The NC7SZU04 is a single unbuffered inverter from
ON Semiconductor’s Ultra−High Speed series of TinyLogic. The
special purpose unbuffered circuit design is primarily intended for
crystal oscillator or analog applications. The device is fabricated with
advanced CMOS technology to achieve ultra−high speed with high
output drive while maintaining low static power dissipation over a
broad V
1.65 V to 5.5 V V
Features
• Unbuffered for Crystal Oscillator and Analog Applications
• Balanced Output Drive: ±32 mA at 4.5 V V
• Broad V
• Matches Performance of LCX Operated at 3.3 V V
• Low Quiescent Power: I
• Ultra−Small MicroPak Packages
• Space−Saving SC−74A and SC−88A Packages
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
operating range. The device is specified to operate over the
CC
range.
CC
CC
Operating Range: 1.65 V to 5.5 V
CC
CC
< 2 mA, VCC = 5.5 V, TA = 25°C
CC
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SIP6
CASE 127EB
Pin 1
UDFN6
CASE 517DP
Pin 1
SC−74A
CASE 318BQ
MARKING
DIAGRAMS
C5KK
XYZ
C5KK
XYZ
7ZU4MG
G
IEEE / IEC
1
Figure 1. Logic Symbol
YA
C5, 7ZU4, ZU4 = Specific Device Code
KK= 2−Digit Lot Run Traceability Code
XY= 2−Digit Date Code Format
Z= Assembly Plant Code
M= Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
SC−88A
CASE 419A−02
ZU4MG
G
Semiconductor Components Industries, LLC, 1996
January, 2021 − Rev. 4
1Publication Order Number:
NC7SZU04/D
Pin Configurations
NC7SZU04
NC
1
A
2
GNDY
3
Figure 2. SC88A and SC−74A (Top View)
PIN DEFINITIONS
Pin # SC−88A /
SC74A
11, 5NC No Connect
22A Input
33GND Ground
44Y Output
56V
Pin # MicroPakNameDescription
5
4
Supply Voltage
CC
V
CC
NC 16 V
A 25 NC
GND 34 Y
CC
Figure 3. MicroPak (Top Through View)
FUNCTION TABLE
InputsOutput
AY
LH
HL
H = HIGH Logic Level
L = LOW Logic Level
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2
NC7SZU04
ABSOLUTE MAXIMUM RATINGS
SymbolParameterMinMaxUnit
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
ICC or I
T
STG
T
J
T
L
P
D
ESD
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Supply Voltage−0.56.5V
DC Input Voltage−0.56.5V
DC Output Voltage−0.5VCC + 0.5V
DC Input Diode CurrentVIN < 0 V−−50mA
DC Output Diode Current
V
< 0 V−−50
OUT
V
OUT
> V
CC
−+50
DC Output Current−±50mA
DC VCC or Ground Current−±50mA
GND
Storage Temperature Range−65+150°C
Junction Temperature Under Bias−+150°C
Junction Lead Temperature (Soldering, 10 Seconds)−+260°C
Power Dissipation in Still Air
SC−74A−390
SC−88A−332
MicroPak−6−812
MicroPak2−6−812
Human Body Model, JEDEC: JESD22−A114−4000
Charge Device Model, JEDEC: JESD22−C101−2000
mA
mW
V
RECOMMENDED OPERATING CONDITIONS
SymbolParameterConditionsMinMaxUnit
V
CC
Supply Voltage Operating1.655.5
Supply Voltage Data Retention1.505.5
V
V
OUT
T
q
IN
JA
Input Voltage05.5V
Output Voltage0V
Operating Temperature−40+85°C
A
Thermal Resistance
SC−74A−320
CC
SC−88A−377
MicroPak−6−154
MicroPak2−6−154
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
V
V
°C/W
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3
DC ELECTICAL CHARACTERISTICS
Symbol
V
IH
V
IL
V
OH
V
OL
I
IN
I
CC
I
CCPEAK
ParameterConditionsV
HIGH Level Input
Voltage
LOW Level Input
Voltage
High−Level Output
Voltage
Low−Level Output
Voltage
VIN = GND
IOH = −100 mA
= −4 mA
I
OH
IOH = −8 mA
I
= −12 mA
OH
IOH = −16 mA
I
= −24 mA
OH
IOH = −32 mA
VIN = V
CC
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
I
= 12 mA
OL
IOL = 16 mA
I
= 24 mA
OL
= 32 mA
I
OL
Input Leakage
Current
Quiescent Supply
Current
Peak Supply
Current in Analog
Operation
V
= 5.5 V, GND1.65 to 5.5−−±1−±10
IN
V
= 5.5 V, GND1.65 to 5.5−−2−20
IN
V
= Open, VIN = Adjust
OUT
for Peak I
CC
Current
NC7SZU04
TA = +25°CTA = −40 to +85°C
(V)
CC
1.8 to 2.70.85 V
3.0 to 5.50.80 V
1.8 to 2.7−−0.15 V
3.0 to 5.5−−0.20 V
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
1.8−2−−−
2.5−4−−−
3.3−10−−−
5.0−30−−−
MinTypMaxMinMax
−−0.85 V
CC
CC
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
−
−
−
−
−
−
−
−−0.80 V
CC
CC
V
CC
1.4
2.1
2.4
2.7
2.5
4.0
−
0.08
0.2
0.22
0.28
0.38
0.42
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
CC
CC
−0.15 V
−0.20 V
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
CC
CC
Unit
V
V
V
V
mA
mA
mA
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4
NC7SZU04
AC ELECTRICAL CHARACTERISTICS
TA = +25°CTA = −40 to +85°C
SymbolParameterV
t
, t
PLH
Propagation Delay
PHL
(Figure 4, 5)
(V)Conditions
CC
C
1.65
1.80−−8.5−9.0
= 15 pF,
L
= 1 MW
R
L
2.50 ±0.20−−6.2−6.5
3.30 ±0.30−−4.5−4.8
5.00 ±0.50−−3.9−4.1
C
3.30 ±0.30
5.00 ±0.50−−5.0−5.5
C
C
Input Capacitance0.00−4.5−−−pF
IN
Power Dissipation Capacitance
PD
(Note 2)
(Figure 6)
3.30−6.3−−−
5.00−9.5−−−
= 50 pF,
L
= 500 W
R
L
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
no output loading and operating at 50% duty cycle. C
= (CPD) (VCC) (fIN) + (ICCstatic).
I
CCD
is related to I
PD
CCD
MinTy pMaxMinMax
−−11.7−12.1
−−6.0−6.5
dynamic operating current by the expression:
Unit
pF
CCD
ns
) at
V
CC
INPUTOUTPUT
C
R
L
L
NOTE:
3. C
includes load and stray capacitance.
L
4. Input PRR = 1.0 MHz; t
= 500 ns
W
Figure 4. AC Test CircuitFigure 5. AC Waveforms
INPUT
tr = 3 ns
INPUT
OUTPUT
V
CC
A
10%
50%
t
PLH
90%
t
W
50%
90%
50%
t
50%
PHL
10%
tf = 3 ns
V
CC
GND
V
OH
V
OL
NOTE:
5. When operating the NC7SZU04’s unbuffered output stage in its linear range, as in oscillator applications, care must be taken to observe
maximum power rating for the device and package. The high drive nature of the design of the output stage results in substantial simultaneous
specification in the DC Electrical Characteristics table.
conduction currents when the stage is in the linear region. See the I
= t
6. Input = AC Waveform; t
= 1.8 ns; PRR = Variable; Duty Cycle = 50%.
r
f
Figure 6. I
CCD
CCPEAK
Test Circuit
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5
NC7SZU04
ORDERING INFORMATION
Part NumberTop MarkPackagesShipping
NC7SZU04M5X7ZU4SC−74A3000 / Tape & Reel
NC7SZU04P5XZU4SC−88A3000 / Tape & Reel
NC7SZU04L6XC5SIP6, MicroPak5000 / Tape & Reel
NC7SZU04FHXC5UDFN6, MicroPak25000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
†
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
5
1
SCALE 2:1
b
5X
0.20
C AB
54
E1
123
B
A
D
TOP VIEW
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
E
e
A
SEATING
C
PLANE
0.05
SC−74A
CASE 318BQ
ISSUE B
A1
DETAIL A
c
END VIEW
DATE 18 JAN 2018
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
M
L
DETAIL A
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
MILLIMETERS
DIM MINMAX
A0.901.10
A10.010.10
b0.250.50
c0.100.26
D
2.853.15
E2.503.00
E1
1.351.65
e0.95 BSC
L0.200.60
M0 10
__
GENERIC
MARKING DIAGRAM*
XXX MG
G
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
XXX= Specific Device Code
M= Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
SCALE 2:1
CASE 419A−02
ISSUE L
DATE 17 JAN 2013
S
0.40
0.0157
A
G
12 3
H
SOLDER FOOTPRINT
0.50
0.0197
D
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
XXX = Specific Device Code
M= Date Code
G= Pb−Free Package
0.65
0.025
0.65
0.025
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
1.9
0.0748
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
PAGE 1 OF 1
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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