ON Semiconductor MR2535 Technical data

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MR2535
Overvoltage Transient Suppressors
Medium Current
Avalanche Voltage 24 to 32 Volts
High Power Capability
Economical
Increased Capacity by Parallel Operation
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Mechanical Characteristics
Case: Epoxy, Molded
Weight: 2.5 Grams (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Maximum Lead Temperature for Soldering Purposes:
350°C 3/8 from Case for 10 Seconds at 5 lbs. Tension
Polarity: Indicated by Diode Symbol or Cathode Band
Marking: MR2535L
MAXIMUM RATINGS (T
Rating
DC Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage DC Blocking Voltage
Repetitive Peak Reverse Surge Current
(Time Constant = 10 ms, Duty Cycle 1%, TC = 25°C) (See Note 1)
Average Rectified Forward Current
(Single Phase, Resistive Load, 60 Hz, TC = 125°C) (See Figure 4)
Non–Repetitive Peak Surge Current
Surge Supplied at Rated Load Conditions Halfwave, Single Phase
Operating and Storage Junction
T emperature Range
= 25°C unless otherwise noted)
J
Symbol Value Unit
V
RRM
V
RWM
V
R
I
RSM
I
O
I
FSM
TJ, T
stg
20 Volts
62 Amps
6.0 Amps
600 Amps
–65 to
+175
°C
L SUFFIX
CASE 194
STYLE 1
ORDERING INFORMATION
Device Package Shipping
MR2535L Axial–Lead
Button
MR2535LRL Axial–Lead
Button
1000/Box
800/Reel
Semiconductor Components Industries, LLC, 1999
September, 1999 – Rev. 3
1 Publication Order Number:
MR2535L/D
MR2535
THERMAL CHARACTERISTICS
Lead
Characteristic
Thermal Resistance, Junction to Lead @ Both Leads to Heat Sink,
Equal Length
Thermal Resistance Junction to Case R
*Typical
Length
1/4 3/8 1/2
Symbol Max Unit
R
θJL
θJC
7.5 10 13
0.8* °C/W
°C/W
ELECTRICAL CHARACTERISTICS (T
Instantaneous Forward Voltage Reverse Current (VR = 20 Vdc, TC = 25°C) I Breakdown Voltage Breakdown Voltage Breakdown Voltage Temperature Coefficient V Forward Voltage Temperature Coefficient @ IF = 10 mA V
(1) Pulse Test: Pulse Width 300 µs, Duty Cycle 2%. *Typical
(1) (1)
(1)
(IR = 100 mAdc, TC = 25°C) V (IR = 90 Amp, TC = 150°C, PW = 80 µs) V
= 25°C unless otherwise noted)
J
Characteristic Symbol Min Max Unit
(iF = 100 Amps, TC = 25°C) v
F
R (BR) (BR)
(BR)TC
FTC
1.1 Volts — 200 nAdc 24 32 Volts — 40 Volts — 0.096* %/°C — 2* mV/°C
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2
MR2535
1000
100
10
1
, INSTANTANEOUS FORWARD CURRENT (A)
F
I
4000
3500
3000
2500
2000
C, CAPACITANCE (pF)
1500
1000
VR = 20 V
100
75°C
0.1
, REVERSE CURRENT (nA)
R
I
0.01
10
1
TJ = 125°C
25°C
1000900800700600
VF, INSTANTANEOUS FORWARD VOLTAGE (mV) TJ, JUNCTION TEMPERATURE (°C)
Figure 1. T ypical Forward Voltage Figure 2. T ypical Reverse Current versus
Junction T emperature
25
TJ = 25°C
, AVERAGE FORWARD CURRENT (A)
20
15
10
10 mm
15 mm
5
Both leads to heatsink with equal length
I
F(peak)/IF(avg)
L = 6.25 mm
=
p
150125100755025
1000
Figure 3. T ypical Capacitance Figure 4. Maximum Current Ratings
1
0.1
r(t), TRANSIENT THERMAL
RESISTANCE (NORMALIZED)
0.01
L = 6.25 mm, both leads to heatsink (equal length)
2520151050
VR, DC BLOCKING VOLTAGE (V) TL, LEAD TEMPERATURE (°C)
45 40
35 30 25 20 15
, THERMAL RESIST ANCE
10
JL
q
JUNCTION TO LEAD ( C/W)°
R
5
0.1 t, TIME (S) LEAD LENGTH (mm)
1001010.010.001
0
Single to heatsink
Both leads to heatsink (equal length)
Maximum
Maximum
160
Typical
Typical
0
F(avg)
I
Figure 5. Thermal Response Figure 6. Steady State Thermal Resistance
18014012010080604020
2520151050
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