ON Semiconductor TCC-202 User Manual

TCC-202
f
Two-Output PTIC Control IC
Introduction
TCC−202 is a two−output high−voltage digital to analog control IC specifically designed to control and bias ON Semiconductor’s Passive Tunable Integrated Circuits (PTICs).
These tunable capacitor control circuits are intended for use in mobile phones and dedicated RF tuning applications. The implementation of ON Semiconductor’s tunable circuits in mobile phones enables significant improvement in terms of antenna radiated performance.
The tunable capacitors are controlled through a bias voltage ranging from 1 V to 24 V. The TCC−202 high−voltage PTIC control IC has been specifically designed to cover this need, providing two independent high−voltage outputs that control up to two different tunable PTICs in parallel. The device is fully controlled through a MIPI interface.
Key Features
Controls ON Semiconductor’s PTIC Tunable Capacitors
Compliant with Timing Needs of Cellular and Other Wireless System
Requirements
Integrated Boost Converter with 2 Programmable DAC Outputs
(up to 24 V)
Low Power Consumption
MIPI−RFFE Interface
Compliant with MIPI 26 MHz Read−back
Available in WLCSP (RDL ball arrays)
This is a Pb−Free Device
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WLCSP12
CASE 567KZ
MARKING DIAGRAM
XXXX ALYW
G
A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information on page 21 o this data sheet.
Typical Applications
Multi−band, Multi−standard, Advanced and Simple Mobile Phones
Tunable Antenna Matching Networks
Compatible with Closed−loop and Open−loop Antenna Tuner
Applications
© Semiconductor Components Industries, LLC, 2016
September, 2016 − Rev. 3
1 Publication Order Number:
TCC−202/D
TCC−202
VDDA
GND
VIO
L_BOOST VHV
VIO
POR
Start
Reference
Interface
Level
Shifter
Booster
Registers
GND_BOOST
vio_on
ibias_start / vref_start
Level
Shifter
OTP
VREG
Regulator
4 bit
DAC
por_vreg
Bandgap
VREG
POR
7 bit
7
DAC
7 bit
7
DAC
RC
OSC
OUTA
OUTB
VIO VDDA VREG VHV
CLK DATA
Figure 1. Control IC Functional Block Diagram
ATEST
A4
B4
C4
A3
B3
C3
A2
B2
C2
Figure 2. Die Bump Side View
A1
B1
C1
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TCC−202
RDL Pin Out
Table 1. PAD DESCRIPTIONS
Bump RDL Name Type Description
A1 OUTB AOH High Voltage Output B A2 ATEST AO Analog Test Out (Note 1) A3 VHV AOH/AIH Boost High Voltage A4 L_BOOST AOH Boost Inductor B1 OUTA AOH High Voltage Output A B2 GNDA P Analog Ground B3 GND_BOOST P Ground for Booster B4 VIO Digital IO Supply C1 VREG AO Regulator Output C2 AVDD Analog Supply C3 DATA DIO MIPI RFFE Data C4 CLK DI MIPI RFFE Clock
1. To be grounded when not in use.
Legend: Pad Types
AIH = High Voltage Analog Input AO = Analog Input AOH = High Voltage Analog Input DI = Digital Input DIO = Digital Input/Output (IO) P = Power
ELECTRICAL PERFORMANCE SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Rating Unit
AVDD Analog Supply Voltage −0.3 to +6.0 V
VIO IO Reference Supply Voltage −0.3 to +2.5 V V
I/O
V
HVH
V
ESD (HBM)
V
ESD (MM)
T
STG
T
AMB_OP_MAX
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
Input Voltage Logic Lines (DATA, CLK, CS) −0.3 to VIO + 0.3 V VHV Maximum Voltage −0.3 to 30 V Human Body Model, JESD22−A114, All I/O 2,000 V Machine Model, JESD22−A115 200 V Storage Temperature −55 to +150 °C Max Operating Ambient Temperature without Damage +110 °C
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TCC−202
Table 3. RECOMENDED OPERATING CONDITIONS
Rating
Symbol Parameter
T
AMB_OP
T
J_OP
Operating Ambient Temperature −30 +85 °C Operating Junction Temperature −30 +125 °C
AVDD Analog Supply Voltage 2.3 5.5 V
VIO IO Reference Supply Voltage 1.62 1.98 V
Min Typ Max
Unit
Table 4. DC CHARACTERISTICS (T
= equivalent series load of 5.6 kW and 2.7 nF; CHV = 47 nF; L
R
LOAD
Symbol
Parameter Min Typ Max Unit Comment
= −30 to +85°C; V
A
SHUTDOWN MODE
I
AVDD
I
L_BOOST
I
BATT
I
VIO
I
CLK
I
DATA
AVDD Supply Current 1.5 mA L_BOOST Leakage 1.5 Battery Current 2.5 VIO Supply Current −1 1 CLK Leakage −1 1 DATA Leakage −1 1
ACTIVE MODE
I
BATT_SS0
I
BAT_SS2
I
BATT_SS16
I
L_BOOST_SS0
I
L_BOOST_SS2
I
L_BOOST_SS16
I
VIO_INACT
I
VIO_ACTIVE
V
VREG
Average battery current, 2 outputs @ 0 V steady state
Average battery current, 2 outputs @ 2 V steady state
Average battery current, 2 outputs @ 16 V steady state
Average inductor current, 2 outputs @ 0 V steady state
Average inductor current, 2 outputs @ 2 V steady state
Average inductor current, 2 outputs @ 16 V steady state
VIO average inactive current 3 VIO is high, no bus activity VIO average active current 250 VIO = 1.8 V, master sending
LOW POWER MODE
I
AVDD
I
L_BOOST
I
BATT
I
VIO
V
VREG
AVDD Supply Current 8 mA L_BOOST Leakage 6 Battery Current 14 I VIO Supply Current 3 No bus activity
= 15 V for each output; 2.3 V < AVDD < 5.5 V; 1.62 V < VIO < 1.98 V;
OUTX
= 15 mH; unless otherwise specified)
BOOST
VIO Supply is Low
380 750
mA
At VHV = 20 V
AVDD = 3.3 V
400 780 mA At VHV = 20 V AVDD = 3.3 V
510 870 At VHV = 20 V AVDD = 3.3 V
260 490 At VHV = 20 V AVDD = 3.3 V
280 510 At VHV = 20 V AVDD = 3.3 V
400 600 At VHV = 20 V AVDD = 3.3 V
data at 26 MHz
1.7 1.9 V No external load allowed
+ I
AVDD
L_BOOST
1.6 1.9 V No external load allowed
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TCC−202
Table 5. BOOST CONVERTER CHARACTERISTICS
(AVDD from 2.3 V to 5.5 V; VIO from 1.62 V to 1.98 V; TA = –30 to +85°C; CHV = 47 nF; L
Symbol
VHV_min Minimum programmable output volt-
Parameter Conditions Min Typ Max Unit
Active mode 13
age (average), DAC Boost = 0h
VHV_max Maximum programmable output volt-
Active mode 28
age (average), DAC Boost = Fh
Resolution Boost voltage resolution 4−bit DAC 1
I
L_BOOST_LIMIT
Inductor current limit 200 mA
Table 6. ANALOG OUTPUTS (OUT A, OUT B)
(AVDD from 2.3 V to 5.5 V; VIO from 1.62 V to 1.98 V; VHV = 26 V; TA = –30 to +85°C; Rload = unless otherwise specified)
Parameter
SHUTDOWN MODE
Z
OUT
OUT A, OUT B output impedance 7
ACTIVE MODE
V
OH
V
OL
Maximum output voltage 23.8 V DAC A, B = 7Fh,
Minimum output voltage 1 V DAC A, B = 01h, DAC
Slew Rate 3 10
R
PD
OUT A, OUT B set in pull−down mode
Resolution Voltage resolution (1−bit) 188 mV (1 LSB = 1−bit)
V
OFFSET
Zero scale, least squared best fit −1 +1 LSB
Error −3.0 +3.0 %V
DNL Differential non−linearity least
squared best fit
INL Integral non−linearity least squared
best fit
I
V
RIPPLE
SC
Over current protection 5 65 mA Any DAC output shorted to ground Output ripple with all outputs at
steady state
Description Min Typ Max Unit Comment
1000
−0.9 +0.9 LSB Over 2 V – 24 V VO range
−1 +1 LSB Over 2 V – 24 V VO range
40 mV RMS Over 2 V – 24 V for VHV = 23.5 V
= 15 mH; unless otherwise specified)
BOOST
MW
DAC disabled
DAC Boost = Fh, I
Boost = 0h to Fh, I
ms
W
2 V to 24 V step, measured at V
= 15.2 V,
OUT
R
= equivalent series load of
LOAD
2.7 kW and 5.6 nF, Turbo enabled DAC A, B = 00h, DAC Boost = 0h to
Fh, selected output(s) is disabled
OUT
Over 2 V – 24 V VO range
< 10 mA
OH
< 10 mA
OH
V
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TCC−202
THEORY OF OPERATION
Overview
The control IC outputs are directly controlled by programming the two DACs (DAC A and DAC B) through the digital interface.
The DAC stages are driven from a reference voltage, generating an analog output voltage driving a high−voltage amplifier supplied from the boost converter (see Figure 1 − Control IC Functional Block Diagram).
The control IC output voltages are scaled from 0 V to 24 V, with 128 steps of 188 mV (2x (24 / 255 V) =
0.188235 V). The nominal control IC output can be approximated to 188 mV x DAC value.
For performance optimization the boost output voltage (VHV) can be programmed to levels between 13 V and 28 V via the DAC_boost register (4 bits with 1 V steps). The startup default level for the boosted voltage is VHV = 24 V.
For proper operation and to avoid saturation of the output devices and noise issues it is recommended to operate the boosted VHV voltage at least 2 V above the highest programmed V
Operating Modes
voltage of any of the two outputs.
OUT
The following operating modes are available:
1. Shutdown Mode: All circuit blocks are off, the
DAC outputs are disabled and placed in high Z state and current consumption is limited to minimal leakage current. The shutdown mode is entered upon initial application of AVDD or upon VIO being placed in the low state. The contents of the registers are not maintained in shutdown mode.
2. Startup Mode: Startup is only a transitory mode.
Startup mode is entered upon a VIO high state. In
startup mode all registers are reset to their default states, the digital interface is functional, the boost converter is activated, outputs OUT A and OUT B are disabled and the DAC outputs are placed in a high Z state. Control software can request a full hardware and register reset of the TCC−202 by sending an appropriate PWR_MODE command to direct the chip from either the active mode or the low power mode to the startup mode. From the startup mode the device automatically proceeds to the active mode.
3. Active Mode: All blocks of the TCC−202 are
activated and the DAC outputs are fully controlled through the digital interface, DACs remain off until enabled. The DAC settings can be dynamically modified and the HV outputs will be adjusted according to the specified timing diagrams. Each DAC can be individually controlled and/or switched off according to application requirements. Active mode is automatically entered from the startup mode. Active mode can also be entered from the low power mode under control software command.
4. Low Power Mode: In low power mode the serial
interface stays enabled, the DAC outputs are disabled and are placed in a high Z state and the boost voltage circuit is disabled. Control software can request to enter the low power mode from the active mode by sending an appropriate PWR_MODE command. The contents of all registers are maintained in the low power mode.
VDDA = 0
Shutdown
VIO = LOW
(User Defined)
Battery insertion
VIO = HIGH
PWR_MODE =
VIO = LOW
PWR_MODE = 0b00
Low Power
PWR_MODE = 0b10
Figure 3. Modes of Operation
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Startup
(Registers reset)
0b01
PWR_MODE =
0b01
automatic
Active
(User Defined)
TCC−202
AVDD Power−On Reset (POR)
Upon application of AVDD the TCC−202 will be in shutdown mode. All circuit blocks are off and the chip draws only minimal leakage current.
VIO Power−On Reset and Startup Conditions
A high level on VIO places the chip in startup mode which provides a POR to the TCC−202. POR resets all registers to their default settings as described in T able 8. VIO POR also resets the serial interface circuitry . POR is not a brown−out detector and VIO needs to be brought back to a low level to enable the POR to trigger again.
Table 7. VIO POWER−ON RESET AND STARTUP
Default State for
Register
DAC Boost [1011] VHV = 24 V Power Mode [01]>[00] Transitions from shutdown to startup and then automatically to active mode DAC Enable [000000] V
DAC A Output in High−Z Mode DAC B Output in High−Z Mode
VIO POR
A, B Disabled
OUT
Comment
VIO Shutdown
A low level at any time on VIO places the chip in shutdown mode in which all circuit blocks are off. The contents of the
registers are not maintained in shutdown mode.
Table 8. VIO THRESHOLDS (AVDD from 2.3 V to 5.5 V; T
Parameter
VIORST VIO Low Threshold 0.2 V When VIO is lowered below this threshold level the
Description Min Typ Max Unit Comments
= –30 to +85°C unless otherwise specified)
A
chip is reset and placed into the shutdown state
Power Supply Sequencing
The AVDD input i s typically d irectly s upplied f rom t he b attery a nd t hus i s t he f irst o n. A fter AVDD is applied a nd b efore V IO is applied to the chip, all circuits are in the shutdown state and draw minimum leakage currents. Upon application of VIO, the chip automatically starts up using default settings and is placed in the active state waiting for a command via the serial interface.
Table 9. TIMING (AVDD from 2.3 V to 5.5 V; VIO from 1.62 V to 1.98 V; T
= 15 mH; VHV = 24 V; Turbo−Charge mode off unless otherwise specified; VDDA = 1.7 V)
Parameter
T
POR_VREG
T
BOOST_START
T
SD_TO_ACT
T
SET+
T
SET−
T
SET+
T
SET−
Internal bias settling time from shutdown to active mode 50 120 Time to charge CHV @ 80% of set VHV
(set to 24 V, V Startup time from shutdown to active mode 180 300 Output A, B positive settling time to within 5% of the
delta voltage, equivalent series load of 5.6 kW and 2.7 nF, V
Output A, B negative settling time to within 5% of the delta voltage, equivalent series load of 5.6 kW and 2.7 nF, V
Output A, B positive settling time with Turbo 35
Output A, B negative settling time with Turbo 35
from 2 V to 20 V; 0Bh (11d) to 55h (85d)
OUT
from 20 V to 2 V; 55h (85d) to 0Bh (11d)
OUT
Description Min Typ Max Unit Comments
= 2.7 V)
DDA
= –30 to +85°C; OUT A and OUT B; CHV = 47 nF; L
A
For info only For info only
Voltage settling time
connected on V
A, B
Voltage settling time
connected on V
A, B
Voltage settling time
connected on V
A, B
Voltage settling time
connected on V
A, B
130
50 60
50 60
ms ms
ms
ms
ms
ms
ms
BOOST
OUT
OUT
OUT
OUT
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TCC−202
Figure 5. Startup Timing Diagram
Figure 4. Output Settling Diagram
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