The NCV7361A consists of a low drop voltage regulator,
5.0 V/50 mA and a LIN bus transceiver. The LIN transceiver is
suitable for LIN bus systems compatible to
“LIN−Protocol Specification” Rev. 1.3, 2.0 and SAE J2602.
The combination of voltage regulator and bus transceiver make it
ideal for a powerful and inexpensive cost effective slave node in a
LIN Bus system.
Features
• Operating Voltage V
• Very Low Standby Current Consumption < 110 A in Normal Mode
(< 50 A in Sleep Mode)
• LIN−Bus Transceiver:
♦ PNP−Bipolar Transistor Driver
♦ Slew Rate Control and Wave Shaping for Best EMC Behavior
♦ BUS Input Voltage −24 V to 30 V (Independent of V
♦ Wake−Up Via LIN Bus
♦ Baud Rate up to 20 kBaud
♦ Compatible to LIN Specification 1.3, 2.0 and SAE J2602
♦ Compatible to ISO9141 Functions
• Wake−Up by LIN BUS and Startup Capable Independent of EN
Voltage Level
• Linear Low Drop Voltage Regulator:
♦ Output Voltage 5.0 V 2%
♦ Output Current Max. 50 mA
♦ Output Current Limit
♦ Overtemperature Shutdown
• Reset Time 100 ms and Reset Threshold Voltage 4.65 V
• CMOS Compatible Interface to Microcontroller
• Load Dump Protected (40 V Peak)
• Resistant Against Transient Pulses According to ISO 7637 at
Pin V
, BUS and EN
SUP
• NCV Prefix for Automotive and Other Applications Requiring Site
and Change Control
= 5.5 to 18 V
SUP
SUP
)
http://onsemi.com
MARKING
DIAGRAM
8
8
1
V
SUP
EN
GND
BUS
ORDERING INFORMATION
DevicePackageShipping
NCV7361ADSO−898 Units/Rail
NCV7361ADR2SO−82500 T ape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SO−8
D SUFFIX
CASE 751
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
PIN CONNECTIONS
18
2
3
4
(Top View)
7
6
5
7361A
ALYW
1
V
OUT
RESET
TxD
RxD
†
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
Semiconductor Components Industries, LLC, 2004
October, 2004 − Rev. P0
1Publication Order Number:
NCV7361A/D
NCV7361A
V
SUP
EN
GND
BUS
Bandgap
Adjustment
V
SUP
Aux.
Supply
30 k
VBG
Mode
Control
Thermal
Protection
Slew Rate
Control
Amplifier
+
−
Receiver
Control
T
SHD
Current
Limitation
I
VAUX
POR
UVR
Wake−Up
Control
Wake−
Filter
Rec−Filter
Driver
Control
V
OUT
MR
Reset
Generator
V
SUP
4.65 V
V
OUT
RESET
Reset
Timer
V
OSC
OUT
RxD
V
OUT
T
SHD
MR
Filter
TxD
MR= Master Reset
T
= Thermal Shutdown
SHD
VBG = Bandgap V oltage
Figure 1. Block Diagram
P ACKAGE PIN DESCRIPTION
PinSymbolDescription
1V
SUP
2ENEnable input controls the regulator. Active high.
3GNDGround
4BUSLIN bus line.
5RxDReceive output (push−pull to V
6TxDTransmit input (pullup−input to V
7RESETReset output, active low (pullup to V
8V
OUT
Supply voltage.
Regulator output 5.0 V/50 mA.
OUT
OUT
).
).
OUT
).
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2
NCV7361A
ELECTRICAL SPECIFICATIONS
All voltages are referenced to ground (GND). Positive
currents flow into the IC.
The maximum ratings (in accordance with IEC 134)
given in the table below are limiting values that do not lead
these limits may do so. Long term exposure to limiting
values may affect the reliability of the device. Correct
operating of the device can’t be guaranteed if any of these
limits are exceeded.
to a permanent damage of the device but exceeding any of
ESD Capability TxD PinESD
ESD Capability on All Other PinsESD
Junction TemperatureT
Storage TemperatureT
Lead Temperature Soldering
Reflow: (SMD styles only)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values
(not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage
may occur and reliability may be affected.
V
SUP
BUS
V
SUP−VOUT
INEN
IN
IN
I
INSH
BUSHB
J
STG
T
sld
−−1.030V
T 500 ms−40
−−2430V
T 500 ms−40
−−0.340V
−−0.3V
−−0.3V
−−2525mA
−−500500mA
Human Body Model, 100 pF via 1.5 k−1.01.0kV
Human Body Model, 100 pF via 1.5 k−2.02.0kV
HB
−−150°C
−−55150°C
60 second maximum above 183°C
−5°C/+0°C allowable conditions
5.2518V
−40+125°C
−+150°C
+
SUP
0.3
+
OUT
0.3
−240 peak°C
V
V
THERMAL RATINGS
ParameterTest Conditions Typical ValueUnits
SO−8 PackageMin−Pad Board (Note 1)1.0 in Pad Board (Note 2)
(Note 7)
BUS Input Current (Recessive)−I
BUS Input Current (Recessive)−I
BUS Pullup ResistorR
BUS Output Voltage (Dominant)
(Note 7)
BUS Output Voltage (Recessive)
thr_rec
V
thr_dom
V
thr_cnt
V
thr_hys
I
INBUSR
INBUSR
INBUSR
BUSpu
V
BUSdom
V
BUSrec
,
V
SUP
7.0 V V
8.0 V
= V
V
SUP
V
SUP
BUS
= 0 V , V
= Open, V
18 V
SUP
18 V,
BUS
− 0.7 V, TxD = 4.5 V
= −12 V−1.0−−mA
BUS
= −18 V−1.0−−mA
BUS
0.4 *V
0.475
*V
SUP
0.12 *V
SUP
SUP
−0.6
0.5
*V
SUP
0.135
*V
SUP
*V
SUP
0.525
*V
SUP
0.15
*V
SUP
−−20A
V
−203047k
7.0 V
7.0 V
18 V, TxD = 0 V ,
SUP
RL = 500
18 V, TxD = 4.5 V0.8 *V
SUP
−−1.2V
SUP
−−V
(Notes 7 and 8)
BUS Current LimitI
LIM
V
> 2.5 V, TxD = 0 V40−120mA
BUS
TxD
Pullup ResistanceR
pu_TxD
Input Low LevelV
Input High LevelV
IL
IH
−9.51521k
−−−1.25V
−3.75−−V
RxD
Output Voltage LowV
Output Voltage HighV
OL
OH
I
= 1.0 mA−−0.8V
OUT
I
= −1.0 mA4.2−−V
OUT
7. See Figures 7, 8, and 9 for test setup.
8. The recessive voltage on BUS should be less than 80% direct battery. The LIN protocol requires an external reverse battery diode between
the battery and V