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NC7SZ32
User manual
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ON Semiconductor NC7SZ32 User manual

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TinyLogic UHS Two-Input OR Gate
NC7SZ32
Description
Features
• Ultra−High Speed: t
= 2.4 ns (Typical) into 50 pF at 5 V V
PD
• High Output Drive: ±24 mA at 3 V V
• Broad V
Operating Range: 1.65 V to 5.5 V
CC
• Matches Performance of LCX Operated at 3.3 V V
• Power Down High−Impedance Inputs / Outputs
• Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
• Proprietary Noise / EMI Reduction Circuitry
• Ultra−Small MicroPak Packages
• Space−Saving SC−74A and SC−88A Packages
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
operating range. The device is
CC
operating range. The
CC
is 0 V. Inputs tolerate
CC
operating voltage.
CC
CC
CC
CC
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SIP6
CASE 127EB
Pin 1
UDFN6
CASE 517DP
Pin 1
SC−74A
CASE 318BQ
MARKING
DIAGRAMS
HHKK
XYZ
HHKK
XYZ
7Z32 M•
•
IEEE / IEC
A B
Figure 1. Logic Symbol
≥1
SC−88A
CASE 419A−02
Y
HH, 7Z32, Z32= Specific Device Code KK = 2−Digit Lot Run Traceability Code XY = 2−Digit Date Code Format Z = Assembly Plant Code M = Date Code
• = Pb−Free Package (Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet.
Z32 M•
•
Semiconductor Components Industries, LLC, 1996
January , 2021 − Rev. 4
1 Publication Order Number:
NC7SZ32/D
Pin Configurations
PIN DEFINITIONS
Pin # SC−88A /
Pin # MicroPak
Name
Description
11A
Input
22B
Input
3
3
GND
Ground
44Y
Output
56VCC Supply Voltage
5
NC
No Connect
FUNCTION TABLE (Y = A + B)
Inputs
Output
ABY
LLL
LHH
HLH
HHH
H = HIGH Logic Level
NC7SZ32
A
1
B
2
GND Y
3
5
4
Figure 2. SC−88A and SC−74A (Top View)
SC74A
V
CC
A 1 6 V
B 2 5 NC
GND 3 4 Y
CC
Figure 3. MicroPak (Top Through View)
L = LOW Logic Level
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2
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
Max
Unit
VCCSupply Voltage
−0.5
6.5
V
V
IN
DC Input Voltage
−0.5
6.5
V
V
DC Output Voltage
−0.5
6.5
V
IIKDC Input Diode Current
VIN < 0 V−−50
mA
IOKDC Output Diode Current
V
< 0 V−−50
mA
I
DC Output Current
−±50
mA
ICC or I
DC VCC or Ground Current
−±50
mA
T
Storage Temperature Range
−65
+150
C
T
Junction Temperature Under Bias
−
+150
C
T
Junction Lead Temperature (Soldering, 10 Seconds)
−
+260
C
SC−74A−390
SC−88A−332
MicroPak−6−812
MicroPak2−6
−
812
Human Body Model, JEDEC: JESD22−A114
−
4000
Charge Device Model, JEDEC: JESD22−C101
−
2000
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
Max
Unit
Supply Voltage Operating
1.65
5.50
Supply Voltage Data Retention
1.50
5.50
VINInput Voltage
0
5.5
V
V
Output Voltage
0
VCCV
TAOperating Temperature
−40
+85
C
VCC = 1.8 V, 2.5 V ±0.2 V
0
20
VCC = 3.3 V ±0.3 V
0
10
VCC = 5.0 V ±0.5 V
0
5
SC−74A−320
SC−88A−377
MicroPak−6−154
MicroPak2−6
−
154
OUT
OUT
STG
P
J L D
GND
Power Dissipation in Still Air
NC7SZ32
OUT
°
°
°
mW
ESD
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
V
CC
OUT
V
°
tr, t
q
JA
Input Rise and Fall Times
f
Thermal Resistance
ns/V
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7SZ32
DC ELECTICAL CHARACTERISTICS
l
TA = +25°C
TA = −40 to +85°C
Min
Typ
Max
Min
Max
1.65 to 1.95
0.65 VCC−−0.65 VCC−
2.30 to 5.50
0.70 VCC−−0.70 VCC−
1.65 to 1.95
−−0.35 VCC−
0.35 V
2.30 to 5.50
−−0.30 VCC−
0.30 V
1.65
1.55
1.65−1.55
−
1.80
1.70
1.80−1.70
−
2.30
2.20
2.30−2.20
−
3.00
2.90
3.00−2.90
−
4.50
4.40
4.50−4.40
−
1.65
I
= −4 mA
1.29
1.52−1.29
−
2.30
I
= −8 mA
1.90
2.15−1.90
−
3.00
I
= −16 mA
2.40
2.80−2.40
−
3.00
I
= −24 mA
2.30
2.68−2.30
−
4.50
I
= −32 mA
3.80
4.20−3.80
−
1.65
−
0.00
0.10−0.10
1.80
−
0.00
0.10−0.10
2.30
−
0.00
0.10−0.10
3.00
−
0.00
0.10−0.10
4.50
−
0.00
0.10−0.10
1.65
I
= 4 mA
−
0.80
0.24−0.24
2.30
I
= 8 mA
−
0.10
0.30−0.30
3.00
I
= 16 mA
−
0.15
0.40−0.40
3.00
I
= 24 mA
−
0.22
0.55−0.55
4.50
I
= 32 mA
−
0.22
0.55−0.55
IIN Input Leakage Current
1.65 to 5.50
V
= 5.5 V, GND
−
−±1
−±10
A
I
Power Off Leakage Current
0
V
or V
= 5.5 V
−−1−10
A
ICC Quiescent Supply Current
1.65 to 5.50
V
= 5.5 V, GND
−−2.0−20
A
Symbo
V
IH
V
IL
V
OH
V
OL
Parameter V
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
LOW Level Output Voltage
(V) Conditions
CC
V
= VIH or VIL,
IN
= −100 mA
I
OH
OH OH OH OH OH
V
= VIH or VIL,
IN
= 100 mA
I
OL
CC CC
Unit
V
V
V
V
OFF
OL OL OL OL OL
IN IN IN
OUT
m
m
m
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4
NC7SZ32
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
TA = −40 to +85°C
Min
Typ
Max
Min
Max
1.65
−
5.5
12.0−12.7
1.80
−
4.6
10.0−10.5
2.50 ±0.30
−
3.0
7.0−7.5
3.30 ±0.30
−
2.4
4.7−5.0
5.00 ±0.50
−
1.9
4.1−4.4
3.30 ±0.30
−
3.0
5.2−5.5
5.00 ±0.50
−
2.4
4.5−4.8
CINInput Capacitance
0.00
−4−−−
pF
3.30
−20−−−
5.00
−26−−−
Symbol Parameter V
t
, t
PLH
C
Propagation Delay
PHL
(Figure 4, 5)
Power Dissipation Capacitance
PD
(Note 2)
(Figure 6)
(V) Conditions
CC
C
= 15 pF,
L
= 1 MW
R
L
C
= 50 pF,
L
= 500 W
R
L
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I no output loading and operating at 50% duty cycle. C
= (CPD) (VCC) (fIN) + (ICCstatic).
I
CCD
V
CC
INPUT
C
L
R
L
OUTPUT
is related to I
PD
dynamic operating current by the expression:
CCD
Unit
CCD
ns
pF
) at
NOTE:
includes load and stray capacitance.
3. C
L
Input PRR = 10 MHz, t
= 500 ns
w
Figure 4. AC Test Circuit Figure 5. AC Waveforms
V
CC
A
INPUT
NOTE:
= t
4. Input = AC Waveform; t PRR = 10 MHz; Duty Cycle = 50%.
r
= 1.8 ns;
f
Figure 6. ICCD Test Circuit
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5
NC7SZ32
ORDERING INFORMATION
Part Number
Top Mark
Packages
Shipping
†
NC7SZ32M5X
7Z32
SC−74A
3000 / Tape & Reel
NC7SZ32P5X
Z32
SC−88A
3000 / Tape & Reel
NC7SZ32L6XHHSIP6, MicroPak
5000 / Tape & Reel
NC7SZ32FHX
HH
UDFN6, MicroPak2
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON13590G
SIP6 1.45X1.0
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
5
1
SCALE 2:1
b
5X
0.20
C AB
54
E1
123
B
A
D
TOP VIEW
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
E
e
A
SEATING
C
PLANE
0.05
SC−74A
CASE 318BQ
ISSUE B
A1
DETAIL A
c
END VIEW
DATE 18 JAN 2018
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
M
L
DETAIL A
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE.
MILLIMETERS
DIM MIN MAX
A 0.90 1.10
A1 0.01 0.10
b 0.25 0.50 c 0.10 0.26 D
2.85 3.15
E 2.50 3.00
E1
1.35 1.65
e 0.95 BSC L 0.20 0.60 M 0 10
__
GENERIC
MARKING DIAGRAM*
XXX MG
G
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
XXX = Specific Device Code M = Date Code G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Some products may not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
SCALE 2:1
CASE 419A−02
ISSUE L
DATE 17 JAN 2013
S
0.40
0.0157
A
G
12 3
H
SOLDER FOOTPRINT
0.50
0.0197
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD 419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
45
−B−
MM
5 PL
B0.2 (0.008)
N
MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
INCHES
DIMAMIN MAX MIN MAX
B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC H --- 0.10---0.004 J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087
MILLIMETERS
1.80 2.200.071 0.087
J
C
GENERIC MARKING
DIAGRAM*
K
XXXMG
G
XXX = Specific Device Code M = Date Code G = Pb−Free Package
0.65
0.025
0.65
0.025
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.
1.9
0.0748
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
98ASB42984B
SC−88A (SC−70−5/SOT−353)
SCALE 20:1
STYLE 3:
PIN 1. ANODE 1
STYLE 8:
PIN 1. CATHODE
mm
ǒ
Ǔ
inches
STYLE 4:
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment.
PAGE 1 OF 1
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON13593G
UDFN6 1.0X1.0, 0.35P
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
. ON Semiconductor reserves the right to make changes without further notice to any products herein.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
TECHNICAL SUPPORT North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910
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