Page 1
D-Type Flip-Flop with
Asynchronous Clear
NL17SZ175
The NL17SZ175 is a single, positive edge triggered, D−type CMOS
Flip−Flop with Asynchronous Clear operating from a 1.65 V to 5.5 V
supply.
Features
• Designed for 1.65 V to 5.5 V V
• 2.6 ns t
at VCC = 5 V (Typ)
PD
• Inputs/Outputs Overvoltage Tolerant up to 5.5 V
• I
Supports Partial Power Down Protection
OFF
• Sink 32 mA at 4.5 V
• Available in SC−88, SC−74 and UDFN6 Packages
• Chip Complexity < 100 FETs
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
C
CP
D
Operation
CC
IEEC / IEC
Q
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MARKING
DIAGRAMS
6
SC−88
CASE 419B−02
1
6
1
1
SC−74
CASE 318F−05
UDFN6
1.45 x 1.0
CASE 517AQ
1
XXXM
G
XXX MG
G
XM
G
Figure 1. Logic Symbol
UDFN6
1.0 x 1.0
CASE 517BX
X, XXX = Specific Device Code
M = Date Code*
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 7 of this data sheet.
X M
1
© Semiconductor Components Industries, LLC, 2019
February, 2021 − Rev. 1
1 Publication Order Number:
NL17SZ175/D
Page 2
Connection Diagrams
NL17SZ175
CP C
1
GND V
2
DQ
3
Figure 2. SC−88/SC−74 (Top View)
PIN DESCRIPTIONS
Pin Name Description
D Data Input
CP Clock Pulse Input
C Clear Input
Q Flip−Flop Output
CP
C
D Q
6
CP 1 6 C
5
CC
GND 2 5 V
4
D 3 4 Q
CC
Figure 3. UDFN6(Top Through View)
FUNCTION TABLE
Inputs Output
CP D C Q
L H L
H H H
X H Qn
X X L L
H = HIGH Logic Level Qn = No Change in Data
L = LOW Logic Level X = Immaterial
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2
Page 3
NL17SZ175
MAXIMUM RATINGS
Symbol Characteristics Value Unit
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
ICC or I
T
STG
T
L
T
J
q
JA
P
D
MSL Moisture Sensitivity Level 1 −
F
R
V
ESD
I
Latchup
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
DC Supply Voltage −0.5 to +6.5 V
DC Input Voltage −0.5 to +6.5 V
DC Output Voltage Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (V
CC
= 0 V)
−0.5 to VCC + 0.5
−0.5 to +6.5
−0.5 to +6.5
DC Input Diode Current VIN < GND −50 mA
DC Output Diode Current V
< GND −50 mA
OUT
DC Output Source/Sink Current ±50 mA
DC Supply Current per Supply Pin or Ground Pin ±100 mA
GND
Storage Temperature Range −65 to +150 °C
Lead Temperature, 1 mm from Case for 10 secs 260 °C
Junction Temperature Under Bias +150 °C
Thermal Resistance (Note 2) SC−88
SC−74
UDFN6
Power Dissipation in Still Air SC−88
SC−74
UDFN6
377
320
154
332
390
812
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in −
ESD Withstand Voltage (Note 3) Human Body Model
Charged Device Model
2000
1000
Latchup Performance (Note 4) $100 mA
V
°C/W
mW
V
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
V
V
V
OUT
T
t
r
CC
IN
A
, t
Positive DC Supply Voltage 1.65 5.5 V
DC Input Voltage 0 5.5
DC Output Voltage Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (V
CC
= 0 V)
0
0
0
V
5.5
5.5
Operating Temperature Range −55 +125 °C
Input Rise and Fall Time VCC = 1.65 V to 1.95 V
f
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
0
0
20
20
10
V
CC
ns
5
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
Page 4
NL17SZ175
DC ELECTRICAL CHARACTERISTICS
V
CC
Symbol Parameter Condition
V
V
High−Level Input
IH
Voltage
V
Low−Level Input
IL
Voltage
High−Level Output
OH
Voltage
VIN = VIH or V
IOH = −100 mA
IOH = −4 mA
IOH = −8 mA
I
= −16 mA
OH
IOH = −24 mA
I
= −32 mA
OH
V
I
Low−Level Output
OL
Voltage
I
Input Leakage Current VIN = 5.5 V or GND 1.65 to 5.5 − − ±0.1 − ±1.0
IN
Power Off Leakage
OFF
Current
I
Quiescent Supply
CC
Current
VIN = VIH or V
IOH = 100 mA
= 4 mA
I
OH
IOH = 8 mA
I
= 16 mA
OH
IOH = 24 mA
I
= 32 mA
OH
VIN = 5.5 V or
V
= 5.5 V
OUT
VIN = VCC or GND 5.5 − − 1.0 − 10
IL
IL
(V)
1.65 to 1.95 0.65 V
2.3 to 5.5 0.70 V
1.65 to 1.95 − − 0.35 V
2.3 to 5.5 − − 0.30 V
1.65 to 5.5
VCC − 0.1
1.65
2.3
3
3
4.5
1.65 to 5.5
1.65
2.3
3
3
4.5
0 − − 1.0 − 10
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TA = 255C −555C 3 TA 3 1255C
Min Typ Max Min Max
1.29
1.9
2.4
2.3
3.8
−
−
−
−
−
−
− − 0.65 V
CC
− − 0.70 V
CC
V
CC
1.52
2.1
2.7
2.5
4
−
0.08
0.12
0.24
0.26
0.31
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.55
0.55
CC
CC
CC
CC
− 0.35 V
− 0.30 V
VCC − 0.1
1.29
1.9
2.4
2.3
3.8
−
−
−
−
−
−
−
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.55
0.55
CC
CC
Units
V
V
V
V
mA
mA
mA
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4
Page 5
AC ELECTRICAL CHARACTERISTICS
Symbol Parameter V
t
PLH
f
MAX
t
t
PHL
t
t
t
rec
Maximum Clock Frequency
(Figure 4, 5)
, t
Propagation Delay, CP to Q
PHL
(Figure 4, 5)
Propagation Delay, C to Q
(Figure 4, 5)
Setup Time, CP to D
S
(Figure 4, 5)
Hold Time, CP to D
H
(Figure 4, 5)
Pulse Width, CP
W
(Figure 4, 5)
Pulse Width, C
(Figure 4, 5)
Recovery Time, C to CP
(Figure 4, 5)
NL17SZ175
TA = +25°C TA = −40 to +85°C
(V) Conditions
CC
C
1.65
1.8 − − − 100 −
= 50 pF,
L
= 500 W
R
L
2.3 to 2.7 − − − 125 −
3.0 to 3.6 − − − 150 −
4.5 to 5.5 − − − 175 −
C
1.65
1.8 − 6.5 10.0 − 11.0
= 15 pF,
L
= 1 MW
R
L
2.3 to 2.7 − 3.8 6.5 − 7.0
3.0 to 3.6 − 2.8 4.5 − 5.0
4.5 to 5.5 − 2.2 3.5 − 3.8
C
3.0 to 3.6
4.5 to 5.5 − 2.6 4.0 − 4.7
1.65
1.8 − 6.5 9.0 − 10.0
= 50 pF,
L
= 500 W
R
L
C
= 15 pF,
L
= 1 MW
R
L
2.3 to 2.7 − 3.8 6.0 − 6.4
3.0 to 3.6 − 2.8 4.3 − 4.6
4.5 to 5.5 − 2.2 3.2 − 3.5
C
3.0 to 3.6
4.5 to 5.5 − 2.7 4.0 − 4.5
2.3 to 2.7
3.0 to 3.6 − − − 2.0 −
= 50 pF,
L
= 500 W
R
L
C
= 50 pF,
L
= 500 W
R
L
4.5 to 5.5 − − − 1.5 −
C
2.3 to 2.7
3.0 to 3.6 − − − 1.5 −
= 50 pF,
L
= 500 W
R
L
4.5 to 5.5 − − − 1.5 −
C
2.3 to 2.7
3.0 to 3.6 − − − 2.8 −
= 50 pF,
L
= 500 W
R
L
4.5 to 5.5 − − − 2.5 −
2.3 to 2.7
3.0 to 3.6 − − − 2.8 −
4.5 to 5.5 − − − 2.5 −
2.3 to 2.7
3.0 to 3.6 − − − 1.0 −
Clock HIGH
or LOW
C
= 50 pF,
L
= 500 W
R
L
C
= 50 pF,
L
= 500 W
R
L
4.5 to 5.5 − − − 1.0 −
Min Typ Max Min Max Unit
− − − 100 −
− 9.8 15.0 − 16.5
− 3.4 5.5 − 6.2
− 9.8 13.5 − 15.0
− 3.4 5.3 − 5.8
− − − 2.5 −
− − − 1.5 −
− − − 3.0 −
− − − 3.0 −
− − − 1.0 −
MHz
ns
ns
ns
ns
ns
ns
ns
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5
Page 6
NL17SZ175
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Units
C
C
C
5. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
no output loading and operating at 50% duty cycle. CPD is related to I
I
CL includes probe and jig capacitance
R
f = 1 MHz
Input Capacitance VCC = 5.5 V, VIN = 0 V or V
IN
Output Capacitance VCC = 5.5 V, VIN = 0 V or V
OUT
Power Dissipation Capacitance
PD
(Note 5)
= (CPD) (VCC) (fIN) + (ICCstatic).
CCD
10 MHz, VCC = 5.5 V, VIN = 0 V or V
OPEN
T
2 x V
CC
DUT
R
T
is Z
of pulse generator (typically 50 W)
OUT
R
R
GND
1
OUTPUT
C
L
*
L
CC
CC
CC
dynamic operating current by the expression:
CCD
Test Switch
CL, pF
Position
t
PLH
t
t
PHZ
PLZ
/ t
/ t
/ t
Open See AC Characteristics Table
PHL
PZL
PZH
2 x V
CC
GND 50 500 500
50 500 500
X = Don’t Care
2.5 pF
4.0 pF
4.0 pF
CCD
RL, W R1, W
) at
Figure 4. Test Circuit
VCC, V Vmi, V
1.65 to 1.95 V
2.3 to 2.7 V
3.0 to 3.6 V
4.5 to 5.5 V
Figure 5. Switching Waveforms
/ 2 V
CC
/ 2 V
CC
/ 2 V
CC
/ 2 V
CC
Vmo, V
t
, t
PLH
PHL
/ 2 V
CC
/ 2 V
CC
/ 2 V
CC
/ 2 V
CC
t
PZL
, t
, t
PLZ
, t
PZH
PHZ
/ 2 0.15
CC
/ 2 0.15
CC
/ 2 0.3
CC
/ 2 0.3
CC
VY, V
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6
Page 7
NL17SZ175
DEVICE ORDERING INFORMATION
Pin 1 Orientation
Device Packages Specific Device Code
NL17SZ175DFT2G
(In Development)
NL17SZ175DBVT1G SC−74 AT Q4 3000 / Tape & Reel
NL17SZ175MU1TCG
(In Development)
NL17SZ175MU3TCG
(In Development)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
UDFN6, 1.45 x 1.0, 0.5P TBD Q4 3000 / Tape & Reel
UDFN6, 1.0 x 1.0, 0.35P TBD Q4 3000 / Tape & Reel
SC−88 TBD Q4 3000 / Tape & Reel
(See below)
Shipping
Pin 1 Orientation in Tape and Reel
†
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7
Page 8
NL17SZ175
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
2X
aaa H D
D
A
654
E
123
2X
bbb H
D
e
B
TOP VIEW
D
E1
2X 3 TIPS
6X
L2
aaa C
b
M
A2
Cddd
A-B D
DETAIL A
H
L
DETAIL A
GAGE
PLANE
A
6X
ccc
C
SIDE VIEW END VIEW
A1
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
MILLIMETERS
DIM MIN NOM MAX
A −−− −−− 1.10
A1 0.00 −−− 0.10
A2 0.70 0.90 1.00 0.027 0.035 0.039
b 0.15 0.20 0.25
C 0.08 0.15 0.22
D 1.80 2.00 2.20
E
2.00 2.10 2.20
E1 1.15 1.25 1.35
e 0.65 BSC
L 0.26 0.36 0.46
L2 0.15 BSC 0.006 BSC
aaa 0.15 0.006
bbb 0.30 0.012
ccc 0.10 0.004
ddd
c
0.10 0.004
INCHES
MIN NOM MAX
−−− −−− 0.043
0.000 −−− 0.004
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
0.078 0.082 0.086
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.30
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
6X
0.66
2.50
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8
Page 9
NL17SZ175
PACKAGE DIMENSIONS
SC−74
CASE 318F−05
ISSUE N
0.05 (0.002)
0.7
0.028
D
H
E
1
23
e
A1
SOLDERING FOOTPRINT*
0.094
1.9
0.074
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
456
E
b
q
A
c
L
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05.
DIMAMIN NOM MAX MIN
A1 0.01 0.06 0.10 0.001
b 0.25 0.37 0.50 0.010
c 0.10 0.18 0.26 0.004
D 2.90 3.00 3.10 0.114
E 1.30 1.50 1.70 0.051
e 0.85 0.95 1.05 0.034
L
H
E
q
MILLIMETERS
0.90 1.00 1.10 0.035
0.20 0.40 0.60 0.008
2.50 2.75 3.00 0.099 0.108 0.118
0° 10° 0° 10°
− −
INCHES
NOM MAX
0.039 0.043
0.002 0.004
0.015 0.020
0.007 0.010
0.118 0.122
0.059 0.067
0.037 0.041
0.016 0.024
0.95
0.037
0.95
0.037
1.0
0.039
SCALE 10:1
ǒ
inches
mm
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLE 1:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
STYLE 7:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 2:
PIN 1. NO CONNECTION
2. COLLECTOR
3. EMITTER
4. NO CONNECTION
5. COLLECTOR
6. BASE
STYLE 8:
PIN 1. EMITTER 1
2. BASE 2
3. COLLECTOR 2
4. EMITTER 2
5. BASE 1
6. COLLECTOR 1
STYLE 3:
PIN 1. EMITTER 1
2. BASE 1
3. COLLECTOR 2
4. EMITTER 2
5. BASE 2
6. COLLECTOR 1
STYLE 9:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 4:
PIN 1. COLLECTOR 2
2. EMITTER 1/EMITTER 2
3. COLLECTOR 1
4. EMITTER 3
5. BASE 1/BASE 2/COLLECTOR 3
6. BASE 3
STYLE 10:
PIN 1. ANODE/CATHODE
2. BASE
3. EMITTER
4. COLLECTOR
5. ANODE
6. CATHODE
STYLE 5:
PIN 1. CHANNEL 1
2. ANODE
3. CHANNEL 2
4. CHANNEL 3
5. CATHODE
6. CHANNEL 4
STYLE 11:
PIN 1. EMITTER
2. BASE
3. ANODE/CATHODE
4. ANODE
5. CATHODE
6. COLLECTOR
STYLE 6:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
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9
Page 10
NL17SZ175
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
REFERENCE
6X
PIN ONE
0.10 C
0.10
0.05 C
0.05 C
DETAIL A
D
TOP VIEW
C
SIDE VIEW
e
1
BOTTOM VIEW
DETAIL B
A1
3
46
A
B
E
A
A2
C
L6X
b
6X
0.10 B
0.05ACC
L1
SEATING
PLANE
NOTE 3
L
DETAIL A
OPTIONAL
CONSTRUCTIONS
MOLD CMPDEXPOSED Cu
DETAIL B
OPTIONAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A2 0.07 REF
b 0.20 0.30
D 1.45 BSC
E 1.00 BSC
e 0.50 BSC
L 0.30 0.40
L1 −−− 0.15
MOUNTING FOOTPRINT
6X
PACKAGE
OUTLINE
6X
0.53
1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.30
1.24
0.50
PITCH
DIMENSIONS: MILLIMETERS
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10
Page 11
NL17SZ175
PACKAGE DIMENSIONS
UDFN6, 1x1, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
2X
2X
0.10 C
0.10
0.05 C
0.05 C
C
TOP VIEW
SIDE VIEW
e
1
L1
BOTTOM VIEW
D
A B
E
A3
A
A1
C
SEATING
PLANE
L5X
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.12 0.22
D 1.00 BSC
E 1.00 BSC
e 0.35 BSC
L 0.25 0.35
L1 0.30 0.40
RECOMMENDED
SOLDERING FOOTPRINT*
5X
0.48
6X
0.22
1.18
46
b
6X
0.10 B
0.05ACC
M
M
NOTE 3
0.53
PKG
OUTLINE
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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