ON Semiconductor NCV8775C User Manual

NCV8775C

f

Ultra Low Iq 350 mA LDO Regulator with Reset

The NCV8775C is 350 mA LDO regulator with integrated reset functions dedicated for microprocessor applications. Its robustness allows NCV8775C to be used in severe automotive environments. Ultra low quiescent current as low as 19 mA typical makes it suitable for applications permanently connected to battery requiring ultra low quiescent current with or without load. This feature is especially critical when modules remain in active mode when ignition is off. The NCV8775C contains protection functions as current limit, thermal shutdown.

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MARKING

DIAGRAMS

Features

• Output Voltage Options: 3.3 V and 5 V

• Output Voltage Accuracy: ±2%

• Output Current up to 350 mA

• Ultra Low Quiescent Current: typ 19 mA (max 28 mA)

• Very Wide Range of C

and ESR Values for Stability

out

• Microprocessor Compatible Control Functions:

− Reset with Adjustable Delay

• Wide Input Voltage Operation Range: up to 40 V

• Protection Features

− Current Limitation

− Thermal Shutdown

• NCV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100 Grade 1 Qualified and PPAP Capable

• EMC Compliant

• These are Pb−Free Devices

Typical Applications

• Body Control Module

• Instruments and Clusters

• Occupant Protection and Comfort

• Powertrain

DPAK−5

DT SUFFIX

CASE 175AA

D2PAK−5

D5S SUFFIX

CASE 936A

xx = 50 (5.0 V Version)

= 33 (3.3 V Version)

A = Assembly Location WL, L = Wafer Lot Y = Year WW = Work Week G or G = Pb−Free Package

ORDERING INFORMATION

See detailed ordering and shipping information on page 12 o this data sheet.

775CxxG

ALYWW

NC

V8775Cxx

AWLYWWG

V

BAT

0.1 mF

C

D

47 nF

Figure 1. Typical Application Schematic

December, 2019 − Rev. 1

C

in

V

in

NCV8775C

D

GND

V

out

RO

V

out

C

out

10 mF

R

RO

5 kW

V

DD

Microprocessor

RESET

1 Publication Order Number:

NCV8775C/D

NCV8775C

PIN FUNCTION DESCRIPTION

Pin No.

Pin Name

Description

1

V

Positive Power Supply Input. Connect 0.1 mF capacitor to ground.

2ROReset (Open Collector) Output. External Pull−up resistor connected to V

.

3, TAB

GND

Power Supply Ground. Pin 3 internally connected to tab.

4DReset Delay. Timing capacitor to GND for Reset Delay function.

5

V

Regulated Output Voltage. Connect 10 mF capacitor with ESR < 5 W to ground.

V

GND

in

Thermal

Shutdown

V

RO

out

Driver

With

Current

Error Amplifier

Reset Comparator

Reset Driver

Limit

Reference

Delay

D

Timer

Figure 2. Simplified Block Diagram

PIN CONNECTIONS

PIN 1.V

in

2.RO

Tab, 3.GND

4.D

5.V

out

PIN 1.V

in

2.RO

Tab, 3.GND

4.D

5.V

out

DPAK−5

D2PAK−5

out

1

DPAK−5

D2PAK−5

Figure 3. Pin Connections

in

out

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2

NCV8775C

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Min

Max

Unit

Input Voltage (Note 1) DC

Vin−0.3

40

V

Input Voltage (Note 2) Load Dump − Suppressed

Us*−45

V

Output Voltage

V

−0.3

7

V

Reset Delay Voltage

VD−0.3

7

V

Reset Output Voltage

VRO−0.3

7

V

Junction Temperature

TJ−40

150

C

Storage Temperature

T

−55

150

C

ESD CAPABILITY (Note 3)

Rating

Symbol

Min

Max

Unit

ESD Capability, Human Body Model

ESD

−4

4

kV

ESD Capability, Charged Device Model

ESD

−1

1

kV

LEAD SOLDERING TEMPERATURE AND MSL (Note 4)

Rating

Symbol

Min

Max

Unit

Moisture Sensitivity Level DPAK−5

MSL

1

−

THERMAL CHARACTERISTICS (Note 5)

Rating

Symbol

Value

Unit

Thermal Characteristics, DPAK−5

C/W

Thermal Characteristics, D2PAK−5

C/W

RECOMMENDED OPERATING RANGE (Note 8)

Rating

Symbol

Min

Max

Unit

Input Voltage (Note 9)

Vin4.5

40

V

Junction Temperature

TJ−40

150

C

out

°

STG

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in production. Passed Class A according to ISO16750−1.

HBM CDM

3. This device series incorporates ESD protection and is tested by the following methods: ESD HBM tested per AEC−Q100−002 (JS−001−2017) Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes 2 x 2 mm due to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic defined in JEDEC JS−002−2018.

°

D2PAK−5

1

4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

°

Thermal Resistance, Junction−to−Air (Note 6) Thermal Reference, Junction−to−Lead (Note 6) Thermal Resistance, Junction−to−Air (Note 7) Thermal Reference, Junction−to−Lead (Note 7)

R

θJA

ψJL1

θJA

ψJL1

53.5

8.2

23.9

7.4

°

Thermal Resistance, Junction−to−Air (Note 6) Thermal Reference, Junction−to−Lead (Note 6) Thermal Resistance, Junction−to−Air (Note 7) Thermal Reference, Junction−to−Lead (Note 7)

R

θJA

ψJL1

θJA

ψJL1

53.3

7.6

23.7

6.9

5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

6. Values based on 1s0p board with copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3.

7. Values based on 2s2p board with copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness for inner layers, 2 oz copper thickness for signal layers and FR4 PCB substrate. 4 layers − according to JEDEC51.7.

°

8. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

9. Minimum Vin = 4.5 V or (V

+ VDO), whichever is higher.

out

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NCV8775C

ELECTRICAL CHARACTERISTICS V

= 13.5 V, Cin = 0.1 mF, C

= 10 mF, Min and Max values are valid for temperature range

Parameter

Test Conditions

Symbol

Min

Typ

Max

Unit

REGULATOR OUTPUT

Output Voltage (Accuracy %)

V V

A

V

Line Regulation

V V

Reg

−20020

mV

Load Regulation

I

= 0.1 mA to 350 mA

Reg

−351035

mV

Dropout Voltage (Note 12)

V

mV

QUIESCENT CURRENT

Quiescent Current (Iq = Iin − I

)

I

A

CURRENT LIMIT PROTECTION

Current Limit

V

= 0.96 x V

I

500−1100

mA

Short Circuit Current Limit

V

= 0 V

ISC500−1100

mA

PSRR

Power Supply Ripple Rejection (Note 13)

f = 100 Hz, 0.5 V

PSRR−80−dB

D (RESET DELAY)

Reset Charging Current

VD = 1.0 V

ID2.0

4.0

6.5

A

Upper Timing Threshold

VDU1.2

1.3

1.4

V

Reset Delay Time

CD = 47 nF

tRD101622

ms

Reset Reaction Time

tRR6.0

s

RESET OUTPUT RO

Input Voltage Reset Threshold

V

Vin decreasing, V

> V

V

Output Voltage Reset Threshold

V

decreasing

VRT909396

%V

Reset Hysteresis

VRH−

2.0−%V

Reset Output Low Voltage

V

> 1 V, RRO > 5 k

V

−

0.2

0.4

V

Reset High Level Leakage Current

I

−−5

A

THERMAL SHUTDOWN

Thermal Shutdown Temperature

TSD150

175

195°C

Thermal Shutdown Hysteresis

TSH−10−°C

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product per-

ty

in

out

−40°C ≤ TJ ≤ 150°C unless noted otherwise and are guaranteed by test, design or statistical correlation. Typical values are referenced to T

= 25°C (Notes 10 and 11)

J

out

DO

LIM

line

load

q

3.234

4.9

−

3.3

5.0

200 350

19

−

3.366

5.1

350 600

m

27 28

out

3.3

Vin = 4.5 V to 40 V, I

= 4.5 V to 16 V, I

V

in

V

5.0

3.3

5.0

5.0 VI

= 5.6 V to 40 V, I

in

V

= 5.975 V to 16 V, I

in

Vin = 4.5 V to 28 V, I Vin = 6 V to 28 V, I

out

= 200 mA

out

I

= 350 mA

out

I

= 0.1 mA, TJ = 25°C

out

I

= 0.1 mA, TJ ≤ 125°C

out

out out

= 0.1 mA to 200 mA

out

= 0.1 mA to 350 mA

out

= 0.1 mA to 200 mA

out

= 5 mA

out

= 5 mA

out

out_nom

= 0.1 mA to 350 m

pp

out

3.3

out

RT

W

in_RT

ROL

ROLK

− 3.8 4.2

(Note 13)

formance may not be indicated by the Electrical Characteristics if operated under different conditions.

10.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.

11.Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at T cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.

12.Measured when output voltage falls 100 mV below the regulated voltage at V

13.Values based on design and/or characterization.

= 13.5 V.

in

[ TJ. Low du

A

m

out out

m

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NCV8775C

TYPICAL CHARACTERISTICS

30

Vin = 13.5 V

28

I

= 100 mA

out

26

V

out(nom)

= 5.0 V

24 22 20 18 16 14

, QUIESCENT CURRENT (mA)

q

I

12 10

−40 −20 0 20 40 60 80 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C)

Figure 4. Quiescent Current vs. Junction

Temperature

800

I

= 100 mA

700 600 500 400

out

= 25°C

T

J

V

out(nom)

= 5.0 V

30

Vin = 13.5 V

28

I

= 100 mA

out

26

V

out(nom)

= 3.3 V

24 22 20 18 16 14

, QUIESCENT CURRENT (mA)

q

I

12 10

−40 −20 0 20 40 60 80 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C)

Figure 5. Quiescent Current vs. Junction

Temperature

800

I

= 100 mA

700 600 500 400

out

= 25°C

T

J

V

out(nom)

= 3.3 V

, QUIESCENT CURRENT (mA)

q

I

300 200 100

0

300 200

, QUIESCENT CURRENT (mA)

100

q

I

0

0 4 8 12 16 20 24 28 32 36 40 0 4 8 12 16 20 24 28 32 36 40

Vin, INPUT VOLTAGE (V)

Figure 6. Quiescent Current vs. Input Voltage

1200

1000

Vin = 13.5 V

out(nom)

= 5.0 V

V

TJ = −40°C

Figure 7. Quiescent Current vs. Input Voltage

1200

1000

Vin = 13.5 V V

out(nom)

Vin, INPUT VOLTAGE (V)

= 3.3 V

TJ = 25°C

TJ = −40°C

TJ = 25°C

800

600

TJ = 150°C

800

600

TJ = 150°C

400

200

, QUIESCENT CURRENT (mA)

q

I

0

0 50 100 150 200 250 300 350

I

, OUTPUT CURRENT (mA)

OUT

Figure 8. Quiescent Current vs. Output Current

400

200

, QUIESCENT CURRENT (mA)

q

I

0

0 50 100 150 200 250 300 350

I

, OUTPUT CURRENT (mA)

out

Figure 9. Quiescent Current vs. Output Current

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