ON Semiconductor MCR16N Technical data

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MCR16N
Preferred Device
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Blocking Voltage to 800 Volts
On–State Current Rating of 16 Amperes RMS
High Surge Current Capability — 160 Amperes
Rugged Economical TO–220AB Package
Glass Passivated Junctions for Reliability and Uniformity
Minimum and Maximum Values of I
Ease of Design
High Immunity to dv/dt — 100 V/µsec Minimum at 125°C
Device Marking: Logo, Device T ype, e.g., MCR16N, Date Code
, VGT, and IH Specified for
GT
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SCRs
16 AMPERES RMS
800 VOLT
G
A
K
MAXIMUM RATINGS (T
Rating
Peak Repetitive Off–State V oltage
(TJ = –40 to 125°C, Sine Wave, 50 to 60 Hz, Gate Open) MCR16N
On-State RMS Current
(180° Conduction Angles; TC = 80°C)
Peak Non-repetitive Surge Current
(1/2 Cycle, Sine Wave 60 Hz, TJ = 125°C)
Circuit Fusing Consideration
(t = 8.3 ms)
Forward Peak Gate Power
(Pulse Width ≤ 1.0 µs, TC = 80°C)
Forward Average Gate Power
(t = 8.3 ms, TC = 80°C)
Forward Peak Gate Current
(Pulse Width ≤ 1.0 µs, TC = 80°C)
Operating Junction Temperature Range T
Storage Temperature Range T
(1) V
and V
DRM
apply for zero or negative gate voltage; positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
RRM
= 25°C unless otherwise noted)
J
Symbol Value Unit
(1)
for all types can be applied on a continuous basis. Ratings
V
DRM,
V
RRM
I
T(RMS)
I
TSM
I2t 106 A2sec
P
GM
P
G(AV)
I
GM
J
stg
800
16 A
160 A
5.0 Watts
0.5 Watts
2.0 A
–40 to
+125
–40 to
+150
Volts
°C
°C
4
1
2
3
TO–220AB
CASE 221A
STYLE 3
PIN ASSIGNMENT
1 2 3 4
Cathode
Anode
Gate
Anode
ORDERING INFORMATION
Device Package Shipping
MCR16N TO220AB 50 Units/Rail
Preferred devices are recommended choices for future use and best overall value.
Semiconductor Components Industries, LLC, 1999
February , 2000 – Rev. 2
1 Publication Order Number:
MCR16/D
MCR16N
THERMAL CHARACTERISTICS
Thermal Resistance — Junction to Case
Maximum Lead Temperature for Soldering Purposes 1/8 from Case for 10 Seconds T
ELECTRICAL CHARACTERISTICS (T
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current TJ = 25°C
(VAK = Rated V
ON CHARACTERISTICS
Peak Forward On–State Voltage* (ITM = 32 A) V Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 Ω) I Gate Trigger V oltage (Continuous dc) (VD = 12 V, RL = 100 Ω) V Hold Current (Anode Voltage = 12 V, Initiating Current = 200 mA,
Gate Open)
Latch Current
(VD = 12 V, Ig = 200 mA)
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Off–State Voltage
(VD = Rated V
Critical Rate of Rise of On–State Current
(IPK = 50 A, Pw = 30 µs, diG/dt = 1 A/µsec, Igt = 50 mA)
*Indicates Pulse Test: Pulse Width v2.0 ms, Duty Cycle v2%.
— Junction to Ambient
= 25°C unless otherwise noted)
J
Characteristic
or V
DRM
, Exponential Waveform, Gate Open, TJ = 125°C)
DRM
, Gate Open) TJ = 125°C
RRM
Symbol Min Typ Max Unit
I
,
DRM
I
RRM
TM
GT
GT
I
H
I
L
dv/dt 100 300 V/µs
di/dt 50 A/µs
R
θJC
R
θJA
L
— —
1.7 Volts
2.0 10 20 mA
0.5 0.65 1.0 Volts
4.0 25 40 mA
30 60 mA
1.5
62.5 260 °C
— —
0.01
2.0
°C/W
mA
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2
MCR16N
T
130
,
AS
T
M
RAT
R
(
)
32
Voltage Current Characteristic of SCR
+ Current
Anode +
Symbol Parameter
°
C E
U
PE E E
C
C
V I
DRM
V I
RRM
V I
H
120
110
100
90
80
DRM
RRM
TM
Peak Repetitive Off State Forward Voltage Peak Forward Blocking Current Peak Repetitive Off State Reverse Voltage Peak Reverse Blocking Current Peak On State Voltage Holding Current
28410120 6 14 16
I
T(RMS)
α
α = CONDUCTION ANGLE
α = 30°
, ITRMS ON–STATE CURRENT (AMPS)
90°
180°60°
I
at V
RRM
Reverse Avalanche Region
Anode –
dc
RRM
Reverse Blocking Region
(off state)
24
α = CONDUCTION ANGLE
16
8
, A VERAGE POWER DISSIPATION (WATTS)
(AV)
0
P
V
TM
on state
I
H
I
DRM
Forward Blocking Region
(off state)
α
60°
α = 30°
68 14016
4102
I
, AVERAGE ON–STATE CURRENT (AMPS)
T(AV)
at V
90°
+ Voltage
DRM
180°
dc
12
Figure 1. Typical RMS Current Derating
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Figure 2. On State Power Dissipation
3
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