NCV7450V1GEVB
NCV7450 System Basis
Chip Evaluation Board
User's Manual
Introduction
This document describes the evaluation board for the
ON Semiconductor system basis chip (SBC) NCV7450, which
contains a CAN−FD transceiver, 5 V / 250 mA LDO regulator and HS
driver. The board provides basic connections for a device evaluation.
Evaluation Board Features
• One−row pin header providing access to all the device pins, enables
easy insertion of the evaluation board into a more complex
application setup
• Separated supply path for VS1 and VS2
• Standard CAN termination
• Position for optional ESD protection
• LED for RSTN signal activity indication
• Jumpers for enable signals
SCHEMATIC
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EVAL BOARD USER’S MANUAL
Figure 1. NCV7450V1GEVB Evaluation Board
© Semiconductor Components Industries, LLC, 2020
June, 2020 − Rev. 0
Figure 2. NCV7450 Evaluation Board Schematic
1 Publication Order Number:
EVBUM2737/D
NCV7450V1GEVB
Table 1. ABSOLUTE MAXIMUM RATINGS
Rating Pins Min Max Unit
Battery supply voltage Vbat1, Vbat2 −40 40 V
LDO Regulator output voltage VR1 −0.3 6 or VS1 + 0.5 V
Digital inputs/outputs voltage TxDC, RxDC, EN_WD, EN_CAN,
EN_HS, HS_DIAG, WDI, RSTN
CAN bus line voltage CANH, CANL −40 40 V
HS Driver output voltage HS
− with Cbuf2
− without Cbuf2
NCV7450 junction temperature −40 +150
Board temperature −40 +125
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
−0.3 VR1 + 0.3 V V
−0.3
−0.3
(whichever is lower)
Vbat2
40
Table 2. RECOMMENDED BOARD OPERATING CONDITIONS
Rating Pins Min Max Unit
Battery supply voltage Vbat1, Vbat2 6 18 V
LDO Regulator output current
(thermally limited)
Digital inputs/outputs voltage TxDC, RxDC, EN_WD, EN_CAN,
EN_HS, HS_DIAG, WDI, RSTN
CAN bus line voltage CANH, CANL 0 5 V
HS Driver output voltage HS 0 VS2 V
HS Driver output current HS 0 1.7 A
NCV7450 junction temperature −40 +150
Board temperature −40 +125
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
VR1 −0.1 250 mA
0 5 V
V
V
V
°C
°C
°C
°C
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