ON Semiconductor MC34164, MC33164, NCV33164 Technical data

查询MC33164D-3G供应商

MC34164, MC33164,
NCV33164

Micropower Undervoltage
Sensing Circuits

The MC34164 series are undervoltage sensing circuits specifically
designed for use as reset controllers in portable microprocessor based
systems where extended battery life is required. These devices offer
the designer an economical solution for low voltage detection with a
single external resistor. The MC34164 series features a bandgap
reference, a comparator with precise thresholds and built−in hysteresis
to prevent erratic reset operation, an open collector reset output
capable of sinking in excess of 6.0 mA, and guaranteed operation
down to 1.0 V input with extremely low standby current. The MC
devices are packaged in 3−pin TO−226AA, micro size TSOP−5, 8−pin
SOIC−8 and Micro8™ surface mount packages. The NCV device is
packaged in SOIC−8.

Applications include direct monitoring of the 3.0 V or 5.0 V
MPU/logic power supply used in appliance, automotive, consumer,
and industrial equipment.

• Temperature Compensated Reference

• Monitors 3.0 V (MC34164−3) or 5.0 V (MC34164−5) Power Supplies

• Precise Comparator Thresholds Guaranteed Over Temperature

• Comparator Hysteresis Prevents Erratic Reset

• Reset Output Capable of Sinking in Excess of 6.0 mA

• Internal Clamp Diode for Discharging Delay Capacitor

• Guaranteed Reset Operation With 1.0 V Input

• Extremely Low Standby Current: As Low as 9.0 A

• Economical TO−226AA, TSOP−5, SOIC−8 and Micro8 Surface

Mount Packages

• NCV Prefix for Automotive and Other Applications Requiring Site

and Control Changes

• Pb−Free Packages are Available

Input

Reset

1

2

3

TO−226AA

P SUFFIX

CASE 29

8

1

Micro8
DM SUFFIX
CASE 846A

TSOP−5

Pin 1. Ground

2. Input

3. Reset

4. NC

5. NC

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5

PIN CONNECTIONS

Reset

Input

N.C.

Ground

1

2

3

4

(Top View)

8

7

6

5

8

1

SOIC−8
D SUFFIX
CASE 751

1

TSOP−5

SN SUFFIX

CASE 483

N.C.

N.C.

N.C.

N.C.

TO−226AA

Pin 1. Reset

2. Input

3. Ground

1.2 V

ref

GND

Figure 1. Representative Block Diagram

This device contains 28 active transistors.

© Semiconductor Components Industries, LLC, 2005

August, 2005 − Rev. 16

See detailed ordering and shipping information in the package

ORDERING INFORMATION

dimensions section on page 7 of this data sheet.

Sink Only

=

Positive True Logic

1 Publication Order Number:

DEVICE MARKING INFORMATION

See general marking information in the device marking
section on page 9 of this data sheet.

MC34164/D

MC34164, MC33164, NCV33164

MAXIMUM RATINGS

Rating Symbol Value Unit

Power Input Supply Voltage V
Reset Output Voltage V
Reset Output Sink Current I

in
O

Sink

Clamp Diode Forward Current, Reset to Input Pin (Note 1) IF 100 mA
Power Dissipation and Thermal Characteristics

P Suffix, Plastic Package

Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air

P

D

R



JA

D Suffix, Plastic Package

Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air

DM Suffix, Plastic Package

Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air

Operating Junction Temperature T
Operating Ambient Temperature Range

P

D

R



JA

P

D

R



JA
J

T

A

MC34164 Series
MC33164 Series, NCV33164

Storage Temperature Range T

Electrostatic Discharge Sensitivity (ESD)

stg

ESD
Human Body Model (HBM)
Machine Model (MM)

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.

MC34164−3, MC33164−3 SERIES, NCV33164−3
ELECTRICAL CHARACTERISTICS

(For typical values T

range that applies [Notes 2 & 3], unless otherwise noted.)

Characteristic Symbol Min Typ Max Unit

COMPARATOR

Threshold Voltage

High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis (I

= 100 A)

Sink

RESET OUTPUT

Output Sink Saturation

(Vin = 2.4 V, I
(Vin = 1.0 V, I

= 1.0 mA)

Sink

= 0.25 mA)

Sink

Output Sink Current (Vin, Reset = 2.4 V) I
Output Off−State Leakage

(Vin, Reset = 3.0 V)
(Vin, Reset = 10 V)

Clamp Diode Forward Voltage, Reset to Input Pin (IF = 5.0 mA) V

TOTAL DEVICE

Operating Input Voltage Range V
Quiescent Input Current

V

= 3.0 V

in

Vin = 6.0 V

1. Maximum package power dissipation limits must be observed.

2. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

3. T

= 0°C for MC34164 T

low

=−40°C for MC33164, NCV33164 = +125°C for MC33164, NCV33164

= +70°C for MC34164

high

= 25°C, for min/max values TA is the operating ambient temperature

A

V

IH

V

IL

V

H

V

OL

2.55

2.55

0.03

−

−

Sink

I

R(leak)

6.0 12 30 mA

−

−

F

in

I

in

0.6 0.9 1.2 V

1.0 to 10 − − V

−

−

−1.0 to 12 V

−1.0 to 12 V
Internally

mA

Limited

700
178

700
178

520
240

mW

°C/W

mW

°C/W

mW

°C/W

+150 °C

°C

0 to +70

− 40 to +125

− 65 to +150 °C

4000

200

2.71

2.65

0.06

0.14

0.1

0.02

0.02

9.0
24

2.80

2.80

−

0.4

0.3

0.5

1.0

15
40

V

V

V

A

A

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2

MC34164, MC33164, NCV33164

MC34164−5, MC33164−5 SERIES, NCV33164−5
ELECTRICAL CHARACTERISTICS

(For typical values T

range that applies [Notes 5 & 6], unless otherwise noted.)

Characteristic Symbol Min Typ Max Unit

COMPARATOR

Threshold Voltage

High State Output (V

Increasing)

in

Low State Output (Vin Decreasing)
Hysteresis (I

= 100 A)

Sink

RESET OUTPUT

Output Sink Saturation

(Vin = 4.0 V, I
(Vin = 1.0 V, I

= 1.0 mA)

Sink

= 0.25 mA)

Sink

Output Sink Current (Vin, Reset = 4.0 V) I
Output Off−State Leakage

(Vin, Reset = 5.0 V)
(Vin, Reset = 10 V)

Clamp Diode Forward Voltage, Reset to Input Pin (IF = 5.0 mA) V

TOTAL DEVICE

Operating Input Voltage Range V
Quiescent Input Current

Vin = 5.0 V
Vin = 10 V

4. Maximum package power dissipation limits must be observed.

5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

6. T

= 0°C for MC34164 T

low

=−40°C for MC33164, NCV33164 = +125°C for MC33164, NCV33164

high

7. NCV prefix is for automotive and other applications requiring site and change control.

= 25°C, for min/max values TA is the operating ambient temperature

A

= +70°C for MC34164

V

IH

V

IL

V

H

V

OL

Sink

I

R(leak)

F

in

I

in

4.15

4.15

0.02

−

−

4.33

4.27

0.09

0.14

0.1

4.45

4.45

7.0 20 50 mA

−

−

0.02

0.02

0.6 0.9 1.2 V

1.0 to 10 − − V

−

−

12
32

V

−

V

0.4

0.3

A

0.5

2.0

A

20
50

10

8.0

6.0

4.0

, OUTPUT VOLTAGE (V)

O

2.0

V

0

RL = 82 k to V
TA = 25°C

0

2.0 4.0 6.0 8.0 10

in

Vin, INPUT VOLTAGE (V)

Figure 2. MC3X164−3 Reset Output

Voltage versus Input Voltage

10

8.0

6.0

4.0

, OUTPUT VOLTAGE (V)

O

2.0

V

0

0

RL = 82 k to V
TA = 25°C

2.0 4.0 6.0 8.0 10

in

Vin, INPUT VOLTAGE (V)

Figure 3. MC3X164−5 Reset Output

Voltage versus Input Voltage

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3

MC34164, MC33164, NCV33164

O

O

G

(

)

, OUTPUT VOLTAGE (V)
V

5.0

4.0

3.0

2.0

O

1.0

0

4.22

RL = 82 k to V
TA = 25°C

4.26 4.30 4.34 4.38

Vin, INPUT VOLTAGE (V)

in

Figure 5. MC3X164−5 Reset Output

Voltage versus Input Voltage

4.36

4.32

4.28

Upper Threshold

High State Output

5.0

4.0

V
E

LTA

3.0

2.0

UTPUT V
,

O

1.0

V

0

2.62

2.66 2.70 2.74 2.78

Vin, INPUT VOLTAGE (V)

RL = 82 k to V
TA = 25°C

in

Figure 4. MC3X164−3 Reset Output

2.76

2.72

2.68

Voltage versus Input Voltage

Upper Threshold

High State Output

, THRESHOLD VOLTAGE (V)
V

μ

, INPUT CURRENT ( A)
I

2.64

in

2.60

−50

−25 0 25 50 75 100 125

TA, AMBIENT TEMPERATURE (°C)

Lower Threshold

Low State Output

Figure 6. MC3X164−3 Comparator Threshold

Voltage versus Temperature

50

40

30

20

in

10

0

0

TA = 0°C

2.0 4.0 6.0 8.0 10

Vin, INPUT VOLTAGE (V)

TA = 25°C

TA = 70°C

, THRESHOLD VOLTAGE (V)
V

4.24

in

4.20

−50

Lower Threshold

Low State Output

−25 0 25 50 75 100 125

TA, AMBIENT TEMPERATURE (°C)

Figure 7. MC3X164−5 Comparator Threshold

Voltage versus Temperature

50

40

μ

30

20

, INPUT CURRENT ( A)

in

I

10

0

0

2.0 4.0 6.0 8.0 10

TA = 0°C

Vin, INPUT VOLTAGE (V)

TA = 25°C

TA = 70°C

Figure 8. MC3X164−3 Input Current

versus Input Voltage

Figure 9. MC3X164−5 Input Current

versus Input Voltage

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4

MC34164, MC33164, NCV33164

, OUTPUT SATURATION (V)

OL

V

, FORWARD CURRENT (mA)

F

I

4.0

Vin = 2.4 V

3.0

2.0

1.0

0

0

TA = 25°C

TA = 0°C

TA = 70°C

4.0 8.0 12 16

V

, SINK CURRENT (mA)

Sink

TA = 70°C

Figure 10. MC3X164−3 Reset Output

Saturation versus Sink Current

32

Vin = 0 V
TA = 25°C

0.4 0.8 1.2 1.6

, FORWARD VOLTAGE (V)

V

F

8.0

24

16

0

0

Figure 12. Clamp Diode Forward Current

versus Voltage

TA = 0°C

TA = 25°C

4.0

Vin, Reset = 4 V

3.0

TA = 25°C

2.0

1.0

0

0

TA = 0°C

TA = 70°C

4.0 8.0 12 16 20

I

, SINK CURRENT (mA)

Sink

, OUTPUT SATURATION (V)

OL

V

20

TA = 25°C

TA = 70°C

TA = 0°C

Figure 11. MC3X164−5 Reset Output

Saturation versus Sink Current

Vin = 5.0 V to 4.0 V
RL = 43 k
TA = 25°C

90%

5.0 V

4.0 V

Reset

V

in

V

in

5.0V

4.0V

10

%

Ref

43k

Reset

5.0 s/DIV

Figure 13. Reset Delay Time

(MC3X164−5 Shown)

Input

Power

Supply

1.2 V

ref

GND

A time delayed reset can be accomplished with the addition of C
supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 s. V
the microprocessor reset input threshold.

Reset

R

Reset

C

DLY

t

= R

DLY

CDLY

. For systems with extremely fast power

DLY

Microprocessor

Circuit

In

ǒǓ

1 −

Figure 14. Low Voltage Microprocessor Reset

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5

1

V

th(MPU)

V

th(MPU)

in

is

MC34164, MC33164, NCV33164

Test Data

V

th

(mV)

0

1.0

1.0

1.0

2.2

2.2

2.2

4.7

4.7

4.7

4.7

4.7

R

()

0
100
100
100
220
220
220
470
470
470
470
470

R

H

L

(k)

43
10

6.8

4.3
10

6.8

4.3
10

8.2

6.8

5.6

4.3

Power

Supply

R

I

in

MC3X164−5

H

1.2 V

V

V

in

R

L

Microprocessor

Reset

Circuit

H

(mV)

60
103
123
160
155

ref

GND

4.3 R

V

V

≈

H

th(lower)

H

+ 0.06

R

L

≈ 10 RH x 10

where: RH ≤ 1.0 k

43 k ≥ RL ≥ 4.3 k

−6

199
280
262
306
357
421
530

Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current
Iin as Vin crosses the comparator threshold (Figure 8). An increase of the lower threshold V
equations are accurate to ±10% with RH less than 1.0 k and RL between 4.3 k and 43 k.

will be observed due to Iin which is typically 10 A at 4.3 V. The

th(lower)

Figure 15. Low Voltage Microprocessor Reset With Additional Hysteresis

(MC3X164−5 Shown)

Input

1.2 V

Reset

Solar
Cells

ref

GND

Power

Supply

Input

1.2 V

1.0 k

Reset

ref

GND

Figure 16. Voltage Monitor Figure 17. Solar Powered Battery Charger

V

CC

R

L

4.3V

270

MTP3055EL

Input

Reset

Overheating of the logic level power MOSFET due to insufficient
gate voltage can be prevented with the above circuit. When the
input signal is below the 4.3 V threshold of the MC3X164−5, its

1.2 V

ref

GND

MC3X164−5

output grounds the gate of the L2 MOSFET.

Figure 18. MOSFET Low Voltage Gate Drive Protection Using the MC3X164−5

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MC34164, MC33164, NCV33164

ORDERING INFORMATION

Device Package Shipping

MC33164D−3 SOIC−8
MC33164D−3G SOIC−8

(Pb−Free)
MC33164D−3R2 SOIC−8
MC33164D−3R2G SOIC−8

(Pb−Free)
NCV33164D−3R2* SOIC−8
NCV33164D−3R2G* SOIC−8

(Pb−Free)
MC33164DM−3R2 Micro8
MC33164DM−3R2G Micro8

(Pb−Free)
MC33164P−3 TO−92
MC33164P−3G TO−92

(Pb−Free)
MC33164P−3RA TO−92
MC33164P−3RAG TO−92

(Pb−Free)
MC33164P−3RP TO−92
MC33164P−3RPG TO−92

(Pb−Free)
MC33164D−5 SOIC−8
MC33164D−5G SOIC−8

(Pb−Free)
MC33164D−5R2 SOIC−8
MC33164D−5R2G SOIC−8

(Pb−Free)
NCV33164D−5R2* SOIC−8
NCV33164D−5R2G* SOIC−8

(Pb−Free)
MC33164DM−5R2 Micro8
MC33164DM−5R2G Micro8

(Pb−Free)
MC33164P−5 TO−92
MC33164P−5G TO−92

(Pb−Free)
MC33164P−5RA TO−92
MC33164P−5RAG TO−92

(Pb−Free)
MC33164P−5RP TO−92
MC33164P−5RPG TO−92

(Pb−Free)
MC34164D−3 SOIC−8
MC34164D−3G SOIC−8

(Pb−Free)
MC34164D−3R2 SOIC−8
MC34164D−3R2G SOIC−8

(Pb−Free)

†

98 Units / Rail

2500 Units / Tape & Reel

4000 Units / Tape & Reel

2000 Units / Box

2000 Units / Tape & Reel

2000 Units / Pack

98 Units / Rail

2500 Units / Tape & Reel

4000 Units / Tape & Reel

2000 Units / Box

2000 Units / Tape & Reel

2000 Units / Pack

98 Units / Rail

2500 Units / Tape & Reel

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MC34164, MC33164, NCV33164

ORDERING INFORMATION

Device Shipping

MC34164DM−3R2 Micro8
MC34164DM−3R2G Micro8

MC34164P−3 TO−92 2000 Units / Box
MC34164P−3G TO−92

MC34164P−3RP TO−92 2000 Units / Pack
MC34164P−3RPG TO−92

MC34164D−5 SOIC−8
MC34164D−5G SOIC−8

MC34164D−5R2 SOIC−8 2500 Units / Tape & Reel
MC34164D−5R2G SOIC−8

MC34164DM−5R2 Micro8 4000 Units / Tape & Reel
MC34164DM−5R2G Micro8

MC34164SN−5T1 TSOP−5
MC34164SN−5T1G TSOP−5

MC34164P−5 TO−92 2000 Units / Box
MC34164P−5G TO−92

MC34164P−5RA TO−92
MC34164P−5RAG TO−92

MC34164P−5RP TO−92 2000 Units / Pack
MC34164P−5RPG TO−92

*NCV33164: T

site and change control.

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

= −40°C, T

low

= +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring

high

Package

(Pb−Free)

(Pb−Free)

(Pb−Free)

(Pb−Free)

(Pb−Free)

(Pb−Free)

(Pb−Free)

(Pb−Free)

(Pb−Free)

(Pb−Free)

4000 Units / Tape & Reel

2000 Units / Box

2000 Units / Pack

98 Units / Rail

2500 Units / Tape & Reel

4000 Units / Tape & Reel

3000 Units / Tape & Reel

2000 Units / Box

2000 Units / Tape & Reel

2000 Units / Pack

†

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8

MC34164, MC33164, NCV33164

TSOP−5

SN SUFFIX

CASE 483

54

SRCYWG

123

PIN CONNECTIONS AND MARKING DIAGRAMS

SOIC−8
D SUFFIX
CASE 751

8

3x164

ALYWy

G

1

Micro8

MC33164DM

CASE 846A

8

MIy0

YWW

AWL

1

SRC = Device Code
x = Device Number 3 or 4
y = Suffix Number 3 or 5
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb−Free

Micro8

MC34164DM

CASE 846A

8

MCy0
YWW

AWL

1

TO−92
MC3x164P−yRA
MC3x164P−yRP

MC3x164P−y

CASE 29

MC3x1

64P−y

YWW

123

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9

SEATING
PLANE

MC34164, MC33164, NCV33164

PACKAGE DIMENSIONS

TO−226AA

P SUFFIX

CASE 29−11

ISSUE AL

A

B

R

P

L

K

XX

H
V

1

G

C

N

D

J

SECTION X−X

N

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.

DIM MIN MAX MIN MAX

A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
D 0.016 0.021 0.407 0.533
G 0.045 0.055 1.15 1.39
H 0.095 0.105 2.42 2.66

J 0.015 0.020 0.39 0.50

K 0.500 −−− 12.70 −−−

L 0.250 −−− 6.35 −−−

N 0.080 0.105 2.04 2.66

P −−− 0.100 −−− 2.54

R 0.115 −−− 2.93 −−−

V 0.135 −−− 3.43 −−−

MILLIMETERSINCHES

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10

0.05 (0.002)

S

H

D

54

123

L

G

A

MC34164, MC33164, NCV33164

PACKAGE DIMENSIONS

TSOP−5

SN SUFFIX

PLASTIC PACKAGE

CASE 483−02

ISSUE D

B

J

C

K

M

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.

4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.

DIM MIN MAX MIN MAX

A 2.90 3.10 0.1142 0.1220
B 1.30 1.70 0.0512 0.0669
C 0.90 1.10 0.0354 0.0433
D 0.25 0.50 0.0098 0.0197
G 0.85 1.05 0.0335 0.0413
H 0.013 0.100 0.0005 0.0040

J 0.10 0.26 0.0040 0.0102
K 0.20 0.60 0.0079 0.0236
L 1.25 1.55 0.0493 0.0610
M 0 10 0 10

__ _ _

S 2.50 3.00 0.0985 0.1181

INCHESMILLIMETERS

SOLDERING FOOTPRINT*

1.9

0.95

0.037

1.0

0.039

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

0.074

0.028

0.7

2.4

0.094

SCALE 10:1

ǒ

inches

mm

Ǔ

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11

−Y−

−Z−

MC34164, MC33164, NCV33164

PACKAGE DIMENSIONS

SOIC−8

D SUFFIX

CASE 751−07

ISSUE AG

NOTES:

−X−
A

58

B

1

S

0.25 (0.010)

4

M

M

Y

K

G

N

C

SEATING
PLANE

0.10 (0.004)

H

D

0.25 (0.010) Z

M

Y

SXS

X 45

_

M

J

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.

MILLIMETERS

DIMAMIN MAX MIN MAX

4.80 5.00 0.189 0.197

B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050

M 0 8 0 8

____

N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244

INCHES

SOLDERING FOOTPRINT*

1.52

0.060

7.0

0.275

0.6

0.024

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

4.0

0.155

1.270

0.050

SCALE 6:1

ǒ

inches

mm

Ǔ

http://onsemi.com

12

SEATING
PLANE

−T−

0.038 (0.0015)

PIN 1 ID

MC34164, MC33164, NCV33164

PACKAGE DIMENSIONS

Micro8

DM SUFFIX

CASE 846A−02

ISSUE F

−A−

K

G

−B−

D

8 PL

0.08 (0.003) A

M

T

S

B

S

C

H

J

L

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.

5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.

DIM MIN MAX MIN MAX

A 2.90 3.10 0.114 0.122
B 2.90 3.10 0.114 0.122
C −−− 1.10 −−− 0.043
D 0.25 0.40 0.010 0.016
G 0.65 BSC 0.026 BSC
H 0.05 0.15 0.002 0.006

J 0.13 0.23 0.005 0.009

K 4.75 5.05 0.187 0.199

L 0.40 0.70 0.016 0.028

INCHESMILLIMETERS

SOLDERING FOOTPRINT*

1.04

8X

0.041

3.20

0.126

0.65

6X

0.0256

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

0.38

0.015

8X

4.24

0.167

5.28

0.208

SCALE 8:1

ǒ

inches

mm

Ǔ

http://onsemi.com

13

MC34164, MC33164, NCV33164

Micro8 is a trademark of International Rectifier.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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For additional information, please contact your
local Sales Representative.

MC34164/D

14