ON Semiconductor NCP5010 Technical data

NCP5010
e
500 mW Boost Converter for White LEDs
The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal external components and high−efficiency for use in portable applications and is capable of providing up to 500 mW output power to 2−5 series connected white LEDs. A single resistor sets the LED current and the CTRL pin can be pulse width modulated (PWM) to reduce the LED Current.
The device includes True−Cutoff circuitry to disconnect the load from the battery when the device is put into standby mode. To protect the device, an output overvoltage protection, and short circuit protection have been incorporated. The NCP5010 is housed in a low profile, space efficient 1.7 x 1.7 mm Flip−Chip package. The device has been optimized for use with small inductors and ceramic capacitors.
Features
2.7 to 5.5 V Input Voltage Range
Efficiency: 84% for 5 LED (V
4.2 V V
IN
Low Noise 1 MHz PWM DC−DC Converter
Open LED Protection and Short Circuit Protection
Serial LEDs Architecture for Uniform Current Matching
1 mA Shutdown Current Facility with True−Cutoff
Very Small 8−Pin Flip−Chip 1.7 x 1.7 mm Package
This is a Pb−Free Device
T ypical Applications
White LED Backlighting for Small Color LCD Displays
Cellular Phones
Digital Cameras
MP3 Players
High Efficiency Step−up Converter
= 3.5 V by LED) at 30 mA and
F
90 80 70 60 50 40 30
EFFICIENCY (%)
20 10
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MARKING DIAGRAM
A1
8−Pin Flip−Chip
FC SUFFIX
1
See detailed ordering and shipping information in the packag dimensions section on page 16 of this data sheet.
V
= 5 LED (18 V)
OUT
0
1 10 100
Figure 1. Efficiency vs. Output Current
CASE 499AJ
DAX = Specific Device Code G = Pb−Free Package A = Assembly Location Y = Year WW = Work Week
PIN CONNECTIONS
A1
A2 A3
AGND
CTRL NC
B1 B3
V
IN
C1 C2 C3
V
ORDERING INFORMATION
OUT
I
OUT
SW PGND
Top View
V
= 3 LED (11 V)
OUT
(mA)
DAXG
AYWW
FB
VIN = 4.2 V
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 2
1 Publication Order Number:
NCP5010/D
V
bat
2.7 to 5.5 V
NCP5010
C
in
4.7 mF 0603
L1 22 mH
LED
X5R 6.3V
C2
IN
SW
ENABLE
A2
CTRL
A3
NC
NCP5010
V
AGND
A1 B1
V
PGND
C3
OUT
B3
FB
C1
C
out
1 mF 0805
X5R 25V
R 24
LED
fb
2 to 5 LEDs
Figure 2. Typical Application Circuit
PIN FUNCTION DESCRIPTION
PIN PIN NAME TYPE DESCRIPTION
A1 AGND POWER System ground for the analog circuitry . A high quality ground must be provided to avoid spikes and/
B1 V
C1 V
IN
OUT
POWER Power Supply Input. A ceramic capacitor with a minimum value of 1 mF/6.3 V (X5R or X7R) must be
POWER DC−DC converter output. This pin should be directly connected to the load and a low ESR
A2 CTRL INPUT An Active High logic level on this pin enables the device. A built−in pulldown resistor disables the
C2 SW POWER Power switch connection for inductor. T ypical application will use a coil from 10 mH to 22 mH and
A3 NC N/A Not Connected B3 FB INPUT Feedback voltage input used to close the loop by means of a sense resistor connected between the
C3 PGND POWER Power ground. A high quality ground must be used to avoid spikes and/or uncontrolled operation.
or uncontrolled operations. This pin is to be connected to the PGND pin.
connected to this pin. This capacitor should be placed as close as possible to this pin. In addition, one end of the external inductor is to be connected at this point.
(<30 mW) 1 mF (min) 25 V bypass capacitor. This capacitor is required to smooth the current flowing into the load, thus limiting the noise created by the fast transients present in this circuit. Since this is a current regulated output, this pin has over voltage protection to protect from open load conditions. Care must be taken to avoid EMI through the PCB copper tracks connected to this pin.
device if the pin is left open. This pin can also be used to control the average current into the load by applying a low frequency PWM signal. If a PWM signal is applied, the frequency should be high enough to avoid optical flicker but be no greater than 1 kHz.
must be able to handle at least 350 mA. If the desired output power is above 300 mW, the inductor should have a DCR < 1.4 W.
primary LED branch and the ground. The output current tolerance is depends upon the accuracy of this resistor and a ±5% or better accuracy metal film resistor is recommended. An analog dimming signal can be applied to this point to reduce the output current. Please refer to the application section for additional details.
Care must be taken to avoid high−density current flow in a limited PCB copper track. This pin is to be connected to the AGND pin.
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NCP5010
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply Voltage (Note 2) V Over Voltage Protection V
IN
OUT
Human Body Model (HBM) ESD Rating (Note 3) ESD HBM 2000 V Machine Model (MM) ESD Rating (Note 3) ESD MM 200 V Digital Input Voltage
CTRL −0.3 < VIN < V
Digital Input Current Power Dissipation @ TA = +85 °C P Thermal Resistance Junction−to−Air
D
R
q
JA
8−Pin Flip−Chip Package Operating Ambient Temperature Range T Operating Junction Temperature Range T Storage Temperature Range T
A
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C.
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins. Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
4. Latchup Current Maximum Rating: ±100 mA per JEDEC standard: JESD78.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. For the 8−Pin Flip−Chip CSP Package, the R 50 mm total area and also 135°C/W with 500 mm. All the bumps have the same thermal resistance and need to be connected thereby optimizing
is highly dependent on the PCB Heatsink area. For example R
q
JA
the power dissipation.
7.0 V 24 V
+0.3
bat
1.0
mA
150 mW
°C/W
(Note 6)
−40 to +85 °C
−40 to +125 °C
−65 to +150 °C
can be to 195°C/W with
q
JA
V
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NCP5010
ELECTRICAL CHARACTERISTICS (Limits apply for T
between −40°C to +85°C and VIN = 3.6 V , unless otherwise noted)
A
Pin Symbol Rating Min Typ Max Unit
B1 V C2 I
IN
PEAK_MAX
NMOS R F
OSC
M
DUTY
E
FF
C1 OVP C1 OVP C1 P
C1 I
B3 F
C1 F
OUT
OUT
BV
BVLR
DS(on)
ON H
Supply Voltage 2.7 5.5 V Switch Current Limit 280 420 560 mA Internal Switch On Resistor 0.6 1.0 W PWM Oscillator Frequency 0.8 1.0 1.2 MHz Maximum Duty Cycle 91 95 % Efficiency (Note 7) 84 % Overvoltage Clamp Voltage 20 22 V Overvoltage Clamp Hysteresis 1.0 V Output power (Note 8)
VIN = 3.1 V VIN < 3.1 V
Minimum Output Current Controlled No Skip Mode
500 300
1.0 mA
(Note 9) Feedback Voltage Threshold in Steady State
Overtemperature range At 25°C
475 490
500 500
525 510
Feedback Voltage Line Regulation (Notes 9 and 10)
From DC to 100 Hz 0.2 0.5
B1 U
B1 U C1 I B1 S
VLO
VLOH
OUTSC
CPT
B1C2ISTDB Stand by Current, I
I
Q
A2 V A2 V A2 R
IL IH CTRL
7. Efficiency is defined by 100 * (P VIN = 4.2 V with L= Coilcraft DT1608C−223 I
= 30 mA, Load = 5 LEDs (VF = 3.5 V per LED) bypassed by 1 mF X5R
OUT
VIN Undervoltage Lockout measured at 25°C
Threshold to Enable the Converter Threshold to Disable the Converter
2.2
2.0
2.4
2.2
2.6
2.4 Undervoltage Lockout Hysteresis 200 mV Short Circuit Output Current 20 mA Short Circuit Protection Threshold
Detected Released
V
bat
= 4.2 V
= 0 mA, CTRL = Low
OUT
35 47
50 67
65 87
2.0 mA
Quiescent Current
Device Not Switching (BF = VIN) Device Switching (RFB disconnected)
0.4
1.0 Voltage Input Logic Low 0.3 V Voltage Input Logic High 1.2 V CTRL Pin Pulldown Resistance 175 370 kW
/ Pin) at 25°C
out
8. Guaranteed by design and characterized with L = 22 mH, DCR = 0.7 W max.
9. Load = 4 LEDs (VF = 3.5 V by LED), C
10.VIN = 3.6 V , Ripple = 0.2 V P−P, I
OUT
= 1 mF X5R, L= Coilcraft DT1608C−223.
OUT
= 15 mA.
mW
mV
%/V
V
% of V
mA
IN
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NCP5010
)
TYPICAL OPERATING CHARACTERISTICS
0
0
0
Condition: Efficiency = 100 x (Number of LED stacked x V
90
80
70
EFFICIENCY (%)
60
50
010203040506070
VIN = 2.7 V
I
OUT
VIN = 3.3 V
VIN = 4.2 V
(mA)
Figure 3. Efficiency vs. Current @ 3 LEDS (10.5 V)
L = Coilcraft DT1608C−223
90
80
x I
LED
90
80
70
EFFICIENCY (%)
60
50
0 1020304050607
)/P
LED
IN
VIN = 2.7 V
I
(mA)
OUT
VIN = 3.3 V
VIN = 4.2 V
Figure 4. Efficiency vs. Current @ 3 LEDS (10.5 V)
L = TDK VLF4012AT−220
90
80
VIN = 2.7 V
70
EFFICIENCY (%)
60
50
0 10203040506070
VIN = 3.3 V
I
(mA)
OUT
VIN = 4.2 V
Figure 5. Efficiency vs. Current @ 4 LEDS (14 V)
L = Coilcraft DT1608C−223
90
80
VIN = 2.7 V
70
EFFICIENCY (%)
60
VIN = 3.3 V
VIN = 4.2 V
70
EFFICIENCY (%)
60
50
0 1020304050607
VIN = 2.7 V
VIN = 3.3 V
I
(mA)
OUT
VIN = 4.2 V
Figure 6. Efficiency vs. Current @ 4 LEDS (14 V)
L = TDK VLF4012AT−220
90
80
70
EFFICIENCY (%)
60
VIN = 2.7 V
VIN = 3.3 V
VIN = 4.2 V
50
0 10203040506070
I
(mA)
OUT
Figure 7. Efficiency vs. Current @ 5 LEDS (17.5 V)
L = Coilcraft DT1608C−223
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50
0 1020304050607
I
(mA)
OUT
Figure 8. Efficiency vs. Current @ 5 LEDS (17.5 V
L = TDK VLF4012AT−220
5
NCP5010
0
TYPICAL OPERATING CHARACTERISTICS
.5
00
Condition: Efficiency = 100 x (Number of LED stacked x V
90
I
= 33 mA
OUT
80
I
= 10 mA
70
I
OUT
= 23 mA
OUT
60
50
EFFICIENCY (%)
40
I
OUT
= 1 mA
30
20
2.5 3.0 3.5 4.0 4.5 5.0 5.5 VIN (V)
Figure 9. Efficiency vs. VIN @ 3 LEDS (10.5 V)
L = Coilcraft DT1608C−223
90
80
70
I
OUT
= 28 mA
I
OUT
= 23 mA
I
OUT
= 10 mA
x I
LED
)/P
IN
LED
90
I
= 33 mA
OUT
80
70
I
OUT
= 23 mA
I
OUT
60
50
EFFICIENCY (%)
40
I
OUT
30
20
2.5 3.0 3.5 4.0 4.5 5.0 5 VIN (V)
Figure 10. Efficiency vs. VIN @ 4 LEDS (14 V)
L = Coilcraft DT1608C−223
510
505
VIN = 3.6 V
= 10 mA
= 1 mA
60
I
50
EFFICIENCY (%)
40
OUT
= 1 mA
30
20
2.5 3.0 3.5 4.0 4.5 5.0 5.5 VIN (V)
Figure 11. Efficiency vs. V
@ 5 LEDS (17.5 V)
IN
L = Coilcraft DT1608C−223
1.04
VIN = 3.6 V
1.02
1.00
FREQUENCY (MHz)
0.98 VIN = 2.7 V
VIN = 5.5 V
VIN = 5.5 V
500
VIN = 2.7 V
495
FEEDBACK VOLTAGE (mV)
490
−40 −20 0 20 40 60 80 10 TEMPERATURE (°C)
Figure 12. Feedback Voltage vs. Temperature
900
800
700
(mW)
DS(on)
600
500
NMOS R
400
VIN = 3.6 V
VIN = 2.7 V
VIN = 5.5 V
0.96
−40 −20 0 20 40 60 80 100
300
−40 −20 0 20 40 60 80 1
TEMPERATURE (°C)
Figure 13. Oscillator Frequency vs. Temperature Figure 14. NMOS R
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TEMPERATURE (°C)
vs. Temperature
DS(on)
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