
NVMFS5A160PLZ
MOSFET – Power, Single
P-Channel
-60 V, -100 A, 7.7 mW
Features
www.onsemi.com
• Small Footprint (5 x 6 mm) for Compact Design
• Low R
• NVMFS5A160PLZWF: Wettable Flank Option for Enhanced Optical
Inspection
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
SPECIFICATION MAXIMUM RATINGS (T
noted) (Notes 1, 2, 3)
Symbol Parameter Value Unit
V
DSS
V
GS
I
D
P
D
I
D
P
D
I
DP
TJ, T
STG
I
S
E
AS
T
L
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Symbol Parameter Value Unit
R
q
JC
R
q
JA
1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular
conditions noted.
2. Surface mounted on FR4 board using a 650 mm
3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle.
to Minimize Conduction Losses
DS(on)
V
DSS
−60 V
= 25°C unless otherwise
J
G(4)
Drain to Source Voltage −60 V
Gate to Source Voltage ±20 V
Continuous Drain,
Current R
(Notes 1, 3)
Power Dissipation
R
q
JC
q
(Note 1)
JC
,
Steady
T
= 25°C −100 A
C
State
T
= 25°C 200 W
C
Continuous Drain:
Current R
(Notes 1, 2, 3)
Power Dissipation
R
Pulsed Drain
Current
(Note 1, 2)
q
JA
q
JA
Steady
State
PW ≤ 10 ms,
duty cycle ≤ 1%
Operating Junction and Storage Temperature −55 to
Source Current (Body Diode) −100 A
Single Pulse Drain to Source Avalanche Energy (L= 1.0 mH, I
L(pk)
= −26 A)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
= 25°C −15 A
A
T
= 25°C 3.8 W
A
−400 A
+175
335 mJ
260
°C
°C
XXXXXX = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
ORDERING INFORMATION
See detailed ordering and shipping information on page 7 of
this data sheet.
Junction to Case Steady State 0.75
Junction to Ambient Steady State (Note 3) 39
2
, 2 oz. Cu pad.
R
MAX ID MAX
DS(ON)
7.7 mW @ −10 V
−100 A
10.5 mW @ −4.5 V
D(5)
1:Source
2:Source
3:Source
4:Gate
5:Drain
S (1,2,3)
P-CHANNEL MOSFET
DFN5
(SO−8FL)
MARKING DIAGRAM
D
S
S
XXXXXX
S
AYW ZZ
G
D
5A160L(NVMFS5A160PLZ)
160LWF(NVMFS5A160PLZWF)
D
D
°C/W
© Semiconductor Components Industries, LLC, 2017
July, 2019 − Rev. 0
1 Publication Order Number:
NVMFS5A160PLZ/D

NVMFS5A160PLZ
ELECTRICAL CHARACTERISTICS (T
Symbol
Parameter Test Condition Min Typ Max Unit
= 25°C unless otherwise noted)
J
OFF CHARACTERISTICS
V
(BR)DSS
I
DSS
I
GSS
Drain to Source Breakdown Voltage
Zero Gate Voltage Drain Current VDS = −60 V, V
Gate to Source Leakage Current VGS = ±16 V, V
ID = −1 mA, VGS = 0 V −60
= 0 V
GS
= 0 V ±10
DS
TJ = 25°C −1.0
T
= 100°C
J
(Note 4)
−100
V
mA
mA
mA
ON CHARACTERISTICS (Note 5)
V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage VDS = −10 V, ID = −1mA −1.2 −2.6 V
Drain to Source On Resistance
VGS = −10 V ID = −50 A 5.8 7.7
VGS = −4.5 V ID = −50 A 7.3 10.5
mW
Forward Transconductance VDS = −10 V, ID = −50 A 119 S
CHARGES, CAPACITANCES & GATE RESISTANCE
V
= 0 V, f = 1 MHz
GS
= −20 V,
V
DS
V
= −10 V, I
GS
V
= −36 V,
DS
= −50 A
D
7700
pF
160
nC
Q
C
C
C
g(tot)
Q
Q
iss
oss
rss
gs
gd
Input Capacitance
Output Capacitance 720
Reverse Transfer Capacitance 540
Total Gate Charge
Gate to Source Charge 24
Gate to Drain Charge 45
SWITCHING CHARACTERISTICS (Note 6)
t
d(on)
t
d(off)
Turn-On Delay Time
t
Rise Time 690
r
Turn-Off Delay Time 645
t
Fall Time 643
f
VDS = −36 V, ID = −50 A,
V
= −10 V,
GS
= 50 W
R
G
50
ns
DRAIN-SOURCE DIODE CHARACTERISTICS
V
SD
t
Q
Forward Diode Voltage V
Reverse Recovery Time
rr
Reverse Recovery Charge 218 nC
rr
GS
V
GS
di/dt = 100 A/ms
= 0 V, I
= 0 V, I
= −50 A −0.83 −1.5 V
S
= −50 A
S
93 ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. The maximum value is specified by design at T
5. Pulse Test: pulse width ≤ 300ms, duty cycle ≤ 2%.
= 100 °C. Product is not tested to this condition in production.
J
6. Switching characteristics are independent of operating junction temperatures.
www.onsemi.com
2