Analog Multiplexers/
Demultiplexers with
Injection Current Effect
Control
Automotive Customized
MC74HC4851A,
MC74HC4852A
These devices are pin compatible to standard HC405x and
MC1405xB analog mux/demux devices, but feature injection current
effect control. This makes them especially suited for usage in
automotive applications where voltages in excess of normal logic
voltage are common.
The injection current effect control allows signals at disabled analog
input channels to exceed the supply voltage range without affecting
the signal of the enabled analog channel. This eliminates the need for
external diode/resistor networks typically used to keep the analog
channel signals within the supply voltage range.
The devices utilize low power silicon gate CMOS technology.
The Channel Select and Enable inputs are compatible with standard
CMOS outputs.
Features
• Injection Current Cross−Coupling Less than 1 mV/mA (See
Figure 10)
• Pin Compatible to HC405X and MC1405XB Devices
• Power Supply Range (V
• In Compliance With the Requirements of JEDEC Standard No. 7 A
• Chip Complexity: 154 FETs or 36 Equivalent Gates
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free and are RoHS Compliant
− GND) = 2.0 to 6.0 V
CC
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SOIC−16
D SUFFIX
CASE 751B
TSSOP−16
DT SUFFIX
CASE 948F
MARKING DIAGRAMS
16
HC485xAG
AWLYWW
1
SOIC−16
16
HC48
5xA
ALYWG
G
1
TSSOP−16
x = 1 or 2
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
SOIC−16 WIDE
DW SUFFIX
CASE 751G
1
QFN16
MN SUFFIX
CASE 485AW
16
HC4851A
AWLYWWG
1
SOIC−16 WIDE
4851
ALYWG
G
QFN16*
*V4851 marking used for
NLV74HC4851AMN1TWG
© Semiconductor Components Industries, LLC, 2016
April, 2021 − Rev. 23
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
1 Publication Order Number:
MC74HC4851A/D
MC74HC4851A, MC74HC4852A
13
X0
14
X1
15
ANALOG
INPUTS/
OUTPUTS
CHANNEL
SELECT
INPUTS
Figure 2. MC74HC4851A 16−Lead Pinout (Top View)
X2
ENABLE
12
X3
1
X4
5
X5
2
X6
4
X7
11
A
10
B
9
C
6
PIN 16 = V
PIN 8 = GND
MULTIPLEXER/
DEMULTIPLEXER
CC
3
COMMON
X
OUTPUT/
INPUT
Figure 1. MC74HC4851A Logic Diagram
Single−Pole, 8−Position Plus Common Off
X2 X1 X0 X3 A B C
V
CC
1516 14 13 12 11 10
21 34567
X4 X6 X X7 X5 Enable NC GND
9
8
FUNCTION TABLE − MC74HC4851A
Control Inputs
Select
Enable
L
L
L
L
L
L
L
L
H
CBA
L
L
L
L
L
H
H
H
H
X
L
L
H
H
L
H
H
L
L
L
H
H
L
H
H
X
X
V
X4
CC
ON Channels
X0
X1
X2
X3
X4
X5
X6
X7
NONE
116
X6
X7
X5
ENABLE
215
314
X
413
GND
512
611
N
710
C
89
GND
C
X2
X1
X0
X3
A
B
Figure 3. MC74HC4851A QFN Pinout
INPUTS/OUTPUTS
CHANNEL‐SELECT
ANALOG
INPUTS
Double−Pole, 4−Position Plus Common Off
12
X0
14
X1
X2
X3
Y0
Y1
Y2
Y3
ENABLE
15
11
1
5
2
4
10
A
9
B
6
X SWITCH
Y SWITCH
13
X
3
Y
PIN 16 = V
PIN 8 = GND
CC
Figure 4. MC74HC4852A Logic Diagram
COMMON
OUTPUTS/INPUTS
FUNCTION TABLE − MC74HC4852A
Control Inputs
Select
BA
L
L
L
L
L
H
H
H
X
L
L
H
L
H
X
ON ChannelsEnable
Y0
Y1
Y2
Y3
X0
X1
X2
X3
NONE
X = Don’t Care
X2 X1 X X0 X3 A B
V
CC
1516 14 13 12 11 10
21 34567
9
8
Y0 Y2 Y Y3 Y1 Enable NC GND
Figure 5. MC74HC4852A 16−Lead Pinout (Top View)
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2
MC74HC4851A, MC74HC4852A
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
Positive DC Supply Voltage (Referenced to GND) –0.5 to +7.0 V
CC
V
DC Input Voltage (Any Pin) (Referenced to GND) –0.5 to VCC + 0.5 V
in
I DC Current, Into or Out of Any Pin ±25 mA
P
Power Dissipation in Still Air, SOIC Package†
D
TSSOP Package†
T
Storage Temperature Range –65 to +150 °C
stg
T
Lead Temperature, 1 mm from Case for 10 Seconds
L
SOIC or TSSOP Package
500
450
260
mW
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
†Derating: SOIC Package: –7 mW/°C from 65° to 125°C
TSSOP Package: −6.1 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
VIO* Static or Dynamic Voltage Across Switch 0.0 1.2 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
*For voltage drops across switch greater than 1.2 V (switch on), excessive V
contain both V
Positive DC Supply Voltage (Referenced to GND) 2.0 6.0 V
CC
V
DC Input Voltage (Any Pin) (Referenced to GND) GND V
in
T
Operating Temperature Range, All Package Types –55 +125 °C
A
tr, tfInput Rise/Fall Time VCC = 2.0 V
(Channel Select or Enable Inputs) V
current may be drawn; i.e., the current out of the switch may
and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
CC
CC
V
= 4.5 V
CC
= 6.0 V
CC
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, V
V
should be constrained to the
out
range GND v (V
in
or V
) v VCC.
out
in
and
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V
CC
Unused outputs must be left open.
CC
0
0
0
1000
500
400
V
ns
).
DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) V
Symbol
V
IH
V
IL
I
in
I
CC
Minimum High−Level Input Voltage,
Channel−Select or Enable Inputs
Maximum Low−Level Input Voltage,
Channel−Select or Enable Inputs
Maximum Input Leakage Current on Digital Pins
(Enable/A/B/C)
Maximum Quiescent Supply Current
(per Package)
Parameter Condition
Ron = Per Spec 2.0
Ron = Per Spec 2.0
Vin = VCC or GND 6.0 ±0.1 ±1.0 ±1.0
V
V
in(digital)
in(analog)
= VCC or GND
= GND
= GND, Except Where Noted
EE
V
CC
V
Guaranteed Limit
−55 to 25°C ≤85°C ≤125°C
1.50
3.0
4.5
6.0
2.10
3.15
4.20
0.50
3.0
4.5
6.0
0.90
1.35
1.80
6.0 2 20 40
1.50
2.10
3.15
4.20
0.50
0.90
1.35
1.80
1.50
2.10
3.15
4.20
0.50
0.90
1.35
1.80
Unit
V
V
mA
mA
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3
MC74HC4851A, MC74HC4852A
DC CHARACTERISTICS — Analog Section
Symbol Parameter Condition V
R
Maximum “ON” Resistance Vin = VIL or VIH; VIS = VCC to
on
DR
Delta “ON” Resistance Vin = VIL or VIH; VIS = VCC/2
on
I
Maximum Off−Channel Leakage Current,
off
Any One Channel
Common Channel
I
Maximum On−Channel Leakage
on
Channel−to−Channel
1. VIS is the input voltage of an analog I/O pin.
is the currebnt flowing in or out of analog I/O pin.
2. I
S
GND (Note 1); I
(Note 2)
(Note 1); I
Vin = VCC or GND
Vin = VCC or GND
≤ 2.0 mA
S
≤ 2.0 mA (Note 2)
S
Guaranteed Limit
−55 to 25°C ≤85°C ≤125°C
CC
2.0
3.0
4.5
6.0
2.0
3.0
4.5
6.0
6.0 ±0.1
1700
1100
550
400
300
160
80
60
±0.1
1750
1200
650
500
400
200
100
80
±0.1
±0.1
1800
1300
750
600
500
240
120
100
±0.1
±0.1
6.0 ±0.1 ±0.1 ±0.1
Unit
W
W
mA
mA
AC CHARACTERISTICS (C
Symbol
t
,
Maximum Propagation Delay, Analog Input to Analog Output 2.0
PHL
t
PLH
t
,
Maximum Propagation Delay, Enable or Channel−Select to Analog Output 2.0
PHL
t
PHZ,PZH
t
,
PLH
t
PLZ,PZL
C
Maximum Input Capacitance Digital Pins
in
= 50 pF, Input tr = tf = 6 ns)
L
Parameter V
(All Switches Off) Any Single Analog Pin
(All Switches Off) Common Analog Pin
C
Power Dissipation Capacitance Typical 5.0 20 pF
PD
INJECTION CURRENT COUPLING SPECIFICATIONS (V
Symbol
VD
Maximum Shift of Output Voltage of Enabled Analog Channel
out
* Iin = Total current injected into all disabled channels.
Parameter Condition Typ Max Unit
3.0
4.5
6.0
3.0
4.5
6.0
= 5V, TA = −55°C to +125°C)
CC
Iin* ≤ 1 mA, RS ≤ 3,9 kW
I
* ≤ 10 mA, RS ≤ 3,9 kW
in
I
* ≤ 1 mA, RS ≤ 20 kW
in
I
* ≤ 10 mA, RS ≤ 20 kW
in
−55 to 25°C ≤85°C ≤125°C Unit
CC
160
80
40
30
260
160
80
78
10
35
40
180
90
45
35
280
180
90
80
10
35
40
0.1
1.0
0.5
5.0
200
100
50
40
300
200
100
80
10
35
40
1.0
5.0
2.0
20
ns
ns
pF
mV
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4
MC74HC4851A, MC74HC4852A
1100
1000
900
800
700
600
500
400
, ON RESISTANCE (OHMS)
300
on
R
200
100
0
0.0 0.4 0.8 1.2 1.6 2.0 0.0 0.6 1.2 1.8 2.4 3.0
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
-55°C
+25°C
+125°C
1100
1000
900
800
700
600
500
400
, ON RESISTANCE (OHMS)
300
on
R
200
100
0
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
Figure 6. Typical On Resistance VCC = 2V Figure 7. Typical On Resistance VCC = 3V
660
600
540
480
420
360
300
240
, ON RESISTANCE (OHMS)
180
on
R
120
60
0
0.0 0.9 1.8 2.7 3.6 4.5 0.0 1.2 2.4 3.6 4.8 6.0
-55°C
+25°C
+125°C
440
400
360
320
280
240
200
160
, ON RESISTANCE (OHMS)
120
on
R
80
40
0
-55°C
+25°C
+125°C
-55°C
+25°C
+125°C
, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
V
in
Figure 8. Typical On Resistance V
, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
V
in
= 4.5V Figure 9. Typical On Resistance VCC = 6V
CC
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5
Vin2 / Iin2 meas. here.
MC74HC4851A, MC74HC4852A
External DC P.S.
= 5 V
V
CC
Current Source
HP4155C
Smu #2
Vin1 = 4.9 V (Smu3)
Iin1 measure here
Vm1 connected here.
RS
GND or V
SS
X7
X0
4
13
6
8
16
3
X
Vout
Vm2 connected here.
NOTES: Rs = 3.9 KW or 20 KW.
NOTES: Vm1 & Vm2 are internal
NOTES: HP4155C Voltmeters.
Figure 10. Injection Current Coupling Specification
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6
MC74HC4851A, MC74HC4852A
Sensor
(8x Identical Circuitry)
6V5V
V
HC4051A Microcontroller
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
Common Out
CC
5V
V
CC
A/D - Input
Figure 11. Actual Technology
Requires 32 passive components and one extra 6V regulator
to suppress injection current into a standard HC4051 multiplexer
V
CC
A/D - Input
Sensor
(8x Identical Circuitry)
5V
V
HC4851A Microcontroller
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
Common Out
CC
Figure 12. MC74HC4851A Solution
Solution by applying the HC4851A multiplexer
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7
MC74HC4851A, MC74HC4852A
PROGRAMMABLE
POWER
SUPPLY
+-
ANALOG IN COMMON OUT
V
CC
V
EE
V
CC
PLOTTER
MINI COMPUTER
V
CC
DEVICE
UNDER TEST
GND
Figure 13. On Resistance Test
Set−Up
V
ANALOG I/O
OFF
OFF
16
COMMON O/I
DC ANALYZER
CC
A
V
CC
V
CC
V
EE
16
OFF
V
CC
A
NC
V
IH
OFF
6
COMMON O/I
8
Figure 14. Maximum Off Channel Leakage Current,
Any One Channel, Test Set−Up
V
CC
A
ON
V
EE
V
CC
ANALOG I/O
OFF
16
COMMON O/I
V
CC
N/C
V
IH
6
8
Figure 15. Maximum Off Channel Leakage Current,
Common Channel, Test Set−Up
CHANNEL
SELECT
ANALOG
OUT
t
PLH
50%
50%
t
PHL
Figure 17. Propagation Delays, Channel Select
to Analog Out
V
IL
6
8
Figure 16. Maximum On Channel Leakage Current,
Channel to Channel, Test Set−Up
V
V
CC
V
CC
ON/OFF
CC
16
ANALOG I/O
GND
OFF/ON
6
8
CHANNEL SELECT
*Includes all probe and jig capacitance
Figure 18. Propagation Delay, Test Set−Up Channel
Select to Analog Out
COMMON O/I
TEST
POINT
CL*
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8
ANALOG
ANALOG
OUT
MC74HC4851A, MC74HC4852A
V
CC
16
V
CC
IN
50%
ANALOG I/O
ON
GND
t
PLH
50%
t
PHL
6
8
*Includes all probe and jig capacitance
COMMON O/I
TEST
POINT
CL*
Figure 19. Propagation Delays, Analog In
to Analog Out
t
ENABLE
ANALOG
OUT
ANALOG
OUT
f
50%
50%
t
t
PZL
PZH
t
r
t
PLZ
t
PHZ
Figure 21. Propagation Delays, Enable to
Analog Out
90%
50%
10%
10%
90%
V
CC
GND
HIGH
IMPEDANCE
V
OL
V
OH
HIGH
IMPEDANCE
Figure 20. Propagation Delay, Test Set−Up
Analog In to Analog Out
POSITION 1 WHEN TESTING t
1
2
V
CC
1
2
POSITION 2 WHEN TESTING t
ANALOG I/O
ON/OFF
ENABLE
6
V
CC
16
8
Figure 22. Propagation Delay, Test Set−Up
Enable to Analog Out
PHZ
PLZ
AND t
AND t
PZH
PZL
10kW
TEST
POINT
CL*
V
CC
V
CC
A
16
COMMON O/I
ANALOG I/O
V
CC
6
8
11
CHANNEL SELECT
Figure 23. Power Dissipation Capacitance,
Test Set−Up
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9
NC
MC74HC4851A, MC74HC4852A
0
2
3
4
5
6
7
Disabled Analog Mux Input
V
> VCC + 0.7V
in
Figure 24. Diagram of Bipolar Coupling Mechanism
Appears if V
exceeds VCC, driving injection current into the substrate
in
Gate = V
CC
(Disabled)
P+ P+
+
+
+
N - Substrate (on VCC potential)
Common Analog Output
V
> V
out
CC
A
B
C
ENABLE
11
10
9
6
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
13
14
15
12
X
X1
X
X
1
X
5
X
2
X
4
X
Figure 25. Function Diagram, HC4851A
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10
INJECTION
CURRENT
CONTROL
3
X
MC74HC4851A, MC74HC4852A
ENABLE
10
A
9
B
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
13
14
1315
12
X0
X1
X2
X3
3
X
1
Y0
5
Y1
6
INJECTION
CURRENT
CONTROL
2
Y2
Figure 26. Function Diagram, HC4852A
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
4
Y3
3
Y
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11
MC74HC4851A, MC74HC4852A
ORDERING INFORMATION
Device Package Shipping
MC74HC4851ADG
MC74HC4851ADR2G 2500 Units / Tape & Reel
NLVHC4851ADR2G* 2500 Units / Tape & Reel
MC74HC4851AADR2G 2500 Units / Tape & Reel
MC74HC4851ADTR2G
NLVHC4851ADTR2G*
MC74HC4851ADWR2G
NLVHC4851ADWR2G*
NLV74HC4851AMNTWG*#
NLV74HC4851AMN1TWG*# 3000 Units / Tape & Reel
SOIC−16
(Pb−Free)
TSSOP−16
(Pb−Free)
SOIC−16 WIDE
(Pb−Free)
QFN16
(Pb−Free)
48 Units / Rail
2500 Units / Tape & Reel
1000 Units / Tape & Reel
3000 Units / Tape & Reel
†
MC74HC4852ADG
MC74HC4852ADR2G 2500 Units / Tape & Reel
NLV74HC4852ADR2G* 2500 Units / Tape & Reel
MC74HC4852ADTR2G
NLVHC4852ADTR2G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
#MN suffix is with pull−back lead, MN1 is without pull−back lead. Refer to ’Detail A’ of case outline on page 16.
SOIC−16
(Pb−Free)
TSSOP−16
(Pb−Free)
48 Units / Rail
2500 Units / Tape & Reel
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12
0.10 (0.004)
−T−
SEATING
PLANE
L
U0.15 (0.006) T
PIN 1
IDENT.
U0.15 (0.006) T
D
S
2X L/2
S
MC74HC4851A, MC74HC4852A
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
U
B
−U−
ISSUE B
S
J
N
H
S
J1
N
DETAIL E
DETAIL E
SECTION N−N
0.25 (0.010)
F
K1
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
K
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE -W-.
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
−W−
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
INCHESMILLIMETERS
16X REFK
0.10 (0.004) V
16
1
M
T
9
8
A
−V−
C
G
SOLDERING FOOTPRINT*
7.06
1
16X
0.36
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
16X
1.26
DIMENSIONS: MILLIMETERS
0.65
PITCH
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13
MC74HC4851A, MC74HC4852A
PACKAGE DIMENSIONS
SOIC−16 WB
DW SUFFIX
CASE 751G−03
ISSUE D
16 9
M
B
H8X
M
0.25
0.25 B
14X
e
D
A
q
_
E
h X 45
81
S
A1
B
A
C
T
SEATING
PLANE
L
B16X
M
S
A
T
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0 7
__
SOLDERING FOOTPRINT*
16X
0.58
11.00
1
16X
1.62
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
14
−T−
MC74HC4851A, MC74HC4852A
−A−
16 9
−B−
18
G
K
C
SEATING
PLANE
D
16 PL
0.25 (0.010) A
M
S
B
T
S
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
8 PLP
M
0.25 (0.010) B
M
S
X 45
R
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
F
J
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
____
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
INCHESMILLIMETERS
SOLDERING FOOTPRINT*
8X
6.40
16X
1.12
1
16X
0.58
89
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
16
1.27
PITCH
DIMENSIONS: MILLIMETERS
www.onsemi.com
15
16X
2X
2X
NOTE 4
PIN ONE
REFERENCE
C0.10
C0.08
C0.15
C0.15
D
TOP VIEW
DETAIL B
SIDE VIEW
MC74HC4851A, MC74HC4852A
PACKAGE DIMENSIONS
QFN16, 2.5x3.5, 0.5P
CASE 485AW
ISSUE O
A
B
L
L1
DETAIL A
ALTERNATE TERMINAL
E
A
CONSTRUCTIONS
MOLD CMPDEXPOSED Cu
DETAIL B
ALTERNATE
CONSTRUCTIONS
(A3)
A1
SEATING
C
PLANE
L
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A
0.80 1.00
A1 0.00 0.05
A3
0.20 REF
b 0.20 0.30
D 2.50 BSC
D2 0.85 1.15
E 3.50 BSC
E2
1.85 2.15
e 0.50 BSC
K 0.20 ---
L 0.35 0.45
L1 --- 0.15
3.80
2.10
0.50
PITCH
L
16X
DETAIL A
8
D2
0.15
10
K
C A B
0.15
C A B
2.80
1.10
E2
16X
1
PACKAGE
16X
0.30
DIMENSIONS: MILLIMETERS
OUTLINE
16X
b
0.10 C
0.05 C
A B
NOTE 3
0.60
2
1
15
e
e/2
BOTTOM VIEW
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