ON Semiconductor NCV768 User Manual

NCV7683

s

Enhanced 100 mA Linear Current Regulator and Controller for Automotive Sequenced LED Lighting

The NCV7683 consists of eight linear programmable constant current sources. The part is designed for use in the regulation and control of LED based Rear Combination Lamps and blinking functions for automotive applications. System design with the NCV7683 allows for two programmed levels for stop (100% Duty Cycle) and tail illumination (programmable Duty Cycle), or an optional external PWM control can be implemented.

LED brightness levels are easily programmed (stop is programmed to the absolute current value, tail is programmed to the duty cycle) with two external resistors. The use of an optional external ballast FET allows for power distribution on designs requiring high currents. Set back power limit reduces the drive current during overvoltage conditions. This is most useful for low power applications when no external FET is used.

Sequencing functionality is activated, controlled, and programmed by individual pins. In addition to programming of the sequence interval, the device can sequence 8 individual output channels, 4 pairs of output channels, 2 quad output channels, or all 8 at once (for multi IC use at high currents).

Enhanced features of this device are a global enable function and display sequencing.

The device is available in a SSOP−24 package with exposed pad.

Features

• Constant Current Outputs for LED String Drive

• LED Drive Current up to 100 mA per Channel

• Open LED String Diagnostic with Open−Drain Output in All Modes

• Slew Rate Control Eliminates EMI Concerns

• Low Dropout Operation for Pre−Regulator Applications

• External Modulation Capable

• On−chip 800 Hz T ail PWM Dimming

• Single Resistor for Stop Current Set Point

• Single Resistor for Tail Dimming Set Point

• Overvoltage Set Back Power Limitation

• Improved EMC Performance

• Programmable Latch−Off function on Open String

♦ Restart Option of Unaffected Strings

• Over Temperature Fault Reporting

• Global Enable

• Display Sequencing

• SSOP−24 Fused Lead Package with Exposed Pad

• AEC−Q100 Qualified and PPAP Capable

• These are Pb−Free Devices

Applications

• Rear Combination Lamps (RCL)

• Daytime Running Lights (DRL)

• Fog Lights

• Center High Mounted Stop Lamps (CHMSL) Arrays

• Turn Signal and Other Externally Modulated Applications

• Signature Lamp

www.onsemi.com

MARKING DIAGRAM

NCV7683G

SSOP24 NB EP

CASE 940AP

NCV7683 = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

Device Package Shipping

NCV7683DQR2G SSOP24−EP

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD801 1/D.

AWLYYWW

2500 /

Tape & Reel

†

February, 2018 − Rev. 3

1 Publication Order Number:

NCV7683/D

ENABLE

200k

Output

Drive Control

NCV7683

VP

Timer Circuit

Timer

Programming Current

Vref

SEQTIME

SEQ1 SEQ2

SEQON

SEQOUT

VP

Ballast

Drive

FB

STOP

DIAG

200k

DIAG

Interface

EMC Filter

200K

1.8V

UVLO

− +

FET Drive

1V

CC

− +

Open Circuit Restart

SEQOUT

Open Load

Detection

Vreg

Over temperature &

Over voltage sense

Control Logic

I

RSTOP

V−I Converter

Current

Limit

8

Channel Control

Overvoltage

Soft Start,

Bias and

Reference

DIAG

Inverface

x 150

1

234567

CC

Channel

Control

Setback

Current

−20%

Output

Latch−Off

Oscillator

and PWM

2.2V

0.4V

50% IOUT

Open Load

Detect

Vreg

Irstop

− +

Rtail

1 of 8

Output

Current

Drive

LO

Out1 Out2 Out3 Out4 Out5 Out6 Out7 Out8

GND_Signal GND_DRV

LO

RSTOP

Figure 1. Block Diagram

Figure 2. Pinout Diagram

www.onsemi.com

2

RTAIL

ENABLE

NCV7683

TAIL

STOP

MRA4003T3G

R1 10K

C4 10nF

C1

0.68uF

R4, 3.01K

R5, 1.62K

R2

R3 1K

NTD2955

VP Ballast

Drive FB STOP

DIAG RSTOP

RTAIL

GND_Signal

GND_DRV

ENABLE SEQOUT SEQ1

SEQ2 SEQON SEQTIME LO

NCV7683

C2

0.22uF

OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7

OUT8

C3

100nF

V

STRING

Figure 3. Application Diagram with External FET Ballast Transistor

R6

9.53K

R7 1K

R6 and R7 values shown yield 10.5 V regulation on V

STRING

. C1 is for line noise and stability considerations. C3 is for EMC considerations. Unused OUTx channels should be shorted to ground as OUT7 shows in this example.

MRA4003T3G

TAIL

MRA4003T3G

STOP

R1 10K

C4 10nF

0.68uF

R4, 3.01K

R5, 1.62K

C1

VP

Ballast

Drive

FB

STOP

DIAG

RSTOP

RTAIL

GND_Signal

ENABLE SEQOUT SEQ1

SEQ2 SEQON SEQTIME LO

R2

NCV7683

100nF

OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8

GND_DRV

C3

V

STRING

Figure 4. Application Diagram without the FET Ballast Transistor

When using the NCV7683 without the FET ballast transistor, tie the FB pin and Ballast Drive pin to GND.

www.onsemi.com

3

NCV7683

Table 1. APPLICATION I/O TRUTH TABLE

STOP

EN SEQON

INPUT

1 X X X no OFF − 1 0 0 0 0 no OFF − 1 0 0 1 X no I 0 0 1 X no I 0 0 1 X yes OFF OPEN CIRCUIT*** 1 0 0 0 1 no PWM NORMAL 0 0 0 0 1 no PWM OPEN CIRCUIT*** PWM 0 1 X X no I 0 1 X X no I 0 1 X X yes OFF OPEN CIRCUIT*** 1

Reference Figures below.

X = don’t care 0 = LOW 1 = HIGH * Open Circuit, RSTOP Current Limit, Set Back Current Limit down 20%, and thermal shutdown **Pull−up resistor to DIAG and SEQOUT required. *** OPEN CIRCUIT = Any string or SEQOUT open.

TAIL

MODE

OUTx LATCH OFF

= GND)

(w/ LO

OUTX

CURRENT

STOP STOP

FAULT

STATE*

NORMAL 0

OPEN CIRCUIT*** 1

NORMAL 0

OPEN CIRCUIT*** 1

DIAG

STATE**

DIAG

Open String Occurs

on

OUTx

Current

off

on

OUTx

Current

off

Outputs with no open string.

Figure 5. DIAG timing diagram WITH

Open String Latch Active

All outputs latch off.

Open String Removed

on

Current

off

on

Current

off

DIAG

Open String Occurs

OUTx

Outputs with no open string.

Open String Removed

Figure 6. DIAG timing diagram WITHOUT

Open String Latch Active No outputs are turned off. DIAG will report the state.

www.onsemi.com

4

NCV7683

Sequencing_on

Sequence Programming Timing Diagrams

The four timing diagrams show the options available for sequencing of the 8 outputs dependent on the state of SEQ1 and SEQ2.

1. 8 individual sequence intervals.

2. 4 pairs of sequence intervals.

3. 2 quads of sequence intervals.

4. 1 single sequence interval.

ENABLE

OUT1

(current)

OUT2

(current)

OUT3

(current)

OUT4

(current)

OUT5

(current)

OUT6

(current)

OUT7

(current)

OUT8

(current)

SEQOUT

Figure 7. Sequencing Timing Diagram

Sequencing_on

ENABLE

OUT1

(current)

OUT2

(current)

OUT3

(current)

OUT4

(current)

OUT5

(current)

OUT6

(current)

OUT7

(current)

OUT8

(current)

SEQOUT

Figure 9. Sequencing Timing Diagram

Sequence Interval

Sequence

Sequence Time

(SEQ1 = 0, SEQ2 = 0)

Interval

Sequence Time

(SEQ1 = 0, SEQ2 = 1)

ENABLE

OUT1

(current)

OUT2

(current)

OUT3

(current)

OUT4

(current)

OUT5

(current)

OUT6

(current)

OUT7

(current)

OUT8

(current)

SEQOUT

Sequencing_on

ENABLE

OUT1

(current)

OUT2

(current)

OUT3

(current)

OUT4

(current)

OUT5

(current)

OUT6

(current)

OUT7

(current)

OUT8

(current)

SEQOUT

Sequence

Interval

Sequence Time

Figure 8. Sequencing Timing Diagram

(SEQ1 = 1, SEQ2 = 0)

Sequence Time

Figure 10. Sequencing Timing Diagram

(SEQ1 = 1, SEQ2 = 1)

The sequencing function is triggered by a logic level high to low signal on the ENABLE pin. 0=ground 1=floating

www.onsemi.com

5

NCV7683

Table 2. PIN FUNCTION DESCRIPTION

SSOP−24 Exposed

Pad Package

Pin # Label Description

1 DIAG Open−drain diagnostic output. Requires a pull−up resistor.

2 SEQ1 Grounding this pin changes the output sequencing.

3 SEQ2 Grounding this pin changes the output sequencing.

4 LO Latch Off. Ground this pin for latch off function. 5 RSTOP Stop current bias program resistor.

6 RTAIL Tail current duty cycle PWM program resistor.

7 SEQTIME Sequence Time program resistor.

8 OUT8 Channel 8 constant current output to LED.

9 OUT7 Channel 7 constant current output to LED.

10 OUT6 Channel 6 constant current output to LED.

11 OUT5 Channel 5 constant current output to LED.

12 GND_Signal Low Current Logic Ground. 13 GND_DRV High Current Driver Ground. Pin is fused to the epad. 14 OUT4 Channel 4 constant current output to LED.

15 OUT3 Channel 3 constant current output to LED.

16 OUT2 Channel 2 constant current output to LED.

17 OUT1 Channel 1 constant current output to LED.

18 SEQOUT Open−drain output. Requires a pull−up resistor. Follows ENABLE pin after delay of OUT8

19 SEQON High turns on 1−8 output sequencing. 20 ENABLE Global enable input. Low turns device on. 21 VP Supply voltage input. 22 Ballast Drive Gate drive for external power distribution PFET.

23 FB Feedback Sense node for VP regulation.

24 STOP Stop Logic Input. External Modulation Input when VP is high.

epad epad Ground. Do not connect to pcb traces other than GND.

Reporting Open Circuit, RSTOP Current Limit, Set Back Current Limit down 20%, and thermal shutdown. Normal Operation = LOW. Open Load reset input. Ground if not used (only if latchoff is not used).

Reference the sequencing section of the datasheet.

Referenced to ground (pin 12).

Referenced to ground (pin 12). Ground pin if using external modulation.

Referenced to ground (pin 12).

Unused pin should be grounded (pin 13).

with SEQON high.

Ground if not used.

Use feedback resistor divider or connect to GND.

www.onsemi.com

6

NCV7683

Table 3. MAXIMUM RATINGS (Voltages are with respect to device substrate.)

Rating

Supply Input (VP, Ballast Drive, STOP, DIAG, ENABLE, SEQON, SEQOUT)

DC

Peak Transient Output Pin Voltage (OUTX) −0.3 to 40 V Output Pin Current (OUTX) 200 mA DIAG Pin Current 10 mA Input Voltage (RTAIL, RSTOP, FB, SEQTIME, SEQ1, SEQ2, LO) −0.3 to 3.6 V Junction Temperature, T

J

Peak Reflow Soldering Temperature: Lead−free

60 to 150 seconds at 217°C (Note 1)

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

Table 4. ATTRIBUTES

Characteristic Value

ESD Capability

Human Body Model

Machine Model Moisture Sensitivity (Note 1) MSL3 Storage Temperature Package Thermal Resistance (Note 2)

SSOP24

Junction–to–Board, R

Junction–to–Ambient, R

Junction–to–Lead, R

1. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D, and Application Note AND8003/D.

2. Values represent typical still air steady−state thermal performance on 1 oz. copper FR4 PCB with 645 mm

q

JB

q

JA

q

JL

Value Unit

−0.3 to 40 40

−40 to 150 °C 260 peak °C

≥ ± 4.0 kV

≥ ± 200 V

−55 to 150°C

18°C/W 78°C/W 54°C/W

2

copper area.

V

www.onsemi.com

7