The NCP5010 is a fixed frequency PWM boost converter with
integrated rectification optimized for constant current applications
such as driving white LEDs. This device features small size, minimal
external components and high−efficiency for use in portable
applications and is capable of providing up to 500 mW output power
to 2−5 series connected white LEDs. A single resistor sets the LED
current and the CTRL pin can be pulse width modulated (PWM) to
reduce the LED Current.
The device includes True−Cutoff circuitry to disconnect the load
from the battery when the device is put into standby mode. To protect
the device, an output overvoltage protection, and short circuit
protection have been incorporated. The NCP5010 is housed in a low
profile, space efficient 1.7 x 1.7 mm Flip−Chip package. The device
has been optimized for use with small inductors and ceramic
capacitors.
Features
• 2.7 to 5.5 V Input Voltage Range
• Efficiency: 84% for 5 LED (V
4.2 V V
IN
• Low Noise 1 MHz PWM DC−DC Converter
• Open LED Protection and Short Circuit Protection
• Serial LEDs Architecture for Uniform Current Matching
• 1 mA Shutdown Current Facility with True−Cutoff
• Very Small 8−Pin Flip−Chip 1.7 x 1.7 mm Package
• This is a Pb−Free Device
T ypical Applications
• White LED Backlighting for Small Color LCD Displays
• Cellular Phones
• Digital Cameras
• MP3 Players
• High Efficiency Step−up Converter
= 3.5 V by LED) at 30 mA and
F
90
80
70
60
50
40
30
EFFICIENCY (%)
20
10
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MARKING
DIAGRAM
A1
8−Pin Flip−Chip
FC SUFFIX
1
See detailed ordering and shipping information in the packag
dimensions section on page 16 of this data sheet.
V
= 5 LED (18 V)
OUT
0
110100
Figure 1. Efficiency vs. Output Current
CASE 499AJ
DAX = Specific Device Code
G= Pb−Free Package
A= Assembly Location
Y= Year
WW = Work Week
A1AGNDPOWERSystem ground for the analog circuitry . A high quality ground must be provided to avoid spikes and/
B1V
C1V
IN
OUT
POWERPower Supply Input. A ceramic capacitor with a minimum value of 1 mF/6.3 V (X5R or X7R) must be
POWERDC−DC converter output. This pin should be directly connected to the load and a low ESR
A2CTRLINPUTAn Active High logic level on this pin enables the device. A built−in pulldown resistor disables the
C2SWPOWERPower switch connection for inductor. T ypical application will use a coil from 10 mH to 22 mH and
A3NCN/ANot Connected
B3FBINPUTFeedback voltage input used to close the loop by means of a sense resistor connected between the
C3PGNDPOWERPower ground. A high quality ground must be used to avoid spikes and/or uncontrolled operation.
or uncontrolled operations. This pin is to be connected to the PGND pin.
connected to this pin. This capacitor should be placed as close as possible to this pin. In addition,
one end of the external inductor is to be connected at this point.
(<30 mW) 1 mF (min) 25 V bypass capacitor. This capacitor is required to smooth the current flowing
into the load, thus limiting the noise created by the fast transients present in this circuit. Since this is
a current regulated output, this pin has over voltage protection to protect from open load conditions.
Care must be taken to avoid EMI through the PCB copper tracks connected to this pin.
device if the pin is left open. This pin can also be used to control the average current into the load
by applying a low frequency PWM signal. If a PWM signal is applied, the frequency should be high
enough to avoid optical flicker but be no greater than 1 kHz.
must be able to handle at least 350 mA. If the desired output power is above 300 mW, the inductor
should have a DCR < 1.4 W.
primary LED branch and the ground. The output current tolerance is depends upon the accuracy of
this resistor and a ±5% or better accuracy metal film resistor is recommended. An analog dimming
signal can be applied to this point to reduce the output current. Please refer to the application
section for additional details.
Care must be taken to avoid high−density current flow in a limited PCB copper track. This pin is to
be connected to the AGND pin.
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2
NCP5010
MAXIMUM RATINGS
RatingSymbolValueUnit
Power Supply Voltage (Note 2)V
Over Voltage ProtectionV
IN
OUT
Human Body Model (HBM) ESD Rating (Note 3)ESD HBM2000V
Machine Model (MM) ESD Rating (Note 3)ESD MM200V
Digital Input Voltage
CTRL−0.3 < VIN < V
Digital Input Current
Power Dissipation @ TA = +85 °CP
Thermal Resistance Junction−to−Air
D
R
q
JA
8−Pin Flip−Chip Package
Operating Ambient Temperature RangeT
Operating Junction Temperature RangeT
Storage Temperature RangeT
A
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C.
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
4. Latchup Current Maximum Rating: ±100 mA per JEDEC standard: JESD78.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. For the 8−Pin Flip−Chip CSP Package, the R
50 mm total area and also 135°C/W with 500 mm. All the bumps have the same thermal resistance and need to be connected thereby optimizing
is highly dependent on the PCB Heatsink area. For example R
q
JA
the power dissipation.
7.0V
24V
+0.3
bat
1.0
mA
150mW
°C/W
(Note 6)
−40 to +85°C
−40 to +125°C
−65 to +150°C
can be to 195°C/W with
q
JA
V
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3
NCP5010
ELECTRICAL CHARACTERISTICS (Limits apply for T
between −40°C to +85°C and VIN = 3.6 V , unless otherwise noted)
A
PinSymbolRatingMinTypMaxUnit
B1V
C2I
IN
PEAK_MAX
NMOS R
F
OSC
M
DUTY
E
FF
C1OVP
C1OVP
C1P
C1I
B3F
C1F
OUT
OUT
BV
BVLR
DS(on)
ON
H
Supply Voltage2.75.5V
Switch Current Limit280420560mA
Internal Switch On Resistor0.61.0W
PWM Oscillator Frequency0.81.01.2MHz
Maximum Duty Cycle9195%
Efficiency (Note 7)84%
Overvoltage Clamp Voltage2022V
Overvoltage Clamp Hysteresis1.0V
Output power (Note 8)
VIN = 3.1 V
VIN < 3.1 V
Minimum Output Current Controlled No Skip Mode
500
300
1.0mA
(Note 9)
Feedback Voltage Threshold in Steady State
Overtemperature range
At 25°C
475
490
500
500
525
510
Feedback Voltage Line Regulation (Notes 9 and 10)
From DC to 100 Hz0.20.5
B1U
B1U
C1I
B1S
VLO
VLOH
OUTSC
CPT
B1C2ISTDBStand by Current, I
I
Q
A2V
A2V
A2R
IL
IH
CTRL
7. Efficiency is defined by 100 * (P
VIN = 4.2 V with L= Coilcraft DT1608C−223
I
= 30 mA, Load = 5 LEDs (VF = 3.5 V per LED) bypassed by 1 mF X5R
OUT
VIN Undervoltage Lockout measured at 25°C
Threshold to Enable the Converter
Threshold to Disable the Converter
2.2
2.0
2.4
2.2
2.6
2.4
Undervoltage Lockout Hysteresis200mV
Short Circuit Output Current20mA
Short Circuit Protection Threshold
Detected
Released
V
bat
= 4.2 V
= 0 mA, CTRL = Low
OUT
35
47
50
67
65
87
2.0mA
Quiescent Current
Device Not Switching (BF = VIN)
Device Switching (RFB disconnected)
0.4
1.0
Voltage Input Logic Low0.3V
Voltage Input Logic High1.2V
CTRL Pin Pulldown Resistance175370kW
/ Pin) at 25°C
out
8. Guaranteed by design and characterized with L = 22 mH, DCR = 0.7 W max.
9. Load = 4 LEDs (VF = 3.5 V by LED), C
10.VIN = 3.6 V , Ripple = 0.2 V P−P, I
OUT
= 1 mF X5R, L= Coilcraft DT1608C−223.
OUT
= 15 mA.
mW
mV
%/V
V
% of V
mA
IN
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4
NCP5010
)
TYPICAL OPERATING CHARACTERISTICS
0
0
0
Condition: Efficiency = 100 x (Number of LED stacked x V
90
80
70
EFFICIENCY (%)
60
50
010203040506070
VIN = 2.7 V
I
OUT
VIN = 3.3 V
VIN = 4.2 V
(mA)
Figure 3. Efficiency vs. Current @ 3 LEDS (10.5 V)
L = Coilcraft DT1608C−223
90
80
x I
LED
90
80
70
EFFICIENCY (%)
60
50
0 1020304050607
)/P
LED
IN
VIN = 2.7 V
I
(mA)
OUT
VIN = 3.3 V
VIN = 4.2 V
Figure 4. Efficiency vs. Current @ 3 LEDS (10.5 V)
L = TDK VLF4012AT−220
90
80
VIN = 2.7 V
70
EFFICIENCY (%)
60
50
0 10203040506070
VIN = 3.3 V
I
(mA)
OUT
VIN = 4.2 V
Figure 5. Efficiency vs. Current @ 4 LEDS (14 V)
L = Coilcraft DT1608C−223
90
80
VIN = 2.7 V
70
EFFICIENCY (%)
60
VIN = 3.3 V
VIN = 4.2 V
70
EFFICIENCY (%)
60
50
0 1020304050607
VIN = 2.7 V
VIN = 3.3 V
I
(mA)
OUT
VIN = 4.2 V
Figure 6. Efficiency vs. Current @ 4 LEDS (14 V)
L = TDK VLF4012AT−220
90
80
70
EFFICIENCY (%)
60
VIN = 2.7 V
VIN = 3.3 V
VIN = 4.2 V
50
0 10203040506070
I
(mA)
OUT
Figure 7. Efficiency vs. Current @ 5 LEDS (17.5 V)
L = Coilcraft DT1608C−223
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50
0 1020304050607
I
(mA)
OUT
Figure 8. Efficiency vs. Current @ 5 LEDS (17.5 V
L = TDK VLF4012AT−220
5
NCP5010
0
TYPICAL OPERATING CHARACTERISTICS
.5
00
Condition: Efficiency = 100 x (Number of LED stacked x V
90
I
= 33 mA
OUT
80
I
= 10 mA
70
I
OUT
= 23 mA
OUT
60
50
EFFICIENCY (%)
40
I
OUT
= 1 mA
30
20
2.53.03.54.04.55.05.5
VIN (V)
Figure 9. Efficiency vs. VIN @ 3 LEDS (10.5 V)
L = Coilcraft DT1608C−223
90
80
70
I
OUT
= 28 mA
I
OUT
= 23 mA
I
OUT
= 10 mA
x I
LED
)/P
IN
LED
90
I
= 33 mA
OUT
80
70
I
OUT
= 23 mA
I
OUT
60
50
EFFICIENCY (%)
40
I
OUT
30
20
2.53.03.54.04.55.05
VIN (V)
Figure 10. Efficiency vs. VIN @ 4 LEDS (14 V)
L = Coilcraft DT1608C−223
510
505
VIN = 3.6 V
= 10 mA
= 1 mA
60
I
50
EFFICIENCY (%)
40
OUT
= 1 mA
30
20
2.53.03.54.04.55.05.5
VIN (V)
Figure 11. Efficiency vs. V
@ 5 LEDS (17.5 V)
IN
L = Coilcraft DT1608C−223
1.04
VIN = 3.6 V
1.02
1.00
FREQUENCY (MHz)
0.98
VIN = 2.7 V
VIN = 5.5 V
VIN = 5.5 V
500
VIN = 2.7 V
495
FEEDBACK VOLTAGE (mV)
490
−40−2002040608010
TEMPERATURE (°C)
Figure 12. Feedback Voltage vs. Temperature
900
800
700
(mW)
DS(on)
600
500
NMOS R
400
VIN = 3.6 V
VIN = 2.7 V
VIN = 5.5 V
0.96
−40−20020406080100
300
−40−200204060801
TEMPERATURE (°C)
Figure 13. Oscillator Frequency vs. TemperatureFigure 14. NMOS R
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6
TEMPERATURE (°C)
vs. Temperature
DS(on)
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