Page 1
TinyLogic UHS Inverter
NC7SZ04
Description
The NC7SZ04 is a single inverter from ON Semiconductor’s
Ultra−High Speed (UHS) series of TinyLogic. The device is fabricated
with advanced CMOS technology to achieve ultra−high speed with
high output drive while maintaining low static power dissipation over
a broad V
the 1.65 V to 5.5 V V
high−impedance when V
independent of V
Features
• Ultra−High Speed: t
• High Output Drive: ±24 mA at 3 V V
• Broad V
• Matches Performance of LCX when Operated at 3.3 V V
• Power Down High−Impedance Inputs / Outputs
• Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
• Proprietary Noise / EMI Reduction Circuitry
• Ultra−Small MicroPak Packages
• Space−Saving SC−74A and SC−88A Packages
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
operating range. The device is specified to operate over
CC
operating range. The inputs and output are
CC
is 0 V. Inputs tolerate voltages up to 5.5 V,
CC
operating voltage.
CC
= 2.4 ns (Typical) into 50 pF at 5 V V
PD
CC
Operating Range: 1.65 V to 5.5 V
CC
CC
CC
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SIP6 1.45x1.0
CASE 127EB
Pin 1
UDFN6
1.0X1.0, 0.35P
CASE 517DP
Pin 1
SC−74A
CASE 318BQ
MARKING
DIAGRAMS
CCKK
XYZ
CCKK
XYZ
7Z04M G
G
IEEC / IEC
1
Figure 1. Logic Symbol
YA
CC, 7Z04, Z04 = Specific Device Code
KK = 2−Digit Lot Run Traceability Code
XY = 2−Digit Date Code Format
Z = Assembly Plant Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
SC−88A
CASE 419A−02
Z04M G
G
Semiconductor Components Industries, LLC, 1996
January, 2021 − Rev. 4
1 Publication Order Number:
NC7SZ04/D
Page 2
Pin Configurations
NC7SZ04
NC
1
A
2
GND Y
3
Figure 2. SC−88A and SC−74A (Top View)
PIN DEFINITIONS
Pin # SC−88A /
SC−74 A
1 1, 5 NC No Connect
2 2 A Input
3 3 GND Ground
4 4 Y Output
5 6 V
Pin # MicroPak Name Description
CC
5
V
CC
4
Supply Voltage
NC 1 6 V
A 2 5 NC
GND 3 4 Y
Figure 3. MicroPak (Top Through View)
FUNCTION TABLE
Input Output
A Y
L H
H L
H = HIGH Logic Level
L = LOW Logic Level
CC
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NC7SZ04
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
ICC or I
T
STG
T
J
T
L
P
D
ESD
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Supply Voltage −0.5 6.5 V
DC Input Voltage −0.5 6.5 V
DC Output Voltage −0.5 6.5 V
DC Input Diode Current VIN < 0 V − −50 mA
DC Output Diode Current V
< 0 V − −50 mA
OUT
DC Output Current − ±50 mA
DC VCC or Ground Current − ±50 mA
GND
Storage Temperature Range −65 +150 °C
Junction Temperature Under Bias − +150 °C
Junction Lead Temperature (Soldering, 10 Seconds) − +260 °C
Power Dissipation in Still Air
SC−74A − 390
SC−88A − 332
MicroPak−6 − 812
MicroPak2−6 − 812
Human Body Model, JEDEC: JESD22−A114 − 4000
Charge Device Model, JEDEC: JESD22−C101 − 2000
mW
V
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Max Unit
V
CC
Supply Voltage Operating 1.65 5.5
Supply Voltage Data Retention 1.5 5.5
V
V
OUT
T
tr, t
IN
Input Voltage 0 5.5 V
Output Voltage 0 V
Operating Temperature −40 +85 °C
A
Input Rise and Fall Times
f
VCC at 1.8 V, 2.5 V ±0.2 V 0 20
CC
VCC at 3.3 V ±0.3 V 0 10
VCC at 5.0 V ±0.5 V 0 5
q
JA
Thermal Resistance
SC−74A − 320
SC−88A − 377
MicroPak−6 − 154
MicroPak2−6 − 154
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
V
V
ns/V
°C/W
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DC ELECTICAL CHARACTERISTICS
Symbol
V
IH
V
IL
V
OH
V
OL
I
IN
I
OFF
I
CC
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
LOW Level Output Voltage
Input Leakage Current 1.65 to 5.5 0 ≤ VIN ≤ 5.5 V − − ±1 − ±10
Power Off Leakage Current 0 V
Quiescent Supply Current 1.65 to 5.50 V
Parameter V
1.65 to 1.95 0.65 V
2.30 to 5.50 0.70 V
1.65 to 1.95 − − 0.35 V
2.30 to 5.50 − − 0.30 V
NC7SZ04
TA = 25°C TA = −40 to 85°C
(V) Conditions
CC
V
1.65
1.80 1.70 1.80 − 1.70 −
= VIH or VIL,
IN
= −100 mA
I
OH
2.30 2.20 2.30 − 2.20 −
3.00 2.90 3.00 − 2.90 −
4.50 4.40 4.50 − 4.40 −
1.65 I
2.30 I
3.00 I
3.00 I
4.50 I
1.65
1.80 − 0.00 0.10 − 0.10
= −4 mA 1.29 1.52 − 1.29 −
OH
= −8 mA 1.90 2.15 − 1.90 −
OH
= −16 mA 2.40 2.80 − 2.40 −
OH
= −24 mA 2.30 2.68 − 2.30 −
OH
= −32 mA 3.80 4.20 − 3.80 −
OH
V
= VIH or VIL,
IN
= 100 mA
I
OL
2.30 − 0.00 0.10 − 0.10
3.00 − 0.00 0.10 − 0.10
4.50 − 0.00 0.10 − 0.10
1.65 I
2.30 I
3.00 I
3.00 I
4.50 I
= 4 mA − 0.80 0.24 − 0.24
OL
= 8 mA − 0.10 0.30 − 0.30
OL
= 16 mA − 0.15 0.40 − 0.40
OL
= 24 mA − 0.22 0.55 − 0.55
OL
= 32 mA − 0.22 0.55 − 0.55
OL
IN
IN
or V
= 5.5 V − − 1 − 10
OUT
= 5.5 V, GND − − 2.0 − 20
Min Typ Max Min Max
− − 0.65 V
CC
− − 0.70 V
CC
CC
CC
CC
CC
− 0.35 V
− 0.30 V
1.55 1.65 − − −
− 0.00 0.10 − 0.10
−
−
CC
CC
Unit
V
V
V
V
mA
mA
mA
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NC7SZ04
AC ELECTRICAL CHARACTERISTICS
TA = +25°C TA = −40 to +85°C
Symbol Parameter V
t
, t
PLH
C
C
Propagation Delay
PHL
(Figure 4, 5)
Input Capacitance 0.00 − 4 − − − pF
IN
Power Dissipation Capacitance
PD
(Note 2)
(Figure 6)
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
no output loading and operating at 50% duty cycle. C
= (CPD) (VCC) (fIN) + (ICCstatic).
I
CCD
(V) Conditions Min Typ Max Min Max Unit
CC
C
1.65
1.80 − 4.4 9.5 − 10.0
= 15 pF,
L
= 1 MW
R
L
− 5.3 11.4 − 12.0
2.50 ±0.20 − 2.9 6.5 − 7.0
3.30 ±0.30 − 2.1 4.5 − 4.7
5.00 ±0.50 − 1.8 3.9 − 4.1
C
3.30 ±0.30
5.00 ±0.50 − 2.4 4.3 − 4.5
= 50 pF,
L
= 500 W
R
L
− 2.9 5.0 − 5.2
3.30 − 20 − − −
5.00 − 26 − − −
is related to I
PD
dynamic operating current by the expression:
CCD
CCD
ns
pF
) at
tr = 3 ns
90%
t
PHL
50%
V
CC
INPUT OUTPUT
C
R
L
L
INPUT
10%
OUTPUT
Figure 4. AC Test Circuit Figure 5. AC Waveforms
V
CC
A
INPUT
t
W
50%
90%
50%
t
50%
PLH
10%
t
= 3 ns
f
V
CC
GND
V
OH
V
OL
NOTE:
3. Input = AC Waveform; t
PRR = 10 MHz; Duty Cycle = 50%.
Figure 6. I
CCD
= t
r
Test Circuit
= 1.8 ns;
f
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Page 6
NC7SZ04
DEVICE ORDERING INFORMATION
Device Top Mark Packages Shipping
NC7SZ04M5X 7Z04 5−Lead SC−74A, 1.6mm 3000 / Tape & Reel
NC7SZ04P5X Z04 5−Lead SC70, EIAJ SC−88A, 1.25 mm Wide 3000 / Tape & Reel
NC7SZ04L6X CC 6−Lead MicroPak, 1.00 mm Wide 5000 / Tape & Reel
NC7SZ04FHX CC 6−Lead, MicroPak2, 1 x 1 mm Body, .35 mm Pitch 5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
†
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON13590G
SIP6 1.45X1.0
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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Page 8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
5
1
SCALE 2:1
b
5X
0.20
C AB
54
E1
123
B
A
D
TOP VIEW
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
E
e
A
SEATING
C
PLANE
0.05
SC−74A
CASE 318BQ
ISSUE B
A1
L
DETAIL A
c
END VIEW
DETAIL A
DATE 18 JAN 2018
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
M
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
MILLIMETERS
DIM MIN MAX
A 0.90 1.10
A1 0.01 0.10
b 0.25 0.50
c 0.10 0.26
D
2.85 3.15
E 2.50 3.00
E1
1.35 1.65
e 0.95 BSC
L 0.20 0.60
M 0 10
__
GENERIC
MARKING DIAGRAM*
XXX MG
G
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
XXX = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
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Page 9
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
SCALE 2:1
CASE 419A−02
ISSUE L
DATE 17 JAN 2013
S
0.40
0.0157
A
G
12 3
H
SOLDER FOOTPRINT
0.50
0.0197
D
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
45
−B−
MM
5 PL
B0.2 (0.008)
N
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
INCHES
DIMAMIN MAX MIN MAX
B 1.15 1.350.045 0.053
C 0.80 1.100.031 0.043
D 0.10 0.300.004 0.012
G 0.65 BSC0.026 BSC
H --- 0.10---0.004
J 0.10 0.250.004 0.010
K 0.10 0.300.004 0.012
N 0.20 REF0.008 REF
S 2.00 2.200.079 0.087
MILLIMETERS
1.80 2.200.071 0.087
J
C
GENERIC MARKING
DIAGRAM*
K
XXXMG
G
XXX = Specific Device Code
M = Date Code
G = Pb−Free Package
0.65
0.025
0.65
0.025
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
1.9
0.0748
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
98ASB42984B
SC−88A (SC−70−5/SOT−353)
SCALE 20:1
STYLE 3:
PIN 1. ANODE 1
STYLE 8:
PIN 1. CATHODE
mm
ǒ
Ǔ
inches
STYLE 4:
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
PAGE 1 OF 1
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Page 10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON13593G
UDFN6 1.0X1.0, 0.35P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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Page 11
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor ’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
. ON Semiconductor reserves the right to make changes without further notice to any products herein.
PUBLICATION ORDERING INFORMATION
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TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
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For additional information, please contact your local Sales Representative
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