ON Semiconductor NB4N441 User Manual

NB4N441
3.3V Serial Input MultiProtocol PLL Clock Synthesizer, Differential LVPECL Output
Description
The NB4N441 is a precision clock synthesizer which generates a differential LVPECL clock output frequency from 12.5 MHz to 425 MHz. A Serial Peripheral Interface (SPI) is used to configure the device to produce one of sixteen popular standard protocol output frequencies from a single 27 MHz crystal reference. The NB4N441 also has the added feature of allowing application specific output frequencies from 12.5 MHz to 425 MHz using crystals within the range of 10 MHz to 28 MHz.
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1
QFN24 MN SUFFIX CASE 485L
MARKING
DIAGRAM*
24
NB4N
441
ALYWG
G
Features
Performs Precision Clock Generation and Synthesis from a Single
27 MHz Crystal Reference
Serial Load Capability for Proprietary Frequencies
Flexible Input Allows for External Clock Reference
Exceeds Bellcore and ITU Jitter Generation Specification
PLL Lock Detect Output
Output Enable
Fully Integrated PhaseLockLoop with Internal Loop Filter
Operating Range: V
= 3.135 V to 3.465 V
CC
Small Footprint 24 Pin QFN
These are PbFree Devices*
LOCKED
27 MHz
XTAL
OSC
B
R
FB
Feedback
Divider
A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet.
OUTDIV
B2, 4, 8,
16, 32
CLKOUT
CLKOUT
OE
VCC 2 V
SDATA
SCLOCK
SLOAD
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2011
April, 2011 Rev. 2
Frequency Control Logic
Serial Load
Figure 1. Simplified Block Diagram
1 Publication Order Number:
NB4N441/D
NB4N441
CLK/XTAL1
XTAL2
SDATA
SCLOCK
SLOAD
V
CC
XTAL
OSC
GND
Input
Prescaler
PB
LOCKED
PFD
VCC_PLL
Loop Filter
R
FB
Feedback
Divider (MB)
P[4:0] M[9:0] N[3:0]
Frequency Control Logic
Serial Load
Figure 2. Block Diagram
CC
V
CLKOUT
CLKOUT
OE
VCO
LOCKED
GND
1924 23 22 2021
OUTDIV (NB)
B2, 4, 8,
16, 32
Exposed Pad (EP)
OE
CLKOUT CLKOUT
GND
NC
VCC_PLL
NC
NC
GND
1
2
3
4
5
6
789 1110
XTAL2
GND
NC
CC
V
18
17
16
15
14
13
12
CC
V
CLK/XTAL1
Figure 3. QFN24 Lead Pinout (Top View)
GND
SCLOCK
SDATA
SLOAD
NC
V
CC
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NB4N441
Table 1. PIN DESCRIPTION
Pin Name I/O Description
11, 12, 13, 24 V
3 VCC_PLL PLL Power Supply Positive supply voltage for the PLL.
1, 6, 9, 18, 19 GND Ground Ground.
20 LOCKED LVTTL Lock Output When Low, this output provides indication that the PLL is
2, 4, 5, 10, 14 NC No Connect.
8 CLK / XTAL1,
7 XTAL2
15 SLOAD** LVTTL / LVCMOS,
16 SDATA** LVTTL / LVCMOS
17 SCLOCK** LVTTL / LVCMOS
21 OE* LVTTL Input Synchronous Output Enable. When OE is HIGH or left
22, 23 CLKOUT
*Pins will default HIGH when left Open **Pins will default LOW when left Open
CC
CLKOUT
EP The Exposed Pad on the 24 pin QFN package bottom is
Power Supply Positive supply voltage.
locked and the device is in proper operating mode. When High, the PLL is out of lock.
LVTTL/LVCMOS Single Ended
Clock or XTAL Inputs
Serial Load Input
Serial Data Input
Serial Clock Input
LVPECL Output Differential LVPECL Clock Outputs, Typically terminated with
The crystal is connected between the XTAL1 and XTAL2 pin. If driving singleended, use XTAL1 and leave XTAL2 floating.
Serial Load.
Serial Data Input.
Serial Clock Input.
OPEN, the outputs are enabled. When OE is LOW, the outputs are disabled.
50 W resistor to VCC – 2.0 V.
thermally connected to the die for improved heat transfer out of package. The pad is not electrically connected to the die, but is recommended to be electrically connected to GND on the PC board.
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NB4N441
Table 2. STANDARD PROTOCOL / OUTPUT FREQUENCY SELECT TABLE WITH 27 MHz CRYSTAL REFERENCE
Input Prescaler
# Protocol CLKOUT (MHz)
0 OC3 /STM1 155.52 11001 1001000000 010
0 OC12 / STM4 155.52 11001 1001000000 010
0 OC48 / STM16 155.52 11001 1001000000 010
1 ETR 32 11011 1000000000 100
2 OC1 51.84 11001 1100000000 100
3 Fast Ethernet 50 11011 1100100000 100
3 ESCON 50 11011 1100100000 100
4 FDDI 125 11011 0111110100 010
4 Infiniband 125 11011 0111110100 010
4 Gigabit Ethernet 125 11011 0111110100 010
4 PCIe 125 11011 0111110100 010
5 1/8 Fibre Channel 13.28125 11011 0110101001 101
6 1/4 Fibre Channel 26.5625 11011 1101010010 101
7 1/2 Fibre Channel 53.125 11011 1101010010 100
8 Fibre Channel 106.25 11011 1101010010 011
9 General 150 11011 1001011000 010
10 D1 Video 69 11011 1000101000 011
11 SONET Reference 19.44 11001 1001000000 101
12 2x Fibre Channel 212.5 11011 1101010010 010
13 4x Fibre Channel 425 11011 1101010010 001
14 XAUI 156.25 11011 1001110001 010
15 Serial ATA 100 11011 1100100000 011
16 HDTV 74.25 11011 1001010010 011
17 HDTV 148.50 11011 1001010010 010
Divider P[4:0]
PLL FB Divider
M[9:0]
Output Frequency Divider
OUTDIV N[2:0]
Table 3. N−DIVIDER TABLE
N2 N1 N0 N Divider
0 0 0 na
0 0 1 B2
0 1 0 B4
0 1 1 B8
1 0 0 B16
1 0 1 B32
1 1 0 na
1 1 1 na
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NB4N441
Table 4. ATTRIBUTES
Characteristics Value
Internal Input Pullup Resistor
Internal Input Pulldown Resistor
ESD Protection Human Body Model
Machine Model
Moisture Sensitivity (Note 1) Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 2102
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 5. MAXIMUM RATINGS (Note 2)
Symbol
V
CC
V
I
I
out
T
A
T
stg
q
JA
q
JC
T
sol
Positive Power Supply GND = 0 V 3.6 V
Input Voltage GND = 0 V GND = VI = V
LVPECL Output Current Continuous Surge 50
Operating Temperature Range QFN24 40 to +85 °C
Storage Temperature Range 65 to +150 °C
Thermal Resistance (JunctiontoAmbient) (Note 3) 0 lfpm
Thermal Resistance (JunctiontoCase) 2S2P (Note 3) QFN24 °C/W
Wave Solder < 3 sec @ 260°C 265 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
2. Maximum Ratings are those values beyond which device damage may occur.
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power).
Parameter Condition 1 Condition 2 Rating Unit
500 lfpm
37.5kW
75kW
> 1000 V
> 150 V
QFN24 QFN24
CC
3.6 V
100
°C/W °C/W
mA mA
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NB4N441
Table 6. DC CHARACTERISTICS V
Symbol
I
CC
I
CCPLL
V
OH
V
OL
V
OHTTL
V
OLTTL
V
IH
V
IL
I
IH
I
IL
Power Supply Current (Inputs and Outputs Loaded) 50 70 90 mA
PLL Power Supply Current 10 20 30 mA
LVPECL Output HIGH Voltage (Notes 4 and 5)
LVPECL Output LOW Voltage (Notes 4 and 5)
Output HIGH Voltage (LOCKED Pin) IOH = 0.8 mA 2.5 V
Output LOW Voltage (LOCKED Pin) GND 0.4 V
Input HIGH Voltage (LVTTL/LVCMOS) 2.0 V
Input LOW Voltage (LVTTL/LVCMOS) GND 0.8 V
Input HIGH Current, OE VIN = 2.7 V, VCC SCLK, SDATA, SLOAD VIN = 2.7 V, VCC OE, SCLK, SDATA, SLOAD VIN = VCC, VCC
Input LOW Current VIN = 0.5 V, VCC
= 3.135 V to 3.465 V, GND = 0 V, TA = 40°C to +85°C
CC
Characteristic Min Typ Max Unit
V
V
= 3.3 V
CC
= 3.3 V
CC
max max max
max
VCC – 1145
2155
VCC – 1945
1355
6.0 20 20
VCC 1030
2270
VCC 1760
1540
VCC – 895
2405
VCC – 1695
1605
CC
CC
26 60 60
10
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
4. LVPECL Outputs loaded with 50 W termination resistors to V
5. LVPECL Output parameters vary 1:1 with V
CC
.
= VCC – 2.0 V for proper operation.
TT
mV
mV
V
V
mA mA
mA
Table 7. AC CHARACTERISTICS V
Symbol
f
IN
V
OUTPP
f
VCO
f
CLKOUT
tR/t
F_IN
t
LOCK
Crystal Input Frequency External CLOCK Input Frequency (Pin 8) SCLOCK
Output Voltage Amplitude 600 800 mV
VCO Frequency Range 400 850 MHz
Output Clock Frequency Range 12.5 425 MHz
Input Clock Rise and Fall Time (CLK, Pin 8) (Note 7) 10 ns
Maximum PLL Lock Time 0.5 5 ms
= 3.135 V to 3.465 V, GND = 0 V, TA = 40°C to +85°C (Note 6)
CC
Characteristic Min Typ Max Unit
10 27
27
28 50
MHz
10
DCO Output CLOCK Duty Cycle (Differential Configuration) 48 52 %
t
JITTER(pd)
t
JITTER(pd)
t
s
t
h
t
pwmin
tr, t
f
Period Jitter (RMS, 1s, 10,000 Cycles) (Notes 8 and 9)
Period Jitter (PeaktoPeak, 10,000 Cycles) (Note 9) 25 40 ps
Setup Time SDATA to SCLOCK
SCLOCK to SLOAD
Hold Time SDATA to SCLOCK
SCLOCK to SLOAD
20 20
20 20
Minimum Pulse Width SLOAD 20 ns
Output Rise/Fall Times (Note 7) CLKOUT / CLKOUT 175 300 425 ps
3.5 6.5 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.
6. LVPECL Outputs loaded with 50 W to V
7. Measured 20% to 80%
8. Additive RMS jitter with 50% duty cycle input clock signal at 27.000 MHz; f = 155 MHz. Protocol 13.28125 MHz will have typical period jitter (RMS) of 14 ps and a typical cycletocycle jitter of 95 ps.
9. f
OUT
2.0 V.
CC
= 155 MHz.
OUT
ns ns
ns ns
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NB4N441
APPLICATIONS INFORMATION
General
The NB4N441 is a precision clock synthesizer which generates a differential LVPECL clock output frequency from 12.5 MHz to 425 MHz. A three−wire SPI interface is used to configure the device to produce the exact frequency of one of sixteen predefined popular standard protocol output frequencies from a single 27 MHz crystal reference; see Table 1. This serial interface gives the user complete control of each internal counter/divider.
If a different or custom output frequency is required, the SPI interface can also enable the user to configure the device for frequencies not specified in Table 1.
Input Clock / Crystal Functionality
To generate the exact protocol frequencies in Table 1, a
27.000 MHz frequency source is required. This can be accomplished by connecting a 27.000 MHz crystal across the XTAL1 and XTAL2 pins. If driving single ended, use the XTAL1 pin and leave XTAL2 floating. The CLK/XTAL1 input will accept a LVTTL/LVCMOS input.
Frequency Control Logic Configuration
The NB4N441 includes a 5bit input prescaler, a 10−bit divider for the PLL feedback path and a 3−bit Output Divider, which divides the VCO frequency by 2, 4, 8, 16, or
32. The Frequency Control Logic for the NB4N441 configures these dividers and counters through the Serial inputs and will select one of the sixteen predetermined clock frequencies in Table 1. The serial interface can also be used to configure the device for user specified custom frequencies not specified in Table 1. Output frequencies are generated based on the following equation: F
OUT
= (F
/P) * M B N, with the stipulation
xtal
that the internal VCO frequency be 400 MHz < VCO < 850 MHz with VCO = F 10 MHz < F
Output Enable
< 28 MHz.
xtal
OUT
* N and
The NB4N441 incorporates a synchronous output Disable/Enable pin, OE. The synchronous output enable pin insures no runt clock pulses are generated. When disabled, CLKOUT is set LOW and CLKOUT
Table 8. Table 8. Output Enable Function
OE Function
1 Clock Outputs Enabled
0 Clock Outputs Disabled
CLKOUT = L, CLKOUT
is set HIGH.
= H
Lock Detect Functionality
The NB4N441 features a PLL Lock Detect function which indicates the locked status of the PLL. When the PLL is locked, the LOCKED
output pin asserts a logic Low. When the internal phase lock is lost (such as when the input clock stops, drifts beyond the pullable range of the crystal, or suddenly shifts in phase), the LOCKED
Table 9. Table 9. Lock Detect Function
LOCKED Function
0 PLL is Locked
1 PLL is not Locked
Using the On−Board Crystal Oscillator
output goes High.
The NB4N441 features a fully integrated on−board
crystal oscillator to minimize system implementation costs.
The crystal should be fundamental mode, parallel resonant. For exact tuning of cyrstal frequency, capacitors should be connected from pins X1 and X2. Typical loading should be on the order of 20 pF to 30 pF (on each crystal input pin). As the oscillator is somewhat sensitive to loading on its inputs, the user is advised to mount the crystal as close to the NB4N441 as possible to avoid any board level parasitic effects. To facilitate collocation, surface mount crystals are recommended, but not required.
Table 10. CRYSTAL SPECIFICATIONS
Parameter Value
Crystal Cut Fundamental AT Cut
Resonance Parallel Resonance
Load Capacitance 18 pF
Frequency Tolerance ±15 ppm at 25°C
Frequency/Temperature Stability ±20 ppm 0 to 70°C
Operating Range 0 to 70°C or
Shunt Capacitance 5 pF Max
Equivalent Series Resistance (ESR)
Correlation Drive Level
Aging 5 ppm / Yr
40 to +85°C
50 W Max
1.0 mW Max
(First 3 Years)
15 ppm /10 Yrs
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NB4N441
3.3 V or
5.0 V
L=1000 mH R=15 W
PLL_V
CC
0.01 mF
V
CC
Figure 4. Power Supply Filter
Power Supply Filtering
R
= 5 W
S
47 mF
3.3 V or
5.0 V
0.01 mF
The NB4N441 is a mixed analog/digital product and as such, it exhibits some sensitivities that would not necessarily be seen on a fully digital product. Analog circuitry is naturally susceptible to random noise, especially if this noise is seen on the power supply pins. The NB4N441 provides separate power supplies for the digital circuitry (V the internal PLL (PLL_V
CC) of the device. The purpose of
CC) and
this design technique is to try and isolate the high switching noise of the digital outputs from the relatively sensitive internal analog phase−locked loop. In a controlled environment such as an evaluation board, this level of isolation is sufficient. However, in a digital system environment where it is more difficult to minimize noise on
the power supplies, a second level of isolation may be required. The simplest form of isolation is a power supply filter on the PLL_V
CC Pin for the NB4N441. Figure 4
illustrates a typical power supply filter scheme. The NB4N441 is most susceptible to noise with spectral content in the 1 kHz to 1 MHz range. Therefore, the filter should be designed to target this range. The key parameter that needs to be met in the final filter design is the DC voltage drop that will be seen between the V of the NB4N441. From the data sheet, the PLL_V (the current sourced through the PLL_V
CC supply and the PLL_VCC pin
CC current
CC Pin) is typically
26 mA. Assuming that a minimum of 2.9 V must be maintained on the PLL_V can be tolerated when a 3.3 V V
CC pin, very little DC voltage drop
CC supply is used. The
resistor shown in Figure 4 must have a resistance of 5 W Max to meet the voltage drop criteria. The RC filter pictured will provide a broadband filter with approximately 100:1 attenuation for noise whose spectral content is above 20 kHz. As the noise frequency crosses the series resonant point of an individual capacitor, it’s overall impedance begins to look inductive and thus increases with increasing frequency. The parallel capacitor combination shown ensures that a low impedance path to ground exists for frequencies well above the bandwidth of the PLL. The level of required filtering is subject to further optimization and simplification. All the V V
plane. All the ground pins (GND) are connected to the
CC
pins are connected to the same
CC
same GND plane.
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S_CLOCK
NB4N441
S_DATA
S_LOAD
S_DATA
S_CLOCK
S_DATA
P4 P3 P2 P1 P0 N2 N0 M9 M8 M7 M2 M1
First
Bit
N1
Figure 5. Serial Interface Timing Diagram
t
t
SETUP
HOLD
Figure 6. Setup and Hold
M0
Last
Bit
18 Bits
S_LOAD
t
t
SETUP
HOLD
Figure 7. Setup and Hold
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NB4N441
Jitter Performance
Jitter is a common parameter associated with clock generation and distribution. Clock jitter can be defined as the deviation in a clock’s output transition from its ideal position.
CycletoCycle Jitter (shortterm) is the period variation between two adjacent cycles over a defined number of observed cycles. The number of cycles observed is application dependent but the JEDEC specification is 1000 cycles.
T
0
T
JITTER(cyclecycle)
Figure 8. CycletoCycle Jitter
T
1
= T1 T
0
PeaktoPeak Jitter is the difference between the highest and lowest acquired value and is represented as the width of the Gaussian base.
RMS or one Sigma
Jitter Amplitude
Time
Figure 9. PeaktoPeak Jitter
Jitter
Typical Gaussian Distribution
There are different ways to measure jitter and often they are confused with one another. The typical method of measuring jitter is to look at the timing signal with an oscilloscope and observe the variations in periodtoperiod
or cycle−to−cycle. If the scope is set up to trigger on every rising or falling edge, set to infinite persistence mode and allowed to trace sufficient cycles, it is possible to determine the maximum and minimum periods of the timing signal. Digital scopes can accumulate a large number of cycles, create a histogram of the edge placements and record peaktopeak as well as standard deviations of the jitter. Care must be taken that the measured edge is the edge immediately following the trigger edge. These scopes can also store a finite number of period durations and postprocessing software can analyze the data to find the maximum and minimum periods.
Recent hardware and software developments have resulted in advanced jitter measurement techniques. The Tektronix TDS−series oscilloscopes have superb jitter analysis capabilities on noncontiguous clocks with their histogram and statistics capabilities. The Tektronix TDSJIT2/3 Jitter Analysis software provides many key timing parameter measurements and will extend that capability by making jitter measurements on contiguous clock and data cycles from single−shot acquisitions.
M1 by Amherst was used as well and both test methods correlated.
LongTerm Period Jitter is the maximum jitter observed at the end of a period’s edge when compared to the position of the perfect reference clock’s edge and is specified by the number of cycles over which the jitter is measured. The number of cycles used to look for the maximum jitter varies by application but the JEDEC spec is 10,000 observed cycles.
The NBC4N441 exhibit long term and cycle−to−cycle
PeaktoPeak Jitter (8 s)
jitter, which rivals that of SAW based oscillators. This jitter performance comes with the added flexibility associated with a synthesizer over a fixed frequency oscillator. The jitter data presented should provide users with enough information to determine the effect on their overall timing budget. The jitter performance meets the needs of most system designs while adding the flexibility of frequency margining and field upgrades. These features are not available with a fixed frequency SAW oscillator.
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NB4N441
Zo = 50 W
Zo = 50 W
50 W 50 W
V
VTT = VCC 2.0 V
TT
Receiver Device
Driver Device
QD
Q D
Figure 10. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D Termination of ECL Logic Devices.)
ORDERING INFORMATION
Device Package Shipping
NB4N441MNG QFN24
(PbFree)
NB4N441MNR2G QFN24
(PbFree)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
92 Units / Rail
3000 / Tape & Reel
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
24
1
SCALE 2:1
D
PIN 1
REFEENCE
2X
0.15 C
2X
0.15 C
TOP VIEW
DETAIL B
0.10 C
0.08 C
NOTE 4
DETAIL A
1
SIDE VIEW
D2
7
24
e
e/2
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT
4.30
2.90
1
A3
A B
E
A
SEATING
24X
C
PLANE
L
A1
13
E2
19
b
24X
0.10 B
0.05
0.55
24X
C
AC
NOTE 3
QFN24, 4x4, 0.5P
CASE 485L
ISSUE B
L1
DETAIL A
ALTERNATE
CONSTRUCTIONS
MOLD CMPDEXPOSED Cu
DETAIL B
ALTERNATE TERMINAL
CONSTRUCTIONS
DATE 05 JUN 2012
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00 A1 0.00 0.05 A3 0.20 REF
b 0.20 0.30
D 4.00 BSC D2 2.70 2.90
E 4.00 BSC E2 2.70 2.90
e 0.50 BSC
L 0.30 0.50 L1 0.05 0.15
L
L
A1
GENERIC
MARKING DIAGRAM*
XXXXX XXXXX ALYWG
G
XXXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking. PbFree indicator, “G” or microdot “ G”, may or may not be present.
24X
0.32
4.30
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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2.90
0.50
PITCH
DOCUMENT NUMBER:
DESCRIPTION:
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© Semiconductor Components Industries, LLC, 2019
DIMENSIONS: MILLIMETERS
98AON11783D
QFN24, 4X4, 0.5P
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