Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Features
500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 1.8 V to 43 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Peak Power − 225 W (8 x 20 ms)
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb−Free Packages are Available*
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MAXIMUM RATINGS
RatingSymbolMaxUnit
Peak Power Dissipation @ 20 ms (Note 1)
@ T
25C
L
Total Power Dissipation on FR−5 Board,
(Note 2) @ T
Derated above 75C
Thermal Resistance, (Note 3)
Junction−to−Ambient
Thermal Resistance, (Note 3)
Junction−to−Lead
Junction and Storage Temperature RangeTJ, T
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 11.
2. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.
3. Thermal Resistance measurement obtained via infrared Scan Method.
= 75C
L
P
pk
P
R
q
R
q
D
JA
JL
stg
225W
500
6.7mWmW/C
C/W
340
C/W
150
−55 to
+150
C
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SOD−123
CASE 425
STYLE 1
1
Cathode
2
Anode
MARKING DIAGRAM
1
xxx = Device Code (Refer to page 2)
M= Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
xxx M G
G
ORDERING INFORMATION
DevicePackageShipping
MMSZ4xxxET1GSOD−123
SZMMSZ4xxxET1G SOD−123
MMSZ4xxxET3GSOD−123
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
(Pb−Free)
(Pb−Free)
(Pb−Free)
Tape & Reel
Tape & Reel
10,000 /
Tape & Reel
†
3,000 /
3,000 /
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 6
1Publication Order Number:
MMSZ4678ET1/D
MMSZ4xxxET1G Series, SZMMSZ4xxxET1G Series
ELECTRICAL CHARACTERISTICS (T
otherwise noted, V
Symbol
V
Z
I
ZT
I
R
V
R
I
F
V
F
= 0.95 V Max. @ IF = 10 mA)
F
Parameter
Reverse Zener Voltage @ I
Reverse Current
Reverse Leakage Current @ V
Reverse Voltage
Forward Current
Forward Voltage @ I
F
= 25C unless
A
ZT
R
I
I
F
VRV
Z
I
V
R
F
I
ZT
V
Zener Voltage Regulator
ELECTRICAL CHARACTERISTICS (T
Device
Device*
MMSZ4680ET1GCF82.092.22.315041
MMSZ4684ET1GCG33.133.33.47507.51.5
MMSZ4688ET1GCG74.474.74.9450103
MMSZ4689ET1GCG84.855.15.3650103
MMSZ4690ET1GCG95.325.65.8850104
MMSZ4691ET1GCH15.896.26.5150105
MMSZ4692ET1GCH26.466.87.1450105.1
MMSZ4693ET1GCH37.137.57.8850105.7
MMSZ4697ET1GCH79.501010.505017.6
MMSZ4699ET1GCH911.401212.60500.059.1
MMSZ4701ET1GCJ213.31414.7500.0510.6
MMSZ4702ET1GCJ314.251515.75500.0511.4
MMSZ4703ET1GCJ415.201616.80500.0512.1
MMSZ4705ET1GCJ617.101818.90500.0513.6
MMSZ4709ET1GCK122.802425.20500.0118.2
MMSZ4711ET1GCK325.652728.35500.0120.4
MMSZ4717ET1GCK940.854345.15500.0132.6
1. Nominal Zener voltage is measured with the device junction in thermal equilibrium at TL = 30C 1C.
*Include SZ-prefix devices where applicable.
Marking
= 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA)
A
Zener Voltage (Note 1)Leakage Current
VZ (V)@ I
MinNomMax
mAmA
ZT
IR @ V
R
V
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2
MMSZ4xxxET1G Series, SZMMSZ4xxxET1G Series
TYPICAL CHARACTERISTICS
8
7
TYPICAL TC VALUES
100
TYPICAL TC VALUES
6
5
4
3
2
VZ @ I
ZT
10
VZ @ I
ZT
1
0
−1
, TEMPERATURE COEFFICIENT (mV/ C)
VZ
−2
−3
VZ, NOMINAL ZENER VOLTAGE (V)
Figure 1. Temperature Coefficients
(Temperature Range −55C to +150C)
1.2
1.0
0.8
PD versus T
L
, TEMPERATURE COEFFICIENT (mV/ C)
VZ
1
12111098765432
10100
VZ, NOMINAL ZENER VOLTAGE (V)
Figure 2. Temperature Coefficients
(Temperature Range −55C to +150C)
1000
RECTANGULAR
WAVEFORM, T
100
= 25C
A
0.6
0.4
0.2
, POWER DISSIPATION (WATTS)
D
P
1000
100
10
, DYNAMIC IMPEDANCE ( )
ZT
Z
0
IZ = 1 mA
1
PD versus T
A
T, TEMPERATURE (C)
Figure 3. Steady State Power Derating
TJ = 25C
I
= 0.1 I
Z(AC)
f = 1 kHz
5 mA
20 mA
101
, NOMINAL ZENER VOLTAGE
V
Z
Figure 5. Effect of Zener Voltage on
Zener Impedance
Z(DC)
1501251007550250
100
10
, PEAK SURGE POWER (WATTS)
pk
P
1
0.1
1101001000
PW, PULSE WIDTH (ms)
Figure 4. Maximum Nonrepetitive Surge Power
1000
75 V (MMSZ5267BT1G)
91 V (MMSZ5270BT1G)
100
10
, FORWARD CURRENT (mA)
F
I
150C
75C 25C0C
1
VF, FORWARD VOLTAGE (V)
Figure 6. Typical Forward Voltage
1.21.11.00.90.80.70.60.50.4
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3
MMSZ4xxxET1G Series, SZMMSZ4xxxET1G Series
TYPICAL CHARACTERISTICS
1000
0 V BIAS
1 V BIAS
100
10
C, CAPACITANCE (pF)
1
100
10
1
BIAS AT
50% OF V
V
NOM
Z
101
, NOMINAL ZENER VOLTAGE (V)
Z
Figure 7. Typical Capacitance
TA = 25C
TA = 25C
100
1000
100
10
0.1
, LEAKAGE CURRENT ( A)m
0.01
R
I
0.001
0.0001
0.00001
100
10
1
+150C
+25C
−55C
80706050403020100
90
, NOMINAL ZENER VOLTAGE (V)
V
Z
Figure 8. Typical Leakage Current
TA = 25C
1
, ZENER CURRENT (mA)
Z
0.1
I
0.01
, ZENER VOLTAGE (V)
V
Z
Figure 9. Zener Voltage versus Zener Current
(V
Up to 12 V)
Z
100
90
80
70
60
50
40
30
20
% OF PEAK PULSE CURRENT
10
0
020406080
, ZENER CURRENT (mA)
Z
0.1
I
0.01
1086420
12
1030507090
Figure 10. Zener Voltage versus Zener Current
t
P
PEAK VALUE I
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
HALF VALUE I
t, TIME (ms)
t
r
RSM
@ 8 ms
RSM
Figure 11. 8 20 ms Pulse Waveform
VZ, ZENER VOLTAGE (V)
(12 V to 91 V)
/2 @ 20 ms
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 5:1
SOD−123
CASE 425−04
ISSUE G
DATE 07 OCT 2009
D
1
H
E
2
E
b
A
A1
q
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERSINCHES
DIM MINNOMMAX
A0.941.171.35 0.037
A10.000.050.10 0.000
b0.510.610.71 0.020
---
c
E2.542.692.84 0.100
H
E
L0.25
q00
---
1.60
3.56
3.680.140
------
------
°°° °
MINNOMMAX
0.046
0.002
0.024
------
0.15
0.055D1.401.80
0.063
0.010
0.106
0.145
3.86
1010
GENERIC
MARKING DIAGRAM*
0.053
0.004
0.028
0.006
0.071
0.112
0.152
------
C
SOLDERING FOOTPRINT*
0.91
0.036
1
XXX = Specific Device Code
M= Date Code
XXXMG
G
G= Pb−Free Package
2.36
0.093
4.19
0.165
SCALE 10:1
ǒ
inches
mm
1.22
0.048
Ǔ
(Note: Microdot may be in either location)
*This information is generic. Please refer to device data
sheet for actual part marking. Pb−Free indicator, “G” or
microdot “ G”, may or may not be present.
STYLE 1:
PIN 1. CATHODE
2. ANODE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
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