 9–13 T-series Tape Drive Part Numbers

Description Part Number

T10000D tape drive: 16 Gb FC 7105799

T10000D tape drive: 16 Gb FICON 7105800

T10000C tape drive: 4 Gb FC T10C-4FC-SW-30Z

T10000C tape drive: 4 Gb FICON T10C-4FI-LW-30Z

The SL3000 library is compatible with LTO drives generation 3, 4, 5, and 6. However, not all drive models are currently sold. Check the Oracle website for the most current sales information. All currently sold LTO drives are encryption capable.

Table 9–14 LTO Tape Drive Part Numbers

Description Part Number

HP LTO6 8 Gb FC 7104452

IBM LTO6 8 Gb FC 7104436

HP LTO5 8 Gb FC LTO5-HP8FC-SL3000Z

IBM LTO5 8 Gb FC LTO5-IB8FC-SL3000Z

Conversion Kits

Tape drive conversion kits convert drives previously used in another StorageTek library for use in the SL3000 library. If you are converting from:

■ An SL8500 library — only order the drive tray part number.

■ A previous generation library (such as L180, L700, L5500, 9740, 9310 or SL500) —

order both part numbers listed.

Table 9–15 Tape Drive Conversion Kits

Description Drive Tray Part Number

IBM LTO generation 3 or higher 7110132 7110138

HP LTO generation 3 or higher 7110133 7110137

T9840C/D 7110134 7110139

T10000A/B 7110135 7110140

T10000C 7110135 7110141

T10000D 7110136 7110141

Not needed if converting from an SL8500 library

Encryption Switches and Cabling

For tape drive encryption, you must have the proper Ethernet switches and cables. The number of required parts depends on the number and location of the encrypted drives. The "Harness number" correspond to the drive array location. Therefore, "Harness 1"

Bezel and Power Supply Part Number

Ordering 9-7

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Cartridges and Labels

supports the first drive array in a module, "Harness 2" supports the second drive array in a module, and so on.

Table 9–16 Drive E-Switch Harness Part Numbers

Description Part Number

Drive E-Switch Harness 1 (supports 1-8 drives) - includes switch XSL3000-ETHRNT1-N

Drive E-Switch Harness 2 (supports 9-16 drives) - cables only XSL3000-ETHRNT2-N

Drive E-Switch Harness 3 (supports 17-24 drives) - includes switch XSL3000-ETHRNT3-N

Drive E-Switch Harness 4 (supports 25-32 drives, DEM only) - cables only XSL3000-ETHRNT4-N

Port Conversions Kits

Port conversion kits convert the port type or install additional ports on tape drive. For single port to dual port upgrades or dual port long to short wave conversions, order two kits.

Table 9–17 T-Series Port Conversion Kit Part Numbers

Description Part Number

T10000C FC to FICON conversion kit T10C-FC/FI-CKITZ

T10000A/B 4GB FC and FICON single 4GB long wave SFP XT10K-4GB-LW-Z-N

T10000A/B 4GB FC and FICON single 4GB short wave SFP XT10K-4GB-SW-Z-N

T9840C/D and T10000A 2GB FC and FICON single 2GB long wave SFP X984/T10K-2GB-LW-N

T9840C/D and T10000A 2GB FC and FICON single 2GB short wave SFP X984/T10K-2GB-SW-N

Table 9–18 LTO Dual-Port Conversion Kit Part Numbers

Description Part Number

HP LTO4 FC dual-port conversion kit for installation of a second data port XL4-HF-SL30-DPCK-N

IBM LTO4 FC dual-port conversion kit for installation of a second data port XL4-IF-SL30-DPCK-N

LTO5 FC dual-port conversion kit for installation of a second data port XL5-SL85-SL30-DPCK

Cartridges and Labels

You must order tape cartridges separately. You can use existing cartridges if they are compatible and still within their warranty period. Professional Services and Data Center Services offer media and drives migration services.

■ Call 1.877.STK.TAPE to order media from your local reseller or to obtain media

pre-sales support.

■ E-mail: tapemediaorders_ww@oracle.com

Label kits are available in either 60 or 200 piece quantities. The 60 piece kit has 60 data and 6 cleaning cartridge labels. The 200 piece kit has 200 data and 20 cleaning cartridge labels. The label ranges are sequentially numbered, non-repeating and cannot be customized.

Refer to the T-Series Systems Assurance Guides for information about the media part numbers for the T9840 and T10000 tape drives. Refer to the Barcode Technical Brief for more details about media labels.

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Power Options

Refer to Chapter 5, "Power and Cooling" for details on the power configurations, as well as how to calculate power requirements for the SL3000 library.

DC Power Supplies

The number of powers supplies required depends on the power redundancy option selected (N+1, 2N, or 2N+1) and the number of tape drives. To calculate the number of DC power supplies to order for the tape drives, see "Calculating Tape Drive Power

Supply Quantities" on page 5-4.

If the 2N+1 power options is selected, order one additional 1200W DC supply to power the robotics, and two additional 200W cPCI power supplies for the electronics control module. These are in addition to the DC supplies required for the tape drives. For more information, see "DC Power Supplies" on page 5-2.

Table 9–19 DC Power Supply Part Numbers

Description ATO PTO

1200W DC power supply (for tape drives and robotics) SL3000-1DCPWR-Z XSL3000-DCPWR-Z-N

200W cPCI power supply (for ECM) SL3000-EMDCPWR-Z XSL3000-EM-DCPWR-N

Software Options

AC Power Distribution Units (PDU)

One PDU is required per Base module or DEM. The same PDU type must be installed in both module. There can be a maximum of four PDUs in the library depending on the configuration selected. To determine the number and type of PDUs to order, see

Chapter 5, "Power and Cooling".

Table 9–20 AC Power Distribution Unit Part Numbers

Description ATO PTO

100 - 127 VAC 20 Amp PDU SL3000-PDU110-Z XSL3000-PDU-110-N

200 - 240 VAC 30 Amp PDU SL3000-PDU240-Z XSL3000-PDU-240-N

AC Power Cords

You must order one power cord per PDU installed:

■ N+1: One power cord for the Base module and an additional power cord for the

DEM (if installed)

■ 2N or 2N+1: Two power cords for the Base module and two additional power

cords for the DEM (if installed)

Table 9–21 AC Power Cord Part Numbers

Description ATO PTO

US Power Cord 20A/110V, 3.7 meter SL3000-PWCD20110 XSL3000-PC20110-N

US Power Cord 30A/220V, 3.7 meters SL3000-PWCD30220 XSL3000-PC30220-N

International Power Cord, 30A/220V, 4 meters SL3000-IPWCD30220 XSL3000-IPC30220-N

Software Options

Hardware activation files for these software options are required. For download instructions, see "Hardware Activation Files" on page 9-1. For additional information about these options, refer to the SL3000 User’s Guide or SL3000 Host Connectivity Guide.

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Cables

Table 9–22 Software Options Part Numbers

Description ATO PTO

Partitioning SL3000K-PART XSL3000-PART-F

Dual TCP/IP SL3000-2TCPIP XSL3000-2TCPIP-F

Dual Fibre Channel Card XSL3000-2FCCARD XSL3000-2FCCARD

Dual Fibre Channel Port SL3000K-2FCPORT XSL3000-2FCPORT-F

Cables

The following tables list the cables available for the SL3000 library and tape drives. The cables are either Riser or Plenum. Plenum-rated cables have a higher flammability rating and are used for under-the-floor applications. SL3000 drive trays accept only LC fiber cable connectors. If you are using cables with SC connectors, you must add an adapter.

Fiber Optic Cables

LC connectors are the industry standard for all 2 Gb-capable or higher Fibre Channel devices. SL3000 drive trays accept only LC fiber cable connectors.

Table 9–23 LC-to-LC, 50/125 Micron, Multimode Cable Part Numbers

Description ATO PTO

50 m (164 ft) FC cable OM4, 50/125 duplex riser 7106951 7106952

50 m (164 ft) FC cable OM4, 50/125 duplex plenum 7106953 7106954

3 m (9.8 ft) FC cable, duplex riser CABLE10800340-Z-A CABLE10800340-Z-N

5 m (16.4 ft) FC cable, duplex riser CABLE10800341-Z-A CABLE10800341-Z-N

10 m (32.8 ft) FC cable, duplex riser CABLE10800310-Z-A CABLE10800310-Z-N

10 m (32.8 ft) FC cable, duplex plenum CABLE10800313-Z-A CABLE10800313-Z-N

Table 9–24 LC-to-LC, 9/125 Micron, Single Mode Cable Part Numbers

Description Part Number

3 m (9.8 ft) Optical Cable, LC-to-LC Duplex, Riser CABLE10800302-Z-A

10 m (32.8 ft) Optical Cable, LC-to-LC Duplex, Riser CABLE10800331-Z-A

50 m (164 ft) Optical Cable, LC-to-LC Duplex, Riser CABLE10800333-Z-A

100 m (328 ft) Optical Cable, LC-to-LC Duplex, Riser CABLE10800306-Z-A

10 m (32.8 ft) Optical Cable, LC-to-LC Duplex, Plenum CABLE10800330-Z-A

50 m (164 ft) Optical Cable, LC-to-LC Duplex, Plenum CABLE10800332-Z-A

100 m (328 ft) Optical Cable, LC-to-LC Duplex, Plenum CABLE10800305-Z-A

Table 9–25 LC-to-SC, 9/125 Micron Cable Part Numbers

Description Part Number

10 m (32.8 ft) Optical Cable, LC-to-SC Duplex, Riser CABLE10800335-Z

50 m (164 ft) Optical Cable, LC-to-SC Duplex, Riser CABLE10800337-Z

100 m (328 ft) Optical Cable, LC-to-SC Duplex, Riser CABLE10800304-Z

10 m (32.8 ft) Optical Cable, LC-to-SC Duplex, Plenum CABLE10800334-Z

50 m (164 ft) Optical Cable, LC-to-SC Duplex, Plenum CABLE10800336-Z

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Ethernet Cables

Support

Table 9–25 (Cont.) LC-to-SC, 9/125 Micron Cable Part Numbers

Description Part Number

100 m (328 ft) Optical Cable, LC-to-SC Duplex, Plenum CABLE10800303-Z

Table 9–26 ESCON Cable Part Numbers

Description Part Number

13 m (4 ft) Riser CABLE10800289-Z

107 m (350 ft) Riser CABLE10800292-Z

13 m (4 ft) Plenum CABLE10800285-Z

31 m (100 ft) Plenum CABLE10800286-Z

107 m (350 ft) Plenum CABLE10800288-Z

These cables provide the interface connection for TCP/IP (HLI-PRC). Only connect shielded cables to the library and tape drives.

Table 9–27 Ethernet Cable Part Numbers

Description Part Number

2.4 m (8 ft), 24 AWG, CAT5, Shielded CABLE10187033-Z-A

10.7 m (35 ft), 24 AWG, CAT5, Shielded CABLE10187034-Z-A

Support

Service and support representatives are available to assist with hardware and software problem resolution. During the initial order and installation planning, you can contact local and remote support with any questions.

Service Delivery Platform

The Service Delivery Platform (SDP) is a support enhancement solution that provides faster problem resolution, analysis and trending, and improved diagnostic capabilities. The SDP consists of a smart appliance placed at the customer site that connects to the library and any StorageTek T-series tape drives. The SDP collects device events and alerts support analysts, providing remote diagnosis and auto service requests (ASR).

For more information, customers should contact an Oracle representative, or visit:

http://www.oracle.com/technetwork/systems/asr/documentation/oracle-install ed-storage-330027.html

Oracle sales representatives should work with the customer to complete an SDP Systems Assurance Guide. Sales or service representatives can find the SDP Systems Assurance Guide and other SDP information at:

https://stbeehive.oracle.com/teamcollab/overview/Service+Delivery+Platform

Oracle Premier Support for Systems

Oracle Premier Support is a fully integrated support solution which features:

■ Complete system coverage and unlimited 24/7 access to Oracle system specialists

■ Essential product updates, such as firmware

■ Personalized, proactive IT support and rapid-response hardware service

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Support

For more information, visit:

Contacting Support

The Oracle Global Customer Support Contacts Directory can be found at:

http://www.oracle.com/us/support/contact-068555.html

To submit, update, or review service requests, go to My Oracle Support at:

https://support.oracle.com/

http://www.oracle.com/us/support/index.html

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This appendix provides basic information about the tape drives and media supported by the SL3000 library. For more information, refer to the tape drive section on the corporate website:

http://www.oracle.com/us/products/servers-storage/storage/tape-storage/ove rview/index.html

Additionally, for more information about the T-series tape drives, refer to the drive specific System Assurance Guide. For more information about LTO drives, refer to the LTO specific documentation. For information about labels and barcodes for tape media, refer to the Barcode Technical Brief. These resources can be found on OTN:

http://www.oracle.com/technetwork/documentation/tape-storage-curr-187744.h tml

■ Supported Tape Drives

■ Tape Drive and Media Comparisons

Supported Tape Drives

■ StorageTek T-Series (T9840C and D)

Tape Drives and Media

T9840

■ StorageTek T-Series (T10000A, B, C, and D)

■ Linear Tape-Open (LTO) Ultrium generations 3, 4, 5, and 6

Note: Tape drives must support the dynamic World Wide Name

feature for them to be placed online by the SL3000 library.

Most drives are capable of reading the data recorded by an earlier generation tape drive from the same family. Therefore, the customer may use their existing cartridges, if they are within their warranty period. Generally, there are four types of tape cartridges: data, write once read many (WORM) or VolSafe secure media, cleaning, and diagnostic.

The T9840 tape drives use a dual-reel cartridge design to enable fast access and reduce latency by positioning the read/write head in the middle of the tape when the cartridge is loaded. T9840C and T9840D drives are backward read compatible to the first generation (T9840A and B) cartridges, but not backward write compatible.

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Tape Drive and Media Comparisons

T10000

The T10000 tape drive can store a native capacity of up to: 8 TB (T10000D). There are two generations of cartridges: the T10000 for A and B drives and the T10000 T2 for C and D drives. The T10000C and D drives are capable of reading T10000A or T10000B media. The T10000C and D drives only write to T2 media. In addition to the standard data cartridge, there is a sport cartridge for faster access, but with less capacity.

LTO Ult riu m

The LTO Ultrium is an open standard format that provides media compatibility across all brands and manufacturers of LTO Ultrium products. LTO tape drives are read compatible backward two generations and write compatible backward one generation.

Encryption

The following drive models have encryption capabilities:

■ StorageTek T10000A, B, C, D and T9840 D

■ HP and IBM LTO Generations 4, 5, 6

For more information, refer to the tape drive specific documentation and Oracle Key Manager (OKM) documentation on OTN.

Tape Drive and Media Comparisons

Table A–1 Tape Drive and Media Comparisons

Specification T10000C T10000D T9840D LTO5 LTO6

Capacity (native) 5 TB

1TB (sport)

Transfer rates (native) 252 MB/s 252 MB/s 30 MB/s 140 MB/s 160 MB/s

Buffer size 2 GB 2 GB 64 MB 256 MB —

Load Time (sec) 13.1 13 8.5 19 22

Access (sec) 57

17.5 (sport)

Maximum Rewind time (sec)

Unload Time (sec)262312.51919

Load/unloads per cartridge 25,000 25,000 10,000 5,000 —

Length–usable 1,107 m

Total length 1147 m

115

32.5 (sport)

(3,632 ft)

(3763.1 ft)

8 TB

1.6 TB (sport)

14 (sport)

26 (sport)

1,107 m

(3,632 ft)

1147 m

(3763.1 ft)

75 GB 1.5 TB 2.5 TB

85250

16 96 98

251 m

(889 ft)

271 m

(889 ft)

850 m

(2789 ft)

846m

(2776 ft)

—

846m

(2776 ft)

Number of tracks 3584 4608 576 1280 2176

Tape Archival life (years) 30 30+ 15–30 15–30 —

Uncorrected bit error rate

A-2 StorageTek SL3000 Systems Assurance Guide

1x10

–19

1x10

–19

1x10

–18

1x10

–17

1x10

–17

Page 73

Tape Drive and Media Comparisons

Table A–1 (Cont.) Tape Drive and Media Comparisons

Specification T10000C T10000D T9840D LTO5 LTO6

Fibre Channel 4 Gb/s FCP 16 Gb/s FCP

10 Gb/s FCoE

SCSI /SAS ———6 Gb SAS6 Gb SAS

FICON 4 Gb/s 8 Gb/s 2 Gb/s — —

2 Gb/s FCP 8 Gb/s FCP 8 Gb/s FCP

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Tape Drive and Media Comparisons

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Controlling Contaminants

This appendix explains controlling contaminants.

■ Environmental Contaminants

■ Required Air Quality Levels

■ Contaminant Properties and Sources

■ Contaminant Effects

■ Room Conditions

■ Exposure Points

■ Filtration

■ Positive Pressurization and Ventilation

■ Cleaning Procedures and Equipment

■ Activity and Processes

Environmental Contaminants

Control over contaminant levels in a computer room is extremely important because tape libraries, tape drives, and tape media are subject to damage from airborne particulates. Most particles smaller than ten microns are not visible to the naked eye under most conditions, but these particles can be the most damaging. As a result, the operating environment must adhere to the following requirements:

■ ISO 14644-1 Class 8 Environment.

■ The total mass of airborne particulates must be less than or equal to 200

micrograms per cubic meter.

■ Severity level G1 per ANSI/ISA 71.04-1985.

Oracle currently requires the ISO 14644-1 standard approved in 1999, but will require any updated standards for ISO 14644-1 as they are approved by the ISO governing body. The ISO 14644-1 standard primarily focuses on the quantity and size of particulates as well as the proper measurement methodology, but does not address the overall mass of the particulates. As a result, the requirement for total mass limitations is also necessary as a computer room or data center could meet the ISO 14644-1 specification, but still damage equipment because of the specific type of particulates in the room. In addition, the ANSI/ISA 71.04-1985 specification addresses gaseous contaminations as some airborne chemicals are more hazardous. All three requirements are consistent with the requirements set by other major tape storage vendors.

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Required Air Quality Levels

Particles, gasses and other contaminants may impact the sustained operations of computer hardware. Effects can range from intermittent interference to actual component failures. The computer room must be designed to achieve a high level of cleanliness. Airborne dusts, gasses and vapors must be maintained within defined limits to help minimize their potential impact on the hardware.

Airborne particulate levels must be maintained within the limits of ISO 14644-1 Class 8 Environment. This standard defines air quality classes for clean zones based on airborne particulate concentrations. This standard has an order of magnitude less particles than standard air in an office environment. Particles ten microns or smaller are harmful to most data processing hardware because they tend to exist in large numbers, and can easily circumvent many sensitive components' internal air filtration systems. When computer hardware is exposed to these submicron particles in great numbers they endanger system reliability by posing a threat to moving parts, sensitive contacts and component corrosion.

Excessive concentrations of certain gasses can also accelerate corrosion and cause failure in electronic components. Gaseous contaminants are a particular concern in a computer room both because of the sensitivity of the hardware, and because a proper computer room environment is almost entirely recirculating. Any contaminant threat in the room is compounded by the cyclical nature of the airflow patterns. Levels of exposure that might not be concerning in a well ventilated site repeatedly attack the hardware in a room with recirculating air. The isolation that prevents exposure of the computer room environment to outside influences can also multiply any detrimental influences left unaddressed in the room.

While the following sections will describe some best practices for maintaining an ISO 14644-1 Class 8 Environment in detail, there are some basic precautions that must be adhered to:

■ Do not allow food or drink into the area.

■ Cardboard, wood, or packing materials must not be stored in the data center clean

area.

■ Identify a separate area for unpacking new equipment from crates and boxes.

■ Do not allow construction or drilling in the data center without first isolating

sensitive equipment and any air targeted specifically for the equipment. Construction generates a high level of particulates that exceed ISO 14644-1 Class 8 criteria in a localized area. Dry wall and gypsum are especially damaging to storage equipment.

Contaminant Properties and Sources

Contaminants in the room can take many forms, and can come from numerous sources. Any mechanical process in the room can produce dangerous contaminants or agitate settled contaminants. A particle must meet two basic criteria to be considered a contaminant:

■ It must have the physical properties that could potentially cause damage to the

hardware.

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■ It must be able to migrate to areas where it can cause the physical damage.

The only differences between a potential contaminant and an actual contaminant are time and location. Particulate matter is most likely to migrate to areas where it can do damage if it is airborne. For this reason, airborne particulate concentration is a useful measurement in determining the quality of the computer room environment. Depending on local conditions, particles as big as 1,000 microns can become airborne, but their active life is very short, and they are arrested by most filtration devices. Submicron particulates are much more dangerous to sensitive computer hardware, because they remain airborne for a much longer period of time, and they are more apt to bypass filters.

Operator Activity

Human movement within the computer space is probably the single greatest source of contamination in an otherwise clean computer room. Normal movement can dislodge tissue fragments, such as dander or hair, or fabric fibers from clothing. The opening and closing of drawers or hardware panels or any metal-on-metal activity can produce metal filings. Simply walking across the floor can agitate settled contamination making it airborne and potentially dangerous.

Hardware Movement

Hardware installation or reconfiguration involves a great deal of subfloor activity, and settled contaminants can very easily be disturbed, forcing them to become airborne in the supply air stream to the room's hardware. This is particularly dangerous if the subfloor deck is unsealed. Unsealed concrete sheds fine dust particles into the airstream, and is susceptible to efflorescence -- mineral salts brought to the surface of the deck through evaporation or hydrostatic pressure.

Contaminant Properties and Sources

Outside Air

Inadequately filtered air from outside the controlled environment can introduce innumerable contaminants. Post-filtration contamination in duct work can be dislodged by air flow, and introduced into the hardware environment. This is particularly important in a downward-flow air conditioning system in which the sub-floor void is used as a supply air duct. If the structural deck is contaminated, or if the concrete slab is not sealed, fine particulate matter (such as concrete dust or efflorescence) can be carried directly to the room's hardware.

Stored Items

Storage and handling of unused hardware or supplies can also be a source of contamination. Corrugated cardboard boxes or wooden skids shed fibers when moved or handled. Stored items are not only contamination sources; their handling in the computer room controlled areas can agitate settled contamination already in the room.

Outside Influences

A negatively pressurized environment can allow contaminants from adjoining office areas or the exterior of the building to infiltrate the computer room environment through gaps in the doors or penetrations in the walls. Ammonia and phosphates are often associated with agricultural processes, and numerous chemical agents can be produced in manufacturing areas. If such industries are present in the vicinity of the data center facility, chemical filtration may be necessary. Potential impact from

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Contaminant Effects

automobile emissions, dusts from local quarries or masonry fabrication facilities or sea mists should also be assessed if relevant.

Cleaning Activity

Inappropriate cleaning practices can also degrade the environment. Many chemicals used in normal or "office" cleaning applications can damage sensitive computer equipment. Potentially hazardous chemicals outlined in the "Cleaning Procedures and

Equipment" section should be avoided. Out-gassing from these products or direct

contact with hardware components can cause failure. Certain biocide treatments used in building air handlers are also inappropriate for use in computer rooms either because they contain chemicals, that can degrade components, or because they are not designed to be used in the airstream of a re-circulating air system. The use of push mops or inadequately filtered vacuums can also stimulate contamination.

It is essential that steps be taken to prevent air contaminants, such as metal particles, atmospheric dust, solvent vapors, corrosive gasses, soot, airborne fibers or salts from entering or being generated within the computer room environment. In the absence of hardware exposure limits, applicable human exposure limits from OSHA, NIOSH or the ACGIH should be used

Contaminant Effects

Destructive interactions between airborne particulate and electronic instrumentation can occur in numerous ways. The means of interference depends on the time and location of the critical incident, the physical properties of the contaminant and the environment in which the component is placed.

Physical Interference

Hard particles with a tensile strength at least 10% greater than that of the component material can remove material from the surface of the component by grinding action or embedding. Soft particles will not damage the surface of the component, but can collect in patches that can interfere with proper functioning. If these particles are tacky they can collect other particulate matter. Even very small particles can have an impact if they collect on a tacky surface, or agglomerate as the result of electrostatic charge build-up.

Corrosive Failure

Corrosive failure or contact intermittence due to the intrinsic composition of the particles or due to absorption of water vapor and gaseous contaminants by the particles can also cause failures. The chemical composition of the contaminant can be very important. Salts, for instance, can grow in size by absorbing water vapor from the air (nucleating). If a mineral salts deposit exists in a sensitive location, and the environment is sufficiently moist, it can grow to a size where it can physically interfere with a mechanism, or can cause damage by forming salt solutions.

Shorts

Conductive pathways can arise through the accumulation of particles on circuit boards or other components. Many types of particulate are not inherently conductive, but can absorb significant quantities of water in high-moisture environments. Problems caused by electrically conductive particles can range from intermittent malfunctioning to actual damage to components and operational failures.

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Thermal Failure

Premature clogging of filtered devices will cause a restriction in air flow that could induce internal overheating and head crashes. Heavy layers of accumulated dust on hardware components can also form an insulative layer that can lead to heat-related failures.

Room Conditions

All surfaces within the controlled zone of the data center should be maintained at a high level of cleanliness. All surfaces should be periodically cleaned by trained professionals on a regular basis, as outlined in the "Cleaning Procedures and

Equipment" section. Particular attention should be paid to the areas beneath the

hardware, and the access floor grid. Contaminants near the air intakes of the hardware can more easily be transferred to areas where they can do damage. Particulate accumulations on the access floor grid can be forced airborne when floor tiles are lifted to gain access to the sub-floor.

The subfloor void in a downward-flow air conditioning system acts as the supply air plenum. This area is pressurized by the air conditioners, and the conditioned air is then introduced into the hardware spaces through perforated floor panels. Thus, all air traveling from the air conditioners to the hardware must first pass through the subfloor void. Inappropriate conditions in the supply air plenum can have a dramatic effect on conditions in the hardware areas.

Room Conditions

The subfloor void in a data center is often viewed solely as a convenient place to run cables and pipes. It is important to remember that this is also a duct, and that conditions below the false floor must be maintained at a high level of cleanliness. Contaminant sources can include degrading building materials, operator activity or infiltration from outside the controlled zone. Often particulate deposits are formed where cables or other subfloor items form air dams that allow particulate to settle and accumulate. When these items are moved, the particulate is re-introduced into the supply airstream, where it can be carried directly to hardware.

Damaged or inappropriately protected building materials are often sources of subfloor contamination. Unprotected concrete, masonry block, plaster or gypsum wall-board will deteriorate over time, shedding fine particulate into the air. Corrosion on post-filtration air conditioner surfaces or subfloor items can also be a concern. The subfloor void must be thoroughly and appropriately decontaminated on a regular basis to address these contaminants. Only vacuums equipped with High Efficiency Particulate Air (HEPA) filtration should be used in any decontamination procedure. Inadequately filtered vacuums will not arrest fine particles, passing them through the unit at high speeds, and forcing them airborne.

Unsealed concrete, masonry or other similar materials are subject to continued degradation. The sealants and hardeners normally used during construction are often designed to protect the deck against heavy traffic, or to prepare the deck for the application of flooring materials, and are not meant for the interior surfaces of a supply air plenum. While regular decontaminations will help address loose particulate, the surfaces will still be subject to deterioration over time, or as subfloor activity causes wear. Ideally all of the subfloor surfaces will be appropriately sealed at the time of construction. If this is not the case, special precautions will be necessary to address the surfaces in an on-line room.

It is extremely important that only appropriate materials and methodology are used in the encapsulation process. Inappropriate sealants or procedures can actually degrade the conditions they are meant to improve, impacting hardware operations and

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Exposure Points

reliability. The following precautions should be taken when encapsulating the supply air plenum in an on-line room:

■ Manually apply the encapsulant. Spray applications are totally inappropriate in an

on-line data center. The spraying process forces the sealant airborne in the supply airstream, and is more likely to encapsulate cables to the deck.

■ Use a pigmented encapsulant. The pigmentation makes the encapsulant visible in

application, ensuring thorough coverage, and helps in identifying areas that are damaged or exposed over time.

■ It must have a high flexibility and low porosity to effectively cover the irregular

textures of the subject area, and to minimize moisture migration and water damage.

■ The encapsulant must not out-gas any harmful contaminants. Many encapsulants

commonly used in industry are highly ammoniated or contain other chemicals that can be harmful to hardware. It is very unlikely that this out-gassing could cause immediate, catastrophic failure, but these chemicals will often contribute to corrosion of contacts, heads or other components.

Effectively encapsulating a subfloor deck in an on-line computer room is a very sensitive and difficult task, but it can be conducted safely if appropriate procedures and materials are used. Avoid using the ceiling void as an open supply or return for the building air system. This area is typically very dirty and difficult to clean. Often the structural surfaces are coated with fibrous fire-proofing, and the ceiling tiles and insulation are also subject to shedding. Even before filtration, this is an unnecessary exposure that can adversely affect environmental conditions in the room. It is also important that the ceiling void does not become pressurized, as this will force dirty air into the computer room. Columns or cable chases with penetrations in both the subfloor and ceiling void can lead to ceiling void pressurization.

Exposure Points

All potential exposure points in the data center should be addressed to minimize potential influences from outside the controlled zone. Positive pressurization of the computer rooms will help limit contaminant infiltration, but it is also important to minimize any breaches in the room perimeter. To ensure the environment is maintained correctly, the following should be considered:

■ All doors should fit snugly in their frames.

■ Gaskets and sweeps can be used to address any gaps.

■ Automatic doors should be avoided in areas where they can be accidentally

■ Seal all penetrations between the data center and adjacent areas.

■ Avoid sharing a computer room ceiling or subfloor plenum with loosely controlled

Filtration

Filtration is an effective means of addressing airborne particulate in a controlled environment. It is important that all air handlers serving the data center are

triggered. An alternate means of control would be to remotely locate a door trigger so that personnel pushing carts can open the doors easily. In highly sensitive areas, or where the data center is exposed to undesirable conditions, it may be advisable to design and install personnel traps. Double sets of doors with a buffer between can help limit direct exposure to outside conditions.

adjacent areas.

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Positive Pressurization and Ventilation

adequately filtered to ensure appropriate conditions are maintained within the room. In-room process cooling is the recommended method of controlling the room environment. The in-room process coolers re-circulate room air. Air from the hardware areas is passed through the units where it is filtered and cooled, and then introduced into the subfloor plenum. The plenum is pressurized, and the conditioned air is forced into the room, through perforated tiles, which then travels back to the air conditioner for reconditioning. The airflow patterns and design associated with a typical computer room air handler have a much higher rate of air change than typical comfort cooling air conditioners so air is filtered much more often than in an office environment. Proper filtration can capture a great deal of particulates. The filters installed in the in-room, re-circulating air conditioners should have a minimum efficiency of 40% (Atmospheric Dust-Spot Efficiency, ASHRAE Standard 52.1). Low-grade pre-filters should be installed to help prolong the life of the more expensive primary filters.

Any air being introduced into the computer room controlled zone, for ventilation or positive pressurization, should first pass through high efficiency filtration. Ideally, air from sources outside the building should be filtered using High Efficiency Particulate Air (HEPA) filtration rated at 99.97% efficiency (DOP Efficiency MILSTD-282) or greater. The expensive high efficiency filters should be protected by multiple layers of pre-filters that are changed on a more frequent basis. Low-grade pre-filters, 20% ASHRAE atmospheric dust-spot efficiency, should be the primary line of defense. The next filter bank should consist of pleated or bag type filters with efficiencies between 60% and 80% ASHRAE atmospheric dust-spot efficiency.

ASHRAE 52-76

Dust spot efficiency % 3.0 micron 1.0 micron 0.3 micron

25-30 80 20 <5

60-65 93 50 20

80-85 99 90 50

90 >99 92 60

DOP 95 -- >99 95

Low efficiency filters are almost totally ineffective at removing sub-micron particulates from the air. It is also important that the filters used are properly sized for the air handlers. Gaps around the filter panels can allow air to bypass the filter as it passes through the air conditioner. Any gaps or openings should be filled using appropriate materials, such as stainless steel panels or custom filter assemblies.

Positive Pressurization and Ventilation

A designed introduction of air from outside the computer room system will be necessary to accommodate positive pressurization and ventilation requirements. The data center should be designed to achieve positive pressurization in relation to more loosely controlled surrounding areas. Positive pressurization of the more sensitive areas is an effective means of controlling contaminant infiltration through any minor breaches in the room perimeter. Positive pressure systems are designed to apply outward air forces to doorways and other access points within the data processing center to minimize contaminant infiltration of the computer room. Only a minimal amount of air should be introduced into the controlled environment. In data centers with multiple rooms, the most sensitive areas should be the most highly pressurized. It is, however, extremely important that the air being used to positively pressurize the room does not adversely affect the environmental conditions in the room. It is essential

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Cleaning Procedures and Equipment

that any air introduction from outside the computer room is adequately filtered and conditioned to ensure that it is within acceptable parameters. These parameters can be looser than the goal conditions for the room since the air introduction should be minimal. A precise determination of acceptable limits should be based on the amount of air being introduced and the potential impact on the environment of the data center.

Because a closed-loop, re-circulating air conditioning system is used in most data centers, it will be necessary to introduce a minimal amount of air to meet the ventilation requirements of the room occupants. Data center areas normally have a very low human population density; thus the air required for ventilation will be minimal. In most cases, the air needed to achieve positive pressurization will likely exceed that needed to accommodate the room occupants. Normally, outside air quantities of less than 5% make-up air should be sufficient (ASHRAE Handbook: Applications, Chapter 17). A volume of 15 CFM outside air per occupant or workstation should sufficiently accommodate the ventilation needs of the room.

Cleaning Procedures and Equipment

Even a perfectly designed data center requires continued maintenance. Data centers containing design flaws or compromises may require extensive efforts to maintain conditions within desired limits. Hardware performance is an important factor contributing to the need for a high level of cleanliness in the data center.

Daily Tasks

Operator awareness is another consideration. Maintaining a fairly high level of cleanliness will raise the level of occupant awareness with respect to special requirements and restrictions while in the data center. Occupants or visitors to the data center will hold the controlled environment in high regard and are more likely to act appropriately. Any environment that is maintained to a fairly high level of cleanliness and is kept in a neat and well organized fashion will also command respect from the room's inhabitants and visitors. When potential clients visit the room they will interpret the overall appearance of the room as a reflection of an overall commitment to excellence and quality. An effective cleaning schedule must consist of specially designed short-term and long-term actions. These can be summarized as follows:

Frequency Task

Daily Actions Rubbish Removal

Weekly Actions Access floor maintenance (vacuum and damp mop)

Quarterly Actions Hardware decontamination

Room surface decontamination

Biennial Actions Subfloor void decontamination

Air conditioner decontamination (as necessary)

This statement of work focuses on the removal of each day's discarded trash and rubbish from the room. In addition, daily floor vacuuming may be required in Print Rooms or rooms with a considerable amount of operator activity.

Weekly Tasks

This statement of work focuses on the maintenance of the access floor system. During the week, the access floor becomes soiled with dust accumulations and blemishes. The entire access floor should be vacuumed and damp mopped. All vacuums used in the

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Cleaning Procedures and Equipment

data center, for any purpose, should be equipped with High Efficiency Particulate Air (HEPA) filtration. Inadequately filtered equipment cannot arrest smaller particles, but rather simply agitates them, degrading the environment they were meant to improve. It is also important that mop-heads and dust wipes are of appropriate non-shedding designs.

Cleaning solutions used within the data center must not pose a threat to the hardware. Solutions that could potentially damage hardware include products that are:

■ Ammoniated

■ Chlorine-based

■ Phosphate-based

■ Bleach enriched

■ Petro-chemical based

■ Floor stripper or re-conditioners

It is also important that the recommended concentrations are used, as even an appropriate agent in an inappropriate concentration can be potentially damaging. The solution should be maintained in good condition throughout the project, and excessive applications should be avoided.

Quarterly Tasks

The quarterly statement of work involves a much more detailed and comprehensive decontamination schedule and should only be conducted by experienced computer room contamination-control professionals. These actions should be performed three to four times per year, based on the levels of activity and contamination present. All room surfaces should be thoroughly decontaminated including cupboards, ledges, racks, shelves and support equipment. High ledges and light fixtures and generally accessible areas should be treated or vacuumed as appropriate.

Vertical surfaces including windows, glass partitions, doors, etc. should be thoroughly treated. Special dust cloths that are impregnated with a particle absorbent material are to be used in the surface decontamination process. Do not use generic dust rags or fabric cloths to perform these activities. Do not use any chemicals, waxes or solvents during these activities.

Settled contamination should be removed from all exterior hardware surfaces including horizontal and vertical surfaces. The unit's air inlet and outlet grilles should be treated as well. Do not wipe the unit's control surfaces as these areas can be decontaminated by the use of lightly compressed air. Special care should also be taken when cleaning keyboards and life-safety controls. Specially treated dust wipes should be used to treat all hardware surfaces. Monitors should be treated with optical cleansers and static-free cloths. No Electro-Static Discharge (ESD) dissipative chemicals should be used on the computer hardware, since these agents are caustic and harmful to most sensitive hardware. The computer hardware is sufficiently designed to permit electrostatic dissipation thus no further treatments are required. After all of the hardware and room surfaces have been thoroughly decontaminated, the access floor should be HEPA vacuumed and damp mopped as detailed in the Weekly Actions.

Biennial Tasks

The subfloor void should be decontaminated every 18 months to 24 months based on the conditions of the plenum surfaces and the degree of contaminant accumulation.

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Activity and Processes

Over the course of the year, the subfloor void undergoes a considerable amount of activity that creates new contamination accumulations. Although the weekly above floor cleaning activities will greatly reduce the subfloor dust accumulations, a certain amount of surface dirt will migrate into the subfloor void. It is important to maintain the subfloor to a high degree of cleanliness since this area acts as the hardware's supply air plenum. It is best to perform the subfloor decontamination treatment in a short time frame to reduce cross contamination. The personnel performing this operation should be fully trained to assess cable connectivity and priority. Each exposed area of the subfloor void should be individually inspected and assessed for possible cable handling and movement. All twist-in and plug-in connections should be checked and fully engaged before cable movement. All subfloor activities must be conducted with proper consideration for air distribution and floor loading. In an effort to maintain access floor integrity and proper psychrometric conditions, the number of floor tiles removed from the floor system should be carefully managed. In most cases, each work crew should have no more than 24 square feet (six tiles) of open access flooring at any one time. The access floor's supporting grid system should also be thoroughly decontaminated, first by vacuuming the loose debris and then by damp-sponging the accumulated residue. Rubber gaskets, if present, as the metal framework that makes up the grid system should be removed from the grid work and cleaned with a damp sponge as well. Any unusual conditions, such as damaged floor suspension, floor tiles, cables and surfaces, within the floor void should be noted and reported.

Activity and Processes

Isolation of the data center is an integral factor in maintaining appropriate conditions. All unnecessary activity should be avoided in the data center, and access should be limited to necessary personnel only. Periodic activity, such as tours, should be limited, and traffic should be restricted to away from the hardware so as to avoid accidental contact. All personnel working in the room, including temporary employees and janitorial personnel, should be trained in the most basic sensitivities of the hardware so as to avoid unnecessary exposure. The controlled areas of the data center should be thoroughly isolated from contaminant producing activities. Ideally, print rooms, check sorting rooms, command centers or other areas with high levels of mechanical or human activity should have no direct exposure to the data center. Paths to and from these areas should not necessitate traffic through the main data center areas.

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Standards of Conformance

The tables below list the standards to which the SL3000 library complies.

Table C–1 Standards of Conformance - Country

Country Standard

U.S.A. Federal Communications Commission (FCC). Title 47, Part 15, Subpart B,

Japan Voluntary Control Council for Interference(VCCI), Class A(CISPR22)

European Union (CE mark) Electromagnetic Compatibility Directive 89/336/EEC and 2004/108/EC

Australia/New Zealand EMC Framework AS/NZS 3548

Taiwan Bureau of Standards, Metrology and Inspection (BSMI) Law, Taiwan

Canada Canadian EMC Law ICES-003

Korea Korean EMC Law

and as an Unintentional Radiators Class A

(including EN55022, EN55024, EN61000-3-2, EN61000-3-3 and amendments)

CNS13438

Table C–2 Standards of Conformance - Emissions

Emissions European Union Test Requirements

HF Radiated EN55022 Class A

HF Conducted EN55022 Class A

Harmonic Current EN61000-3-2

Voltage Fluctuations/Flicker EN61000-3-3

Table C–3 Standards of Conformance - Directives

Directive Description

RoHS Reduction of Hazardous Substances

WEEE Waste Electrical and Electronic Equipment (e-waste)

Table C–4 Standards of Conformance

Standard Description

EDS 3-3 AC Powerline

EDS 5-6 Product Safety Requirements

EDS 6-3 Electrostatic Discharge (ESD) Immunity

CP-7-1-2 Product Safety

Standards of Conformance C-1

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C-2 StorageTek SL3000 Systems Assurance Guide

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Glossary

A power configuration that gives the library full AC and DC power redundancy. This configuration allows AC line cords on two separate circuits, either of which can power the entire system. See also N+1.

access door

A door on the Base module and DEM for service personnel to enter the library.

access expansion module (AEM)

An optional module installed on the ends of a library that allows for bulk cartridge loading and redundant robotics support. One module supports bulk loading only. Two modules support bulk loading and redundant robotics.

accessory rack

Area of the Base module and DEM used for standard 19-inch rack-mount equipment. Two racks are supplied in each Base module and DEM.

ACSLS

See Automated Cartridge System Library Software (ACSLS).

addressing schemes

Used to identify library slots and devices. The type of scheme used depends on the application. See also HLI-PRC address and SCSI elements.

Any Cartridge Any Slot technology

The library supports placing any cartridge type in any active slot in the library. No partitions are required.

array

A unit that holds multiple objects, such as cartridges or tape drive tray assemblies.

ATO

The part number used for initial library orders. See also PTO.

audit

The process of updating the cartridge VOLIDs and locations the database.

Automated Cartridge System Library Software (ACSLS)

Tape management software that manages ACS library contents and controls ACS library hardware to mount and dismount cartridges on ACS drives.

Glossary-1

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bulk load

Loading numerous cartridges into the library. See also access expansion module

(AEM).

Capacity on Demand

A process by which a customer purchases additional physical slots and enlarges the library's active capacity with minimal impact to host applications.

cartridge access port (CAP)

A device in the library that allows an operator to insert or remove cartridges during library operations. Synonymous with import/export mail slot in SCSI and open system libraries.

cartridge array

An array that holds multiple cartridges. See also array.

cartridge expansion module (CEM)

Optional module in the library that added storage capacity. There can be a maximum of eight per library.

cleaning cartridge

A tape cartridge that contains special material to clean the tape path in a tape drive.

CLI

Command line interface.

CompactPCI (cPCI)

Compact peripheral component interconnect. Industry standard bus used for card-to-card bus expansion. The electronics control module uses 200W cPCI power supplies.

data cartridge

A term used to distinguish a cartridge onto which a tape drive may write data from a cartridge used for cleaning or diagnostic purposes.

diagnostic cartridge

A data cartridge with a "DG" label that is used for diagnostic routines.

Base module

The main module in an SL3000 library that houses the electronics module assembly, power distribution units (PDUs), power supplies, accessory racks and equipment, and tape drives. This module is required for all libraries.

drive array assembly

An array that is installed in the Base module or DEM for inserting tape drive tray assemblies. The Base module holds up to three array assemblies; the DEM can contain four array assemblies, and each array holds up to 8 tape drive tray assemblies.

Glossary-2

drive bay

A section of the tape drive array assembly that holds one tape drive tray assembly.

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firmware

drive expansion module (DEM)

An optional library module that provide additional drive tray capacity and cartridge storage.

dynamic World Wide Name (dWWN)

A feature that applies dynamic names to network devices rather than fixed names. When a dWWN-named device is replaced, it is assigned the same WWN as the one replaced, preventing reconfiguration of the network.

electronics control module (ECM)

The assembly that processes commands from a host system, coordinates the activities of TallBots, CAPs, and tape drives, and Monitors status inputs from sensors and switches.

Enterprise Library Software (ELS)

Enterprise Library Software (ELS) incorporates the StorageTek Nearline Control Solutions (NCS) products, VTCS products, and provides customers with a single, integrated software suite.

Enterprise Systems Connection (ESCON)

(1) A set of fiber-optic based products and services developed by IBM that allows devices within a storage environment to be dynamically configured. A channel-to-control unit I/O interface that uses optical cables as a transmission medium.

(2) A set of IBM products and services that provide a dynamically-connected environment within an enterprise.

Ethernet

A local-area, packet-switched network technology. See TCP/IP.

export

The action in which the library places a cartridge into the cartridge access port so that the operator can remove the cartridge from the library. Synonymous with eject.

failover

The act of moving to a secondary or redundant path when the primary path fails.

FC-SCSI

A library connection type which uses small computer system interface over a physical Fibre Channel interface.

Fibre Channel

A bidirectional, full-duplex, point-to-point, serial data channel structured for high performance capacity. See FC-SCSI.

fibre connection (FICON)

An IBM S/390-based channel architecture that provides up to 256 channels in a single connection, each having a capacity of 100 MB per second.

firmware

An ordered set of instructions and data stored in a way that is functionally independent of main storage; for example, microprograms stored in a ROM.

Glossary-3

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HLI-PRC address

A four-digit, comma-separated value (L,P,R,C) that represents LSM, Panel, Row, and Column. This addressing scheme is used by host LMU interface (HLI) clients, including ACSLS and ELS/HSC, to represent library components accessible to those HLI clients.

host audit

The process of updating the cartridge VOLIDs and locations (collected by a security audit) in a host CDS. This audit is initiated by a host command.

Host Software Component (HSC)

A host-resident software package, implemented on operating systems, that influences device allocation and intercepts mount and dismount requests to automate these requests. See also Enterprise Library Software (ELS).

import

The process of placing a cartridge into the cartridge access port so that the library can insert it into a storage slot. Synonymous with enter.

label

An identifier associated with a removable media or cartridge. Labels are humanly readable, machine readable, or both. Synonymous with volume serial number

(VOLSER or VOLID).

library console

The customer's operator console that interfaces with the library. See StorageTek

Library Console (SLConsole).

library controller (HBCR)

The HBCR card within the SL3000 library that controls operations and communicates with the operator console and other modules.

local operator panel

An optional feature consisting of a flat-panel display with a touch screen interface and a panel mount computer. This feature is attached to the front door of the Base module (or the DEM door).

magazine

A removable array that holds cartridges in the cells provided and is inserted into the cartridge access port (CAP).

N+1

A power configuration that provides AC power and redundant DC power by adding a second DC power supply to each DC bus. See also 2N.

parking expansion module (PEM)

Modules that can be installed on the ends of a library configuration. These modules (or access expansion modules) are required for dual TallBot operation. Parking expansion modules can house a defective robot in a redundant robotics library. Robot maintenance is disruptive to the library. (Contrast with access expansion module

(AEM).)

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slot

partition

A subset or portion of an entire library that presents itself to a host client as an independent library. Slots and tape drives included in one partition cannot be seen by another partition. CAPs cannot be shared.

PCI

Peripheral component interconnect.

physical capacity

The number of data cartridge slots in the library (excludes reserved slots for cleaning cartridges, diagnostic cartridges, and the module identification block).

power distribution unit (PDU)

A device for the distribution of AC line power from one inlet to multiple outlets. Multiple PDUs provide higher availability because the power continues if one PDU (or its alternating current [AC] source if the PDUs use separate AC sources) loses power.

PTO

The part number used for orders after the initial purchase of an SL3000 modular library. See also AT O.

rack unit (u)

A standard unit of measurement of vertical space inside a rack mount cabinet. One u equals 44.5 mm (1.75 in.).

rail

That portion of the upper robot track assembly that provides power and communication to the robot.

rail assembly

The mechanism on which the robot travels between cartridge arrays and tape drives.

remote operator console

The customer's operator console that interfaces with the library. See also StorageTek

Library Console (SLConsole).

reserved slots

Cartridge slots that are used only for cleaning and diagnostic cartridges and as drop-off slots.

robot

An electromechanical device that moves tape cartridges among the cartridge access ports, storage slots, and drives. Also called a Tal l B o t .

SCSI elements

A four-digit number that represents the addressing scheme used by hosts operating on a Fibre Channel interface. See also FC-SCSI.

service area

An area surrounding the library for service representatives to perform maintenance.

slot

The location in the library in which a tape cartridge is stored. Synonymous with cell.

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storage cell

See slot.

StorageTek Library Console (SLConsole)

The operator console software application used for the SL3000.

TallB o t

High capacity tall robot. One or two TallBots are used in an SL3000 library. See also

robot.

tape cartridge

A container holding magnetic tape that can be processed without separating the tape from the container. The library uses data, diagnostic, and cleaning cartridges. These cartridges are not interchangeable.

tape drive

An electromechanical device that moves magnetic tape and includes mechanisms for writing and reading data to and from the tape.

tape transport interface (TTI)

An interface to control/monitor tape movement.

TCP/IP

A library connection type using Ethernet (10/100 Base-T and CAT-5 cable).

volume serial number (VOLSER or VOLID)

An alphanumeric label that the host software uses to identify a volume. It attaches to the spine of a cartridge and is both human and machine readable. Generally, a six-character alphanumeric label used to identify a physical volume.

World Wide Name (WWN)

A 64-bit integer that identifies a Fibre Channel port. See also dynamic World Wide

Name (dWWN).

World Wide Node Name (WWNN)

A globally unique 64-bit identifier assigned to each Fibre Channel node process.

World Wide Port Name (WWPN)

A 64-bit network address that identifies the port name.

write once read many (WORM)

A storage classification for media that can be written only once but read many times.

Glossary-6

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Index

Numerics

2N, 5-1 2N+1, 5-1

See power

access expansion module

See AEM

ACSLS, 3-3 active capacity, 4-3 AEM

measurements, 7-4 ordering, 9-4 overview, 2-5 shipping, 8-2

air quality, B-2 airborne contaminants

details, B-1 overview, 7-8

arbitrated loop, 3-1 automated cartridge system library software, 3-3

bar-code scanner, 2-6 Base module

installation time estimate, 8-2 installation tool kit, 8-4 measurements, 7-3 ordering, 9-2 overview, 2-2 power, 5-2 shipping, 8-2

Btu/hr, 5-7 bulk loading, 2-7

Oracle StorageTek SL3000 System Assurance Manual

Contents

List of Figures

List of Tables

Documentation Accessibility

Preface

Library Features

Introduction

Software Options

Supported Tape Drives and Media

Library Modules

Library Modules and Hardware

Base Module

Configuration Options

Components

Drive Expansion Module

Configuration Options

Components

Cartridge Expansion Module

Configuration Options

Parking Expansion Module

Configuration Options

Access Expansion Module

Configuration Options

Hardware Components

Electronics Control Module

Command Line Interface

Redundant Electronics

Robotics

Redundant Robotics

Cartridge Access Ports - Rotational

Cartridge Access Ports - Bulk Load

Host Connectivity

Software and Connectivity

FC-SCSI Connection

Supported Topologies

Media Validation

TCP/IP Connection

Port Bonding

Library Monitoring

StorageTek Library Console

Simple Network Management Protocol

Log SnapShot Feature

Library Management Software

Automated Cartridge System Library Software (ACSLS)

Other Storage System Solutions

Enterprise Library Software

Host Software Component (HSC) and Storage Management Component (SMC)

Virtual Tape Control System (VTCS)

Concurrent Disaster Recovery Test (CDRT)

Independent Software Vendors (ISVs)

Client System Component (CSC)

Expert Performance Reporter

Extended High Performance Data Mover

Library Content Manager (LCM)

Linear Tape File System (LTFS)

StorageTek Tape Analytics

Virtual Storage Manager (VSM)

Virtual Library Extension (VLE)

Physical Capacity

Capacity

Calculation Example 1: Base, DEM, CEMs, PEMs

Calculation Example 2: Base and CEM

Calculation Example 3: Base, DEM, CEMs, AEM

Active Capacity

RealTime Growth

Capacity on Demand

Power Configurations

Power and Cooling

AC Power Source Options

Power Redundancy Options

N+1 power configuration (standard)

DC Power Supplies

2N power configuration

2N+1 power configuration

Electronic Control Module Power Supplies

Robotics Unit Power Supplies

Calculating Tape Drive Power Supply Quantities

Tape Drive Power Supplies

Watt Consumption Per Drive