ON Semiconductor MSB710−RT1 Technical data

MSB710−RT1

l l

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Preferred Device

PNP General Purpose Amplifier Transistor Surface Mount

Features

• Pb−Free Package is Available

MAXIMUM RATINGS (T

Rating Symbol Value Unit

Collector−Base Voltage V Collector−Emitter Voltage V Emitter−Base Voltage V Collector Current − Continuous I Collector Current − Peak I

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Power Dissipation P Junction Temperature T Storage Temperature T

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

ELECTRICAL CHARACTERISTICS (T

Characteristic Symbol Min Max Unit

Collector−Emitter Breakdown Voltage

(IC = −10 mAdc, IB = 0) V

Collector−Base Breakdown Voltage

(IC = −10 mAdc, IE = 0)

Emitter−Base Breakdown Voltage

(IE = −10 mAdc, IC = 0)

Collector−Base Cutoff Current

(VCB = −20 Vdc, IE = 0) I

DC Current Gain (Note 1)

(VCE = −10 Vdc, IC = −150 mAdc) (VCE = −10 Vdc, IC = 500 mAdc)

Collector−Emitter Saturation Voltage

(IC = −300 mAdc, IB = −30 mAdc) V

Collector−Base Saturation Voltage

(IC = −300 mAdc, IB = −30 mAdc) V

Output Capacitance

(VCB = −10 Vdc, IE = 0, f = 1.0 MHz) C

1. Pulse Test: Pulse Width ≤ 300 ms, D.C. ≤ 2%.

= 25°C)

(BR)CBO (BR)CEO (BR)EBO

C(P)

D J

stg

= 25°C)

(BR)CEO

(BR)CBO

(BR)EBO

CBO

FE1

FE2

CE(sat)

BE(sat)

−60 Vdc

−50 Vdc

−7.0 Vdc

−500 mAdc

−1.0 Adc

200 mW 150 °C

−55 to +150 °C

Vdc

−50 − Vdc

−60 − Vdc

−7.0 − mAdc

− −0.1

−

12040240

− Vdc

− −0.6 Vdc

− −1.5

− 15

http://onsemi.com

COLLECTOR

BASE

SC−59

CASE 318D

EMITTER

MARKING DIAGRAM

CR M G

CR = Device Code M = Date Code* G = Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

ORDERING INFORMATION

Device Package Shipping

MSB710−RT1 SC−59 3000 / Tape & Ree MSB710−RT1G SC−59

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

Preferred devices are recommended choices for future use and best overall value.

3000 / Tape & Ree

†

January, 2006 − Rev. 4

1 Publication Order Number:

MSB710−RT1/D

MSB710−RT1

查询"MSB710-RT1-D"供应商

PACKAGE DIMENSIONS

SC−59

CASE 318D−04

ISSUE G

SOLDERING FOOTPRINT*

0.95

0.037

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

DIMAMIN NOM MAX MIN

A1 0.01 0.06 0.10 0.001

b 0.35 0.43 0.50 0.014 c 0.09 0.14 0.18 0.003 D 2.70 2.90 3.10 0.106 E 1.30 1.50 1.70 0.051 e 1.70 1.90 2.10 0.067 L 0.20 0.40 0.60 0.008

MILLIMETERS

1.00 1.15 1.30 0.039

2.50 2.80 3.00 0.099

0.95

0.037

INCHES

NOM MAX

0.045 0.051

0.002 0.004

0.017 0.020

0.005 0.007

0.114 0.122

0.059 0.067

0.075 0.083

0.016 0.024

0.110 0.118

2.4

0.094

1.0

0.039

0.8

0.031

SCALE 10:1

inches

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

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For additional information, please contact your local Sales Representative.

MSB710−RT1/D