ON Semiconductor NSR05301MX4 User Manual
Trench-based Schottky
Diode, 500 mA, 30 V
NSR05301MX4
These Schottky diodes are optimized for low forward voltage drop
and low leakage current that offers the most optimal power dissipation
in applications. They are housed in space saving micro−packaging
ideal for space constrained applications.
Features
• Smallest Package Available (01005); 0.445mm x 0.24mm
• 500 mA of Continuous Forward Current
• Low Forward Voltage Drop − 430 mV (Typical) @ I
• Low Reverse Current − 25 mA (Typical) @ V
R
• Low Reverse Recovery Time − 9 ns Typical
• Low Capacitance − 19 pF Typical
Typical Applications
• Mobile and Wearable Devices
• LED Boost Converters
• Buck and Boost dc−dc Converters
• Reverse Voltage and Current Protection
• Clamping & Protection
MAXIMUM RATINGS
Rating Symbol Value Unit
Forward Current (DC) I
Reverse Voltage V
Repetitive Peak Forward Current
(Pulse Wave = 1 sec, Duty Cycle = 66%)
ESD Rating: Human Body Model
Machine Model
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
F
R
I
FRM
ESD >8.0
F
= 30 V
500 mA
30 V
1.0 A
>400
= 200 mA
kV
V
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1
CATHODE
X4DFN2
CASE 718AA
D = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
NSR05301MX4T5G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Package
X4DFN2
(Pb−Free)
2
ANODE
MARKING
DIAGRAM
DM
Shipping†
10000 /
Tape & Reel
© Semiconductor Components Industries, LLC, 2017
October, 2020 − Rev. 1
1 Publication Order Number:
NSR05301/D
NSR05301MX4
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T
= 25°C
A
R
q
JA
P
D
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T
= 25°C
A
Junction Temperature Range T
Storage Temperature Range T
Lead Solder Temperature − Maximum (10 seconds) T
1. Mounted onto a 4 in2 FR−4 board 10 mm2 1 oz. Cu 0.06’ thick single−sided. Operating to steady state.
2. Mounted onto a 4 in
2
FR−4 board 2 cm2 1 oz. Cu 0.06’ thick single−sided. Operating to steady state.
R
q
P
STG
JA
D
J
L
614.9
203
239.4
522
−55 to +125 °C
−55 to +150 °C
260 °C
°C/W
mW
°C/W
mW
1000
D = 0.5
100
0.2
0.1
0.05
10
0.02
0.01
(°C/W)
1
0.1
0.01
R(t), TRANSIENT THERMAL RESPONSE
Single Pulse
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10
1000
D = 0.5
100
0.2
0.1
0.05
10
0.02
0.01
(°C/W)
1
100 10000.00000010.00000001
t, PULSE TIME (s)
Figure 1. Thermal Response (Note 1)
0.1
0.01
R(t), TRANSIENT THERMAL RESPONSE
Single Pulse
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10
100 10000.00000010.00000001
t, PULSE TIME (s)
Figure 2. Thermal Response (Note 2)
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