Page 1
TinyLogic UHS 2-Input
Non-Inverting Multiplexer
NC7SZ157
Description
The NC7SZ157 is a single, high performance, 2−to−1 CMOS
non−inverting multiplexer from ON Semiconductor’s Ultra−High
Speed series of TinyLogic. The device is fabricated with advanced
CMOS technology to achieve ultra high speed with high output drive
while maintaining low static power dissipation over a broad V
operating range. The device is specified to operate over the 1.65 V to
5.5 V V
impedance when V
independent of V
Features
• Broad V
operating range. The inputs and outputs are high
CC
is 0 V. Inputs tolerate voltages up to 5.5 V
CC
operating range.
CC
Operating Range: 1.65 V to 5.5 V
CC
• Ultra High−Speed
• Power Down High−Impedance Inputs / Outputs
• Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
• Proprietary Noise / EMI Reduction Circuitry
• Ultra−Small MicroPak Packages
• Space−Saving SC−88 Package
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
CC
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SIP6 1.45x1.0
CASE 127EB
Pin 1
UDFN6
1.0X1.0, 0.35P
CASE 517DP
Pin 1
SC−88
CASE 419B−02
MARKING
DIAGRAMS
B9KK
XYZ
B9KK
XYZ
6
ZF7M
G
1
G
IEEC / IEC
S
MUX
0
I
0
I
1
1
Figure 1. Logic Symbol
B9, ZF7 = Specific Device Code
KK = 2−Digit Lot Run Traceability Code
XY = 2−Digit Date Code Format
Z = Assembly Plant Code
M = Date Code*
G = Pb−Free Package
Z
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
Semiconductor Components Industries, LLC, 2000
January, 2021 − Rev. 4
1 Publication Order Number:
NC7SZ157/D
Page 2
Pin Configurations
NC7SZ157
1
I
1
6
S
1
2
GND V
5
CC
0
I
3
0
Z
4
Figure 2. SC−88 (Top View)
(Top View) AAA
Pin One
NOTES:
1. AAA represents product code top mark (see Ordering Information).
2. Orientation of top mark determines pin one location.
3. Reading the top mark left to right, pin one is the lower left pin.
Figure 4. Pin 1 Orientation
PIN DEFINITIONS
Pin # SC−88 Pin # MicroPak Name Description
1 1 I
2 2 GND Ground
3 3 I
4 4 Z Output
5 5 V
6 6 S Control Input
1
0
CC
Data Input
Data Input
Supply Voltage
I1 1 6 S
GND 2 5 V
I0 3 4 Z
Figure 3. MicroPak (Top Through View)
FUNCTION TABLE
Inputs Output
S I
1
L X L L
L X H H
H L X L
H H X H
H = HIGH Logic Level
L = LOW Logic Level
X = Don’t Care
I
0
CC
Z = (I0) · (S) + (I1) · (S)
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2
Page 3
NC7SZ157
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
ICC or I
T
STG
T
J
T
L
P
D
ESD
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Supply Voltage −0.5 6.5 V
DC Input Voltage −0.5 6.5 V
DC Output Voltage −0.5 6.5 V
DC Input Diode Current VIN < 0 V − −50 mA
DC Output Diode Current V
< 0 V − −50 mA
OUT
DC Output Current − ±50 mA
DC VCC or Ground Current − ±50 mA
GND
Storage Temperature Range −65 +150 °C
Junction Temperature Under Bias − +150 °C
Junction Lead Temperature (Soldering, 10 Seconds) − +260 °C
Power Dissipation in Still Air
SC−88 − 332
MicroPak−6 − 812
MicroPak2−6 − 812
Human Body Model, JEDEC: JESD22−A114 − 4000
Charge Device Model, JEDEC: JESD22−C101 − 2000
mW
V
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Max Unit
V
CC
Supply Voltage Operating 1.65 5.5
Supply Voltage Data Retention 1.50 5.5
V
V
OUT
T
tr, t
IN
Input Voltage 0 5.5 V
Output Voltage 0 V
Operating Temperature −40 +85 °C
A
Input Rise and Fall Times
f
VCC at 1.8 V ±0.15 V, 2.5 V ±0.2 V 0 20
CC
VCC at 3.3 V ±0.3 V 0 10
VCC at 5.0 V ±0.5 V 0 5
q
JA
Thermal Resistance
SC−88 − 377
MicroPak−6 − 154
MicroPak2−6 − 154 °C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
V
V
ns/V
°C/W
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Page 4
DC ELECTICAL CHARACTERISTICS
Symbol Parameter V
V
V
V
V
I
OFF
I
I
IH
IL
OH
OL
IN
CC
HIGH Level
Input Voltage
LOW Level
Input Voltage
HIGH Level
Output Voltage
LOW Level
Output Voltage
Input Leakage
Current
Power Off
Leakage Current
Quiescent
Supply Current
(V) Conditions
CC
1.65 to 1.95 0.65 V
2.30 to 5.50 0.70 V
1.65 to 1.95 − − 0.35 V
2.30 to 5.50 − − 0.30 V
1.65
2.30 2.20 2.30 − 2.20 −
3.00 2.90 3.00 − 2.90 −
4.50 4.40 4.50 − 4.40 −
1.65 I
2.30 I
3.00 I
3.00 I
4.50 I
1.65
2.30 − 0 0.10 − 0.10
3.00 − 0 0.10 − 0.10
4.50 − 0 0.10 − 0.10
1.65 I
2.30 I
3.00 I
3.00 I
4.50 I
1.65 to 5.5 VIN = 5.5 V, GND − − ±0.1 − ±1
0 VIN or
1.65 to 5.50 V
V
IN
or V
V
IN
or V
= V
= V
NC7SZ157
TA = +25°C TA = −40 to +85°C
Min Typ Max Min Max
− − 0.65 V
CC
− − 0.70 V
CC
CC
CC
I
= −100 mA 1.55 1.65 − 1.55 −
IH
OH
IL
= −4 mA 1.29 1.52 − 1.29 −
OH
= −8 mA 1.90 2.15 − 1.90 −
OH
= −16 mA 2.40 2.80 − 2.40 −
OH
= −24 mA 2.30 3.68 − 2.30 −
OH
= −32 mA 3.90 4.20 − 3.80 −
OH
I
= 100 mA − 0 0.10 − 0.10
IH
OL
IL
= 4 mA − 0.08 0.24 − 0.24
OL
= 8 mA − 0.10 0.30 − 0.30
OL
= 16 mA − 0.15 0.40 − 0.40
OL
= 24 mA − 0.22 0.55 − 0.55
OL
= 32 mA − 0.22 0.55 − 0.55
OL
CC
CC
− 0.35 V
− 0.30 V
− − 1.0 − 10
V
= 5.5 V
OUT
= 5.5 V, GND − − − − 10
IN
Unit
−
V
−
V
CC
CC
V
V
mA
mA
mA
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Page 5
NC7SZ157
AC ELECTRICAL CHARACTERISTICS
TA = +25°C TA = −40 to +85°C
Symbol Parameter V
t
, t
PLH
Propagation Delay S to Z
PHL
(Figure 5, 6)
Propagation Delay In to Z
(Figure 5, 6)
Propagation Delay S to Z
(Figure 5, 6)
Propagation Delay In to Z
(Figure 5, 6)
C
C
Input Capacitance 0.00 − 2 − − − pF
IN
Power Dissipation Capacitance
PD
(Note 4) (Figure 7)
4. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
no output loading and operating at 50% duty cycle. C
= (CPD) (VCC) (fIN) + (ICCstatic).
I
CCD
(V) Conditions Min Ty p Max Min Max Unit
CC
1.80 ±0.15
2.50 ±0.20 − 3.5 6.1 − 6.5
CL = 15 pF,
= 1 MW,
R
L
− 6.0 11.5 − 12.0
3.30 ±0.30 − 2.6 4.1 − 4.5
5.00 ±0.50 − 1.9 3.2 − 3.5
1.80 ±0.15
5.00 ±0.50
3.30 ±0.30
5.00 ±0.50
3.30 ±0.30
5.00 ±0.50
3.30 ±0.30
5.00 ±0.50
3.30
5.00
PD
CL = 15 pF,
= 1MW,
R
L
CL = 50 pF,
= 500 W,
R
L
CL = 50 pF,
= 500 W,
R
L
is related to I
−
− 3.5 5.8 − 6.1
− 2.6 3.9 − 4.2
− 1.9 3.1 − 3.3
− 3.2 4.8 − 5.2
− 2.4 3.8 − 4.1
− 3.2 4.6 − 5.0
− 2.4 3.7 − 4.0
− 14 − − −
− 17 − − −
dynamic operating current by the expression:
CCD
5.9 10.0 − 10.5
CCD
ns
pF
) at
V
CC
INPUT OUTPUT
DUT
C
R
L
L
NOTE:
includes load and stray capacitance;
5. C
L
inputs PRR = 1.0 MHz, t
= 500 ns.
W
Figure 5. AC Test Circuit
V
CC
A
INPUT
NOTE:
6. Input = AC Waveform; PRR = Variable; Duty Cycle = 50%.
DUT
INPUT
= 3 ns
t
r
INPUT
Out of Phase
OUTPUT
In Phase
OUTPUT
90%
50%
10%
t
PHL
t
W
50%
t
PLH
50%
Figure 6. AC Waveforms
90%
50%
t
PLH
t
PHL
10%
= 3 ns
t
f
50%
50%
V
CC
GND
V
OH
V
OL
V
OH
V
OL
Figure 7. I
Test Circuit
CCD
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5
Page 6
NC7SZ157
DEVICE ORDERING INFORMATION
Device Top Mark Packages Shipping
NC7SZ157P6X ZF7 6−Lead SC70, EIAJ SC−88, 1.25 mm Wide 3000 / Tape & Reel
NC7SZ157L6X B9 6−Lead MicroPak, 1.00 mm Wide 5000 / Tape & Reel
NC7SZ157FHX B9 6−Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch 5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
†
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
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6
Page 7
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON13590G
SIP6 1.45X1.0
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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Page 8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
1
SCALE 2:1
D
A
654
E
123
2X
bbb H
D
e
B
TOP VIEW
6X
ccc
C
SIDE VIEW END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.30
0.65
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
2X
aaa H D
D
E1
L2
aaa C
2X 3 TIPS
b
6X
M
A2
A
A1
C
6X
0.66
SEATING
PLANE
2.50
DIMENSIONS: MILLIMETERS
Cddd
A-B D
DETAIL A
CASE 419B−02
ISSUE Y
H
L
DETAIL A
GAGE
PLANE
DATE 11 DEC 2012
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
MILLIMETERS
DIM MIN NOM MAX
A −−− −−− 1.10
A1 0.00 −−− 0.10
A2 0.70 0.90 1.00 0.027 0.035 0.039
b 0.15 0.20 0.25
C 0.08 0.15 0.22
D 1.80 2.00 2.20
E
2.00 2.10 2.20
E1 1.15 1.25 1.35
e 0.65 BSC
L 0.26 0.36 0.46
L2 0.15 BSC 0.006 BSC
aaa 0.15 0.006
bbb 0.30 0.012
ccc 0.10 0.004
ddd
c
0.10 0.004
INCHES
MIN NOM MAX
−−− −−− 0.043
0.000 −−− 0.004
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
0.078 0.082 0.086
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
GENERIC
MARKING DIAGRAM*
6
XXXMG
G
1
XXX = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
98ASB42985B
SC−88/SC70−6/SOT−363
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
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Page 9
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 7:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
4. SOURCE 1
5. DRAIN 1
6. GATE 2
STYLE 13:
PIN 1. ANODE
2. N/C
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 19:
PIN 1. I OUT
2. GND
3. GND
4. V CC
5. V EN
6. V REF
STYLE 25:
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
5. EMITTER
6. COLLECTOR 1
STYLE 2:
CANCELLED
STYLE 8:
CANCELLED
STYLE 14:
PIN 1. VREF
2. GND
3. GND
4. IOUT
5. VEN
6. VCC
STYLE 20:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 3:
CANCELLED
STYLE 9:
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
5. BASE 2
6. COLLECTOR 2
STYLE 15:
PIN 1. ANODE 1
2. ANODE 2
3. ANODE 3
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
STYLE 21:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. N/C
6. CATHODE 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
6. ANODE
STYLE 10:
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
4. DRAIN 1
5. DRAIN 2
6. GATE 2
STYLE 16:
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
5. EMITTER 1
6. COLLECTOR 1
STYLE 22:
PIN 1. D1 (i)
2. GND
3. D2 (i)
4. D2 (c)
5. VBUS
6. D1 (c)
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
STYLE 5:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 11:
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
STYLE 17:
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
5. EMITTER 2
6. COLLECTOR 1
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
4. N/C
5. CH2
6. N/C
STYLE 29:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
STYLE 6:
PIN 1. ANODE 2
2. N/C
3. CATHODE 1
4. ANODE 1
5. N/C
6. CATHODE 2
STYLE 12:
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
STYLE 18:
PIN 1. VIN1
2. VCC
3. VOUT2
4. VIN2
5. GND
6. VOUT1
STYLE 24:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
STYLE 30:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
98ASB42985B
SC−88/SC70−6/SOT−363
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
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Page 10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON13593G
UDFN6 1.0X1.0, 0.35P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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Page 11
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ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
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