Page 1
2-Input NAND Gate,
Open Drain Output
NL17SZ38
The NL17SZ38 is a single 2−Input NAND gate with open drain
output operating from a 1.65 V to 5.5 V supply.
Features
• Designed for 1.65 V to 5.5 V V
• 2.4 ns t
at VCC = 5 V (Typ)
PD
Operation
CC
• Inputs/Outputs Overvoltage Tolerant up to 5.5 V
• I
Supports Partial Power Down Protection
OFF
• Sink 32 mA at 4.5 V
• Available in SC−88, SC−74 and UDFN6 Packages
• Chip Complexity < 100 FETs
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
IEEC / IEC
A
B
Figure 1. Logic Symbol
&
Y
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SC−88A
DF SUFFIX
CASE 419A
SC−74A
DBV SUFFIX
CASE 318BQ
UDFN6
1
1.45 x 1.0
CASE 517AQ
UDFN6
1.0 x 1.0
CASE 517BX
X, XXX = Specific Device Code
M = Date Code*
G = Pb−Free Package
MARKING
DIAGRAMS
XXXMG
G
XXX MG
G
XM
X M
1
© Semiconductor Components Industries, LLC, 2019
October, 2020 − Rev. 1
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
1 Publication Order Number:
NL17SZ38/D
Page 2
NL17SZ38
B
1
OVT
A
2
GND Y
3
SC−88A / SC−74A UDFN6
5
4
Figure 2. Pinout (Top View)
PIN ASSIGNMENT (SC−88A/SC−74A)
Pin Function
1 B
2 A
3 GND
4 Y
5 V
CC
1
GND
B
2
A
3
V
CC
6
V
CC
5
NC
4
Y
PIN ASSIGNMENT (UDFN)
Pin Function
1 B
2 A
3 GND
4 Y
5 NC
6 V
CC
FUNCTION TABLE
Inputs Output
A B Y
L L Z
L H Z
H L Z
H H L
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2
Page 3
NL17SZ38
MAXIMUM RATINGS
Symbol Characteristics Value Unit
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
ICC or I
T
STG
T
L
T
J
q
JA
P
D
MSL Moisture Sensitivity Level 1 −
F
R
V
ESD
I
Latchup
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
DC Supply Voltage −0.5 to +6.5 V
DC Input Voltage −0.5 to +6.5 V
DC Output Voltage Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (V
CC
= 0 V)
−0.5 to VCC + 0.5
−0.5 to +6.5
−0.5 to +6.5
DC Input Diode Current VIN < GND −50 mA
DC Output Diode Current V
< GND −50 mA
OUT
DC Output Source/Sink Current ±50 mA
DC Supply Current per Supply Pin or Ground Pin ±100 mA
GND
Storage Temperature Range −65 to +150 °C
Lead Temperature, 1 mm from Case for 10 secs 260 °C
Junction Temperature Under Bias +150 °C
Thermal Resistance (Note 2) SC−88A
SC−74A
UDFN6
Power Dissipation in Still Air SC−88A
SC−74A
UDFN6
377
320
154
332
390
812
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in −
ESD Withstand Voltage (Note 3) Human Body Model
Charged Device Model
2000
1000
Latchup Performance (Note 4) $100 mA
V
°C/W
mW
V
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
V
V
V
OUT
T
t
r
CC
Positive DC Supply Voltage 1.65 5.5 V
DC Input Voltage 0 5.5
IN
DC Output Voltage Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (V
Operating Temperature Range −55 +125 °C
A
, t
Input Rise and Fall Time VCC = 1.65 V to 1.95 V
f
VCC = 2.3 V to 2.7 V
CC
= 0 V)
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
0
0
0
0
0
V
5.5
5.5
20
20
10
V
CC
ns
5
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
Page 4
NL17SZ38
DC ELECTRICAL CHARACTERISTICS
V
CC
Symbol Parameter Condition
V
V
High−Level Input
IH
Voltage
V
Low−Level Input
IL
Voltage
Low−Level Output
OL
Voltage
VIN = VIH or V
IOH = 100 mA
IOH = 4 mA
IOH = 8 mA
I
= 16 mA
OH
IOH = 24 mA
I
= 32 mA
OH
I
Input Leakage Current VIN = 5.5 V or GND 1.65 to 5.5 − − ±0.1 − ±1.0
IN
I
Power Off Leakage
OFF
Current
I
Quiescent Supply
CC
Current
I
3−State Output
OZ
Leakage Current
VIN = 5.5 V or
V
= 5.5 V
OUT
VIN = VCC or GND 5.5 − − 1.0 − 10
V
= 0 V to 5.5 V 1.65 to 5.5 − − ±0.5 − ±5.0
OUT
IL
(V)
1.65 to 1.95 0.65 V
2.3 to 5.5 0.70 V
1.65 to 1.95 − − 0.35 V
2.3 to 5.5 − − 0.30 V
1.65 to 5.5
1.65
2.3
3
3
4.5
0 − − 1.0 − 10
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TA = 255C −555C 3 TA 3 1255C
Min Typ Max Min Max
− − 0.65 V
CC
− − 0.70 V
CC
CC
CC
−
−
−
−
−
−
−
0.08
0.12
0.24
0.26
0.31
0.1
0.24
0.3
0.4
0.55
0.55
CC
CC
− 0.35 V
− 0.30 V
−
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.55
0.55
CC
CC
Units
V
V
V
mA
mA
mA
mA
AC ELECTRICAL CHARACTERISTICS
TA = +25°C TA = −40 to +85°C
Symbol Parameter Conditions V
t
PZL
Propagation Delay,
(A or B) to Y
(Figure 3, 4)
(V) Min Typ Max Min Max Unit
CC
1.65 to 1.95 − 6.5 12.7 − 13.2
2.3 to 2.7 − 3.5 7.0 − 7.5
3.0 to 3.6 − 2.8 5.0 − 5.2
4.5 to 5.5 − 2.8 5.0 − 5.2
t
PLZ
Propagation Delay,
(A or B) to Y
(Figure 3, 4)
1.65 to 1.95 − 5.5 12.7 − 13.2
2.3 to 2.7 − 3.0 7.0 − 7.5
3.0 to 3.6 − 2.1 6.0 − 5.2
4.5 to 5.5 − 1.3 4.3 − 4.5
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Units
C
C
C
5. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
no output loading and operating at 50% duty cycle. C
I
Input Capacitance VCC = 5.5 V, VIN = 0 V or V
IN
Output Capacitance VCC = 5.5 V, VIN = 0 V or V
OUT
Power Dissipation Capacitance
PD
(Note 5)
= (CPD) (VCC) (fIN) + (ICCstatic).
CCD
10 MHz, VCC = 5.5 V, VIN = 0 V or V
is related to I
PD
CC
CC
CC
dynamic operating current by the expression:
CCD
2.5 pF
4.0 pF
4.0 pF
CCD
ns
ns
) at
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4
Page 5
NL17SZ38
OPEN
2 x V
CC
R
1
DUT
R
T
R
L
CL includes probe and jig capacitance
R
is Z
T
of pulse generator (typically 50 W)
OUT
f = 1 MHz
Figure 3. Test Circuit
tr = 3 ns
90%
90%
INPUT
OUTPUT
OUTPUT
10%
t
PHL
t
PLH
V
mi
V
V
mo
V
mo
GND
CL*
OUTPUT
t
/ t
PLH
t
/ t
PLZ
t
/ t
PHZ
X = Don’t Care
Position
Open See AC Characteristics Table
PHL
2 x V
PZL
PZH
CC
GND 50 500 500
tf = 3 ns
V
Test Switch
CC
INPUT
mi
t
PLH
t
PHL
10%
V
V
mo
mo
GND
V
OH
V
OL
V
OH
OUTPUT
OUTPUT
t
PZL
t
PZH
V
mi
V
mo
V
mo
CL, pF
RL, W R1, W
50 500 500
V
mi
t
PLZ
VOL + V
t
PHZ
VOH − V
V
CC
GND
~V
V
OL
V
OH
CC
Y
Y
VCC, V Vmi, V
1.65 to 1.95 V
2.3 to 2.7 V
3.0 to 3.6 V
4.5 to 5.5 V
Figure 4. Switching Waveforms
/ 2 V
CC
/ 2 V
CC
/ 2 V
CC
/ 2 V
CC
V
OL
~0 V
Vmo, V
t
, t
PLH
PHL
/ 2 V
CC
/ 2 V
CC
/ 2 V
CC
/ 2 V
CC
t
PZL
, t
, t
PLZ
, t
PZH
PHZ
/ 2 0.15
CC
/ 2 0.15
CC
/ 2 0.3
CC
/ 2 0.3
CC
VY, V
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5
Page 6
NL17SZ38
†
DEVICE ORDERING INFORMATION
Pin 1 Orientation
Device Packages Specific Device Code
NL17SZ38DFT2G
(In Development)
NL17SZ38DBVT1G SC−74A AT Q4 3000 / Tape & Reel
NL17SZ38MU1TCG
(In Development)
NL17SZ38MU3TCG
(In Development)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
SC−88A TBD Q4 3000 / Tape & Reel
UDFN6, 1.45 x 1.0, 0.5P TBD Q4 3000 / Tape & Reel
UDFN6, 1.0 x 1.0, 0.35P TBD Q4 3000 / Tape & Reel
Pin 1 Orientation in Tape and Reel
(See below)
Shipping
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6
Page 7
NL17SZ38
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
G
45
D 5 PL
−B−
MM
B0.2 (0.008)
S
12 3
N
J
C
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
INCHES
DIMAMIN MAX MIN MAX
B 1.15 1.350.045 0.053
C 0.80 1.100.031 0.043
D 0.10 0.300.004 0.012
G 0.65 BSC0.026 BSC
H --- 0.10---0.004
J 0.10 0.250.004 0.010
K 0.10 0.300.004 0.012
N 0.20 REF0.008 REF
S 2.00 2.200.079 0.087
MILLIMETERS
1.80 2.200.071 0.087
H
K
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.40
0.0157
1.9
0.0748
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.025
mm
ǒ
inches
Ǔ
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7
Page 8
E1
B
A
54
123
D
TOP VIEW
SIDE VIEW
NL17SZ38
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
b
5X
0.20
C AB
E
0.05
A1
e
A
C
SEATING
PLANE
c
L
DETAIL A
DETAIL A
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
M
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
MILLIMETERS
DIM MIN MAX
A 0.90 1.10
A1 0.01 0.10
b 0.25 0.50
c 0.10 0.26
D
2.85 3.15
E 2.50 3.00
E1
1.35 1.65
e 0.95 BSC
L 0.20 0.60
M 0 10
__
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
8
Page 9
NL17SZ38
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
REFERENCE
6X
PIN ONE
0.10 C
0.10
0.05 C
0.05 C
DETAIL A
TOP VIEW
C
SIDE VIEW
e
1
BOTTOM VIEW
D
DETAIL B
A1
3
46
A
B
E
A
A2
C
L6X
b
6X
0.10 B
0.05ACC
L1
SEATING
PLANE
NOTE 3
L
DETAIL A
OPTIONAL
CONSTRUCTIONS
MOLD CMPDEXPOSED Cu
DETAIL B
OPTIONAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A2 0.07 REF
b 0.20 0.30
D 1.45 BSC
E 1.00 BSC
e 0.50 BSC
L 0.30 0.40
L1 −−− 0.15
MOUNTING FOOTPRINT
6X
PACKAGE
OUTLINE
6X
0.53
1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.30
1.24
0.50
PITCH
DIMENSIONS: MILLIMETERS
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9
Page 10
PIN ONE
REFERENCE
2X
2X
0.08 C
0.08
0.05 C
0.05 C
DETAIL A
C
TOP VIEW
DETAIL B
SIDE VIEW
e
1
NL17SZ38
PACKAGE DIMENSIONS
UDFN6, 1x1, 0.35P
CASE 517BX
ISSUE O
D
A B
E
A3
A
A1
C
SEATING
PLANE
L1
L3
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTION
DETAIL B
ALTERNATE
CONSTRUCTION
L
MOLD CMPDEXPOSED Cu
SOLDERING FOOTPRINT*
3
L6X
6X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
MILLIMETERS
DIM MIN MAX
A 0.50 0.65
A1 0.00 0.05
A3 0.13 REF
b 0.17 0.23
D 1.00 BSC
E 1.00 BSC
e 0.35
L 0.20 0.40
L1 −−− 0.15
L3 0.26 0.33
RECOMMENDED
0.25
6X
0.52
1.20
46
BOTTOM VIEW
6X
b
0.07 BC
0.05 C
OUTLINE
M
A
M
NOTE 3
1
0.35
PITCH
DIMENSION: MILLIMETERS
PACKAGE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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