The NV34C02WF is a EEPROM Serial 2−kb, internally organized
as 16 pages of 16 bytes each, for a total of 256 bytes of 8 bits each.
It features a 16−byte page write buffer and supports both the
Standard (100 kHz) as well as Fast (400 kHz) I
Write operations can be inhibited by taking the WP pin High (this
protects the entire memory) or by setting an internal Write Protect flag
via Software command (this protects the lower half of the memory).
In addition to Permanent Software Write Protection, the
NV34C02WF also features JEDEC compatible Reversible
Software Write Protection for DDR2 Serial Presence Detect (SPD)
applications operating over the 1.7 V to 3.6 V supply voltage range.
The NV34C02WF is fully backwards compatible with earlier
DDR1 SPD applications operating over the 1.7 V to 5.5 V supply
voltage range.
Features
• Supports Standard and Fast I
2
C Protocol
• 1.7 V to 5.5 V Supply Voltage Range
• 16−Byte Page Write Buffer
• Hardware Write Protection for Entire Memory
• Software Write Protection for Lower 128 Bytes
• Schmitt Triggers and Noise Suppression Filters on I
(SCL and SDA)
• Low power CMOS Technology
• 1,000,000 Program/Erase Cycles
• 100 Year Data Retention
• Automotive Grade 1 Temperature Range
• This Device is Pb−Free, Halogen Free/BFR Free and RoHS
Compliant*
V
CC
2
C protocol.
2
C Bus Inputs
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1
UDFN8
U SUFFIX
CASE 517DH
PIN CONFIGURATION
A
A
A
V
SS
1
0
1
2
US8 (U)
PART MARKING
1
XXXXX
AWLYWG
XXXXX = Specific Device Code
A= Assembly Location
WL= Wafer Lot
Y= Year
W= Work Week
G= Pb−Free Package
V
CC
WP
SCL
SDA
SCL
A2, A1, A
WP
0
NV34C02WF
V
SS
SDA
Figure 1. Functional Symbol
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
NV34C02WF/D
NV34C02WF
Table 1. ABSOLUTE MAXIMUM RATINGS
ParameterRatingUnit
Operating Temperature−45 to +130°C
Storage Temperature−65 to +150°C
Voltage on Any Pin with Respect to Ground (Note 1)−0.5 to +6.5V
Voltage on Pin A0 with Respect to Ground−0.5 to +10.5V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The DC input voltage on any pin should not be lower than −0.5 V or higher than V
undershoot to no less than −1.5 V or overshoot to no more than V
+ 1.5 V, for periods of less than 20 ns.
CC
Table 2. RELIABILITY CHARACTERISTICS (Note 2)
Symbol
N
(Note 3)Endurance1,000,000Program/ Erase Cycles
END
T
DR
Data Retention100Years
2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
3. Page Mode, V
= 5 V, 25°C
CC
ParameterMinUnits
+ 0.5 V. During transitions, the voltage on any pin may
CC
Table 3. D.C. OPERATING CHARACTERISTICS (V
Symbol
I
CC
I
SB
I
L
V
IL
V
IH
V
OL
ParameterTest ConditionsMinMaxUnits
Supply Current
VCC < 3.6 V, f
VCC > 3.6 V, f
Standby CurrentAll I/O Pins at GND or V
I/O Pin LeakagePin at GND or V
Input Low Voltage−0.50.3 x V
Input High Voltage0.7 x V
Output Low Voltage
VCC > 2.5 V, IOL = 3 mA0.4
= 1.7 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.)
CC
= 100 kHz1
SCL
= 400 kHz2
SCL
TA = −40°C to +125°C
CC
V
≤ 3.3 V
CC
TA = −40°C to +125°C
V
> 3.3 V
CC
CC
CCVCC
mA
1mA
3
2
mA
CC
+ 0.5
V
VCC < 2.5 V, IOL = 1 mA0.2
Table 4. PIN IMPEDANCE CHARACTERISTICS (V
= 1.7 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.)
CC
SymbolParameterConditionsMaxUnits
CIN (Note 4)
SDA I/O Pin Capacitance
VIN = 0 V, f = 1.0 MHz, VCC = 5.0 V
8
pF
Other Input Pins6
IWP (Note 5)WP Input Current
VIN < VIH, VCC = 5.5 V130mA
VIN < VIH, VCC = 3.6 V120
VIN < VIH, VCC = 1.7 V80
IA (Note 5)Address Input Current
(A0, A1, A2)
Product Rev H
VIN > V
IH
VIN < VIH, VCC = 5.5 V50mA
VIN < VIH, VCC = 3.6 V35
2
VIN < VIH, VCC = 1.7 V25
VIN > V
IH
2
4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
5. When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull-down is
relatively strong; therefore the external driver must be able to supply the pull-down current when attempting to drive the input HIGH. To
conserve power, as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x V
source.
), the strong pull-down reverts to a weak current
CC
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2
NV34C02WF
Table 5. A.C. CHARACTERISTICS (V
= 1.7 V to 5.5 V, TA = −40°C to +125°C)(Note 6)
CC
StandardFast
Symbol
F
SCL
t
HD:STA
t
LOW
t
HIGH
t
SU:STA
t
HD:DAT
t
SU:DAT
Parameter
Clock Frequency100400kHz
START Condition Hold Time40.6
Low Period of SCL Clock4.71.3
High Period of SCL Clock40.6
START Condition Setup Time4.70.6
Data Hold Time00
Data Setup Time250100ns
MinMaxMinMax
Units
ms
ms
ms
ms
ms
tR (Note 7)SDA and SCL Rise Time1000300ns
tF (Note 7)SDA and SCL Fall Time300300ns
t
SU:STO
t
BUF
t
AA
t
DH
STOP Condition Setup Time40.6
Bus Free Time Between STOP and START4.71.3
SCL Low to SDA Data Out3.50.9
ms
ms
ms
Data Out Hold Time100100ns
Ti (Note 7)Noise Pulse Filtered at SCL and SDA Inputs100100ns
t
SU:WP
t
HD:WP
t
WR
WP Setup Time00
WP Hold Time2.52.5
ms
ms
Write Cycle Time55ms
tPU (Notes 7 & 8)Power−up to Ready Mode11ms
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Test conditions according to “A.C. Test Conditions” table.
7. Tested initially and after a design or process change that affects this parameter.
is the delay between the time VCC is stable and the device is ready to accept commands.
9. All packages are RoHS−compliant (Lead−free, Halogen−free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
†
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3
NV34C02WF
Power−On Reset (POR)
The NV34C02WF incorporates Power−On Reset (POR)
circuitry which protects the internal logic against powering
up in the wrong state.
The NV34C02WF will power up into Standby mode after
V
exceeds the POR trigger level and will power down into
CC
Reset mode when V
drops below the POR trigger level.
CC
This bi−directional POR feature protects the device against
‘brown−out’ failure following a temporary loss of power.
Pin Description
SCL: The Serial Clock input pin accepts the Serial Clock
generated by the Master.
SDA: The Serial Data I/O pin receives input data and
transmits data stored in EEPROM. In transmit mode, this pin
is open drain. Data is acquired on the positive edge, and is
delivered on the negative edge of SCL.
A
, A1 and A2: The Address pins accept the device address.
0
These pins have on−chip pull−down resistors.
WP: The Write Protect input pin inhibits all write
operations, when pulled HIGH. This pin has an on−chip
pull−down resistor.
Functional Description
The NV34C02WF supports the Inter−Integrated Circuit
(I2C) Bus data transmission protocol, which defines a device
that sends data to the bus as a transmitter and a device
receiving data as a receiver. Data flow is controlled by a
Master device, which generates the serial clock and all
START and STOP conditions. The NV34C02WF acts as a
Slave device. Master and Slave alternate as either
transmitter or receiver. Up to 8 devices may be connected to
the bus as determined by the device address inputs A
and A
.
2
2
C Bus Protocol
I
two wires are connected to the V
2
The I
C bus consists of two ‘wires’, SCL and SDA. The
supply via pull−up
CC
, A1,
0
resistors. Master and Slave devices connect to the 2−wire
bus via their respective SCL and SDA pins. The transmitting
device pulls down the SDA line to ‘transmit’ a ‘0’ and
releases it to ‘transmit’ a ‘1’.
Data transfer may be initiated only when the bus is not
busy (see A.C. Characteristics).
During data transfer, the SDA line must remain stable
while the SCL line is HIGH. An SDA transition while SCL
is HIGH will be interpreted as a START or STOP condition
(Figure 2).
Start
The START condition precedes all commands. It consists
of a HIGH to LOW transition on SDA while SCL is HIGH.
The START acts as a ‘wake−up’ call to all receivers. Absent
a START, a Slave will not respond to commands.
Stop
The STOP condition completes all commands. It consists
of a LOW to HIGH transition on SDA while SCL is HIGH.
The STOP starts the internal Write cycle (when following a
Write command) or sends the Slave into standby mode
(when following a Read command).
Device Addressing
The Master initiates data transfer by creating a START
condition on the bus. The Master then broadcasts an 8−bit
serial Slave address. The first 4 bits of the Slave address are
set to 1010, for normal Read/Write operations (Figure 3).
The next 3 bits, A
devices. The last bit, R/W
, A1 and A0, select one of 8 possible Slave
2
, specifies whether a Read (1) or
Write (0) operation is to be performed.
Acknowledge
After processing the Slave address, the Slave responds
with an acknowledge (ACK) by pulling down the SDA line
th
during the 9
clock cycle (Figure 4). The Slave will also
acknowledge the byte address and every data byte presented
in Write mode. In Read mode the Slave shifts out a data byte,
and then releases the SDA line during the 9
th
clock cycle. If
the Master acknowledges the data, then the Slave continues
transmitting. The Master terminates the session by not
acknowledging the last data byte (NoACK) and by sending
a STOP to the Slave. Bus timing is illustrated in Figure 5.
SDA
SCL
START BIT
STOP BIT
Figure 2. Start/Stop Timing
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