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NC7SZ125
User Manual
11 pgs459.54 Kb0

ON Semiconductor NC7SZ125 User Manual

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TinyLogic UHS Buffer with Three-State Output
NC7SZ125
Description
Features
• Ultra−High Speed: t
= 2.6 ns (Typical) into 50 pF at 5 V V
PD
• High Output Drive: ±24 mA at 3 V V
• Broad V
Operating Range: 1.65 V to 5.5 V
CC
• Matches Performance of LCX when Operated at 3.3 V V
• Power Down High−Impedance Inputs / Outputs
• Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
• Proprietary Noise / EMI Reduction Circuitry
• Ultra−Small MicroPak Packages
• Space−Saving SC−74A and SC−88A Packages
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A
OE
EN
Figure 1. Logic Symbol
operating range. The device is
CC
CC
operating voltage.
CC
when in the 3−STATE
CC
CC
IEEE / IEC
1
Y
is 0 V. Inputs
CC
CC
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MARKING
DIAGRAMS
SIP6
CASE 127EB
Pin 1
UDFN6
CASE 517DP
Pin 1
SC−74A
CASE 318BQ
SC−88A
CASE 419A−02
DD, 7Z25, Z25= Specific Device Code KK = 2−Digit Lot Run Traceability Code XY = 2−Digit Date Code Format Z = Assembly Plant Code M = Date Code
• = Pb−Free Package (Microdot may be in either location)
DDKK
XYZ
DDKK
XYZ
7Z25 M•
•
Z25 M•
•
Semiconductor Components Industries, LLC, 1996
January , 2021 − Rev. 4
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet.
1 Publication Order Number:
NC7SZ125/D
Pin Configurations
PIN DEFINITIONS
Pin # SC−88A /
Pin # MicroPak
Name
Description
11OE
Input
22A
Input
3
3
GND
Ground
44Y
Output
56VCC Supply Voltage
5
NC
No Connect
FUNCTION TABLE
Inputs
Output
OEAY
LLL
LHH
HXZ
H = HIGH Logic Level
NC7SZ125
OE
1
A
2
GND Y
3
5
4
Figure 2. SC−88A and SC−74A (Top View)
SC74A
V
CC
OE 1 6 V
A 2 5 NC
GND 3 4 Y
CC
Figure 3. MicroPak (Top Through View)
L = LOW Logic Level X = HIGH or LOW Logic Level Z = HIGH Impedance State
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2
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
Max
Unit
VCCSupply Voltage
−0.5
6.5
V
V
IN
DC Input Voltage
−0.5
6.5
V
V
DC Output Voltage
−0.5
6.5
V
IIKDC Input Diode Current
VIN < 0 V−−50
mA
IOKDC Output Diode Current
V
< 0 V−−50
mA
I
DC Output Current
−±50
mA
ICC or I
DC VCC or Ground Current
−±50
mA
T
Storage Temperature Range
−65
+150
C
T
Junction Temperature Under Bias
−
+150
C
T
Junction Lead Temperature (Soldering, 10 Seconds)
−
+260
C
SC−74A−390
SC−88A−332
MicroPak−6−812
MicroPak2−6
−
812
Human Body Model, JEDEC: JESD22−A114
−
4000
Charge Device Model, JEDEC: JESD22−C101
−
2000
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
Max
Unit
Supply Voltage Operating
1.65
5.50
Supply Voltage Data Retention
1.50
5.50
VINInput Voltage
0
5.5
V
Active State
0
V
Three−State05.5
TAOperating Temperature
−40
+85
C
VCC at 1.8 V, 2.5 V ±0.2 V
0
20
VCC at 3.3 V ±0.3 V
0
10
VCC at 5.0 V ±0.5 V
0
5
SC−74A−320
SC−88A−377
MicroPak−6−154
MicroPak2−6
−
154
OUT
OUT
STG
P
J L D
GND
Power Dissipation in Still Air
NC7SZ125
OUT
°
°
°
mW
ESD
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
V
V
CC
OUT
Output Voltage
CC
V
V
°
tr, t
JA
Input Rise and Fall Times
f
Thermal Resistance
ns/V
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7SZ125
DC ELECTICAL CHARACTERISTICS
l
TA = +25°C
TA = −40 to +85°C
Min
Typ
Max
Min
Max
1.65 to 1.95
0.65 VCC−−0.65 VCC−
2.30 to 5.50
0.70 VCC−−0.70 VCC−
1.65 to 1.95
−−0.35 VCC−
0.35 V
2.30 to 5.50
−−0.30 VCC−
0.30 V
1.65
1.55
1.65−1.55
−
1.80
1.70
1.80−1.70
−
2.30
2.20
2.30−2.20
−
3.00
2.90
3.00−2.90
−
4.50
4.40
4.50−4.40
−
1.65
I
= −4 mA
1.29
1.52−1.29
−
2.30
I
= −8 mA
1.90
2.15−1.90
−
3.00
I
= −16 mA
2.40
2.80−2.40
−
3.00
I
= −24 mA
2.30
2.68−2.30
−
4.50
I
= −32 mA
3.80
4.20−3.80
−
1.65
−
0.00
0.10−0.00
1.80
−
0.00
0.10−0.10
2.30
−
0.00
0.10−0.10
3.00
−
0.00
0.10−0.10
4.50
−
0.00
0.10−0.10
1.65
I
= 4 mA
−
0.80
0.24−0.24
2.30
I
= 8 mA
−
0.10
0.30−0.30
3.00
I
= 16 mA
−
0.15
0.40−0.40
3.00
I
= 24 mA
−
0.22
0.55−0.55
4.50
I
= 32 mA
−
0.22
0.55−0.55
IIN Input Leakage Current
1.65 to 5.5
0 ≥ VIN ≥ 5.5 V
−
−±1
−±10
A
IOZ 3−STATE Output Leakage
0 to 5.5
V
= VIH or V
−
−±1
−±10
A
I
Power Off Leakage Current
0
V
or V
= 5.5 V
−−1−10
A
ICC Quiescent Supply Current
1.65 to 5.50
V
= 5.5 V, GND
−−2−20
A
Symbo
V
IH
V
IL
V
OH
V
OL
Parameter V
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
LOW Level Output Voltage
(V) Conditions
CC
V
= VIH or VIL,
IN
= −100 A
I
OH
OH OH OH OH OH
V
= VIH or VIL,
IN
= 100 A
I
OL
CC CC
Unit
V
V
V
V
OFF
OL OL OL OL OL
IN
0 ≥ VO ≥ 5.5 V
IN IN
OUT
IL
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4
NC7SZ125
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
TA = −40 to +85°C
Min
Typ
Max
Min
Max
)
1.65
−
6.4
13.2−13.8
1.80−5.3
11.0−11.5
2.50 ±0.20
−
3.4
7.5−8.0
3.30 ±0.30
−
2.5
5.2−5.5
5.00 ±0.50
−
2.1
4.5−4.8
3.30 ±0.30
−
3.2
5.7−6.0
5.00 ±0.50
−
2.6
5.0−5.3
1.65
−
8.4
15.0−15.6
1.80−7.0
12.5−13.0
2.50 ±0.20
−
4.6
8.5−9.0
3.30 ±0.30
−
3.5
6.2−6.5
5.00 ±0.50
−
2.8
5.5−5.8
1.65
Z
−
6.5
13.2−14.5
1.80−5.4
11.0−12.0
2.50 ±0.20
−
3.5
8.0−8.5
3.30 ±0.30
−
2.8
5.7−6.0
5.00 ±0.50
−
2.1
4.7−5.0
CIN Input Capacitance
0.00−4−−−pF
C
Output Capacitance
0.00−8−−
−
CPD Power Dissipation Capacitance
3.30−17−−−pF
Symbol Parameter V
t
, t
Propagation Delay (Figure 4, 6
PHL
, t
Output Enable Time
PZH
(Figure 4, 6)
, t
Output Disable Time
PHZ
(Figure 4, 6)
t
t
PLH
PZL
PLZ
(V) Conditions
CC
C
= 15 pF,
L
= 1 M
R
D
=OPEN
S
1
C
= 50 pF,
L
= 500
R
D
= OPEN
S
1
C
= 50 pF,
L
R
= 500
D
RU = 500
= GND for t
S
1
S
= VIN for t
1
V
= 2 · V
IN
C
= 50 pF,
L
= 500
R
D
RU = 500
= GND for t
S
1
S
= VIN for t
1
V
= 2 · V
IN
Unit
ns
ns
PZH
PZL
CC
PH
PLZ
CC
OUT
(Note 2) (Figure 5)
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I no output loading and operating at 50% duty cycle. C
= (CPD) (VCC) (fIN) + (ICCstatic).
I
CCD
is related to I
PD
dynamic operating current by the expression:
CCD
CCD
) at
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5
OE INPUT
ORDERING INFORMATION
Part Number
Top Mark
Operating
Packages
Shipping
†
NC7SZ125M5X
7Z25
−40 to +85°C
SC−74A
3000 / Tape & Reel
NC7SZ125P5X
Z25
−40 to +85°C
SC−88A
3000 / Tape & Reel
NC7SZ125L6X
DD
−40 to +85°C
MicroPak
5000 / Tape & Reel
NC7SZ125FHX
DD
−40 to +85°C
MicroPak2
5000 / Tape & Reel
NC7SZ125
V
V
CC
RU
I
OPEN GND
INPUT
C
L
NOTE:
includes load and stray capacitance;
3. C
L
Input PRR = 1.0 MHz; t
Figure 4. AC Test Circuit
V
CC
A
INPUT
NOTE:
4. Input = AC Waveform; t PRR = 10 MHz; Duty Cycle = 50%.
Figure 5. I
Test Circuit
CCD
= 500 ns
W
OE
= t
= 1.8 ns;
r
f
OUTPUT
RD
OUTPUT
Figure 6. AC Waveforms
Temperature
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON13590G
SIP6 1.45X1.0
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
5
1
SCALE 2:1
b
5X
0.20
C AB
54
E1
123
B
A
D
TOP VIEW
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
E
e
A
SEATING
C
PLANE
0.05
SC−74A
CASE 318BQ
ISSUE B
A1
DETAIL A
c
END VIEW
DATE 18 JAN 2018
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
M
L
DETAIL A
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE.
MILLIMETERS
DIM MIN MAX
A 0.90 1.10
A1 0.01 0.10
b 0.25 0.50 c 0.10 0.26 D
2.85 3.15
E 2.50 3.00
E1
1.35 1.65
e 0.95 BSC L 0.20 0.60 M 0 10
__
GENERIC
MARKING DIAGRAM*
XXX MG
G
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
XXX = Specific Device Code M = Date Code G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Some products may not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
SCALE 2:1
CASE 419A−02
ISSUE L
DATE 17 JAN 2013
S
0.40
0.0157
A
G
12 3
H
SOLDER FOOTPRINT
0.50
0.0197
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD 419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
45
−B−
MM
5 PL
B0.2 (0.008)
N
MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
INCHES
DIMAMIN MAX MIN MAX
B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC H --- 0.10---0.004 J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087
MILLIMETERS
1.80 2.200.071 0.087
J
C
GENERIC MARKING
DIAGRAM*
K
XXXMG
G
XXX = Specific Device Code M = Date Code G = Pb−Free Package
0.65
0.025
0.65
0.025
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.
1.9
0.0748
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
98ASB42984B
SC−88A (SC−70−5/SOT−353)
SCALE 20:1
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
mm
ǒ
Ǔ
inches
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment.
PAGE 1 OF 1
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON13593G
UDFN6 1.0X1.0, 0.35P
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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