ON Semiconductor NCV7356 Technical data

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NCV7356

Single Wire CAN Transceiver

The NCV7356 is a physical layer device for a single wire data link capable of operating with various Carrier Sense Multiple Access with Collision Resolution (CSMA/CR) protocols such as the Bosch Controller Area Network (CAN) version 2.0. This serial data link network is intended for use in applications where high data rate is not required and a lower data rate can achieve cost reductions in both the physical media components and in the microprocessor and/or dedicated logic devices which use the network.

The network shall be able to operate in either the normal data rate mode or a high−speed data download mode for assembly line and service data transfer operations. The high−speed mode is only intended to be operational when the bus is attached to an off−board service node. This node shall provide temporary bus electrical loads which facilitate higher speed operation. Such temporary loads should be removed when not performing download operations.

The bit rate for normal communications is typically 33 kbit/s, for high−speed transmissions like described above a typical bit rate of 83 kbit/s is recommended. The NCV7356 is designed in accordance to the Single Wire CAN Physical Layer Specification GMW3089 V2.4 and supports many additional features like undervoltage lockout, timeout for faulty blocked input signals, output blanking time in case of bus ringing and a very low sleep mode current.

Features

• Fully Compatible with J2411 Single Wire CAN Specification

• 60 mA (max) Sleep Mode Current

• Operating Voltage Range 5.0 to 27 V

• Up to 100 kbps High−Speed Transmission Mode

• Up to 40 kbps Bus Speed

• Selective BUS Wake−Up

• Logic Inputs Compatible with 3.3 V and 5 V Supply Systems

• Control Pin for External Voltage Regulators (14 Pin Package Only)

• Standby to Sleep Mode Timeout

• Low RFI Due to Output Wave Shaping

• Fully Integrated Receiver Filter

• Bus Terminals Short−Circuit and Transient Proof

• Loss of Ground Protection

• Protection Against Load Dump, Jump Start

• Thermal Overload and Short Circuit Protection

• ESD Protection of 4.0 kV on CAN Pin (2.0 kV on Any Other Pin)

• Undervoltage Lock Out

• Bus Dominant Timeout Feature

• NCV Prefix for Automotive and Other Applications Requiring Site

and Change Control

• Pb−Free Packages are Available

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MARKING DIAGRAMS

SOIC−8

D SUFFIX

CASE 751

SOIC−14

D SUFFIX

CASE 751A

GND GND

TxD

MODE1

RxD V

GND GND

ORDERING INFORMATION

Device Package Shipping

NCV7356D1G SOIC−8

NCV7356D1R2G SOIC−8 NCV7356D2 SOIC−14 55 Units / Rail

NCV7356D2R2 SOIC−14 2500 Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G = Pb−Free Package

PIN CONNECTIONS

1TxD 8 GND 2MODE0 3MODE1 4RxD

(Top View)

NC INH

(Top View)

(Pb−Free)

AWLYWW

14 132 123 114 105

96 87

2500 Tape & Reel

V7356 ALYW

NCV7356

7 CANH 6 LOAD 5V

BAT

NC CANHMODE0 LOAD

BAT

98 Units / Rail

†

June, 2005 − Rev. 2

1 Publication Order Number:

NCV7356/D

NCV7356

BAT

NCV7356

TxD

MODE0

MODE1

5 V Supply

and

References

RC−Osc

Time Out

MODE

CONTROL

Biasing and

Monitor

BAT

Wave Shaping

Receive

Comparator

Input Filter

Reverse

Protection

CAN Driver

Feedback

Loss of Ground

Detection

Current

CANH

Loop

LOAD

RxD

RxD Blanking

Time Filter

Figure 1. 8−Pin Package Block Diagram

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Reverse

Current

Protection

GND

NCV7356

TxD

BAT

5 V Supply

and

References

RC−Osc

Time Out

Biasing and

Monitor

BAT

Wave Shaping

Input Filter

Reverse

Current

Protection

CAN Driver

Feedback

Loop

INH

NCV7356

CANH

MODE0

MODE1

RxD

MODE

CONTROL

Receive

Comparator

RxD Blanking

Time Filter

Loss of Ground

Detection

Figure 2. 14−Pin Package Block Diagram

LOAD

Reverse

Current

Protection

GND

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NCV7356

P ACKAGE PIN DESCRIPTION

SOIC−8 SOIC−14 Symbol Description

1 2 TxD Transmit data from microprocessor to CAN. 2 3 MODE0 Operating mode select input 0. 3 4 MODE1 Operating mode select input 1. 4 5 RxD Receive data from CAN to microprocessor. 5 10 V 6 11 LOAD Resistor load (loss of ground detection low side switch). 7 12 CANH Single wire CAN bus pin. 8 1, 7, 8, 14 GND Ground

− 6, 13 NC No Connection (Note 1)

− 9 INH Control pin for external voltage regulator (high voltage high side switch) (14 pin package only)

1. PWB terminal 13 can be connected to ground which will allow the board to be assembled with either the 8 pin package or the 14 pin package.

BAT

Battery input voltage.

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NCV7356

Electrical Specification

All voltages are referenced to ground (GND). Positive currents flow into the IC. The maximum ratings given in the table below are limiting values that do not lead to a

MAXIMUM RATINGS

Rating Symbol Condition Min Max Unit

permanent damage of the device but exceeding any of these limits may do so. Long term exposure to limiting values may affect the reliability of the device.

Supply Voltage, Normal Operation V Short−Term Supply Voltage, T ransient V

BAT

BAT.LD

Load Dump; t < 500 ms − 40 V

− −0.3 18 V

(peak)

Jump Start; t < 1.0 min − 27 V Transient Supply Voltage V Transient Supply Voltage V Transient Supply Voltage V CANH Voltage V

Transient Bus Voltage V Transient Bus Voltage V Transient Bus Voltage V

CANHTR1 CANHTR2 CANHTR3

DC Voltage on Pin LOAD V DC Voltage on Pins TxD, MODE1, MODE0, RxD V ESD Capability of CANH V

ESDBUS

BAT.TR1 BAT.TR2 BAT.TR3

CANH

LOAD

ISO 7637/1 Pulse 1 (Note 2) −50 − V

ISO 7637/1 Pulses 2 (Note 2) − 100 V

ISO 7637/1 Pulses 3A, 3B −200 200 V

< 27 V −20

BAT

= 0 V −40

BAT

ISO 7637/1 Pulse 1 (Note 3) −50 − V

ISO 7637/1 Pulses 2 (Note 3) − 100 V

ISO 7637/1 Pulses 3A, 3B (Note 3) −200 200 V

Via RT > 2.0 kW −40 40 V

− −0.3 7.0 V

Human Body Model

−4000 4000 V

Eq. to Discharge 100 pF with 1.5 kW ESD Capability of Any Other Pins V

ESD

Human Body Model

−2000 2000 V

Eq. to Discharge 100 pF with 1.5 kW Maximum Latchup Free Current at Any Pin I

LATCH

Storage Temperature T Junction Temperature T Lead Temperature Soldering

Reflow: (SMD styles only)

SOIC−14 T

SOIC−8 60 s − 150 s above 217°C − 260 peak

STG

sld

60 s − 150 s above 183°C − 240 peak °C

− −500 500 mA

− −55 150 °C

− −40 150 °C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

2. ISO 7637 test pulses are applied to V

3. ISO 7637 test pulses are applied to CANH via a coupling capacitance of 1.0 nF.

via a reverse polarity diode and >1.0 mF blocking capacitor.

BAT

4. ESD measured per Q100−002 (EIA/JESD22−A114−A).

TYPICAL THERMAL CHARACTERISTICS

Parameter

SOIC−8

Junction−to−Lead (psi−JL7, Y Junction−to−Ambient (R

SOIC−14

Junction−to−Lead (psi−JL8, Y Junction−to−Ambient (R

5. 1 oz copper, 53 mm2 coper area, 0.062″ thick FR4.

6. 1 oz copper, 716 mm2 coper area, 0.062″ thick FR4.

7. 1 oz copper, 94 mm2 coper area, 0.062″ thick FR4.

8. 1 oz copper, 767 mm2 coper area, 0.062″ thick FR4.

) or Pins 6−7 57 (Note 5) 51 (Note 6) °C/W

JL8

, qJA) 187 (Note 5) 128 (Note 6) °C/W

) 30 (Note 7) 30 (Note 8) °C/W

JL8

, qJA) 122 (Note 7) 84 (Note 8) °C/W

Min Pad Board 1, Pad Board

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Test Condition, Typical Value

Unit

NCV7356

ELECTRICAL CHARACTERISTICS (V

Characteristic

= 5.0 to 27 V , T

BAT

Symbol Condition Min Typ Max Unit

= −40 to +125°C, unless otherwise specified.)

GENERAL

Undervoltage Lock Out Supply Current, Recessive,

All Active Modes

Normal Mode Supply Current,

Dominant

High−Speed Mode Supply Current,

Dominant

Wake−Up Mode Supply Current,

Dominant

Sleep Mode Supply Current I

BATuv

BATN

(Note 9)

BATN

(Note 9)

BATW

(Note 9)

BATS

BAT

= 18 V ,

Not High Speed Mode − 5.0 6.0 mA

TxD Open

= 27 V , MODE0 = MODE1 = H,

BAT

TxD = L, R

= 16 V , MODE0 = H, MODE1 = L,

BAT

TxD = L, R

= 27 V , MODE0 = L, MODE1 = H,

BAT

TxD = L, R

= 18 V, TxD, RxD, MODE0,

BAT

MODE1 Open Thermal Shutdown (Note 9) T Thermal Recovery (Note 9) T

REC

CANH

Bus Output Voltage V

RL > 200 W, Normal Mode

6.0 V < V

Bus Output Voltage

Low Battery

Bus Output Voltage

High−Speed Mode

Fixed Wake−Up

Output High Voltage

Offset Wake−Up

Output High Voltage

Recessive State

Output Voltage Bus Short Circuit Current −I Bus Leakage Current

During Loss of Ground Bus Leakage Current, Bus Positive I Bus Input Threshold V

ohWuFix

ohWuOffset

CAN_SHORTVCANH

LKN_CAN

RL > 200 W, Normal High−Speed Mode

Recessive State or Sleep Mode,

(Note 10)

LKP_CAN

5.0 V < V

RL > 75 W, High−Speed Mode

8.0 V < V

Wake−Up Mode, R

11.4 V < V

Wake−Up Mode, R

5.0 V < V

load

= 0 V , V

BAT

Loss of Ground, V

TxD High −10 − 10 mA

Normal, High−Speed Mode,

6.0 v V Bus Input Threshold Low Battery V Fixed Wake−Up

Input High Voltage Threshold

Offset Wake−Up

Input High Voltage Threshold

V (Note 9)

ihWuOffset

(Note 9)

ihlb

ihWuFix

Normal, V

BAT

Sleep Mode, V

Sleep Mode V

LOAD

Voltage on Switched Ground Pin V

LOAD_1mA

Voltage on Switched Ground Pin V Voltage on Switched Ground Pin V Load Resistance During Loss of

LOAD_LOB

LOAD

= 1.0 mA − − 0.1 V

LOAD

= 5.0 mA − − 0.5 V

LOAD

= 7.0 mA, V

BAT

Battery

9. Thresholds not tested in production, guaranteed by design.

10.Leakage current in case of loss of ground is the summary of both currents I

− 3.5 − 4.8 V

High Speed Mode − − 8.0

− 30 35 mA

= 200 W

load

− 70 75 mA

= 75 W

load

− 60 75 mA

= 200 W

load

− 30 60 mA

− 155 − 180 °C

− 126 − 150 °C

4.4 − 5.1 V

< 27 V

BAT

3.4 − 5.1 V

< 6.0 V

BAT

4.2 − 5.1 V

< 16 V

BAT

> 200 W,

< 27 V

> 200 W,

< 11.4 V

9.9 − 12.5 V

–1.5 − V

BAT

−0.20 − 0.20 V

= 6.5 kW

= 27 V, TxD = 0 V 50 − 350 mA

= 0 V −50 − 10 mA

CANH

2.0 2.1 2.2 V

v 27 V

BAT

= 5.0 V to 6.0 V 1.6 1.7 2.2 V

> 10.9 V 6.6 − 7.9 V

BAT

−4.3 − V

BAT

= 0 V − − 1.0 V

BAT

= 0 R

LOAD

− R

−10%

LKN_CAN

and I

LKN_LOAD

−3.25 V

BAT

LOAD

+35%

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NCV7356

ELECTRICAL CHARACTERISTICS (continued) (V

Characteristic

Symbol Condition Min Typ Max Unit

BAT

TXD, MODE0, MODE1

High Level Input Voltage Low Level Input Voltage V TxD Pullup Current −I

MODE0 and 1 Pulldown Resistor R

IL_TXD

MODE_pd

TxD = L, MODE0 and 1 = H

RXD

Low Level Output Voltage V High Level Output Leakage I

ol_rxd

ih_rxd

RxD Output Current Irxd V

INH (14 Pin Package Only)

High Level Output Voltage V Leakage Current I

oh_INH INH_lk

MODE0 = MODE1 = L, INH = 0 V −5.0 − 5.0 mA

= 5.0 to 27 V , T

6.0 < V

= −40 to +125°C, unless otherwise specified.)

< 27 V 2.0 − − V

BAT

< 27 V − − 0.8 V

BAT

10 − 50 mA

5.0 < V

BAT

< 27 V

10 − 50 kW

= 2.0 mA − − 0.4 V

RxD

= 5.0 V −10 − 10 mA

RxD

= 5.0 V − − 70 mA

RxD

= −180 mA V

INH

BAT

−0.8 V

−0.5 V

BAT

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TIMING MEASUREMENT LOAD CONDITIONS

Normal and High Voltage Wake−Up Mode High−Speed Mode

min load / min tau 3.3 kohm / 540 pF min load / max tau 3.3 kohm / 1.2 nF max load / min tau 200 ohm / 5.0 nF max load / max tau 200 ohm / 20 nF

NCV7356

Additional 140 ohm tool resistance

to ground in parallel

Additional 120 ohm tool resistance

to ground in parallel

ELECTRICAL CHARACTERISTICS (5.0 V ≤ V

≤ 27 V, −40°C ≤ TA ≤ 125°C, unless otherwise specified.)

BAT

AC CHARACTERISTICS (See Figures 3, 4, and 5)

Characteristic Symbol Condition Min Typ Max Unit

Transmit Delay in Normal and Wake−Up

Mode, Bus Rising Edge (Note 11)

Transmit Delay in Wake−Up Mode to V

ihWU

Bus Rising Edge (Note 12)

Transmit Delay in Normal Mode,

Bus Falling Edge (Note 13)

Transmit Delay in Wake−Up Mode,

Bus Falling Edge (Note 13)

Transmit Delay in High−Speed Mode,

Bus Rising Edge (Note 14)

Transmit Delay in High−Speed Mode,

Bus Falling Edge (Note 15) Receive Delay, All Active Modes (Note 16) t Receive Delay, All Active Modes (Note 16) t Input Minimum Pulse Length,

All Active Modes (Note 16) Wake−Up Filter Time Delay t Receive Blanking Time

TWUr

TWU1f

THSr

THSf

DR RD

mpDR

mpRD

WUF

Min and Max Loads per Timing

2.0 − 6.3 ms

Measurement Load Conditions

Min and Max Loads per Timing

2.0 − 18 ms

Measurement Load Conditions

Min and Max Loads per Timing

1.8 − 10 ms

Measurement Load Conditions

Min and Max Loads per Timing

3.0 − 13.7 ms

Measurement Load Conditions

Min and Max Loads per Timing

0.1 − 1.5 ms

Measurement Load Conditions

Min and Max Loads per Timing

0.04 − 3.0 ms

Measurement Load Conditions CANH High to Low Transition 0.3 − 1.0 ms CANH Low to High Transition 0.3 − 1.0 ms CANH High to Low Transition

CANH Low to High Transition

0.15

−

1.0

See Figure 4 10 − 70 ms See Figure 5 0.5 − 6.0 ms

After TxD L−H Transition

TxD Timeout Reaction Time t TxD Timeout Reaction Time t Delay from Normal to High−Speed and

tout

toutwu

dnhs

Normal and High−Speed Mode − 17 − ms Wake−Up Mode − 17 − ms

− − − 30 ms

High Voltage W ake−Up Mode

Delay from High−Speed and High Voltage

dhsn

− − − 30 ms

Wake−Up to Normal Mode Delay from Normal to Standby Mode t Delay from Sleep to Normal Mode t Delay from Standby to Sleep Mode (Note 17) t

dsby dsnwu dsleep

= 6.0 V to 27 V − − 500 ms

BAT

= 6.0 V to 27 V − − 50 ms

BAT

= 6.0 V to 27 V 100 250 500 ms

BAT

11.The maximum signal delay time for a bus rising edge is measured from Vcmos_il on the TxD input pin to the VihMax + Vgoff max level on CANH at maximum network time constant, minimum signal delay time for a bus rising edge is measured from Vcmos_ih on the TxD input pin to 1 V on CANH at minimum network time constant. These definitions are valid in both normal and High Voltage Wake−Up (HVWU) mode.

12.The maximum signal delay time for a bus rising edge in HVWU mode is measured from Vcmos_il on the TxD input pin to the VihWuMax + Vgoff max level on CANH at maximum network time constant, minimum signal delay time for a bus rising edge is measured from Vcmos_ih on the TxD input pin to 1 V on CANH at minimum network time constant.

13.Maximum signal delay time for a bus falling edge is measured from Vcmos_ih on the TxD input pin to 1 V on CANH at maximum network time constant, minimum signal delay time for a bus falling edge is measured from Vcmos_ih on the TxD input pin to the VihMax + Vgoff max level on CANH. These definitions are valid in both normal and HVWU mode.

14.The signal delay time in high−speed mode for a bus rising edge is measured from Vcmos_il on the TxD input pin to the VihMax + Vgoff max level on CANH at maximum high−speed network time constant.

15.The signal delay time in high−speed mode for a bus falling edge is measured from Vcmos_ih on the TxD input pin to 1 V on CANH at maximum high−speed network time constant.

16.Receive delay time is measured from the rising / falling edge crossing of the nominal Vih value on CANH to the falling (Vcmos_il_max) / rising (Vcmos_ih_min) edge of RxD. This parameter is tested by applying a square wave signal to CANH. The minimum slew rate for the bus rising and falling edges is 50 V/ms. The low level on bus is always 0 V. For normal mode and high−speed mode testing the high level on bus is 4 V. For HVWU mode testing the high level on bus is V

17.Tested on 14 Pin package only.

BAT

− 2 V .

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