The MC74VHC1G125 is an advanced high speed CMOS
noninverting 3–state buffer fabricated with silicon gate CMOS
technology. It achieves high speed operation similar to equivalent
Bipolar Schottky TTL while maintaining CMOS low power
dissipation.
The internal circuit is composed of three stages, including a buffered
3–state output which provides high noise immunity and stable output.
The MC74VHC1G125 input structure provides protection when
voltages up to 7V are applied, regardless of the supply voltage. This
allows the MC74VHC1G125 to be used to interface 5V circuits to 3V
circuits.
• High Speed: t
• Low Power Dissipation: I
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300mA
• ESD Performance: HBM > 1500V; MM > 200V
= 3.5ns (T yp) at VCC = 5V
PD
= 2µA (Max) at TA = 25°C
CC
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SC–88A / SOT–353
DF SUFFIX
CASE 419A
MARKING DIAGRAM
d
W0
Pin 1
d = Date Code
OE
IN A
2
GND
Figure 1. 5–Lead SOT–353 Pinout (Top View)
LOGIC SYMBOL
OE
IN A
EN
51
43
OUT Y
VCC
OUT Y
PIN ASSIGNMENT
1
2
3GND
4
5VCC
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
FUNCTION TABLE
A InputY Output
L
H
X
OE
Input
L
L
H
OE
IN A
OUT Y
L
H
Z
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
Semiconductor Components Industries, LLC, 1999
February , 2000 – Rev. 0
1Publication Order Number:
MC74VHC1G125/D
MC74VHC1G125
MAXIMUM RATINGS*
CharacteristicsSymbolValueUnit
DC Supply VoltageV
DC Input VoltageV
DC Output VoltageVCC = 0
Input Diode CurrentI
Output Diode Current(V
DC Output Current, per PinI
DC Supply Current, VCC and GNDI
Power dissipation in still air, SC–88A †P
Lead temperature, 1 mm from case for 10 sT
Storage temperatureT
* Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
†Derating — SC–88A Package: –3 mW/_C from 65_ to 125_C
High or Low State
< GND; V
OUT
> VCC)I
OUT
V
OUT
CC
IN
OUT
IK
OK
CC
D
L
stg
RECOMMENDED OPERATING CONDITIONS
CharacteristicsSymbolMinMaxUnit
DC Supply VoltageV
DC Input VoltageV
DC Output VoltageV
Operating Temperature RangeT
Input Rise and Fall TimeVCC = 3.3V ± 0.3V
RL = 1k
Maximum Input Capacitance
Maximum 3–State Output Capacitance
(Output in High Impedance State)
ООООООООООООО
= 50 pF, Input tr = tf = 3.0ns)
load
Test Conditions
CL = 50 pF
CL = 50 pF
W
W
W
W
CL = 50 pF
CL = 50 pF
CL = 50 pF
CL = 50 pF
TA = 25°C
Min
Typ
4.5
ÎÎÎ
6.4
3.5
4.5
4.5
ÎÎÎ
6.4
3.5
ÎÎÎ
4.5
6.5
8.0
ÎÎÎ
4.8
7.0
4.0
6.0
ÎÎÎ
TA ≤ 85°C
Max
Min
Max
8.0
11.5
Î
13.0
ÎÎÎ
5.5
7.5
8.0
Î
11.5
ÎÎÎ
13.0
5.1
7.1
Î
13.2
Î
9.7
6.8
8.8
ÎÎÎ
11.5
15.0
ÎÎÎ
10.0
10
ÎÎÎÎÎÎÎÎÎ
9.5
6.5
8.5
9.5
6.0
8.0
8.0
10
TA ≤ 125°C
Min
Max
12.0
16.0
ÎÎÎ
8.5
10.5
11.5
ÎÎÎ
15.0
8.5
10.5
ÎÎÎ
14.5
18.0
10.0
ÎÎÎ
12.0
10
Unit
ns
ns
ns
pF
pF
Typical @ 25°C, VCC = 5.0V
C
PD
Power Dissipation Capacitance (Note 1.)
8.0
pF
1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
2
power consumption; PD = CPD V
fin + ICC VCC.
CC
CC(OPR
= CPD VCC fin + ICC. CPD is used to determine the no–load dynamic
)
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3
MC74VHC1G125
V
C
N
C
SWITCHING WAVEFORMS
A
t
PLH
Y
50% V
50%
CC
Figure 2. Figure 3.
OUTPUT
DEVICE
UNDER
TEST
*Includes all probe and jig capacitance
Figure 4. T est Circuit
TEST POINT
CL*
t
PHL
V
GND
CC
OE
Y
Y
DEVICE
UNDER
TEST
50%
t
PZLtPLZ
50% V
CC
t
PZHtPHZ
50% V
CC
TEST POINT
OUTPUT
*Includes all probe and jig capacitance
1 kΩ
CL *
VOL –0.3V
VOH +0.3V
CONNECT TO VCC WHEN
TESTING t
CONNECT TO GND WHE
TESTING t
Figure 5. T est Circuit
PLZ
PHZ
CC
GND
HIGH
IMPEDAN
HIGH
IMPEDAN
AND t
AND t
PZL.
PZH.
INPUT
Figure 6. Input Equivalent Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Temp
Device Order Number
MC74VHC1G125DFT1MC74VHC1G125DFT1
Circuit
Indicator
Range
Identifier
Technology
Device
Function
Package
Suffix
Tape &
Reel
Suffix
Package
Type
SC–88A /
SOT–353
Tape and Reel
Size
7–Inch/3000 Unit
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4
S
123
MC74VHC1G125
P ACKAGE DIMENSIONS
SC–88A / SOT–353
DF SUFFIX
5–LEAD PACKAGE
CASE 419A–01
A
ISSUE B
G
V
45
–B–
MM
D 5 PL
B0.2 (0.008)
N
J
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250
EMBOSSED
CARRIER
100 mm
(3.937”)
1 mm MAX
CAMBER (TOP VIEW)
1 mm
(0.039”) MAX
EMBOSSMENT
TAPE
250 mm
(9.843”)
mm
Figure 7. Carrier Tape Specifications
EMBOSSED CARRIER DIMENSIONS (See Notes 1 and 2)
Tape
Size
8 mm4.35 mm
1. Metric Dimensions Govern–English are in parentheses for reference only.
2. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
B
1
Max
(0.171”)
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
DD
1.5 +0.1/
–0.0 mm
(0.059
+0.004/
–0.0”)
1
1.0 mm
Min
(0.039”)
EFKPP
1.75
±0.1 mm
(0.069
±0.004”)
3.5
±0.5 mm
(1.38
±0.002”)
2.4 mm
(0.094”)
4.0
±0.10 mm
(0.157
±0.004”)
0
4.0
±0.1 mm
(0.156
±0.004”)
P
2
2.0
±0.1 mm
(0.079
±0.002”)
RTW
25 mm
(0.98”)
0.3
±0.05 mm
(0.01
+0.0038/
–0.0002”)
8.0
±0.3 mm
(0.315
±0.012”)
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6
MC74VHC1G125
13.0 mm ±0.2 mm
1.5 mm MIN
(0.06”)
(0.512” ±0.008”)
t MAX
20.2 mm MIN
A
(0.795”)
REEL DIMENSIONS
Tape
Size
8 mm330 mm
FULL RADIUS
Figure 8. Reel Dimensions
A MaxGt Max
(13”)
8.400 mm, +1.5 mm, –0.0
(0.33”, +0.059”, –0.00)
14.4 mm
(0.56”)
50 mm MIN
(1.969”)
G
DIRECTION OF FEED
BARCODE LABEL
Figure 9. Reel Winding Direction
HOLEPOCKET
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7
MC74VHC1G125
CAVITY
TAPE
TOP TAPE
TAPE TRAILER
(Connected to Reel Hub)
NO COMPONENTS
160 mm MIN
Figure 10. T ape Ends for Finished Goods
“T1” PIN ONE TOWARDS
SPROCKET HOLE
COMPONENTS
DIRECTION OF FEED
SC–88A/SOT–353 (5 Pin)
DEVICE
User Direction of Feed
Figure 11. Reel Configuration
TAPE LEADER
NO COMPONENTS
400 mm MIN
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability ,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer .
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
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MC74VHC1G125/D
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