
160/ 200/ 230/ 400/ 450/ 450G7/ 640/ 1M

Optris GmbH
Ferdinand-Buisson-Str. 14
D – 13127 Berlin
Germany
Tel.: +49 30 500 197-0
Fax: +49 30 500 197-10
E-mail: info@optris.de
Internet: www.optris.de

Table of contents
1
General Notes ..................................................................................................................................... 7
1.1 Intended use ................................................................................................................................. 7
1.2 Warranty ....................................................................................................................................... 9
1.3 Scope of delivery .......................................................................................................................... 9
1.4 Maintenance ............................................................................................................................... 11
1.4.1 Cleaning .............................................................................................................................. 11
1.5 Model overview ........................................................................................................................... 12
2 Technical Data .................................................................................................................................. 13
2.1 General specifications ................................................................................................................ 13
2.2 Electrical specifications ............................................................................................................... 17
2.3 Measurement specifications ....................................................................................................... 18
2.4 Optical specifications .................................................................................................................. 21

3 Mechanical Installation .................................................................................................................... 27
3.1 Dimensions ................................................................................................................................. 27
3.2 Mounting accessories (optional) ................................................................................................. 29
3.3 High temperature accessories .................................................................................................... 30
3.3.1 Cooling Jacket .................................................................................................................... 30
3.3.2 Cooling Jacket Advanced ................................................................................................... 33
4 Electrical Installation ........................................................................................................................ 37
4.1 Process interface ........................................................................................................................ 38
4.1.1 PIN allocation ...................................................................................................................... 40
4.1.2 Industrial Process Interface (optional) ................................................................................ 41
4.2 Example for a Fail-Safe monitoring of the PI with a PLC ........................................................... 45
4.3 USB cable extension .................................................................................................................. 47

5 Software PIConnect .......................................................................................................................... 49
5.1 Installation and initial start-up ..................................................................................................... 49
5.2 Software window ......................................................................................................................... 52
5.2.1 Basis features of the software PIConnect .......................................................................... 54
6 Basics of Infrared Thermometry ..................................................................................................... 57
7 Emissivity .......................................................................................................................................... 63
7.1 Definition ..................................................................................................................................... 63
7.2 Determination of unknown emissivity ......................................................................................... 65
7.3 Characteristic emissivity ............................................................................................................. 67
Appendix A – Table of emissivity for metals ......................................................................................... 69
Appendix B – Table of emissivity for non-metals ................................................................................. 71
Appendix C – Quick start for serial communication ............................................................................. 73
Appendix D – Interprocess Communication (IPC) ................................................................................ 75
Appendix E – PI Connect Resource Translator ..................................................................................... 77

Appendix F – Wiring diagrams PIF ......................................................................................................... 79
Appendix G – CE Conformity .................................................................................................................. 83

1 General Notes
1.1 Intended use
The optris PI calculates the surface temperature based on the emitted infrared energy of objects
[►6 Basics of Infrared Thermometry]. The two-dimensional detector (FPA - focal plain array) allows a
measurement of an area and will be shown as thermal image using standardized palettes. The
radiometric processing of the picture data enables the user to do a comfortable detailed analysis with
the software PI Connect.
The PI is a precise instrument and contains a sensitive infrared detector and a high-
quality lens. The alignment of the camera to intensive energy sources (high po we r
laser or reflections of such equipment, e.g.) can have effect on the accuracy of the
measurement or can cause an irreparable defect of the infrared detector.

• Avoid abrupt changes of the ambient temperature.
• Avoid static electricity, arc welders, and induction heaters. Keep away from very
strong EMF (electromagnetic fields).
• In case of problems or questions which may arise when you use the infrared
camera, please contact our service department.
► All accessories can be ordered according to the referred part numbers in
Read the manual carefully before the initial start-up. The producer reserves the right to
change the herein described specifications in case of technical advance of the product.

1.2 Warranty
Each single product passes through a quality process. Nevertheless, if failures occur contact the
customer service at once. The warranty period covers 24 months starting on the delivery date. After the
warranty is expired the manufacturer guarantees additional 6 months warranty for all repaired or
substituted product component s. Warranty does not apply to damages, which result from misuse or
neglect. The warranty also expires if you open the product. The manufacturer is not liable for
consequential damage or in case of a non-intended use of the product.
If a failure occurs during the warranty period the product will be replaced, calibrated or repaired without
further charges. The freight costs will be paid by the sender. The manufacturer reserves the right to
exchange components of the product instead of repairing it. If the failure results from misuse or neglect
the user has to pay for the repair. In that case you may ask for a cost estimate beforehand.
1.3 Scope of delivery
Standard version
• PI160, PI200, PI230, PI400, PI450, PI450G7, PI640 or PI1M incl. 1 lens
• USB cable (1 m
1)
)
• Table tripod
• Process interface cable incl. terminal block (1 m)
• Software package PI Connect

• Operators manual
• Aluminum case
• PI450/ 640 only: Hard transport case (IP 67)
• PI200/ 230 only: focusing tool for VIS camera
Thermal Analysis Kit
• PI160 or PI200
• 3 lenses (23°, 6° and 41°, incl. calibration certificate)
• USB cable (1 m
1)
and 10 m)
• Tripod (20 - 63 cm)
• Process interface cable incl. terminal block (1 m)
• Software package PI Connect
• Operators manual
• Aluminum case
• PI200/ 230 only: focusing tool for VIS camera
1)
The camera plug of USB cable (1 m) does not feature an IP67 protection class. For industrial applications there are cables with
IP67 available starting at 5 m.

1.4 Maintenance
1.4.1 Cleaning
Blow off loose particles using clean compressed air. The lens surface can be cleaned with a soft, humid
tissue moistened with water or a water based glass cleaner.
Never use cleaning compounds which contain solvents (neither for the lens nor for the

1.5 Model overview
The cameras of the PI-series are available in the following basic versions:
200 to 1500 °C (optional)
Exact measurements of metallic and
200 to 1500 °C (optional)
Synchronous recording of VIS and IR
200 to 1500 °C
(optional for PI 400)
Real-time thermographic images in high
speed; Detection of smallest
temperature di f fer enc es (PI450)
Measurement of glass with Line-
Pin-sharp radiom etric recordings in real
Measurement of metallic surfaces,
graphite or ceramics with short
wavelengths
Table 1: Model overview

2 Technical Data
2.1 General specifications
0...50 °C (0...70 °C [PI 450/ PI 450 G7])
-40...70 °C (-40...85 °C [PI 450/ PI 450 G7])
10...95 %, non-condensing
PI160/ PI20 0/ PI230: 45 x 4 5 x 62 - 65 mm (depending on lens)
PI400/ 450/ 640/1M: 46 x 56 x 86 - 90 mm (depending on lens)
PI160: 195 g, P I200/ 230: 215 g, PI400/ PI450/ PI640/PI1M: 320 g
1 m (standard), 5 m, 10 m, 20 m
IEC 60068-2-6 (sinus shaped)
IEC 60068-2-64 (broadband noise)
IEC 60068-2-27 (25 g and 50 g)

1)
Used standards for vibration and shock:
Figure 1: Used standards
Stress program (camera in operation):
Shock, half sinus 25 g – testing Ea 25 g (acc. IEC 60068-2-27)
(3 axes with 2 directions each)
(100 Shocks each direction)

Shock, half sinus 50 g – testing Ea 50 g (acc. IEC 60068-2-27)
(3 axes with two directions each)
(3 Shocks each direction)
Vibration, sinus shaped – testing Fc (acc. IEC60068-2-6)
Vibration, broadba nd nois e – testing Fh (acc. IEC60068-2-64)

2.2 Electrical specificatio ns
5 VDC (powered via USB 2.0 interface)
Output Proc ess Interface ( P IF
0-10 V (Main area temperature, internal temperature, flag status, alarm)
[►Appendix F – W ir ing di a gr am s PIF]
Input Process Interface (PIF in)
0-10 V (Emissivity, am bient temperature, refere nce temperat ure, flag control, trigger ed
recording, t riggered snapshots, triggered line-scanner, uncommitted value)
[►Appendix F – W ir ing di a gr am s PIF]
Digital Input Process Interface
Flag control, triggered vi deo or triggered snapshots, triggered line-scanner
[►Appendix F – Wiring dia gram s PI F]

2.3 Measurement specifications
20...100 °C; 0...250 °C; 150...900 °C; Option: 200…1500°C
160 x 120 pixel @1 28 Hz3)
640 x 480 pixel (visual
Camera)
160 x 120 pixel @1 28 Hz3)
640 x 480 pixel (visual
Camera)
23° x 17°; 6° x 5° ; 41° x 31°; 72° x 52°
Temperatur e resolution (NETD):
0.08 K with 23°; 0,3 K with 6°; 0.1 K with 41° and 72°
1)
For an ideal combination of IR and VIS image we recommend the 41° lens for PI200 and the 23° lens for PI230
2)
At ambient temperature 23±5 °C; whichever is greater
3)
The following options can be set: Option 1 (IR with 96 Hz at 160 x 120 px; VIS with 32 Hz at 640 x 480 px);
Option 2 (IR with 128 Hz at 160 x 120 px; VIS with 32 Hz at 596 x 447 px)

150...900 °C;
Option: 200…1500°C
-20...100 °C; 0...250 °C;
382 x 288 pixel@80 Hz
(switchable to 27 Hz)
382 x 288 pixel@80 Hz
(switchable to 27 Hz)
382 x 288 pixel@80 Hz
(switchable to 27 Hz)
1)
Value is valid at 40 Hz and 25°C room temperature
2)
At ambient temperature 23±5 °C; whichever is greater

-20...100 °C; 0...250 °C;
382 x 288 pixel@80 Hz
(switchable to 27 Hz)
72x56 pixel@1000 Hz
768 x 480 pixel@32 Hz
382 x 288 pixel@80 Hz
(switchable to 27 Hz)
72x56 pixel@ 10 00 Hz
51°x 39°, 26°x 20°, 20°x
15°, 13°x 10°, 6,2°x
4,7°, 4,0°x 3,0°
39°x 25°, 20°x 13°, 15°x 9°,
9,6°x 6°, 4,7°x 2,9°,
3,0°x 1,9°
Temperatur e resolution (NETD):
< 1K (700 °C), < 2K (1000 °C)
1)
Value is valid at 40 Hz and 25°C room temperature
2)
At ambient temperature 23±5 °C; whichever is greater

2.4 Optical specification s
Figure 2: PI 200 with visual camera
Make sure that the focus of thermal channel and visual channel (PI200/ 230 only) is
adjusted correctly. For focusing the thermal camera turn the lens in right direction for
“close” and to the left for “infinite” (
Figure 2), as well as focusing the visual camera with
the focusing tool supplied in the scope of delivery (Figure 3).

Figure 3: Focusing tool for VIS camera
The variety of different lenses offers the possibility to precisely measure objects in different distances. We
offer lenses for close, standard distances and large distances. Different parameters are important if using
infrared cameras. They display the connection between the distance of the measured object and the size
of the pixel (
Table 2).
With the help of BI-SPECTRAL technolo g y at PI200/ 2 30, a visual image (VIS) can be combined with a
thermal image (IR). Both can be finally captured time synchronously:

Table 2: Table with examples showing what spot sizes and pixel sizes will be reached in which distance. For
individual configuration there are different lenses available. Wide angle lenses have a radial distortion due to their
large opening angle; the software PIConnec t has an algorithm which corrects this distortion.
* Note: The accuracy of measurement can be outside of the specifications for distances below the defined minimum distance.

Table 3: Table with examples showing what spot sizes and pixel sizes will be reached in which distance. For
individual configuration there are different lenses available. Wide angle lenses have a radial distortion due to their
large opening angle; the software PIConnec t has an algorithm which corrects this distortion.
* Note: The accuracy of measurement can be outside of the specifications for distances below the defined minimum distance.

Figure 4: Measurement field of the infrared camera optris PI representing the 23° x 17° lens

HFOV: Horizontal enlargement of the total measuring at object level
VFOV: Vertical enlargement of the total measuring at object level
IFOV: Size at the single pixel at object level
DFOV: Diagonal dimension of the total measuring field at object level
MFOV: Recommended, smallest measured object size of 3 x 3 pixel

3 Mechanical Installation
3.1 Dimensions
The PI is equipped with two metric M4 thread holes on the bottom side (6 mm depth) and can be installed
either directly via these threads or with help of the tripod mount (also on bottom side).
Figure 5: PI160, dimensions [mm] Figure 6: PI200/ 230, dimensions [mm]

Figure 7: PI400/ PI450/ PI450G7/ PI640/ PI1M, dimensions [mm]

3.2 Mounting accessories (optional)
Figure 8: Mounting base, stainless steel, adjustable in 2 axes [Part No.: ACPIMB]
Figure 9: Protective housing, stainless steel, Incl. Mounting base [Part No.: ACPIPH]

3.3 High temperature accessories
3.3.1 Cooling Jacket
• The IR camera can be used at ambient temperature up to 50 °C (up to 70 °C with
PI450/ PI450G7). For higher temperatures (up to 240 °C) the Cooling Jacket is
provided.
• For detailed information see installation manual.

#
Figure 10: Cooling Jacket - Dimensions

Figure 11: Cooling jacket for PI [Part No.: ACPIxxxCJ]
Figure 12: Cooling jacket with mounting bracket

3.3.2 Cooling Jacket Advanced
• The Cooling Jacket Advanced is available as Standard Version and Extended
Version.
• The IR camera can be used at ambient temperature up to 50 °C (up to 70 °C with
PI450/ PI450G7). For higher temperatures (up to 300 °C) the Cooling Jacket
Advanced is provided.
• For detailed information see installation manual.

Standard Version
Figure 13: Cooling Jacket Advanced [Part No.: ACPIxxxCJAS], Standard Version, 38°/ 62° optics - Dimensions

• The Extended Version is provided for applications of the PI series with the PI Netbox
and industrial PIF or the USB Server Gigabit and industrial PIF.

Figure 14: Cooling Jacket Advanced [Part No.: ACPIxxxCJAE], Extended Version, 38°/ 62° optics - Dimensions

4 Electrical Installation
At the back side of the PI there are the two connector plugs. The left plug is for the USB cable. The right
connector plug is only used for the process interface.
Figure 15: Backside of the camera with connectors

4.1 Process interface
The PI is equipped with a process interface (cable with integrated electronics and terminal block), which
can be programmed via the software as an Analog Input (AI) and Digital Input (DI) in order to control the
camera or as an Analog Output (AO) in order to control the process. The signal level is always 0-10 V.
The process interface can be activated choosing the following options:
Emissivity, ambient temperature, reference temperature, flag control, triggered recording, triggered
snapshots, triggered line-scanner, uncommitted value
Main area temperature, internal temperature, flag status, alarm
Flag control, triggered recording, triggered snapshots, triggered line-scanner
The process interface (electronics within cable as well as industrial interface) must be
powered separately (5-24 VDC). Before switching on the power the PIF cable must be
connected to the camera.

Figure 16: Configuration Standard Process Interface (PIF)
The standard process interface provides the following inputs and outputs:
0/ 10 V
1)
Depending on supply voltage; for 0-10 V on the AO the PIF has to be powered with min. 12 V.

4.1.1 PIN allocation
Figure 17: Rear side of the camera
Consider that the input of the PIF is not protected if there is a direct PIF connection!
A voltage > 3 V on the INT pin will destroy the device!

If the process interface of the camera is directly connected to external hardware1) (without using the
supplied PIF cable) an activation of the field „Support proprietary PIF cable” in the menu
Tools/ Configuration/ Device (PIF) in the PIConnect software is necessary.
Figure 18: Support proprietary PIF cable
1)
We recommend using only a switching contact between INT and DGND as external hardware (button, relay).
4.1.2 Industrial Process Interface (optional)
For use in industrial environment the industrial process interface with 500 VAC
RMS isolation voltage
between PI and process is available (connection box with IP65, 5 m, 10 m or 20 m standard or high
temperature cable for camera connection, terminal for process integration).
[►Appendix F – Wiring
diagrams PIF]

Pin assignment PIF cable (industrial process interface)
Figure 19: Connections of the industrial Process Interface

The industrial process interface provides the following inputs and outputs:
Relay output 1, 2 and 3 2)
open/ closed (red LED on) / 0...30 V, 400 mA
open/ closed (green LED on)/ 0...30 V, 400 mA
1)
depending on supply voltage; for 0-10 V on the AO the PIF has to be powered with min. 12 V.
2)
active if AO1, 2 or 3 is/ are programmed as alarm output

The process interface has an integrated fail-safe mode. This allows to control conditions like interruption
of cables, shut-down of the software etc. and to give out these conditions as an alarm.
Controlled conditions on camera and software
Standard Process interface
Industrial Process interface
Interruption USB cable to camera
Interruption data cable camera - PIF
Interruption power supply PIF
Shut-down of PIConnect software
Crash of PIConnect software
0 V at analog output (AO)
open contact (fail-safe relay)/ green LED off

4.2 Example for a Fail-Safe monitoring of the PI with a PLC
Figure 20: Fail-Safe monitoring states
Fail-Safe monitoring states
Breakdown of PIF power supply
Cable break of fail-safe cable
Breakdown of PI power supply/ Interruption of USB cable
Interruption of cable PI-PIF
Malfunction of PIConnect software

Figure 21: Fail-Safe monitoring states
Fail-Safe monitoring states
Breakdown of PIF power supply
Cable break of fail-safe cable
Breakdown of PI power supply/ Interruption of USB cable
Short circuit of fail-safe cable
Malfunction of PIConnect software
Interruption of cable PI-PIF

4.3 USB cable extension
The maximum USB cable length is 20 m. For greater distances between PI and computer or for standalone solutions the optional PI NetBox or the USB Server Gigabit is provided:
Figure 22: Ethernet direct communication with PI Netbox
Figure 23: Ethernet network communication with PI Netbox

Figure 24: Stand-Alone operation with PI Netbox
Figure 25: USB Server Gigabit

5 Software PIConnect
5.1 Installation and initial start-up
Uninstall previous versions of the PI Connect before installing the new software. To
uninstall the software from your system use the Uninstall icon in the start menu.
A detailed description is provided in the software manual on the software CD.
Minimum system requirements:
• Windows Vista, Windows 7, Windows 8
• USB interface
• Hard disc with at least 30 MByte of free space
• At least 128 MByte RAM
• CD-ROM drive

1. Insert the installation CD into the according drive on your computer. If the autorun option is
activated the installation wizard will start automatically.
2. Otherwise start setup.exe from the CD-ROM. Follow the instructions of the wizard until the
installation is finished.
The installation wizard places a launch icon on the desktop and in the start menu:
Start\Programs\PIConnect
To uninstall the software from your system use the uninstall icon in the start menu.
1. To connect the camera to the PC, plug the USB cable to the camera first. Afterwards connect it
with the PC.
2. To disconnect the camera and the computer remove the USB cable from the computer first and
then disconnect it from the camera.
After the software has been started the live image from the camera is shown inside a window on your
PC screen.
3. Install the calibration data at first start of the software (supplied on the CD) .

Figure 26: Calibration data transfer
4. If necessary adjust the sharpness of the image by turning the exterior lens ring at the camera.

5.2 Software window
Figure 27: Software window

Icon for quick access to Image subtraction functio n
Icon enabling switching between color palettes
Temperature of measure area: Analyses the temperature according to the selected shape, e.g. average
temperature of the rectangle. The value is shown inside the IR image and the control displays
Alarm settings: Bar showing the defined temperature thresholds for low alarm value (blue arrow) and high
alarm value (red arrow). The color of numbers within control displays changes to red (when temperature above
the high alarm value) and to blue (when temperature below the low alarm value)
Control displays: Displays all temperature values in the defined measure areas like Cold Spots, Hot Spots,
temperature at cursor, internal temperature and chip temperature
Reference bar: Shows the scaling of temperature within the color palette
Histogram: Shows the statistic distribution of single tem perature values
Automatic/ manual scaling of the palette (displayed temperature range): Man., </> (min, max),
1σ : 1 Sigma, 3σ : 3 Sigma
Temperature profile: Shows the temperatures along max. 2 lines at any size and position in the image

5.2.1 Basis features of the software PIConnect
Extensive infrared camera software
• No restrictions in licensing
• Modern software with int uit i ve user interf ac e
• Remote control of camera via software
• Display of multiple camera images in different windows
• Compatible with Windows Vista, 7 and 8
High level of individualization for customer specific display
• Various language option including a translat ion too l
• Temperature display in °C or °F
• Different layout options for an individual setup (arrangement of
windows, toolbar)
• Range of individual measurement parameter fitting for each application
• Adaption of thermal image (mirror, rotate)
• Individual start options (full screen, hidden, etc.)

Video recording and snapshot function (IR o r BI-SPECTRAL)
• Recording of video sequences and detailed frames for further analysis
or documentation
• BI-SPECTRAL video analysis (IR and VIS) in order to highlight critical
temperatures
• Adjustment of recording frequency to reduce data volume
• Display of snapshot history for immediate analysis
Extensive online and offline data a nalysis
• Analysis supported by measurement fields, hot and cold spot
searching, image subtraction
• Real time temperature information within main window as digital or
graphic display (line profile, temperature time diagram)
• Slow motion repeat of radiometric files and analysis without camera
being connected
• Editing of sequences such as cutting and saving of individual images
• Various color palettes to highlight thermal contrasts

Automatic process control
• Individual setup of alarm levels depending on the process
• BI-SPECTRAL process monitoring (IR and VIS) for easy orientation at
point of measurement
• Definition of visual or acoustic alarms and analog data output
• Analog and digital signal input (process parameter)
• External communication of software via Comports and DLL
• Adjustment of thermal image via reference values
Temperature data analysis and documentation
• Triggered data collection
• Radiometric video sequences (*.ravi) radiometric snapshots (*.tiff)
• Text files including temp. information for analysis in Excel (*.csv, *.dat)
• Data with color information for standard programmes such as
Photoshop or Windows Media Player (*.avi, *.tiff)
• Data transfer in real time to other software programs DLL or Comport
interfaces

Basics of Infrared Thermometry
6 Basics of Infrared Thermometry
Depending on the temperature each object emits a certain amount of infrared radiation. A change in the
temperature of the object is accompanied by a change in the intensity of the radiation.
Searching for new optical material William Herschel by chance found the infrared radiation in 1800.
Figure 28: William Herschel (1738-1822)

He blackened the peak of a sensitive mercury thermometer. This thermometer, a glass prism that led sun
rays onto a table made his measuring arrangement. With this, he tested the heating of different colors of
the spectrum. Slowly moving the peak of the blackened thermometer through the colors of the spectrum,
he noticed the increasing temperature from violet to red. The temperature rose even more in the area
behind the red end of the spectrum. Finally he found the maximum temperature far behind the red area.
Nowadays this area is called “infrared wavelength area”.
Figure 29: The electromagnetic spectrum and the area used f or tempera t ure mea sur eme nt
For the measurement of “thermal radiation” infrared thermometry uses a wave-length ranging between
1 µ and 20 µm. The intensity of the emitted radiation depends on the material. This material contingent
constant is described with the help of the emissivity which is a known value for most materials
(see enclosed table emissivity).

Basics of Infrared Thermometry
Infrared thermometers are optoelectronic sensors. They calculate the surface temperature on the basis of
the emitted infrared radiation from an object. The most important feature of infrared thermometers is that
they enable the user to measure objects contactless. Consequently, these products help to measure the
temperature of inaccessible or moving objects without difficulties.
Figure 30: Main principle of noncontact thermometry
Infrared thermometers basically consist of the following components:
• Lens
• Spectral filter
• Detector
• Electronics(amplifier/ linearization/ signal processing)

The specifications of the lens decisively determine the optical path of the infrared thermometer, which is
characterized by the ratio Distance to Spot size. The spectral filter selects the wavelength range, which is
relevant for the temperature measurement. The detector in cooperation with the processing electronics
transforms the emitted infrared radiation into electrical signals.
The advantages of noncontact thermometry are clear - it supports:
• temperature measurements of moving or overheated
objects and of objects in hazardous surroundings
• very fast response and exposure times
• measurement without inter-reaction, no influence on the
• measuring object
• non-destructive measurement
• long lasting measurement, no mechanical wear

Basics of Infrared Thermometry
Figure 31: Non-contact thermometry

Process control extruding
manufacturing s olar
modules

7 Emissivity
7.1 Definition
The intensity of infrared radiation, which is emitted by each body, depends on the temperature as well as
on the radiation features of the surface material of the measuring object. The emissivity (ε – Epsilon) is
used as a material constant factor to describe the ability of the body to emit infrared energy. It can range
between 0 and 100 %. A “blackbody” is the ideal radiation source with an emissivity of 1.0 whereas a
mirror shows an emissivity of 0.1.
Figure 32: Capability of an object to em it radiation

Figure 33: Spectral emissivity of several materials: 1 Enamel, 2 Plaster, 3 Concrete, 4 Chamotte
If the emissivity chosen is too high, the infrared thermometer may display a temperature value which is
much lower than the real temperature – assuming the measuring object is warmer than its surroundings.
A low emissivity (reflective surfaces) carries the risk of inaccurate measuring results by interfering infrared
radiation emitted by background objects (flames, heating systems, chamottes). To minimize measuring
errors in such cases, the handling should be performed very carefully and the unit should be protected
against reflecting radiation sources.

7.2 Determination of unknown emissivity
► First determine the actual temperature of the measuring object with a thermocouple or contact sensor.
Second, measure the temperature with the infrared thermometer and modify the emissivity until the
displayed result corresponds to the actual temperature.
► If you monitor temperatures of up to 380 °C you may place a special plastic sticker (emissivity dots –
Part No.: ACLSED) onto the measuring object, which covers it completely.
Figure 34: Plastic sticker at metal surface

1. Set the emissivity to 0.95 and take the temperature of the sticker.
2. Afterwards, determine the temperature of the adjacent area on the measuring object and adjust
the emissivity according to the value of the temperature of the sticker.
3. Cove a part of the surface of the measuring object with a black, flat paint with an emissivity of
0.98. Adjust the emissivity of your infrared thermometer to 0.98 and take the temperature of the
colored surface.
Figure 35: Shiny metal surface left and blackened metal surface right
4. Afterwards, determine the temperature of a directly adjacent area and modify the emissivity until
the measured value corresponds to the temperature of the colored surface.
CAUTION: On all three methods the object temperature must be different from ambient temperature.

7.3 Characteristic emissi vity
In case none of the methods mentioned above help to determine the emissivity you may use the
emissivity table ►Appendix A and Appendix B. These are average values, only. The actual emissivity
of a material depends on the following factors:
• temperature
• measuring angle
• geometry of the surface
• thickness of the material
• constitution of the surface (polished, oxidized, rough, sandblast)
• spectral range of the measurement
• transmissivity (e.g. with thin films)
Figure 36: Adjustment of the emissivity in the software PI Connect (menu Configuration/ Device)

Appendix A – Table of emissivity for metals

Appendix B – Table of emissivity for non-metals

Appendix C – Quick start for serial communication
Introduction
One special feature of the PI Connect software contains the possibility to communicate via a serial
comport interface. This can be a physical comport or a Virtual Comport (VCP). It must be available on the
computer where the PI connect software is installed.
Setup of the interface
1. Open the Options dialog and enter the tab “Extended Communication” to enable the
software for the serial communication.
2. Select the mode “Comport” and choose the appropriate port.
3. Select the baud rate that matches the baud rate of the other communication device. The other
interface parameters are 8 data bits, no parity and one stop bit (8N1).
These parameters are used in many other communication devices too. The other station must support 8
bit data.
4. Connect the computer with the communication device. If this is a computer too, use a null modem
cable.

The command list is provided on the software CD. Every command must expire with

Interprocess communication (ICP)
Appendix D – Interprocess Communication (IPC)
The communication to the process imager device is handled by the PI Connect software (Imager.exe)
only. A dynamic link library (ImagerIPC2.dll) provides the interprocess communication (IPC) for other
attached processes. The DLL can be dynamically linked into the secondary application. Or it can be done
static by a lib file too. Both Imager.exe and ImagerIPC.dll are designed for Windows Vista/ 7/ 8
only. The application must support call-back functions.
The ImagerIPC.dll will export a bunch of functions that are responsible for initiating the
communication, retrieving data and setting some control parameters.
The description of the initialization procedure as well as the necessary command list is

Appendix E – PI Connect Resource Translator
PI Connect is a .Net Application. Therefore it is ready for localization. Localization as a Microsoft
idiom means a complete adaption of resources to a given culture. Learn more about the
internationalization topics consult Microsoft’s developer documentation on
http://msdn.microsoft.com/en-us/goglobal/bb688096.aspx
.
If desired the localization process can be illustrated in detail. Also the resizing of buttons or other visible
resources and the support of right-to-left-languages are supported. Ex perts who have the appropriate
tools should handle it. Nevertheless we have developed the small tool “Resource Translator” to
make the translation of the resources of the PI Connect application possible for everybody.
This tool helps to translate any visible text within the PI Connect application.
A detailed tutorial is provided on the CD.

Appendix F – Wiring diagrams PIF
Analog Output:
Figure 37: Analog output
For voltage measurements the minimum load impedance must be 10KOhm.
The analog output can be used as a digital output too. The voltage for “no alarm” and “alarm on” is
set within the software. The analog output (0 … 10 V) has a 100 Ohm resistor in series. With a maximum
current of 10 mA the voltage drop is 1 V.
To use an alarm LED with a forward voltage of 2 V the analog output value for “alarm on” must be 3 V
as maximum.

Digital Input:
Figure 38: Digital input
The digital input can be activated with a button to the PI GND-Pin or with a low level CMOS/TTL signal:
Low level 0…0.6 V; High level 2…24 V
Example Button:
Figure 39: Button

Analog input (usable voltage range: 0 … 10 V):
Figure 40: Analog input
Relay output at industrial PIF [Part No.: ACPIPIF500V2CBxx]
The analog output must be set to “Alarm”. The voltage level for AO1-AO3 can be set in the software
(no alarm: 0 V/ alarm: 2-10 V)
REL1-3 (DO1-DO3): U
max
= 30 VDC
I
max
= 400 mA

Figure 41: Relay output at industrial PIF

Appendix G – CE Conformity