ON Semiconductor NC7SZ373 User manual

Page 1
TinyLogic UHS D-Type Latch with 3-STATE Output
NC7SZ373
Description
Features
Space Saving SC88 6Lead Package
Ultra Small MicroPak Leadless Package
Ultra High Speed: t
= 2.6 ns Typ into 50 pF at 5 V V
PD
High Output Drive: ±24 mA at 3 V V
Broad V
Operating Range: 1.65 V to 5.5 V
CC
Matches the Performance of LCX when Operated at 3.3 V V
Power Down High Impedance Inputs / Output
Overvoltage Tolerant Inputs Facilitate 5 V to 3 V Translation
Patented Noise / EMI Reduction Circuitry Implemented
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
operating range. The device
CC
range. The inputs
CC
is 0 V. Inputs tolerate
CC
operating voltage. The latch
CC
in the 3STATE condition.
CC
CC
CC
CC
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MARKING
DIAGRAMS
SIP6 1.45x1.0
CASE 127EB
Pin 1
SC88
CASE 419B02
D4, Z73 = Specific Device Code KK = 2Digit Lot Run Traceability Code XY = 2−Digit Date Code Format Z = Assembly Plant Code M = Date Code* G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
D4KK
XYZ
6
Z73M
G
1
G
IEEC / IEC
OE
LE
D
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 2004
January, 2021 Rev. 2
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the package dimensions section on page 7 of this data sheet.
Q
1 Publication Order Number:
NC7SZ373/D
Page 2
Connection Diagrams
NC7SZ373
LE OE
1
GND V
2
DQ
3
LE
DQ
6
5
CC
4
Figure 2. SC88 (Top View)
(Top View) AAA
Pin One
AAA = Product Code Top Mark − see ordering code
NOTE: Orientation of Top Mark determines Pin One location.
Read the top product code mark left to right, Pin One is the lower left pin (see diagram).
Figure 3. Pin 1 Orientation
LE 1 6 OE
GND 2 5 V
D 3 4 Q
CC
Figure 4. MicroPak (Top Through View)
PIN DESCRIPTIONS
Pin Name Description
D Data Input
CP Latch Enable Input
OE Output Enable Input
Q Latch Output
FUNCTION TABLE
Inputs Output
LE D OE Q
H L L L
H H L H
L X L Q
X X H Z
H = HIGH Logic Level X = Immaterial L = LOW Logic Level Z = HIGH Impedance Q
= Previous state prior to HIGHtoLOW transition of latch
n1
enable
n1
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Page 3
NC7SZ373
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
ICC / I
T
STG
T
J
T
L
P
D
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Max Unit
V
CC
V
IN
V
OUT
tr, t
f
T
A
q
JA
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
Supply Voltage −0.5 +6.5 V
DC Input Voltage −0.5 +6.5 V
DC Output Voltage −0.5 +6.5 V
DC Input Diode Current VIN < 0 V 50 mA
DC Output Diode Current V
< 0 V 50 mA
OUT
DC Output Source / Sink Current ±50 mA
DC VCC / GND Current ±50 mA
GND
Storage Temperature Range −65 +150 °C
Junction Temperature under Bias 150 °C
Junction Lead Temperature (Soldering, 10 Seconds) 260 °C
Power Dissipation in Still Air
SC88 332
MicroPak 812
Supply Voltage Operating 1.65 5.5
Supply Voltage Data Retention 1.5 5.5
Input Voltage 0 5.5 V
Output Voltage
Active State 0 V
CC
3STATE 0 5.5 V
Input Rise and Fall Time
VCC = 1.8 V, 2.5 V ±0.2 V 0 20
VCC = 3.3 V ±0.3 V 0 10
V
= 5.5 V ±0.5 V 0 5
CC
Operating Temperature −40 +85 °C
Thermal Resistance
SC88 377
MicroPak 154
mW
V
V
ns/V
°C/W
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Page 4
DC ELECTICAL CHARACTERISTICS
Symbol Parameter V
V
V
V
V
I
I
OFF
I
HIGH Level Control
IH
Input Voltage
LOW Level Control
IL
Input Voltage
HIGH Level Control
OH
Output Voltage
LOW Level Control
OL
Output Voltage
I
Input Leakage
IN
Current
3STATE Output
OZ
Leakage
Power Off Leakage Current
Quiescent Supply
CC
Current
CC
1.65 to 1.95 0.65 V
2.3 to 5.5 0.7 V
1.65 to 1.95 0.35 V
2.3 to 5.5 0.3 V
1.65
1.8 1.7 1.8 1.7
2.3 2.2 2.3 2.2
3.0 2.9 3.0 2.9
4.5 4.4 4.5 4.4
1.65 I
2.3 I
3.0 I
3.0 I
4.5 I
1.65
1.8 0.0 0.1 0.1
2.3 0.0 0.1 0.1
3.0 0.0 0.1 0.1
4.5 0.0 0.1 0.1
1.65 I
2.3 I
3.0 I
3.0 I
4.5 I
1.65 to 5.5 0 VIN 5.5 V ±0.1 ±1.0
1.65 to 5.5 V
0.0 VIN or V
1.65 to 5.5 V
NC7SZ373
(V) Conditions
V
= V
IN
or V
IL
V
= V
IN
or V
IL
= VIL or V
IN
0 V
OUT
= 5.5 V, GND 1.0 10
IN
I
= 100 mA 1.55 1.65 1.55
IH
OH
= 4 mA 1.24 1.52 1.29
OH
= 8 mA 1.9 2.15 1.9
OH
= 16 mA 2.4 2.8 2.4
OH
= 24 mA 2.3 2.68 2.3
OH
= 32 mA 3.8 4.2 3.8
OH
I
= 100 mA 0.0 0.08 0.0
IH
OL
= 4 mA 0.08 0.24 0.24
OL
= 8 mA 0.10 0.3 0.3
OL
= 16 mA 0.15 0.4 0.4
OL
= 24 mA 0.22 0.55 0.55
OL
= 32 mA 0.22 0.55 0.55
OL
IH
5.5 V
= 5.5 V 1.0 10
OUT
TA = +25°C TA = 40 to +85°C
Min Typ Max Min Max
0.65 V
CC
0.7 V
CC
CC
CC
CC
CC
0.35 V
0.3 V
±0.5 ±5.0
CC
CC
Unit
V
V
V
V
mA
mA
mA
mA
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AC ELECTRICAL CHARACTERISTICS
Symbol Parameter V
t
PLH
t
PHL
t
PLH
t
PHL
t
PZL
t
PZH
t
PLZ
t
PHZ
t
t
t
Propagation Delay D to Q
Propagation Delay LE to Q
Output Enable Time
Output Disable Time
Setup Time, D to LE
S
Hold Time, D to LE
H
Pulse Width, LE
W
(V) Conditions
CC
1.65 C
1.8 6.1 10.0 10.5
2.5 ±0.2 3.6 6.5 6.8
3.3 ±0.3 2.7 4.6 5.0
5.0 ±0.5 2.0 3.4 3.7
3.3 ±0.3 C
5.0 ±0.5 2.6 4.3 4.8
1.65 C
1.8 6.0 9.6 10.0
2.5 ±0.2 3.5 6.1 6.6
3.3 ±0.3 2.6 4.4 4.8
5.0 ±0.5 2.0 3.2 3.5
3.3 ±0.3 C
5.0 ±0.5 2.6 4.2 4.6
1.65
1.8 6.0 9.0 9.5
2.5 ±0.2 3.7 6.0 6.6
3.3 ±0.3 2.8 5.0 5.3
5.0 ±0.5 2.2 3.7 3.9
1.65
1.8 5.1 8.0 8.5
2.5 ±0.2 3.5 6.0 6.3
3.3 ±0.3 2.8 4.5 4.7
5.0 ±0.5 2.3 3.7 3.9
2.5 ±0.2 C
3.3 ±0.3 1.5
5.0 ±0.5 1.5
2.5 ±0.2 C
3.3 ±0.3 1.5
5.0 ±0.5 1.5
2.5 ±0.2 C
3.3 ±0.3 3.0
5.0 ±0.5 3.0
NC7SZ373
= 15 pF, R
L
= Open
S
1
(Figures 5, 7)
= 50 pF, R
L
= Open
S
1
(Figures 5, 7)
= 15 pF, R
L
S1 = Open (Figures 5, 7)
= 50 pF, R
L
= Open
S
1
(Figures 5, 8)
C
= 50 pF, VI = 2 x VCC,
L
, R
R
U
D
= GND for t
S
1
S1 = VI for t (Figures 5, 8)
C
= 50 pF, VI = 2 x VCC,
L
, R
R
U
D
= GND for t
S
1
S1 = VI for t (Figures 5, 8)
= 50 pF, R
L
= Open
S
1
(Figures 5, 9)
= 50 pF, R
L
= Open
S
1
(Figures 5, 9)
= 50 pF, R
L
= Open
S
1
(Figures 5, 9)
= 500 W,
PZL
= 500 W,
PLZ
= 1 MW,
D
= 500 W
D
= 1 MW,
D
= 500 W,
D
PZH
PHZ
= 500 W,
D
= 500 W,
D
= 500 W,
D
TA = +25°C TA = 40 to +85°C
Min Typ Max Min Max Unit
9.0 15.0 16.0
ns
3.3 5.5 6.2
9.0 1.45 15.0
ns
3.3 5.3 6.2
9.0 13.5 14.6
7.7 12.0 13.0
2.0
1.5
3.0
ns
ns
ns
ns
ns
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Page 6
NC7SZ373
CAPACITANCE (T
Symbol
C
C
C
Input Capacitance VCC = Open, VIN = 0 V or V
IN
Output Capacitance VCC = 3.3 V, VIN = 0 V or V
OUT
Power Dissipation Capacitance
PD
(Note 2)
= +25°C, f = 1 MHz)
A
Parameter Condition Typ Max Units
CC
CC
VCC = 3.3 V VCC = 5.0 V
3 pF
4 pF
14 17
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
no output loading and operating at 50% duty cycle. (See Figure 6)
is related to I
C
PD
dynamic operating current by the expression: I
CCD
= (CPD) (VCC) (fIN) + (ICCstatic).
CCD
AC Loading and Waveforms
V
CC
A
r
Test Circuit
CCD
= t
Q Output
= 1.8 ns;
f
OE
V
CC
OE
LE
D
Q
RU
C
RD
L
CL includes load and stray capacitance Input PRR = 1.0 MHz, t
= 500 ns.
W
Figure 5. AC Test Circuit
V OPEN
GND
OUTPUT
IN
LE Input
D Input
D Input = AC Waveform; t D Input PRR = 10 MHz; Duty Cycle = 50%.
Figure 6. I
CCD
pF
) at
Figure 8. AC Waveforms
Figure 7. AC Waveforms
Figure 9. AC Waveforms
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Page 7
NC7SZ373
ORDERING INFORMATION
Device Top Mark Packages Shipping
NC7SZ373P6X Z73 6Lead SC70, EIAJ SC88, 1.25 mm Wide 3000 / Tape & Reel
NC7SZ373L6X D4 6Lead MicroPak, 1.00 mm Wide 5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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Page 8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON13590G
SIP6 1.45X1.0
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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Page 9
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC88/SC706/SOT363
1
SCALE 2:1
D
A
654
E
123
2X
bbb H
D
e
B
TOP VIEW
6X
ccc
C
SIDE VIEW END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.30
0.65
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
2X
aaa H D
D
E1
L2
aaa C
2X 3 TIPS
b
6X
M
A2
A
A1
C
6X
0.66
SEATING PLANE
2.50
DIMENSIONS: MILLIMETERS
Cddd
A-B D
DETAIL A
CASE 419B02
ISSUE Y
H
L
DETAIL A
GAGE PLANE
DATE 11 DEC 2012
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU­SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI­TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT.
MILLIMETERS
DIM MIN NOM MAX
A −−− −−− 1.10 A1 0.00 −−− 0.10 A2 0.70 0.90 1.00 0.027 0.035 0.039
b 0.15 0.20 0.25
C 0.08 0.15 0.22
D 1.80 2.00 2.20
E
2.00 2.10 2.20
E1 1.15 1.25 1.35
e 0.65 BSC
L 0.26 0.36 0.46 L2 0.15 BSC 0.006 BSC
aaa 0.15 0.006 bbb 0.30 0.012 ccc 0.10 0.004 ddd
c
0.10 0.004
INCHES
MIN NOM MAX
−−− −−− 0.043
0.000 −−− 0.004
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
0.078 0.082 0.086
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
GENERIC
MARKING DIAGRAM*
6
XXXMG
G
1
XXX = Specific Device Code M = Date Code* G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
*This information is generic. Please refer to
device data sheet for actual part marking. PbFree indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98ASB42985B
SC88/SC706/SOT363
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
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Page 10
SC88/SC706/SOT363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 7:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
4. SOURCE 1
5. DRAIN 1
6. GATE 2
STYLE 13:
PIN 1. ANODE
2. N/C
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 19:
PIN 1. I OUT
2. GND
3. GND
4. V CC
5. V EN
6. V REF
STYLE 25:
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
5. EMITTER
6. COLLECTOR 1
STYLE 2:
CANCELLED
STYLE 8:
CANCELLED
STYLE 14:
PIN 1. VREF
2. GND
3. GND
4. IOUT
5. VEN
6. VCC
STYLE 20:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 3:
CANCELLED
STYLE 9:
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
5. BASE 2
6. COLLECTOR 2
STYLE 15:
PIN 1. ANODE 1
2. ANODE 2
3. ANODE 3
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
STYLE 21:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. N/C
6. CATHODE 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
6. ANODE
STYLE 10:
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
4. DRAIN 1
5. DRAIN 2
6. GATE 2
STYLE 16:
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
5. EMITTER 1
6. COLLECTOR 1
STYLE 22:
PIN 1. D1 (i)
2. GND
3. D2 (i)
4. D2 (c)
5. VBUS
6. D1 (c)
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment.
STYLE 5:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 11:
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
STYLE 17:
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
5. EMITTER 2
6. COLLECTOR 1
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
4. N/C
5. CH2
6. N/C
STYLE 29:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
STYLE 6:
PIN 1. ANODE 2
2. N/C
3. CATHODE 1
4. ANODE 1
5. N/C
6. CATHODE 2
STYLE 12:
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
STYLE 18:
PIN 1. VIN1
2. VCC
3. VOUT2
4. VIN2
5. GND
6. VOUT1
STYLE 24:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
STYLE 30:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98ASB42985B
SC88/SC706/SOT363
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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Page 11
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