ON Semiconductor MC74AC240, MC74ACT240 Technical data

MC74AC240, MC74ACT240

Octal Buffer/Line Driver
with 3−State Outputs

The MC74AC240/74ACT240 is an octal buffer and line driver
designed to be employed as a memory address driver, clock driver and
bus oriented transmitter or receiver which provides improved PC
board density.

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• 3−State Outputs Drive Bus Lines or Buffer Memory Address

Registers

• Outputs Source/Sink 24 mA

• ′ACT240 Has TTL Compatible Inputs

OE

V

CC

2

1920 18 17 16 15 14

21 34567

OE

1

Figure 1. Pinout: 20−Lead Packages Conductors

(Top View)

TRUTH TABLE

Inputs Outputs

OE1D (Pins 12, 14, 16, 18)

L L H
L H L

H X Z

NOTE: H = HIGH Voltage Level

L = LOW Voltage Level
X = Immaterial
Z = High Impedance

TRUTH TABLE

Inputs Outputs

OE2D

L L H
L H L

H X Z

NOTE: H = HIGH Voltage Level

(Pins 3, 5, 7, 9)

L = LOW Voltage Level
X = Immaterial
Z = High Impedance

12

13

8

11

10

9

GND

PDIP−20
N SUFFIX
CASE 738

20

1

20

1

20

1

20

1

SO−20
DW SUFFIX
CASE 751D

TSSOP−20
DT SUFFIX

CASE 948E

EIAJ−20
M SUFFIX
CASE 967

ORDERING INFORMATION

Device Package Shipping

MC74AC240N PDIP−20 18 Units/Rail
MC74ACT240N PDIP−20
MC74AC240DW SOIC−20 38 Units/Rail
MC74AC240DWR2 SOIC−20 1000 Tape & Reel
MC74ACT240DW SOIC−20 38 Units/Rail
MC74ACT240DWR2 SOIC−20
MC74AC240DTR2 TSSOP−20 2500 Tape & Reel
MC74ACT240DTR2 TSSOP−20
MC74AC240MEL EIAJ−20 2000 Tape & Reel
MC74ACT240MEL EIAJ−20

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.

18 Units/Rail

1000 Tape & Reel

2500 Tape & Reel

2000 Tape & Reel

†

DEVICE MARKING INFORMATION

See general marking information in the device marking
section on page 5 of this data sheet.

 Semiconductor Components Industries, LLC, 2004

July, 2004 − Rev. 6

1 Publication Order Number:

MC74AC240/D

MC74AC240, MC74ACT240

r,f

′AC Devices except Schmitt Inputs

In ut Rise and Fall Time (Note 2)

MAXIMUM RATINGS

Symbol Parameter Value Unit

V

CC

V

IN

V

OUT

I

IN

I

OUT

I

CC

T

stg

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Unit

V

CC

VIN, V

OUT

tr, t

f

tr, t

f

T

J

T

A

I

OH

I

OL

1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.

2. V

IN

DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V
DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V

DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V
DC Input Current, per Pin ±20 mA
DC Output Sink/Source Current, per Pin ±50 mA
DC VCC or GND Current per Output Pin ±50 mA
Storage Temperature −65 to +150 °C

Supply Voltage

DC Input Voltage, Output Voltage (Ref. to GND) 0 − V

′AC 2.0 5.0 6.0

′ACT 4.5 5.0 5.5

CC

V

V

VCC @ 3.0 V − 150 −

Input Rise and Fall Time (Note 1)

′

p

p

VCC @ 4.5 V − 40 − ns/V
VCC @ 5.5 V − 25 −

Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs

VCC @ 4.5 V − 10 −
VCC @ 5.5 V − 8.0 −

ns/V

Junction Temperature (PDIP) − − 140 °C
Operating Ambient Temperature Range −40 25 85 °C
Output Current − High − − −24 mA
Output Current − Low − − 24 mA

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2

MC74AC240, MC74ACT240

y

(V)

ugee

auoee

ugee

V

auoee

V

au u

A

V

V

GND

au

a u Quesce

A

V

V

GND

DC CHARACTERISTICS

74AC 74AC

V

Symbol Parameter

V

IH

Minimum High Level
Input Voltage

CC

3.0 1.5 2.1 2.1 V

4.5 2.25 3.15 3.15 V or VCC − 0.1 V

5.5 2.75 3.85 3.85

V

IL

Maximum Low Level
Input Voltage

3.0 1.5 0.9 0.9 V

4.5 2.25 1.35 1.35 V or VCC − 0.1 V

5.5 2.75 1.65 1.65

V

OH

Minimum High Level
Output Voltage

3.0 2.99 2.9 2.9 I

4.5 4.49 4.4 4.4 V

5.5 5.49 5.4 5.4

3.0 − 2.56 2.46

4.5 − 3.86 3.76

5.5 − 4.86 4.76 −24 mA

V

OL

Maximum Low Level
Output Voltage

3.0 0.002 0.1 0.1 I

4.5 0.001 0.1 0.1 V

5.5 0.001 0.1 0.1

3.0 − 0.36 0.44

4.5 − 0.36 0.44

5.5 − 0.36 0.44 24 mA

I

IN

I

OZ

Maximum Input
Leakage Current

Maximum
3−State

5.5 − ±0.1 ±1.0 

5.5 − ±0.5 ±5.0 A VI = VCC, GND

Current

I

OLD

I

OHD

I

CC

†Minimum Dynamic

Output Current

Maximum Quiescent
Supply Current

5.5 − − 75 mA V

5.5 − − −75 mA V

5.5 − 8.0 80 

*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.

NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.

TA = +25°C TA =−40°C to +85°C

Typ Guaranteed Limits

Unit Conditions

= 0.1 V

OUT

= 0.1 V

OUT

= −50 A

OUT

*VIN = VIL or V

−12 mA

I

OH

OUT

−24 mA

= 50 A

*VIN = VIL or V

12 mA

I

OL

=

I

V

I

24 mA

,

CC

(OE) = VIL, V

VO = VCC, GND

= 1.65 V Max

OLD

= 3.85 V Min

OHD

=

CC

or

IN

IH

IH

IH

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3

MC74AC240, MC74ACT240

O

O

O

O

y

(V)

ugee

V

auoee

V

ugee

V

I

auoee

V

I

au u

A

V

V

GND

au

a u Quesce

A

V

V

GND

AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)

74AC 74AC

Symbol Parameter

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

* Voltage Range 3.3 V is 3.3 V ±0.3 V.

Propagation Delay
Data to Output 5.0 1.5 4.5 6.5 1.0 7.0

Propagation Delay
Data to Output 5.0 1.5 4.5 6.0 1.0 6.5

p

utput Enable Time

p

utput Enable Time

p

utput Disable Time

p

utput Disable Time

VCC*

(V)

3.3 1.5 6.0 8.0 1.0 9.0

3.3 1.5 5.5 8.0 1.0 8.5

3.3 1.5 6.0 10.5 1.0 11.0

5.0 1.5 5.0 7.0 1.0 8.0

3.3 1.5 7.0 10.0 1.0 11.0

5.0 1.5 5.5 8.0 1.0 8.5

3.3 1.5 7.0 10.0 1.0 10.5

5.0 1.5 6.5 9.0 1.0 9.5

3.3 1.5 7.5 10.5 1.0 11.5

5.0 1.5 6.5 9.0 1.0 9.5

Voltage Range 5.0 V is 5.0 V ±0.5 V.

DC CHARACTERISTICS

74ACT 74ACT

V

Symbol Parameter

V

IH

Minimum High Level
Input Voltage

V

IL

Maximum Low Level
Input Voltage

V

OH

Minimum High Level
Output Voltage

CC

4.5 1.5 2.0 2.0

5.5 1.5 2.0 2.0

4.5 1.5 0.8 0.8

5.5 1.5 0.8 0.8

4.5 4.49 4.4 4.4

5.5 5.49 5.4 5.4

4.5 − 3.86 3.76 V

5.5 − 4.86 4.76

V

OL

Maximum Low Level
Output Voltage

4.5 0.001 0.1 0.1

5.5 0.001 0.1 0.1

4.5 − 0.36 0.44 V

5.5 − 0.36 0.44

I

IN

∆I

CCT

I

OZ

Maximum Input
Leakage Current

5.5 − ±0.1 ±1.0 

Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V
Maximum

3−State

5.5 − ±0.5 ±5.0 A VI = VCC, GND

Current

I

OLD

I

OHD

I

CC

†Minimum Dynamic

Output Current

Maximum Quiescent
Supply Current

5.5 − − 75 mA V

5.5 − − −75 mA V

5.5 − 8.0 80 

*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.

TA = +25°C TA = −40°C to +85°C

Typ Guaranteed Limits

TA = +25°C
C

= 50 pF

L

Min Typ Max Min Max

TA = −40°C

to +85°C

= 50 pF

C

L

Unit

ns 3−5

ns 3−5

ns 3−7

ns 3−8

ns 3−7

ns 3−8

Unit Conditions

V

= 0.1 V

OUT

or VCC − 0.1 V
V

= 0.1 V

OUT

or VCC − 0.1 V
I

= −50 A

OUT

*VIN = VIL or V

OH

I

= 50 A

OUT

*VIN = VIL or V

OL

=

I

CC

V

(OE) = VIL, V

I

VO = VCC, GND

= 1.65 V Max

OLD

= 3.85 V Min

OHD

=

IN

CC

−24 mA

−24 mA

,

or

Fig.

No.

IH

IH

24 mA
24 mA

IH

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4

MC74AC240, MC74ACT240

Pro agation Delay

Pro agation Delay

AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)

74ACT 74ACT

TA = −40°C

to +85°C

= 50 pF

C

L

Unit

Symbol Parameter

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

Propagation Delay
Data to Output

Propagation Delay
Data to Output

Output Enable Time 5.0 1.5 7.0 8.5 1.0 9.5 ns 3−7
Output Enable Time 5.0 2.0 7.0 9.5 1.5 10.5 ns 3−8
Output Disable Time 5.0 2.0 8.0 9.5 2.0 10.5 ns 3−7
Output Disable Time 5.0 2.5 6.5 10.0 2.0 10.5 ns 3−8

*Voltage Range 5.0 V is 5.0 V ±0.5 V.

CAPACITANCE

Symbol Parameter

C

IN

C

PD

Input Capacitance 4.5 pF VCC = 5.0 V
Power Dissipation Capacitance 45 pF VCC = 5.0 V

VCC*

(V)

TA = +25°C
C

= 50 pF

L

Min Typ Max Min Max

5.0 1.5 6.0 8.5 1.5 9.5 ns 3−5

5.0 1.5 5.5 7.5 1.5 8.5 ns 3−5

Value

Typ

Unit Test Conditions

Fig.

No.

MARKING DIAGRAMS

PDIP−20 SO−20 TSSOP−20 EIAJ−20

MC74AC240N

AWLYYWW

MC74ACT240N

AWLYYWW

AC240

AWLYYWW

ACT240

AWLYYWW

A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week

AC

240

ALYW

ACT

240

ALYW

74AC240

AWLYWW

74ACT240
AWLYWW

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5

MC74AC240, MC74ACT240

PACKAGE DIMENSIONS

PDIP−20

N SUFFIX

20 PIN PLASTIC DIP PACKAGE

CASE 738−03

ISSUE E

−T−

SEATING
PLANE

H10X

M

B

M

0.25

−A−

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

20

11

B

1

10

C

L

K

M

E

FG

N

20 PL

D

0.25 (0.010) T

J

20 PL

0.25 (0.010) T

M

M

A

M

B

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.

DIM MIN MAX MIN MAX

A 25.66 27.171.010 1.070
B 6.10 6.600.240 0.260
C 3.81 4.570.150 0.180
D 0.39 0.550.015 0.022
E
F
G 2.54 BSC0.100 BSC
J 0.21 0.380.008 0.015
K 2.80 3.550.110 0.140
L 7.62 BSC0.300 BSC

M

M 0 15 0 15
N 0.51 1.010.020 0.040

MILLIMETERSINCHES

1.27 BSC0.050 BSC

1.27 1.770.050 0.070



SO−20

DW SUFFIX

20 PIN PLASTIC SOIC PACKAGE

CASE 751D−05

ISSUE G

D

20

1

B20X

M

SAS

T

0.25

18X

e

A

11



E

10

h X 45

B

B

A

SEATING
PLANE

A1

T



NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.

MILLIMETERS

DIM MIN MAX

A 2.35 2.65

A1 0.10 0.25

B 0.35 0.49
C 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55

L

C

h 0.25 0.75
L 0.50 0.90

 0 7



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6

MC74AC240, MC74ACT240

PACKAGE DIMENSIONS

TSSOP−20
DT SUFFIX

20 PIN PLASTIC TSSOP PACKAGE

CASE 948E−02

ISSUE B

20X REFK

S

U0.15 (0.006) T

2X

L/2

0.10 (0.004) V

M

S

U

T

1120

S

B

L

PIN 1
IDENT

110

S

U0.15 (0.006) T

−U−

A

−V−

C

D

G

H

0.100 (0.004)

SEATING

−T−

PLANE

EIAJ−20

M SUFFIX

20 PIN PLASTIC EIAJ PACKAGE

CASE 967−01

ISSUE O

20

110

Z

D

e

b

0.13 (0.005)

M

11

H

E

E

A

0.10 (0.004)

M

VIEW P

A

1

JJ1

N

L

E



N

DETAIL E

K

K1

SECTION N−N

0.25 (0.010)

M

F

DETAIL E

L

DETAIL P

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS. MOLD

FLASH OR GATE BURRS SHALL NOT EXCEED

0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL NOT

EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

MILLIMETERS

DIMAMIN MAX MIN MAX

B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015

−W−

Q

1

c

J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC
M 0 8 0 8

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS AND ARE

MEASURED AT THE PARTING LINE. MOLD FLASH

OR PROTRUSIONS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

DIM MIN MAX MIN MAX

A

A

1

b
c
D
E
e

H

E

L

L

E

M

Q

1

Z

6.60 0.260

6.40 0.252

−−− −−−



MILLIMETERS

−−− 2.05 −−− 0.081

0.05 0.20 0.002 0.008

0.35 0.50 0.014 0.020

0.18 0.27 0.007 0.011

12.35 12.80 0.486 0.504

5.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC

7.40 8.20 0.291 0.323

0.50 0.85 0.020 0.033

1.10 1.50 0.043 0.059
10

0





0.70 0.90 0.028 0.035

−−− 0.81 −−− 0.032

INCHES

INCHES

0



10



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MC74AC240, MC74ACT240

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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