ON Semiconductor NL17SG32 User Manual

NL17SG32

Single 2-Input OR Gate

The NL17SG32 MiniGatet is an advanced high−speed CMOS

2−input OR gate in ultra−small footprint.

The NL17SG32 input structures provides protection when voltages

up to 4.6 V are applied.

Features

• Wide Operating V

• High Speed: t

• Low Power Dissipation: I

• 4.6 V Overvoltage Tolerant (OVT) Input Pins

• Ultra−Small Packages

• These are Pb−Free and Halide−Free Devices

1

IN A

2

GND

Range: 0.9 V to 3.6 V

CC

= 2.4 ns (Typ) at VCC = 3.0 V, CL = 15 pF

PD

= 0.5 mA (Max) at TA = 25°C

CC

5

V

CC

IN B

IN A

1

2

5

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MARKING

DIAGRAMS

SOT−953

P5 SUFFIX

1

V

CC

1

CASE 527AE

UDFN6

1.0 x 1.0

CASE 517BX

UDFN6

1.45 x 1.0

CASE 517AQ

SC−88A

DF SUFFIX

CASE 419A

1

3 M

P

6 M

M

AU M G

M

G

IN B

IN A

IN B

GND

4

OUT Y

1

2

3

SOT−953 SC−88A

UDFN6

GND

3

6

V

5

NC

OUT Y

4

Figure 1. Pinouts (Top View)

IN A

IN B

≥ 1

Figure 2. Logic Symbol

CC

OUT Y

4

OUT Y

M = Date Code* G = Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation and/or position may vary

depending upon manufacturing location.

PIN ASSIGNMENT

SOT−953 SC−88A UDFN6

1

2

3 IN B

4

5V

6

IN A

GND

OUT Y

CC

IN B

IN A

GND

OUT Y

V

CC

IN A

IN B

GND

OUT Y

NC

V

CC

FUNCTION TABLE

A Input Y Output

L

H

B Input

L

H

L

H

L

H

March, 2019 − Rev. 8

See detailed ordering and shipping information in the package

ORDERING INFORMATION

dimensions section on page 5 of this data sheet.

1 Publication Order Number:

NL17SG32/D

NL17SG32

MAXIMUM RATINGS

Symbol Parameter Value Unit

V

CC

V

OUT

I

IK

I

OK

I

OUT

I

CC

I

GND

T

STG

T

MSL Moisture Sensitivity Level 1

F

V

ESD

I

LATCHUP

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to EIA/JESD78.

DC Supply Voltage −0.5 to +5.5 V

DC Input Voltage −0.5 to +4.6 V

IN

DC Output Voltage Output at High or Low State

Power−Down Mode (V

CC

= 0 V)

−0.5 to V

−0.5 to +4.6

CC

DC Input Diode Current VIN < GND −20 mA

DC Output Diode Current V

< GND −20 mA

OUT

DC Output Source/Sink Current ±20 mA

DC Supply Current per Supply Pin ±20 mA

DC Ground Current per Ground Pin ±20 mA

Storage Temperature Range −65 to +150 °C

Lead Temperature, 1 mm from Case for 10 Seconds 260 °C

L

Junction Temperature Under Bias +150 °C

J

Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

R

ESD Withstand Voltage Human Body Model (Note 2)

Machine Model (Note 3)

>2000

>200

Latchup Performance Above VCC and Below GND at 125°C (Note 4) ±100 mA

+0.5

V

RECOMMENDED OPERATING CONDITIONS

Symbol Characteristics Min Max Unit

V

CC

V

OUT

T

Dt / DV

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.

Positive DC Supply Voltage 0.9 3.6 V

Digital Input Voltage 0.0 3.6 V

IN

Output Voltage Output at High or Low State

Power−Down Mode (V

Operating Temperature Range −55 +125 °C

A

CC

= 0 V)

0.0

Input Transition Rise or Fail Rate VCC = 3.3 V ± 0.3 V 0 10 ns/V

V

3.6

CC

V

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2

NL17SG32

DC ELECTRICAL CHARACTERISTICS

Symbol Parameter Conditions VCC (V)

V

OH

V

OL

I

IN

IH

IL

High-Level Input

Voltage

Low-Level Input

Voltage

High-Level

Output Voltage

Low-Level

Output Voltage

Input Leakage

Current

0.9 V

1.1 to 1.3 0.7xV

1.4 to 1.6 0.65xV

1.65 to 1.95 0.65xV

2.3 to 2.7 1.7 1.7

3.0 to 3.6 2.0 2.0

0.9 GND GND

1.1 to 1.3 0.3xV

1.4 to 1.6 0.35xV

1.65 to 1.95 0.35xV

2.3 to 2.7 0.7 0.7

3.0 to 3.6 0.8 0.8

VIN =

V

IH

V

IOH = −20 mA

or

IOH = -0.3 mA 1.1 to 1.3 0.75xV

IL

0.9 0.75 0.75

IOH = -1.7 mA 1.4 to 1.6 0.75xV

IOH = -3.0 mA 1.65 to 1.95 Vcc-0.45 Vcc-0.45

IOH = -4.0 mA 2.3 to 2.7 2.0 2.0

IOH = -8.0 mA 3.0 to 3.6 2.48 2.48

VIN =

V

IH

V

IOL = 20 mA

or

IOL = 1.1 mA 1.1 to 1.3 0.25xV

IL

0.9 to 3.6 0.1 0.1

IOL = 1.7 mA 1.4 to 1.6 0.25xV

IOL = 3.0 mA 1.65 to 1.95 0.45 0.45

IOL = 4.0 mA 2.3 to 2.7 0.4 0.4

IOL = 8.0 mA 3.0 to 3.6 0.4 0.4

0 ≤ VIN ≤ 3.6 V 0 to 3.6 $0.1 $1.0

TA = 255C

TA =

-555C to +1255C

Min Max Min Max

CC

V

CC

0.7xV

0.65xV

0.75xV

CC

0.3xV

0.35xV

CC

0.25xV

Unit

V

CC

V

CC

mA

I

CC

Quiescent

Supply Current

VIN = VCC or GND 3.6 0.5 10.0

mA

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

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3

NL17SG32

AC ELECTRICAL CHARACTERISTICS (Input t

Symbol Parameter Test Condition VCC (V)

r

= t

= 3.0 ns)

f

TA = 255 C

TA =

-555C to +1255C

Min Typ Max Min Max Unit

t

,

PLH

t

PHL

Propagation Delay,

A or B to Y

CL = 10 pF,

= 1 MW

R

L

0.9 - 12.2 14.4 - 18.0

1.1 to 1.3 - 8.8 12.4 - 16.2

ns

1.4 to 1.6 - 5.0 8.5 - 10.0

1.65 to 1.95 - 3.6 6.2 - 6.7

2.3 to 2.7 - 2.7 3.9 - 4.4

3.0 to 3.6 - 2.1 3.1 - 3.7

CL = 15 pF,

= 1 MW

R

L

0.9 - 13.0 16.0 - 18.0

1.1 to 1.3 - 7.8 12.0 - 16.0

ns

1.4 to 1.6 - 5.9 9.3 - 11.2

1.65 to 1.95 - 4.5 6.9 - 7.1

2.3 to 2.7 - 3.0 4.4 - 5.0

3.0 to 3.6 - 2.4 3.4 - 3.9

CL = 30 pF,

= 1 MW

R

L

0.9 - 14.0 17.2 - 20.0

1.1 to 1.3 - 11.0 14.1 - 17.8

ns

1.4 to 1.6 - 8.0 12.1 - 15.9

1.65 to 1.95 - 6.0 9.2 - 9.6

2.3 to 2.7 - 3.9 5.7 - 6.1

3.0 to 3.6 - 3.0 4.4 - 4.8

C

IN

C

PD

Input Capacitance 0 to 3.6 3 - - - pF

Power Dissipation

Capacitance (Note 5)

f = 10 MHz 0.9 to 3.6 - 4 - - - pF

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

5. C

PD

Average operating current can be obtained by the equation: I power consumption; P

= CPD  V

D

2

 fin + ICC  VCC.

CC

= CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic

)

CC(OPR

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4

NL17SG32

Input A or B

Output Y

50%

t

PLH

50% V

Figure 3. Switching Waveforms

V

CC

INPUT

*Includes all probe and jig capacitance.

A 1−MHz square input wave is recommended for propagation delay tests.

Figure 4. Test Circuit

CC

C

L*

50% V

CC

GND

t

PHL

V

OUTPUT

OH

OL

ORDERING INFORMATION

Device Package Shipping

NL17SG32P5T5G SOT−953

8000 / Tape & Reel

(Pb−Free)

NL17SG32DFT2G SC−88A

3000 / Tape & Reel

(Pb−Free)

NL17SG32AMUTCG UDFN6 1.45 x 1 mm

3000 / Tape & Reel

(Pb−Free)

NL17SG32CMUTCG UDFN6 1 x 1 mm

3000 / Tape & Reel

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

†

MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).

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5

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SC−88A (SC−70−5/SOT−353)

SCALE 2:1

CASE 419A−02

ISSUE L

DATE 17 JAN 2013

S

0.40

0.0157

A

G

45

12 3

D

5 PL

C

H

SOLDER FOOTPRINT

0.50

0.0197

−B−

MM

B0.2 (0.008)

N

K

0.65

0.025

0.65

0.025

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 419A−01 OBSOLETE. NEW STANDARD 419A−02.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.

INCHES

DIMAMIN MAX MIN MAX

B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC H --- 0.10---0.004 J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087

MILLIMETERS

1.80 2.200.071 0.087

J

GENERIC MARKING

DIAGRAM*

XXXMG

G

XXX = Specific Device Code M = Date Code G = Pb−Free Package

(Note: Microdot may be in either location)

*This information is generic. Please refer to

device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.

1.9

0.0748

STYLE 1:

PIN 1. BASE

2. EMITTER

3. BASE

4. COLLECTOR

5. COLLECTOR

STYLE 6:

PIN 1. EMITTER 2

2. BASE 2

3. EMITTER 1

4. COLLECTOR

5. COLLECTOR 2/BASE 1

DOCUMENT NUMBER:

DESCRIPTION:

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.

STYLE 2:

PIN 1. ANODE

2. EMITTER

3. BASE

4. COLLECTOR

5. CATHODE

STYLE 7:

PIN 1. BASE

2. EMITTER

3. BASE

4. COLLECTOR

5. COLLECTOR

98ASB42984B

SC−88A (SC−70−5/SOT−353)

SCALE 20:1

STYLE 3:

PIN 1. ANODE 1

STYLE 8:

PIN 1. CATHODE

mm

ǒ

Ǔ

inches

STYLE 4:

2. N/C

3. ANODE 2

4. CATHODE 2

5. CATHODE 1

2. COLLECTOR

3. N/C

4. BASE

5. EMITTER

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PIN 1. SOURCE 1

2. DRAIN 1/2

3. SOURCE 1

4. GATE 1

5. GATE 2

STYLE 9:

PIN 1. ANODE

2. CATHODE

3. ANODE

4. ANODE

5. ANODE

STYLE 5:

PIN 1. CATHODE

2. COMMON ANODE

3. CATHODE 2

4. CATHODE 3

5. CATHODE 4

Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment.

PAGE 1 OF 1

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MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

1

SCALE 4:1

UDFN6, 1.45x1.0, 0.5P

CASE 517AQ−01

ISSUE O

DATE 15 MAY 2008

REFERENCE

6X

PIN ONE

0.10 C

0.05 C

DETAIL A

D

TOP VIEW

DETAIL B

SIDE VIEW

e

1

46

BOTTOM VIEW

A1

3

A B

E

A

A2

C

L6X

b

6X

0.10 B

0.05ACC

L1

SEATING PLANE

NOTE 3

L

DETAIL A

OPTIONAL

CONSTRUCTIONS

MOLD CMPDEXPOSED Cu

DETAIL B

OPTIONAL

CONSTRUCTIONS

L

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55 A1 0.00 0.05 A2 0.07 REF

b 0.20 0.30 D 1.45 BSC E 1.00 BSC

e 0.50 BSC

L 0.30 0.40

L1 −−− 0.15

GENERIC

MARKING DIAGRAM*

XM

X = Specific Device Code M = Date Code

*This information is generic. Please refer to

device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present.

MOUNTING FOOTPRINT

6X

PACKAGE

OUTLINE

6X

0.53

1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

October, 2002 − Rev. 0

DESCRIPTION:

0.30

1.24

0.50

PITCH

DIMENSIONS: MILLIMETERS

98AON30313E

ON SEMICONDUCTOR STANDARD

http://onsemi.com

UDFN6, 1.45X1.0, 0.5P

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

Case Outline Number:

1

PAGE 1 OF 2

XXX

DOCUMENT NUMBER: 98AON30313E

PAGE 2 OF 2

ISSUE REVISION DATE

O RELEASED FOR PRODUCTION. REQ. BY K. VAN TYNE. 15 MAY 2008

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

May, 2008 − Rev. 01O

Case Outline Number:

517AQ

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SCALE 4:1

UDFN6, 1x1, 0.35P

CASE 517BX−01

ISSUE O

DATE 18 MAY 2011

PIN ONE

REFERENCE

2X

0.10 C

0.05 C

TOP VIEW

SIDE VIEW

e

1

L1

BOTTOM VIEW

D

A B

E

A3

A

A1

C

SEATING PLANE

L5X

3

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55 A1 0.00 0.05 A3 0.13 REF

b 0.12 0.22

D 1.00 BSC

E 1.00 BSC e 0.35 BSC L 0.25 0.35

L1 0.30 0.40

GENERIC

MARKING DIAGRAM*

X M

1

X = Specific Device Code M = Date Code

46

b

6X

M

0.10 B

M

0.05ACC

NOTE 3

*This information is generic. Please refer to

device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present.

RECOMMENDED

SOLDERING FOOTPRINT*

5X

0.48

6X

0.22

DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

October, 2002 − Rev. 0

DESCRIPTION:

98AON56787E

ON SEMICONDUCTOR STANDARD

UDFN6, 1X1, 0.35P

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com

1

1.18

0.53

PKG

OUTLINE

1

DIMENSIONS: MILLIMETERS

0.35

PITCH

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

Case Outline Number:

PAGE 1 OF 2

XXX

DOCUMENT NUMBER: 98AON56787E

PAGE 2 OF 2

ISSUE REVISION DATE

O RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA. 18 MAY 2011

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

Case Outline Number:

May, 2011 − Rev. 01O

517BX

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SCALE 4:1

X

Y

45

E

e

5X

L

PIN ONE INDICATOR

D

123

TOP VIEW

SOT−953

CASE 527AE

ISSUE E

A

C

SIDE VIEW

DATE 02 AUG 2011

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL.

H

E

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.

MILLIMETERS

DIM MIN NOM MAX

A 0.34 0.37 0.40 b 0.10 0.15 0.20 C 0.07 0.12 0.17 D 0.95 1.00 1.05 E 0.75 0.80 0.85 e 0.35 BSC

H

E

0.95 1.00 1.05

L L2 0.05 0.10 0.15 L3 −−− −−− 0.15

0.175 REF

5X

L3

5X

L2

BOTTOM VIEW

5X

b

X0.08 Y

SOLDERING FOOTPRINT*

5X

0.20

PACKAGE OUTLINE

1

0.35

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

0.35

1.20

GENERIC

MARKING DIAGRAM*

XM

1

X = Specific Device Code M = Month Code

*This information is generic. Please refer

to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present.

DOCUMENT NUMBER:

DESCRIPTION:

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.

98AON26457D

SOT−953

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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ON Semiconductor NL17SG32 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual