ON Semiconductor MC74VHC1G125 Technical data

MC74VHC1G125
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Noninverting 3-State Buf fer
The MC74VHC1G125 is an advanced high speed CMOS noninverting 3–state buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffered 3–state output which provides high noise immunity and stable output.
The MC74VHC1G125 input structure provides protection when voltages up to 7V are applied, regardless of the supply voltage. This allows the MC74VHC1G125 to be used to interface 5V circuits to 3V circuits.
High Speed: t
Low Power Dissipation: I
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 1500V; MM > 200V
= 3.5ns (T yp) at VCC = 5V
PD
= 2µA (Max) at TA = 25°C
CC
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SC–88A / SOT–353
DF SUFFIX
CASE 419A
MARKING DIAGRAM
d
W0
Pin 1 d = Date Code
OE
IN A
2
GND
Figure 1. 5–Lead SOT–353 Pinout (Top View)
LOGIC SYMBOL
OE
IN A
EN
51
43
OUT Y
VCC
OUT Y
PIN ASSIGNMENT
1 2
3 GND
4
5 VCC
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
FUNCTION TABLE
A Input Y Output
L H X
OE
Input
L L
H
OE
IN A
OUT Y
L H Z
This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice.
Semiconductor Components Industries, LLC, 1999
February , 2000 – Rev. 0
1 Publication Order Number:
MC74VHC1G125/D
MC74VHC1G125
MAXIMUM RATINGS*
Characteristics Symbol Value Unit
DC Supply Voltage V DC Input Voltage V DC Output Voltage VCC = 0
Input Diode Current I Output Diode Current (V DC Output Current, per Pin I DC Supply Current, VCC and GND I Power dissipation in still air, SC–88A † P Lead temperature, 1 mm from case for 10 s T Storage temperature T
* Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — SC–88A Package: –3 mW/_C from 65_ to 125_C
High or Low State
< GND; V
OUT
> VCC) I
OUT
V
OUT
CC
IN
OUT
IK
OK
CC
D L
stg
RECOMMENDED OPERATING CONDITIONS
Characteristics Symbol Min Max Unit
DC Supply Voltage V DC Input Voltage V DC Output Voltage V Operating Temperature Range T Input Rise and Fall Time VCC = 3.3V ± 0.3V
VCC = 5.0V ± 0.5V
CC
IN
OUT
tr , t
A
f
–0.5 to +7.0 V –0.5 to +7.0 V
–0.5 to 7.0
–0.5 to VCC + 0.5
–20 mA +20 mA +25 mA +50 mA 200 mW 260 °C
–65 to +150 °C
2.0 5.5 V
0.0 5.5 V
0.0 V
–55 +85 °C
0 0
CC
100
20
ns/V
V
V
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MC74VHC1G125
Î
Î
Î
Î
Î
Î
Î
I
Y
Î
Î
Î
Î
Î
Î
Î
Î
I
Y
Î
Î
Î
Î
Î
Î
I
Y
Î
Î
Î
Î
Î
Î
Î
Î
Î
DC ELECTRICAL CHARACTERISTICS
V
CC
Symbol Parameter Test Conditions (V) Min Typ Max Min Max Min Max Unit
V
IH
Minimum High–Level Input Voltage
2.0
3.0
4.5
5.5
V
IL
Maximum Low–Level Input Voltage
2.0
3.0
4.5
5.5
V
V
I
I
I
OH
OL
OZ
IN
CC
Minimum High–Level Output Voltage VIN = VIH or V
IL
Maximum Low–Level Output Voltage VIN = VIH or V
IL
Maximum 3–State Leakage Current
Maximum Input Leakage Current
Maximum Quiescent Supply Current
VIN = VIH or V IOH = –50µA
VIN = VIH or V IOH = –4mA
IL
IL
IOH = –8mA VIN = VIH or V
IOL = 50µA
VIN = VIH or V IOL = 4mA
IL
IL
IOL = 8mA VIN = VIH or V
V
= VCC or GND
OUT
IL
VIN = 5.5V or GND 0 to
VIN = VCC or GND 5.5 2.0 20 40 µA
2.0
3.0
4.5
3.0
4.5
2.0
3.0
4.5
3.0
4.5
5.5 ±0.25 ±2.5 ±2.5 µA
5.5
TA = 25°C TA 85°C TA 125°C
1.5
2.1
3.15
3.85
1.9
2.9
4.4
2.58
3.94
1.35
1.65
2.0
3.0
4.5
0.0
0.0
0.0
0.36
0.36
0.5
0.9
0.1
0.1
0.1
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
1.9
2.9
4.4
2.48
3.80
0.1
0.1
0.1
0.44
0.44
±0.1 ±1.0 ±1.0 µA
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
1.9
2.9
4.4
2.34
3.66
0.1
0.1
0.1
0.52
0.52
V
V
V
V
V
V
AC ELECTRICAL CHARACTERISTICS (C
Symbol
t
,
PLH
t
PHL
ÎÎ
t
,
PZL
ÎÎ
t
PZH
ÎÎÎООООО
t
,
PLZ
t
PHZ
ÎÎÎООООО
C
IN
C
OUT
ÎÎ
Parameter
Maximum Propogation Delay,
ООООО
nput A to
(Figures 2 and 4)
Maximum Output
ООООО
Enable Time,
nput OE to
(Figures 3 and 5)
Maximum Output Disable Time,
nput OE to
(Figures 3 and 5)
VCC = 3.0 ± 0.3V CL = 15 pF
ООООООО
VCC = 5.0 ± 0.5V CL = 15 pF
VCC = 3.3 ± 0.3V CL = 15 pF
ООООООО
RL = 1k VCC = 5.0 ± 0.5V CL = 15 pF
RL = 1k
ООООООО
VCC = 3.3 ± 0.3V CL = 15 pF RL = 1k
VCC = 5.0 ± 0.5V CL = 15 pF
ООООООО
RL = 1k Maximum Input Capacitance Maximum 3–State Output Capacitance
(Output in High Impedance State)
ООООООООООООО
= 50 pF, Input tr = tf = 3.0ns)
load
Test Conditions
CL = 50 pF
CL = 50 pF
W
W
W
W
CL = 50 pF
CL = 50 pF
CL = 50 pF
CL = 50 pF
TA = 25°C
Min
Typ
4.5
ÎÎÎ
6.4
3.5
4.5
4.5
ÎÎÎ
6.4
3.5
ÎÎÎ
4.5
6.5
8.0
ÎÎÎ
4.8
7.0
4.0
6.0
ÎÎÎ
TA 85°C
Max
Min
Max
8.0
11.5
Î
13.0
ÎÎÎ
5.5
7.5
8.0
Î
11.5
ÎÎÎ
13.0
5.1
7.1
Î
13.2
Î
9.7
6.8
8.8
ÎÎÎ
11.5
15.0
ÎÎÎ
10.0
10
ÎÎÎÎÎÎÎÎÎ
9.5
6.5
8.5
9.5
6.0
8.0
8.0
10
TA 125°C
Min
Max
12.0
16.0
ÎÎÎ
8.5
10.5
11.5
ÎÎÎ
15.0
8.5
10.5
ÎÎÎ
14.5
18.0
10.0
ÎÎÎ
12.0 10
Unit
ns
ns
ns
pF pF
Typical @ 25°C, VCC = 5.0V
C
PD
Power Dissipation Capacitance (Note 1.)
8.0
pF
1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I
2
power consumption; PD = CPD V
fin + ICC VCC.
CC
CC(OPR
= CPD VCC fin + ICC. CPD is used to determine the no–load dynamic
)
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3
MC74VHC1G125
V
C
N
C
SWITCHING WAVEFORMS
A
t
PLH
Y
50% V
50%
CC
Figure 2. Figure 3.
OUTPUT
DEVICE UNDER
TEST
*Includes all probe and jig capacitance
Figure 4. T est Circuit
TEST POINT
CL*
t
PHL
V
GND
CC
OE
Y
Y
DEVICE UNDER
TEST
50%
t
PZLtPLZ
50% V
CC
t
PZHtPHZ
50% V
CC
TEST POINT
OUTPUT
*Includes all probe and jig capacitance
1 k
CL *
VOL –0.3V VOH +0.3V
CONNECT TO VCC WHEN TESTING t CONNECT TO GND WHE TESTING t
Figure 5. T est Circuit
PLZ
PHZ
CC
GND
HIGH IMPEDAN
HIGH IMPEDAN
AND t
AND t
PZL.
PZH.
INPUT
Figure 6. Input Equivalent Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Temp
Device Order Number
MC74VHC1G125DFT1 MC 74 VHC1G 125 DF T1
Circuit
Indicator
Range
Identifier
Technology
Device
Function
Package
Suffix
Tape &
Reel
Suffix
Package
Type
SC–88A / SOT–353
Tape and Reel
Size
7–Inch/3000 Unit
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4
S
123
MC74VHC1G125
P ACKAGE DIMENSIONS
SC–88A / SOT–353
DF SUFFIX
5–LEAD PACKAGE
CASE 419A–01
A
ISSUE B
G
V
45
–B–
MM
D 5 PL
B0.2 (0.008)
N
J
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MM.
INCHES
DIMAMIN MAX MIN MAX
B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC H ––– 0.10–––0.004
J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087 V 0.30 0.400.012 0.016
0.5 mm (min)
MILLIMETERS
1.80 2.200.071 0.087
H
K
0.65 mm 0.65 mm
0.4 mm (min)
1.9 mm
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5
K
t
COVER
B
1
FOR MACHINE REFERENCE
INCLUDING DRAFT AND RADII
CONCENTRIC AROUND B
ONLY
R MIN.
K
0
SEE
NOTE 2
0
TOP
TAPE
MC74VHC1G125
P
0
D
EMBOSSMENT
USER DIRECTION OF FEED
P
2
SEE NOTE 2A
0
B
0 P
10 PITCHES CUMULATIVE TOLERANCE ON TAPE
±0.2 mm (±0.008”)
++ +
CENTER LINES OF CAVITY
E
F
W
D
1
FOR COMPONENTS
2.0 mm × 1.2 mm AND LARGER
*TOP COVER TAPE THICKNESS (t1)
0.10 mm (0.004”) MAX.
TAPE AND COMPONENTS
BENDING RADIUS
10°
MAXIMUM COMPONENT ROTATION
SHALL PASS AROUND RADIUS “R” WITHOUT DAMAGE
TYPICAL COMPONENT CAVITY CENTER LINE
TYPICAL COMPONENT CENTER LINE
ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250
EMBOSSED CARRIER
100 mm (3.937”)
1 mm MAX
CAMBER (TOP VIEW)
1 mm
(0.039”) MAX
EMBOSSMENT
TAPE
250 mm (9.843”)
mm
Figure 7. Carrier Tape Specifications
EMBOSSED CARRIER DIMENSIONS (See Notes 1 and 2)
Tape
Size
8 mm 4.35 mm
1. Metric Dimensions Govern–English are in parentheses for reference only.
2. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
B
1
Max
(0.171”)
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
D D
1.5 +0.1/ –0.0 mm
(0.059
+0.004/
–0.0”)
1
1.0 mm Min
(0.039”)
E F K P P
1.75
±0.1 mm
(0.069
±0.004”)
3.5
±0.5 mm
(1.38
±0.002”)
2.4 mm
(0.094”)
4.0
±0.10 mm
(0.157
±0.004”)
0
4.0
±0.1 mm
(0.156
±0.004”)
P
2
2.0
±0.1 mm
(0.079
±0.002”)
R T W
25 mm (0.98”)
0.3
±0.05 mm
(0.01
+0.0038/
–0.0002”)
8.0
±0.3 mm
(0.315
±0.012”)
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MC74VHC1G125
13.0 mm ±0.2 mm
1.5 mm MIN (0.06”)
(0.512” ±0.008”)
t MAX
20.2 mm MIN
A
(0.795”)
REEL DIMENSIONS
Tape
Size
8 mm 330 mm
FULL RADIUS
Figure 8. Reel Dimensions
A Max G t Max
(13”)
8.400 mm, +1.5 mm, –0.0 (0.33”, +0.059”, –0.00)
14.4 mm (0.56”)
50 mm MIN
(1.969”)
G
DIRECTION OF FEED
BARCODE LABEL
Figure 9. Reel Winding Direction
HOLEPOCKET
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7
MC74VHC1G125
CAVITY TAPE
TOP TAPE
TAPE TRAILER
(Connected to Reel Hub)
NO COMPONENTS
160 mm MIN
Figure 10. T ape Ends for Finished Goods
“T1” PIN ONE TOWARDS
SPROCKET HOLE
COMPONENTS
DIRECTION OF FEED
SC–88A/SOT–353 (5 Pin)
DEVICE
User Direction of Feed
Figure 11. Reel Configuration
TAPE LEADER
NO COMPONENTS
400 mm MIN
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MC74VHC1G125/D
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