
查询MCR218-2供应商
MCR218-2, MCR218-4,
MCR218-6
Preferred Device
Silicon Contr olled Rectifiers
Reverse Blocking Thyristors
Designed primarily for half-wave ac control applications, such as
motor controls, heating controls and power supplies; or wherever
half-wave silicon gate-controlled, solid-state devices are needed.
• Glass-Passivated Junctions
• Blocking Voltage to 400 Volts
• TO-220 Construction — Low Thermal Resistance, High Heat
Dissipation and Durability
• Device Marking: Logo, Device T ype, e.g., MCR218–2, Date Code
MAXIMUM RATINGS (T
Rating Symbol Value Unit
Peak Repetitive Off–State V oltage
(TJ = *40 to 125°C, Gate Open)
On-State RMS Current
(180° Conduction Angles; TC = 70°C)
Peak Non-repetitive Surge Current
(1/2 Cycle, Sine Wave 60 Hz,
TJ = 125°C)
Circuit Fusing Considerations
(t = 8.3 ms)
Forward Peak Gate Power
(Pulse Width ≤ 1.0 µs, TC = 70°C)
Forward Average Gate Power
(t = 8.3 ms, TC = 70°C)
Forward Peak Gate Current
(Pulse Width ≤ 1.0 µs, TC = 70°C)
Operating Junction Temperature Range T
Storage Temperature Range T
(1) V
and V
DRM
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
RRM
= 25°C unless otherwise noted)
J
(1)
MCR218–2
MCR218–4
MCR218–6
for all types can be applied on a continuous basis. Ratings
V
DRM,
V
RRM
I
T(RMS)
I
TSM
I2t 26 A2s
P
GM
P
G(AV)
I
GM
J
stg
50
200
400
8.0 A
100 A
5.0 Watts
0.5 Watts
2.0 A
–40 to
+125
–40 to
+150
Volts
°C
°C
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SCRs
8 AMPERES RMS
50 thru 400 VOLTS
G
A
1
2
3
TO–220AB
CASE 221A
STYLE 3
PIN ASSIGNMENT
1
2
3
4
Cathode
ORDERING INFORMATION
Device Package Shipping
MCR218–2 TO220AB 500/Box
MCR218–4 TO220AB
MCR218–6 TO220AB
K
4
Anode
Gate
Anode
500/Box
500/Box
Semiconductor Components Industries, LLC, 1999
March, 2000 – Rev . 2
Preferred devices are recommended choices for future use
and best overall value.
1 Publication Order Number:
MCR218/D

MCR218–2, MCR218–4, MCR218–6
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case R
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds T
θJC
L
2.0 °C/W
260 °C
ELECTRICAL CHARACTERISTICS (T
Characteristic
= 25°C unless otherwise noted.)
J
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
(VAK = Rated V
DRM
or V
, Gate Open) TJ = 25°C
RRM
ON CHARACTERISTICS
Peak Forward On-State Voltage
(ITM = 16 A Peak)
Gate Trigger Current (Continuous dc)
(VD = 12 V, RL = 100 Ohms)
Gate Trigger Voltage (Continuous dc)
(VD = 12 V, RL = 100 Ohms)
Gate Non–Trigger V oltage
(Rated 12 V , RL = 100 Ohms, TJ = 125°C)
Holding Current
(VD = 12 Vdc, Initiating Current = 200 mA, Gate Open)
(1)
DYNAMIC CHARACTERISTICS
Critical Rate-of-Rise of Off-State Voltage
(VD = Rated V
(1) Pulse Test: Pulse Width = 1.0 ms, Duty Cycle ≤ 2%.
, Exponential Waveform, Gate Open, TJ = 125°C)
DRM
TJ = 125°C
Symbol Min Typ Max Unit
I
, I
DRM
RRM
V
TM
I
GT
V
GT
V
GD
I
H
dv/dt — 100 — V/µs
—
—
— 1.5 1.8 Volts
— 10 25 mA
— — 1.5 Volts
0.2 — — Volts
— 16 30 mA
—
—
10
2.0
µA
mA
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2

MCR218–2, MCR218–4, MCR218–6
Voltage Current Characteristic of SCR
+ Current
Anode +
Symbol Parameter
V
DRM
I
DRM
V
RRM
I
RRM
V
TM
I
H
C
°
URE
115
EMPER
105
SE
E C
95
B
O
85
Peak Repetitive Off State Forward Voltage
Peak Forward Blocking Current
Peak Repetitive Off State Reverse Voltage
Peak Reverse Blocking Current
Peak On State Voltage
Holding Current
α
α = CONDUCTION ANGLE
dc
on state
I
at V
RRM
Reverse Avalanche Region
Anode –
RRM
Reverse Blocking Region
(off state)
12
9.0
6.0
(WATTS)
3.0
α = Conduction Angle
α = 30°
V
TM
I
H
I
Forward Blocking Region
(off state)
α
120°
90°
60°
DRM
at V
180°
+ Voltage
DRM
dc
MUM
75
X
M
C
0
α = 30° 90° 120° 180°60°
I
, AVERAGE ON-ST ATE FORWARD CURRENT (AMPS)
T(AV)
Figure 1. Current Derating Figure 2. On–State Power Dissipation
, A VERAGE ON-STATE POWER DISSIPATION
0
(AV)
87654321
0
P
I
, AVG. ON-ST ATE CURRENT (AMPS)
T(AV)
8.07.06.05.04.03.02.01.0
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