ON Semiconductor NRTS3060MFS User Manual

Schottky Barrier Rectifier Trench-based, High Performance
NRTS3060MFS
Features
Lower Forward Voltage Drop
Less Leakage Current in High Temperature
Small Junction Capacitance for High Switching Frequency
Higher Avalanche Energy Capability
175°C Operating Junction Temperature
Good Alternative Solution of SMC and DPAK Package
Small Footprint Land Area: 31.2 mm
Low Profile Maximum Height of 1.1 mm
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
2
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TRENCH SCHOTTKY
RECTIFIER
30 AMPERES
60 VOLTS
1,2,3
1
SO8 FLAT LEAD
CASE 488AA
STYLE 2
Not Used
5,6
MARKING DIAGRAM
A
A
A
C
T3060
AYWZZ
C
Mechanical Characteristics:
Case: Molded Epoxy
Epoxy Meets UL 94 V0 @ 0.125 in
Weight: 95 mg (Approximately)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
MSL 1
Applications
High Switching Frequency DC/DC Converter
nd
2
Rectifier
Freewheeling Diode used with Inductive Load
Oring / Reverse Protection
T3060 = Specific Device Code A = Assembly Location Y = Year W = Work Week ZZ = Lot Traceability
ORDERING INFORMATION
Device Package Shipping
NRTS3060MFST3G SO8 FL
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
5000 /
Tape & Reel
© Semiconductor Components Industries, LLC, 2021
January, 2021 Rev. 0
1 Publication Order Number:
NRTS3060MFS/D
NRTS3060MFS
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage
Continuous Forward Current (TC = 164°C, DC) I
Peak Repetitive Forward Current (TC = 162°C, Square Wave, Duty = 0.5) I
NonRepetitive Peak Surge Current
Sinusoidal Halfwave, 8.3 ms
Square wave, 1 ms 600
Square wave, 100 ms
NonRepetitive Avalanche Energy (TJ = 25°C) E
Storage Temperature Range T
Operating Junction Temperature Range (Note 1) T
ESD Rating (Human Body Model) 3B
ESD Rating (Machine Model) M4
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient dP
V
RRM
V
RWM
V
R
F(DC)
FRM
I
FSM
AS
stg
J
/dTJ < 1/R
D
60 V
30 A
60 A
350
1200
800 mJ
65 to +175 °C
55 to +175 °C
q
JA
A
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient (Note 2)
Thermal Resistance, JunctiontoCase Bottom (Note 2)
Thermal Characterization, JunctiontoCase Top (Note 2)
Thermal Characterization, JunctiontoLead of Cathode (Note 2)
R
q
JA
R
q
JCB
y
JCT
y
JLC
56 °C/W
0.65 °C/W
3.72 °C/W
1.44 °C/W
2. Assume 600 mm2, 1 oz. copper bond pad on a FR4 board.
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Typ Max Unit
Instantaneous Forward Voltage
= 15 A, TJ = 25°C)
(I
F
(I
= 15 A, TJ = 125°C)
F
(I
= 30 A, TJ = 25°C)
F
(I
= 30 A, TJ = 125°C)
F
Instantaneous Reverse Current
= Rated DC Voltage, TJ = 25°C)
(V
R
(V
= Rated DC Voltage, TJ = 125°C)
R
Junction Capacitance
= 1 V, TJ = 25°C, f = 1 MHz)
(V
R
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
V
F
I
R
C
J
0.48
0.40
0.53
0.48
17 10
0.60
0.57
100
30
V
mA
mA
pF
3140
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