ON Semiconductor NUF8152WU Technical data

NUF8152MU
8-Channel EMI Filter with Integrated ESD Protection
The NUF8152MU is a eight−channel (C−L−R−C) Pi−style EMI
This performance makes the part ideal for parallel interfaces with data rates up to 83 Mbps in applications where wireless interference must be minimized. The specified attenuation range is very effective in minimizing interference from 2G/3G, GPS, Bluetooth® and WLAN signals.
The NUF8152MU is available in the low−profile 16−lead 1.2 mm x
3.5 mm x 0.5 mm UDFN16 surface mount package.
Features/Benefits
±13 kV ESD Protection on each channel (IEC61000−42 Level 4,
Contact Discharge)
R/C Values of 28 and 17 pF and L = 1.0 nH Deliver Exceptional
S21 Performance Characteristics of 125 MHz f Band Attenuation from 800 MHz to 3.0 GHz
Integrated EMI/ESD System Solution in UDFN Package Offers
Exceptional Cost, System Reliability and Space Savings
This is a PbFree Device
Applications
EMI Filtering for LCD and Camera Data Lines
EMI Filtering and Protection for I/O Ports and Keypads
and 25 dB Stop
3dB
http://onsemi.com
http://onsemi.com
MARKING
16
1
UDFN16
CASE 517AF
815 = Specific Device Code M = Month Code G = Pb−Free Package
DIAGRAM
815 M
G
1
ORDERING INFORMATION
Device Package Shipping
NUF8152MUT2G UDFN16
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
3000 / Tape & Reel
Filter + ESD
n
L = 1 nH
C
= 17 pF C
d
See Table 1 for pin description
R = 28
= 17 pF
d
Figure 1. Electrical Schematic
© Semiconductor Components Industries, LLC, 2009
August, 2009 Rev. 1
Filter + ESD
0
-5
-10
-15
-20
n
-25
S21 (dB)
-30
-35
-40
-45
-50
1.0E + 6 10.0E + 6 100.0E + 6 1.0E + 9 10.0E + 9
FREQUENCY (Hz)
Figure 2. Typical Insertion Loss Characteristics
(S21 Measurement)
1 Publication Order Number:
NUF8152MU/D
NUF8152MU
Table 1. FUNCTIONAL PIN DESCRIPTION
Filter Device Pins Description
Filter 1 1 & 16 Filter + ESD Channel 1
Filter 2 2 & 15 Filter + ESD Channel 2
Filter 3 3 & 14 Filter + ESD Channel 3
Filter 4 4 & 13 Filter + ESD Channel 4
Filter 5 5 & 12 Filter + ESD Channel 5
Filter 6 6 & 11 Filter + ESD Channel 6
Filter 7 7 & 10 Filter + ESD Channel 7
Filter 8 8 & 9 Filter + ESD Channel 8
Ground Pad GND Ground
MAXIMUM RATINGS
Parameter Symbol Value Unit
ESD Discharge IEC61000−4−2 Contact Discharge V
Operating Temperature Range T
Storage Temperature Range T
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) T
PP
OP
STG
L
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
13 kV
40 to 85 °C
55 to 150 °C
260 °C
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
J
Parameter Symbol Test Conditions Min Typ Max Unit
Maximum Reverse Working Voltage V
Breakdown Voltage V
Leakage Current I
RWM
BR
R
IR = 1.0 mA 6.0 7.0 8.0 V
V
= 3.3 V 100 nA
RWM
5.0 V
Inductance L 1.0 3.0 nH
Resistance R
Diode Capacitance C
Line Capacitance C
3 dB CutOff Frequency (Note 1) f
6 dB CutOff Frequency f
3dB
6dB
A
d
L
VR = 2.5 V, f = 1.0 MHz 17 pF
VR = 2.5 V, f = 1.0 MHz 34 pF
Above this frequency,
appreciable attenuation occurs
Above this frequency,
appreciable attenuation occurs
28 36
125 MHz
210 MHz
1. 50 source and 50 load termination.
http://onsemi.com
2
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