Datasheet NCP1086 Datasheet (ON Semiconductor)

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NCP1086
1.5 A Adjustable and 3.3 V Fixed Output Linear Regulator
The NCP1086 linear regulator provides 1.5 A at 3.3 V or adjustable output voltage. The adjustable output voltage device uses two external resistors to set the output voltage within a 1.25 V to 5.5 V range.
The regulators is intended for use as post regulator and microprocessor supply. The fast loop response and low dropout voltage make this regulator ideal for applications where low voltage operation and good transient response are important.
The circuit is designed to operate with dropout voltages less than
1.4 V at 1.5 A output current. Device protection includes overcurrent and thermal shutdown.
This device is pin compatible with LT1086 family of linear regulators and has lower dropout voltage.
The regulators are available in TO−220−3, surface mount
2
D
PAK−3, and SOT−223 packages.
Features
Output Current to 1.5 A
Output Accuracy to ±1% Over T emperature
Dropout Voltage (Typical) 1.05 V @ 1.5 A
Fast Transient Response
Fault Protection Circuitry
Current LimitThermal Shutdown
Pb−Free Packages are Available
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TO−220−3
T SUFFIX
CASE 221A
1
2
3
D2PAK−3
DP SUFFIX
1
2
3
1
2
3
CASE 418AB
SOT−223
ST SUFFIX
CASE 318E
Adjustable
Output
Tab = V
OUT
Pin 1. Adj
2. V
OUT
3. V
IN
3.3 V Fixed Output
Tab = V
OUT
Pin 1. GND
2. V
OUT
3. V
IN
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking section on page 10 of this data sheet.
5.0 V
10 mF
5.0 V
V
IN
NCP1086
Adj
V
OUT
124 W
1.0%
200 W
1.0%
3.3 V @ 1.5 A
22 mF
5.0 V 10 mF
5.0 V
V
IN
NCP1086
GND
V
OUT
22 mF
5.0 V
Figure 1. Application Diagram, Adjustable Output Figure 2. Application Diagram, 3.3 V Fixed Output
© Semiconductor Components Industries, LLC, 2005
May, 2005 − Rev. 6
1 Publication Order Number:
NCP1086/D
3.3 V @ 1.5 A
MAXIMUM RATINGS*
NCP1086
Parameter Value Unit
Supply Voltage, V
CC
7.0 V Operating Temperature Range −40 to +70 °C Junction Temperature 150 °C Storage Temperature Range −60 to +150 °C Lead Temperature Soldering: Wave Solder (through hole styles only) Note 1
Reflow (SMD styles only) Note 2
260 Peak 230 Peak
°C
ESD Damage Threshold 2.0 kV
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. 10 second maximum.
2. 60 second maximum above 183°C.
ELECTRICAL CHARACTERISTICS (C
T
+150°C, unless otherwise specified, I
J
Characteristic
IN
full load
= 10 mF, C
= 1.5 A.)
= 22 mF Tantalum, V
OUT
OUT
+ V
DROPOUT
< VIN < 7.0 V, 0°C TA 70°C,
Test Conditions Min Typ Max Unit
ADJUSTABLE OUTPUT VOLTAGE
Reference Voltage (Notes 3 and 4)
Line Regulation 1.5 V VIN − V Load Regulation (Notes 3 and 4) VIN − V Dropout Voltage (Note 5) I Current Limit VIN − V Minimum Load Current (Note 6) VIN = 7.0 V; V Adjust Pin Current VIN − V
VIN − V 10 mA I
OUT
= 1.5 V; V
OUT
1.5 A
OUT
OUT
= 1.5 V; 10 mA ≤ I
OUT
= 0 V,
Adj
5.75 V; I
1.241
(−1%)
= 10 mA 0.02 0.2 %
OUT
1.5 A 0.04 0.4 %
OUT
1.254 1.266 (+1%)
= 1.5 A 1.05 1.4 V
= 3.0 V; TJ 25°C 1.6 3.1 A
OUT
= 0 0.6 2.0 mA
Adj
OUT
= 3.0 V; I
= 10 mA 50 100
OUT
V
mA Thermal Regulation (Note 7) 30 ms pulse; TA = 25°C 0.002 0.02 %/W Ripple Rejection (Note 7) f = 120 Hz; I
V
RIPPLE
OUT
= 1.0 V
= 1.5 A; VIN − V
P−P
OUT
= 3.0 V;
80 dB
Thermal Shutdown (Note 8) 150 180 210 °C Thermal Shutdown Hysteresis (Note 8) 25 °C
FIXED OUTPUT VOLTAGE
Output Voltage (Notes 3 and 4) VIN − V
Line Regulation 2.0 V VIN − V Load Regulation (Notes 3 and 4) VIN − V Dropout Voltage (Note 5) I
OUT
Current Limit VIN − V Quiescent Current I
OUT
= 1.5 V, 0 ≤ I
OUT
3.7 V; I
OUT
= 2.0 V; 10 mA ≤ I
OUT
1.5 A 3.25
OUT
3.3 3.35
(−1.5%)
= 10 mA 0.02 0.2 %
OUT
1.5 A 0.04 0.4 %
OUT
V
(+1.5%)
= 1.5 A 1.05 1.4 V
= 3.0 V 1.6 3.1 A
OUT
= 10 mA 5.0 10 mA
Thermal Regulation (Note 7) 30 ms pulse; TA = 25°C 0.002 0.02 %/W
3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output voltage due to thermal gradients or temperature changes must be taken into account separately.
4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.
5. Dropout voltage is a measurement of the minimum input/output differential at full load.
6. The minimum load current is the minimum current required to maintain regulation. Normally the current in the resistor divider used to set the output voltage is selected to meet the minimum requirement.
7. Guaranteed by design, not 100% tested in production.
8. Thermal shutdown is 100% functionally tested in production.
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NCP1086
ELECTRICAL CHARACTERISTICS (continued) (C
0°C T
70°C, TJ +150°C, unless otherwise specified, I
A
Characteristic
= 10 mF, C
IN
full load
= 22 mF Tantalum, V
OUT
= 1.5 A.)
OUT
+ V
DROPOUT
< VIN < 7.0 V,
Test Conditions Min Typ Max Unit
FIXED OUTPUT VOLTAGE (continued)
Ripple Rejection (Note 9)
f = 120 Hz; I V
RIPPLE
OUT
= 1.0 V
= 1.5 A; VIN − V
P−P
OUT
= 3.0 V;
80 dB
Thermal Shutdown (Note 10) 150 180 210 °C Thermal Shutdown Hysteresis
25 °C
(Note 10)
9. Guaranteed by design, not 100% tested in production.
10.Thermal shutdown is 100% functionally tested in production.
PACKAGE PIN DESCRIPTION, ADJUSTABLE OUTPUT
Package Pin Number
D2PAK−3 TO−220−3 SOT−223
Pin Symbol Function
1 1 1 Adj Adjust pin (low side of the internal reference). 2 2 2 V 3 3 3 V
OUT
IN
Regulated output voltage (case). Input voltage.
PACKAGE PIN DESCRIPTION, 3.3 V FIXED OUTPUT
Package Pin Number
D2PAK−3 TO−220−3 SOT−223
Pin Symbol Function
1 1 1 GND Ground connection. 2 2 2 V 3 3 3 V
V
IN
Output
Current
OUT
IN
V
OUT
Regulated output voltage (case). Input voltage.
V
IN
Output
Current
Limit
Thermal
Shutdown
Bandgap
+
Error Amplifier
Adj
Thermal
Shutdown
Bandgap
+
Error Amplifier
Figure 3. Block Diagram, Adjustable Output Figure 4. Block Diagram, 3.3 V Fixed Output
Limit
V
OUT
GND
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3
0.10
0
V Drop Out (V)
1.00
1.05
.0
t)
Load Step (mA)
Voltage Deviation (mV)
0
0.95
T
CASE
NCP1086
TYPICAL PERFORMANCE CHARACTERISTICS
= 0°C
0.08
0.04
0.90 T
CASE
= 25°C
0.85
0.80
0.75
0 300
T
= 125°C
CASE
600 900 1200 1500
(mA)
I
OUT
Figure 5. Dropout Voltage vs. Output Current
70
65
IO = 10mA
60
55
50
Adjust Pin Current (mA)
45
40
0
20 40 60 80 100 120
Temperature (°C)
Figure 7. Adjust Pin Current vs. Temperature
(Adjustable Output)
0.00
−0.04
−0.08
Output Voltage Deviation (%)
−0.12 0
10 20 30 40 50 60 70 80 90 100 110 120 13
(°C)
T
J
Figure 6. Reference Voltage vs. Temperature
3.5
3.1
2.7
(A)
SC
I
2.3
1.9
1.5
1.0 2.0 3.0 5.0 6.0 VIN − V
4.0
OUT
(V)
Figure 8. Short Circuit Current vs VIN − V
7
OUT
200
100
−120
−200 1500
750
200
100
0
V
= 3.3 V
OUT
C
0
= CIN = 22 mF Tantalum
OUT
0
−120
Voltage Deviation (mV)
0
−200
C
= CIN = 22 mF Tantalum
OUT
1500
750
0
0 1.0 2.0 4.0 5.0 6.0 7.0 8.0 9.0 10
3.0 Time, ms
0
0 1.0 2.0 4.0 5.0 6.0 7.0 8.0 9.0 1
Load Step (mA)
3.0 Time, ms
Figure 9. Transient Response (Adjustable Output) Figure 10. Transient Response (3.3 V Fixed Outpu
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NCP1086
Output Voltage Deviation, (%)
.0
Ripple Rejection (dB)
85
85
6
75
65
55
45
T
= 25°C
CASE
I
= 6A
OUT
35
25
15
10
1
(V
IN
V
RIPPLE
C
Adj
− V
OUT
= 1.6V
= 0.1 mF
2
10
= 3V)
PP
10 Frequency (Hz)
3
10
4
10
Figure 11. Ripple Rejection vs. Frequency
(Adjustable Output)
0.100
0.075
0.050
0.025
T
CASE
0
0
1.0 2.0
Output Current (A)
= 25°C
T
CASE
= 125°C
Figure 13. Load Regulation vs. Output Current
(Adjustable Output)
5
T
CASE
10
= 0°C
75
65
55
45
T
= 25°C
CASE
I
= 6A
OUT
35
Ripple Rejection (dB)
25
6
15
10
1
(V
IN
V
RIPPLE
− V
OUT
= 1.6V
2
10
= 3V)
PP
10
Frequency (Hz)
3
10
4
10
5
10
Figure 12. Ripple Rejection vs. Frequency
(3.3 V Fixed Output)
0.65
0.60
0.55
0.50
0.45
Minimum Load Current (mA)
0.40
1.0 2.0 3.0 5.0 6.0 7
Figure 14. Minimum Load Current vs V
T
CASE
T
CASE
CIN = C
VIN − V
= 0°C
= 25°C
= 22 mF Tantalum
OUt
4.0 (V)
OUT
T
CASE
= 125°C
− V
IN
OUT
(Adjustable Output)
The NCP1086 voltage regulator series provides adjustable and 3.3 V output voltages at currents up to 1.5 A. The regulator is protected against overcurrent conditions and includes thermal shutdown.
The NCP1086 series has a composite PNP−NPN output transistor and requires an output capacitor for stability. A detailed procedure for selecting this capacitor is included in the Stability Considerations section.
Adjustable Operation
The adjustable output device has an output voltage range of 1.25 V to 5.5 V. An external resistor divider sets the output voltage as shown in Figure 15. The regulator maintains a fixed 1.25 V (typical) reference between the output pin and the adjust pin.
APPLICATIONS INFORMATION
A resistor divider network R1 and R2 causes a fixed current to flow to ground. This current creates a voltage across R2 that adds to the 1.25 V across R1 and sets the overall output voltage. The adjust pin current (typically 50 mA) also flows through R2 and adds a small error that should be taken into account if precise adjustment of V is necessary.
The output voltage is set according to the formula:
V
OUT
The term I
Adj
pin current.
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OUT
R1 ) R2
+ V
REF
ǒ
R1
Ǔ
) I
R2
Adj
× R2 represents the error added by the adjust
NCP1086
R1 is chosen so that the minimum load current is at least
2.0 mA. R1 and R2 should be the same type, e.g. metal film for best tracking over temperature.
V
IN
C
1
V
IN
NCP1086
Figure 15. Resistor Divider Scheme
Adj
V
OUT
I
Adj
V
OUT
V
REF
R
1
C
2
R
2
The adjustable output linear regulator has an absolute maximum specification of 7.0 V for the voltage difference between V
and V
IN
. However, the IC may be used to
OUT
regulate voltages in excess of 7.0 V. The main considerations in such a design are powerup and short circuit capability.
In most applications, ramp−up of the power supply to V
IN
is fairly slow, typically on the order of several tens of milliseconds, while the regulator responds in less than one microsecond. In this case, the linear regulator begins charging the load as soon as the V
IN
to V
differential is
OUT
large enough that the pass transistor conducts current. The load at this point is essentially at ground, and the supply voltage is on the order of several hundred mV, with the result that the pass transistor is in dropout. As the supply to V
IN
increases, the pass transistor will remain in dropout, and current is passed to the load until V
reaches the point at
OUT
which the IC is in regulation. Further increase in the supply voltage brings the pass transistor out of dropout. The result is that the output voltage follows the power supply ramp−up, staying in dropout until the regulation point is reached. In this manner, any output voltage may be regulated. There is no theoretical limit to the regulated voltage as long as the V
IN
to V
differential of 7.0 V is not exceeded.
OUT
However, the possibility of destroying the IC in a short circuit condition is very real for this type of design. Short circuit conditions will result in the immediate operation of the pass transistor outside of its safe operating area. Overvoltage stresses will then cause destruction of the pass transistor before overcurrent or thermal shutdown circuitry can become active. Additional circuitry may be required to clamp the V
IN
to V
differential to less than 7.0 V if
OUT
fail−safe operation is required. One possible clamp circuit is illustrated in Figure 16; however, the design of clamp circuitry must be done on an application by application basis. Care must be taken to ensure the clamp actually protects the design. Components used in the clamp design
must be able to withstand the short circuit condition indefinitely while protecting the IC.
EXTERNAL
SUPPLY
V
IN
NCP1086
Figure 16. Short Circuit Protection Circuit for High
Voltage Application
Stability Considerations
Adj
V
OUT
V
OUT
The output or compensation capacitor helps determine three main characteristics of a linear regulator: startup delay , load transient response and loop stability.
The capacitor value and type is based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the least expensive solution. However, when the circuit operates at low temperatures, both the value and ESR of the capacitor will vary considerably. The capacitor manufacturers’ data sheet provides this information.
A 22 mF tantalum capacitor will work for most applications, but with high current regulators such as the NCP1086 series the transient response and stability improve with higher values of capacitance. The majority of applications for this regulator involve large changes in load current, so the output capacitor must supply the instantaneous load current. The ESR of the output capacitor causes an immediate drop in output voltage given by:
DV + DI ESR
For microprocessor applications it is customary to use an output capacitor network consisting of several tantalum and ceramic capacitors in parallel. This reduces the overall ESR and reduces the instantaneous output voltage drop under load transient conditions. The output capacitor network should be as close as possible to the load for the best results.
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NCP1086
V
Conductor Parasitic
V
Conductor Parasitic
Protection Diodes
When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which V
drops. In the
IN
NCP1086 series linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 17 or Figure 18 is recommended.
IN4002 (optional)
V
IN
C
1
V
IN
NCP1086
Adj
V
OUT
V
OUT
R
1
C
2
R
2
R
IN
V
IN
NCP1086
V
OUT
C
Resistance
R
LOAD
Figure 19. Conductor Parasitic Resistance Effects
Can Be Minimized with the Above Grounding
Scheme for Fixed Output Regulators
For the adjustable regulator, the best load regulation occurs when R1 is connected directly to the output pin of the regulator as shown in Figure 20. If R1 is connected to the load, R
is multiplied by the divider ratio and the effective
C
resistance between the regulator and the load becomes
R1 ) R2
ǒ
R
C
R1
Ǔ
where RC = conductor parasitic resistance.
Resistance
R
LOAD
Figure 17. Protection Diode Scheme for Large Output
Capacitors (Adjustable Output)
IN4002 (optional)
V
IN
C
1
V
IN
NCP1086
GND
V
OUT
V
OUT
C
2
R
IN
V
IN
NCP1086
Adj
V
OUT
C
R
1
R
2
Figure 20. Grounding Scheme for the
Adjustable Output Regulator to Minimize
Parasitic Resistance Effects
Figure 18. Protection Diode Scheme for Large Output
Capacitors (3.3 V Fixed Output)
Output Voltage Sensing
Since the NCP1086 is a three terminal regulator, it is not possible to provide true remote load sensing. Load regulation is limited by the resistance of the conductors connecting the regulator to the load.
For best results the fixed output regulator should be connected as shown in Figure 19.
Calculating Power Dissipation and Heatsink Requirements
The NCP1086 linear regulator includes thermal shutdown and current limit circuitry to protect the device. High power regulators such as these usually operate at high junction temperatures so it is important to calculate the power dissipation and junction temperatures accurately to ensure that an adequate heatsink is used.
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NCP1086
The case is connected to V
, and electrical isolation
OUT
may be required for some applications. Thermal compound should always be used with high current regulators such as these.
The thermal characteristics of an IC depend on the
following four factors:
1. Maximum Ambient Temperature T
2. Power dissipation P
D
(W)
3. Maximum junction temperature T
4. Thermal resistance junction to ambient R
A
(°C)
J
(°C)
JA
q
(°C/W)
These four are related by the equation
TJ+ TA) PD R
qJA
(eq. 1)
The maximum ambient temperature and the power dissipation are determined by the design while the maximum junction temperature and the thermal resistance depend on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
P
D(max)
+
{
V
IN(max)
* V
OUT(min)
}
I
OUT(max)
) V
IN(max)IQ
(eq. 2)
where: V V I
OUT(max)
I
Q
is the maximum input voltage,
IN(max) OUT(min)
is the minimum output voltage,
is the maximum output current, for the application
is the maximum quiescent current at I
OUT(max)
.
A heatsink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air.
Each material in the heat flow path between the IC and the outside environment has a thermal resistance. Like series electrical resistances, these resistances are summed to determine R
, the total thermal resistance between the
JA
q
junction and the surrounding air.
1. Thermal Resistance of the junction to case, R
JC
q
(°C/W)
2. Thermal Resistance of the case to Heatsink, R
CS
q
(°C/W)
3. Thermal Resistance of the Heatsink to the ambient
SA
q
(°C/W)
air, R
These are connected by the equation:
R
qJA
The value for R
+ R
JA
q
qJC
) R
qCS
) R
qSA
is calculated using Equation 3 and the
(eq. 3)
result can be substituted in Equation 1.
The value for R
is 3.5°C/W. For a high current
JC
q
regulator such as the NCP1086 the majority of the heat is generated in the power transistor section. The value for R
depends on the heatsink type, while R
SA
q
depends on
CS
q
factors such as package type, heatsink interface (is an insulator and thermal grease used?), and the contact area between the heatsink and the package. Once these calculations are complete, the maximum permissible value of R
can be calculated and the proper heatsink selected.
JA
q
For further discussion on heatsink selection, see application note “Thermal Management,” document number AND8036/D via our website at www.onsemi.com.
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NCP1086
Adjustable
3.3 V
ORDERING INFORMATION
Device Type Package Shipping
NCP1086D2T−ADJ NCP1086D2T−ADJR4 NCP1086D2TADJR4G D2PAK
NCP1086ST−ADJT3 NCP1086ST−ADJT3G
NCP1086T−ADJ TO220 NCP1086T−ADJG TO220
NCP1086D2T−033 D2PAK 50 Units/Rail NCP1086D2T−33R4 D2PAK NCP1086D2T−33R4G D2PAK
NCP1086ST−33T3 NCP1086ST−33T3G
NCP1086T−033 TO220 NCP1086T−033G TO220
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
D2PAK D2PAK
(Pb−Free)
SOT−223 SOT−223
(Pb−Free)
(Pb−Free)
(Pb−Free)
SOT−223 SOT−223
(Pb−Free)
(Pb−Free)
50 Units/Rail
750 Tape & Reel
2500 Tape & Reel
50 Units/Rail
750 Tape & Reel
2500 Tape & Reel
50 Units/Rail
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TO−220−3
T SUFFIX
CASE 221A
D2PAK−3
D2T SUFFIX
CASE 418AB
MARKING DIAGRAMS
SOT−223
ST SUFFIX
CASE 318E
NCP1086
TO−220−3
T SUFFIX
CASE 221A
3.3 V Fixed OutputAdjustable Output
D
D2T SUFFIX
CASE 418AB
2
PAK−3
SOT−223
ST SUFFIX
CASE 318E
NCP1086−A
AWLYWW
1
NCP1086−A
AWLYWW
1
AYW
086−A
1
A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week
1086−33
AWLYWW
1
1086−33
AWLYWW
1
AYW
08633
1
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NCP1086
PACKAGE DIMENSIONS
TO−220−3
T SUFFIX
CASE 221A−08
ISSUE AA
−Y−
SEATING
−T−
PLANE
−B−
4
Q
123
F
T
C
S
A
U
H
K
L
V
G
D
3 PL
0.25 (0.010) Y
M
M
B
R
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
A 0.560 0.625 14.23 15.87 B 0.380 0.420 9.66 10.66 C 0.140 0.190 3.56 4.82 D 0.025 0.035 0.64 0.89
F 0.139 0.155 3.53 3.93 G 0.100 BSC 2.54 BSC H −−− 0.280 −−− 7.11
J 0.012 0.045 0.31 1.14 K 0.500 0.580 12.70 14.73
L 0.045 0.060 1.15 1.52 N 0.200 BSC 5.08 BSC Q 0.100 0.135 2.54 3.42 R 0.080 0.115 2.04 2.92
S 0.020 0.055 0.51 1.39
T 0.235 0.255 5.97 6.47 U 0.000 0.050 0.00 1.27
V 0.045 −−− 1.15 −−−
MILLIMETERSINCHES
N
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NCP1086
D2PAK−3
PACKAGE DIMENSIONS
CASE 418AB−01
ISSUE O
K
A
S
B
H
TERMINAL 4
E
M
U
V
L
P
G
D
W
N
R
−A−
C
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH AND METAL BURRS.
4. PACKAGE OUTLINE INCLUSIVE OF PLATING THICKNESS.
5. FOOT LENGTH MEASURED AT INTERCEPT POINT BETWEEN DATUM A AND LEAD SURFACE.
DIM MIN MAX MIN MAX
A 0.396 0.406 10.05 10.31 B 0.330 0.340 8.38 8.64 C 0.170 0.180 4.31 4.57 D 0.026 0.036 0.66 0.91
E 0.045 0.055 1.14 1.40 G 0.100 REF 2.54 REF H 0.580 0.620 14.73 15.75 K 0.055 0.066 1.40 1.68 L 0.000 0.010 0.00 0.25 M 0.098 0.108 2.49 2.74 N 0.017 0.023 0.43 0.58 P 0.090 0.110 2.29 2.79 R 0 8
°°0 8 °°
S 0.095 0.105 2.41 2.67 U 0.30 REF 7.62 REF V 0.305 REF 7.75 REF
W 0.010 0.25
MILLIMETERSINCHES
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0.08 (0003)
S
L
H
A F
4
123
G
NCP1086
PACKAGE DIMENSIONS
SOT−223
ST SUFFIX
CASE 318E−04
ISSUE K
B
D
C
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIMAMIN MAX MIN MAX
0.249 0.263 6.30 6.70
B 0.130 0.145 3.30 3.70 C 0.060 0.068 1.50 1.75 D 0.024 0.035 0.60 0.89
F 0.115 0.126 2.90 3.20 G 0.087 0.094 2.20 2.40 H 0.0008 0.0040 0.020 0.100
J
J 0.009 0.014 0.24 0.35 K 0.060 0.078 1.50 2.00
L 0.033 0.041 0.85 1.05 M 0 10 0 10
____
S 0.264 0.287 6.70 7.30
MILLIMETERS
K
SOLDERING FOOTPRINT*
2.0
0.079
2.3
0.091
2.0
0.079
1.5
0.059
*For additional information on our Pb−Free strategy
and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
PACKAGE THERMAL DATA
Parameter
R
q
JC
R
q
JA
Typical 3.5 3.5 15 °C/W Typical 50 10−50* 156 °C/W
* Depending on thermal properties of substrate. R
TO−220−3 D2PAK−3 SOT−223 Unit
3.8
0.15
q
JA
2.3
0.091
= R
SCALE 6:1
+ R
q
JC
6.3
0.248
q
CA
mm
ǒ
inches
Ǔ
http://onsemi.com
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NCP1086
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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NPC1086/D
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