ON Semiconductor MCR218-2, MCR218-4, MCR218-6 Technical data

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MCR218-2, MCR218-4, MCR218-6
Preferred Device
Silicon Contr olled Rectifiers
Designed primarily for half-wave ac control applications, such as motor controls, heating controls and power supplies; or wherever half-wave silicon gate-controlled, solid-state devices are needed.
Glass-Passivated Junctions
Blocking Voltage to 400 Volts
TO-220 Construction — Low Thermal Resistance, High Heat
Dissipation and Durability
Device Marking: Logo, Device T ype, e.g., MCR218–2, Date Code
MAXIMUM RATINGS (T
Rating Symbol Value Unit
Peak Repetitive Off–State V oltage
(TJ = *40 to 125°C, Gate Open)
On-State RMS Current
(180° Conduction Angles; TC = 70°C)
Peak Non-repetitive Surge Current
(1/2 Cycle, Sine Wave 60 Hz, TJ = 125°C)
Circuit Fusing Considerations
(t = 8.3 ms)
Forward Peak Gate Power
(Pulse Width ≤ 1.0 µs, TC = 70°C)
Forward Average Gate Power
(t = 8.3 ms, TC = 70°C)
Forward Peak Gate Current
(Pulse Width ≤ 1.0 µs, TC = 70°C)
Operating Junction Temperature Range T
Storage Temperature Range T
(1) V
and V
DRM
apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
RRM
= 25°C unless otherwise noted)
J
(1)
MCR218–2 MCR218–4 MCR218–6
for all types can be applied on a continuous basis. Ratings
V
DRM,
V
RRM
I
T(RMS)
I
TSM
I2t 26 A2s
P
GM
P
G(AV)
I
GM
J
stg
50 200 400
8.0 A
100 A
5.0 Watts
0.5 Watts
2.0 A
–40 to
+125
–40 to
+150
Volts
°C
°C
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SCRs
8 AMPERES RMS
50 thru 400 VOLTS
G
A
1
2
3
TO–220AB
CASE 221A
STYLE 3
PIN ASSIGNMENT
1 2 3 4
Cathode
ORDERING INFORMATION
Device Package Shipping
MCR218–2 TO220AB 500/Box MCR218–4 TO220AB MCR218–6 TO220AB
K
4
Anode
Gate
Anode
500/Box 500/Box
Semiconductor Components Industries, LLC, 1999
March, 2000 – Rev . 2
Preferred devices are recommended choices for future use
and best overall value.
1 Publication Order Number:
MCR218/D
MCR218–2, MCR218–4, MCR218–6
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case R Maximum Lead Temperature for Soldering Purposes 1/8 from Case for 10 Seconds T
θJC
L
2.0 °C/W
260 °C
ELECTRICAL CHARACTERISTICS (T
Characteristic
= 25°C unless otherwise noted.)
J
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
(VAK = Rated V
DRM
or V
, Gate Open) TJ = 25°C
RRM
ON CHARACTERISTICS
Peak Forward On-State Voltage
(ITM = 16 A Peak)
Gate Trigger Current (Continuous dc)
(VD = 12 V, RL = 100 Ohms)
Gate Trigger Voltage (Continuous dc)
(VD = 12 V, RL = 100 Ohms)
Gate Non–Trigger V oltage
(Rated 12 V , RL = 100 Ohms, TJ = 125°C)
Holding Current
(VD = 12 Vdc, Initiating Current = 200 mA, Gate Open)
(1)
DYNAMIC CHARACTERISTICS
Critical Rate-of-Rise of Off-State Voltage
(VD = Rated V
(1) Pulse Test: Pulse Width = 1.0 ms, Duty Cycle 2%.
, Exponential Waveform, Gate Open, TJ = 125°C)
DRM
TJ = 125°C
Symbol Min Typ Max Unit
I
, I
DRM
RRM
V
TM
I
GT
V
GT
V
GD
I
H
dv/dt 100 V/µs
— —
1.5 1.8 Volts
10 25 mA
1.5 Volts
0.2 Volts
16 30 mA
— —
10
2.0
µA
mA
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2
MCR218–2, MCR218–4, MCR218–6
T
,
A
I
ALL
WA
L
A
T
AT
(
)
125
15
Voltage Current Characteristic of SCR
+ Current
Anode +
Symbol Parameter
V
DRM
I
DRM
V
RRM
I
RRM
V
TM
I
H
C
°
URE
115
EMPER
105
SE E C
95
B O
85
Peak Repetitive Off State Forward Voltage Peak Forward Blocking Current Peak Repetitive Off State Reverse Voltage Peak Reverse Blocking Current Peak On State Voltage Holding Current
α
α = CONDUCTION ANGLE
dc
on state
I
at V
RRM
Reverse Avalanche Region
Anode –
RRM
Reverse Blocking Region
(off state)
12
9.0
6.0
(WATTS)
3.0
α = Conduction Angle
α = 30°
V
TM
I
H
I
Forward Blocking Region
(off state)
α
120°
90°
60°
DRM
at V
180°
+ Voltage
DRM
dc
MUM
75
X M
C
0
α = 30° 90° 120° 180°60°
I
, AVERAGE ON-ST ATE FORWARD CURRENT (AMPS)
T(AV)
Figure 1. Current Derating Figure 2. On–State Power Dissipation
, A VERAGE ON-STATE POWER DISSIPATION
0
(AV)
87654321
0
P
I
, AVG. ON-ST ATE CURRENT (AMPS)
T(AV)
8.07.06.05.04.03.02.01.0
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3
0
1.3
,
ALI
AT
T
I
T
(
m
A)
3.0
I
2.0
1.5
GGER CURREN
1.0
R
0.9
E
0.7
MCR218–2, MCR218–4, MCR218–6
VD = 12 Vdc
1.2
1.0
0.9
0.7
VD = 12 Vdc
ZED G
0.5
0.4
NORM
0.3 –60 120–40 0–20 20 40 60 80 100 140
GT
TJ, JUNCTION TEMPERATURE (°C)
Figure 3. T ypical Gate Trigger Current
versus T emperature
4.0
3.0
2.0
1.5
1.0
0.9
0.7
, NORMALIZED HOLDING CURRENT (mA)
0.5
H
I
0.4 –60
TJ, JUNCTION TEMPERATURE (°C)
0.5
0.4
, NORMALIZED GATE TRIGGER VOLTAGE
GT
V
0.3 –60 120–40 0–20 20 40 60 80 100 14
TJ, JUNCTION TEMPERATURE (°C)
Figure 4. T ypical Gate Trigger Voltage
versus T emperature
VD = 12 Vdc
10080
1406040 120–20 0–40 20
Figure 5. T ypical Holding Current versus
T emperature
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4
MCR218–2, MCR218–4, MCR218–6
P ACKAGE DIMENSIONS
TO–220AB
CASE 221A–07
ISSUE Z
SEATING
–T–
PLANE
FB
Q
4
A
123
T
U
C
S
H
K
Z
L
V
R
J
G
D
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED.
DIM MIN MAX MIN MAX
A 0.570 0.620 14.48 15.75 B 0.380 0.405 9.66 10.28 C 0.160 0.190 4.07 4.82 D 0.025 0.035 0.64 0.88 F 0.142 0.147 3.61 3.73 G 0.095 0.105 2.42 2.66 H 0.110 0.155 2.80 3.93 J 0.014 0.022 0.36 0.55 K 0.500 0.562 12.70 14.27 L 0.045 0.060 1.15 1.52 N 0.190 0.210 4.83 5.33 Q 0.100 0.120 2.54 3.04 R 0.080 0.110 2.04 2.79 S 0.045 0.055 1.15 1.39 T 0.235 0.255 5.97 6.47 U 0.000 0.050 0.00 1.27 V 0.045 ––– 1.15 ––– Z ––– 0.080 ––– 2.04
STYLE 3:
PIN 1. CATHODE
2. ANODE
3. GATE
4. ANODE
MILLIMETERSINCHES
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5
Notes
MCR218–2, MCR218–4, MCR218–6
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6
Notes
MCR218–2, MCR218–4, MCR218–6
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7
MCR218–2, MCR218–4, MCR218–6
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without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability , including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer .
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MCR218/D
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