ON Semiconductor MUN2114, MMUN2114L, MUN5114, DTA114YE, DTA114YM3 User Manual

...
MUN2114, MMUN2114L, MUN5114, DTA114YE, DTA114YM3, NSBA114YF3
Digital Transistors (BRT) R1 = 10 kW, R2 = 47 kW
PNP Transistors with Monolithic Bias Resistor Network
This series of digital transistors is designed to replace a single device and its external resistor bias network. The Bias Resistor Transistor (BRT) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a baseemitter resistor. The BRT eliminates these individual components by integrating them into a single device. The use of a BRT can reduce both system cost and board space.
PIN 1
BASE
(INPUT)
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PIN CONNECTIONS
COLLECTOR
R1
R2
(OUTPUT)
PIN 2
EMITTER
(GROUND)
PIN 3
Features
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
S and NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T
Rating
CollectorBase Voltage V
CollectorEmitter Voltage V
Collector Current Continuous I
Input Forward Voltage V
Input Reverse Voltage V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
= 25°C)
A
Symbol Max Unit
CBO
CEO
C
IN(fwd)
IN(rev)
50 Vdc
50 Vdc
100 mAdc
40 Vdc
6 Vdc
MARKING DIAGRAMS
XX MG
G
1
XXX MG
G
1
XX MG
G
1
XX M
1
XX M
1
X M
1
CASE 318D
STYLE 1
SOT23
CASE 318
STYLE 6
SC70/SOT323
CASE 419
STYLE 3
CASE 463
STYLE 1
SOT723
CASE 631AA
STYLE 1
SOT−1123
CASE 524AA
STYLE 1
SC59
SC75
© Semiconductor Components Industries, LLC, 2012
October, 2016 Rev. 6
XXX = Specific Device Code M = Date Code* G =Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending up-
on manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking, and shipping information in the package dimensions section on page 2 of this data sheet.
1 Publication Order Number:
DTA114Y/D
MUN2114, MMUN2114L, MUN5114, DTA114YE, DTA114YM3, NSBA114YF3
Table 1. ORDERING INFORMATION
Device Part Marking Package Shipping
MUN2114T1G, SMUN2114T1G* 6D SC59 3,000 / Tape & Reel
MMUN2114LT1G, SMMUN2114LT1G* A6D SOT23 3,000 / Tape & Reel
MMUN2114LT3G, NSVMMUN2114LT3G* A6D SOT23 10,000 / Tape & Reel
MUN5114T1G, SMUN5114T1G* 6D SC70/SOT323 3,000 / Tape & Reel
SMUN5114T3G 6D SC70/SOT323 10,000 / Tape & Reel
DTA114YET1G, SDTA114YET1G* 6D SC75 3,000 / Tape & Reel
DTA114YM3T5G, NSVDTA114YM3T5G* 6D SOT723 8,000 / Tape & Reel
NSBA114YF3T5G K SOT1123 8,000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
300
250
200
150
100
, POWER DISSIPATION (mW)
50
D
P
0
(1) (2) (3) (4) (5)
AMBIENT TEMPERATURE (°C)
150
1251007550250−25−50
Figure 1. Derating Curve
(1) SC75 and SC70/SOT323; Minimum Pad (2) SC59; Minimum Pad (3) SOT23; Minimum Pad (4) SOT1123; 100 mm (5) SOT723; Minimum Pad
2
, 1 oz. copper trace
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MUN2114, MMUN2114L, MUN5114, DTA114YE, DTA114YM3, NSBA114YF3
Table 2. THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
THERMAL CHARACTERISTICS (SC59) (MUN2114)
Total Device Dissipation
= 25°C (Note 1)
T
A
Derate above 25°C (Note 1)
Thermal Resistance, (Note 1) Junction to Ambient (Note 2)
Thermal Resistance, (Note 1) Junction to Lead (Note 2)
Junction and Storage Temperature Range TJ, T
THERMAL CHARACTERISTICS (SOT23) (MMUN2114L)
Total Device Dissipation
TA = 25°C (Note 1)
Derate above 25°C (Note 1)
Thermal Resistance, (Note 1)
Junction to Ambient (Note 2)
Thermal Resistance, (Note 1)
Junction to Lead (Note 2)
Junction and Storage Temperature Range TJ, T
THERMAL CHARACTERISTICS (SC70/SOT323) (MUN5114)
Total Device Dissipation
= 25°C (Note 1)
T
A
Derate above 25°C (Note 1)
Thermal Resistance, (Note 1) Junction to Ambient (Note 2)
Thermal Resistance, (Note 1)
Junction to Lead (Note 2)
Junction and Storage Temperature Range TJ, T
THERMAL CHARACTERISTICS (SC75) (DTA114YE)
Total Device Dissipation
= 25°C (Note 1)
T
A
Derate above 25°C (Note 1)
Thermal Resistance, (Note 1) Junction to Ambient (Note 2)
Junction and Storage Temperature Range TJ, T
THERMAL CHARACTERISTICS (SOT723) (DTA114YM3)
Total Device Dissipation
T
= 25°C (Note 1)
A
Derate above 25°C (Note 1)
Thermal Resistance, (Note 1)
Junction to Ambient (Note 2)
Junction and Storage Temperature Range TJ, T
1. FR4 @ Minimum Pad.
2. FR4 @ 1.0 x 1.0 Inch Pad.
3. FR4 @ 100 mm
4. FR4 @ 500 mm
2
, 1 oz. copper traces, still air.
2
, 1 oz. copper traces, still air.
(Note 2)
(Note 2)
(Note 2)
(Note 2)
(Note 2)
(Note 2)
(Note 2)
(Note 2)
(Note 2)
(Note 2)
P
D
230
mW
338
1.8
mW/°C
2.7
R
q
JA
R
q
JL
stg
P
D
540 370
264 287
55 to +150 °C
246
°C/W
°C/W
mW
400
2.0
mW/°C
3.2
R
q
JA
R
q
JL
stg
P
D
508 311
174 208
55 to +150 °C
202
°C/W
°C/W
mW
310
1.6
mW/°C
2.5
R
q
JA
R
q
JL
stg
P
D
618 403
280 332
55 to +150 °C
200
°C/W
°C/W
mW
300
1.6
mW/°C
2.4
R
q
JA
stg
P
D
600 400
55 to +150 °C
260
°C/W
mW
600
2.0
mW/°C
4.8
R
q
JA
stg
480 205
55 to +150 °C
°C/W
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MUN2114, MMUN2114L, MUN5114, DTA114YE, DTA114YM3, NSBA114YF3
Table 2. THERMAL CHARACTERISTICS
Characteristic UnitMaxSymbol
THERMAL CHARACTERISTICS (SOT1123) (NSBA114YF3)
Total Device Dissipation
= 25°C (Note 3)
T
A
Derate above 25°C (Note 3)
Thermal Resistance, (Note 3)
Junction to Ambient (Note 4)
Thermal Resistance, Junction to Lead (Note 3)
Junction and Storage Temperature Range TJ, T
1. FR4 @ Minimum Pad.
2. FR4 @ 1.0 x 1.0 Inch Pad.
3. FR4 @ 100 mm
4. FR4 @ 500 mm
2
, 1 oz. copper traces, still air.
2
, 1 oz. copper traces, still air.
(Note 4)
(Note 4)
P
D
254
mW
297
2.0
mW/°C
2.4
R
q
JA
R
q
JL
stg
493 421
193 °C/W
55 to +150 °C
°C/W
Table 3. ELECTRICAL CHARACTERISTICS (T
= 25°C, unless otherwise noted)
A
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
CollectorBase Cutoff Current
(VCB = 50 V, IE = 0)
CollectorEmitter Cutoff Current
(V
= 50 V, IB = 0)
CE
EmitterBase Cutoff Current
(VEB = 6.0 V, IC = 0)
CollectorBase Breakdown Voltage
= 10 mA, IE = 0)
(I
C
CollectorEmitter Breakdown Voltage (Note 5)
(I
= 2.0 mA, IB = 0)
C
I
CBO
I
CEO
I
EBO
V
(BR)CBO
V
(BR)CEO
100
500
0.2
50
50
nAdc
nAdc
mAdc
Vdc
Vdc
ON CHARACTERISTICS
DC Current Gain (Note 5)
= 5.0 mA, VCE = 10 V)
(I
C
Collector *Emitter Saturation Voltage (Note 5)
(IC = 10 mA, IB = 0.3 mA)
Input Voltage (off)
= 5.0 V, IC = 100 mA)
(V
CE
Input Voltage (on)
(V
= 0.2 V, IC = 1.0 mA)
CE
Output Voltage (on)
= 5.0 V, VB = 2.5 V, RL = 1.0 kW)
(V
CC
Output Voltage (off)
= 5.0 V, VB = 0.5 V, RL = 1.0 kW)
(V
CC
Input Resistor R1 7.0 10 13
Resistor Ratio R1/R
h
V
CE(sat)
V
V
V
V
FE
i(off)
i(on)
OL
OH
80 140
Vdc
0.25
Vdc
0.7 0.5
Vdc
1.4 0.9
Vdc
0.2
Vdc
4.9
kW
2
0.17 0.21 0.25
5. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle v 2%.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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MUN2114, MMUN2114L, MUN5114, DTA114YE, DTA114YM3, NSBA114YF3
TYPICAL CHARACTERISTICS
MUN2114, MMUN2114L, MUN5114, DTA114YE, DTA114YM3
1
IC/IB = 10
25°C
0.1
150°C
55°C
, COLLECTOREMITTER VOLTAGE (V)
0.01 01020
CE(sat)
V
I
, COLLECTOR CURRENT (mA)
C
Figure 2. V
CE(sat)
vs. I
4030
C
10
9
8
7
f = 10 kHz
= 0 A
I
E
T
= 25°C
A
6
5
4
3
2
, OUTPUT CAPACITANCE (pF)
1
ob
C
0
010 20304050
VR, REVERSE VOLTAGE (V)
Figure 4. Output Capacitance
1000
VCE = 10 V
100
10
, DC CURRENT GAIN
FE
h
1
50
0.1 1
100
10
1
0.1
0.01
, COLLECTOR CURRENT (mA)
C
I
0.001 01234
Figure 5. Output Current vs. Input Voltage
25°C
150°C
55°C
I
, COLLECTOR CURRENT (mA)
C
Figure 3. DC Current Gain
25°C
150°C
V
, INPUT VOLTAGE (V)
in
10010
55°C
VO = 5 V
56 7
100
10
1
, INPUT VOLTAGE (V)
in
V
0.1
25°C
55°C
150°C
VO = 0.2 V
1002030
I
, COLLECTOR CURRENT (mA)
C
40 50
Figure 6. Input Voltage vs. Output Current
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